CN211293826U

CN211293826U - Passive heat dissipation micro-host with compact structure

Info

Publication number: CN211293826U
Application number: CN201922463405.XU
Authority: CN
Inventors: 李家富
Original assignee: Nanjing Sugou Electronics Co ltd
Current assignee: Jiangsu Jiye Intelligent Technology Co.,Ltd.
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-08-18
Anticipated expiration: 2029-12-31

Abstract

The utility model provides a compact structure's miniature host computer of dispelling heat passively, be the quick-witted box that the host computer bottom plate of L shape is constituteed including the host computer apron that has the most heat dissipation scale and cross-section, the inside computer mainboard that is provided with of quick-witted box, the one side that the host computer apron was hugged closely to the mainboard is equipped with heating element such as CPU, and battery, wireless network card, DRAM, solid state hard disk and USB interface, network interface, audio interface and COM interface are installed to the another side of mainboard. The utility model reasonably designs the space layout, arranges the heating element on one side of the computer mainboard, which is close to the host cover plate, and is beneficial to utilizing the heat dissipation scale of the host cover plate to dissipate heat; and set up battery, memory bank, hard disk and various interfaces etc. in the another side of mainboard, wherein various interfaces are welded directly on the computer motherboard for the inside overall arrangement of quick-witted case is compacter, and the space obtains effectively utilizing, and the size of whole micro-host is littleer.

Description

Passive heat dissipation micro-host with compact structure

Technical Field

The utility model relates to a micro-host especially relates to a compact structure's micro-host of dispelling heat passively.

Background

The main board of the traditional computer adopts an active heat dissipation mode, and the components with large heat productivity are as follows: the chips of the CPU, the south bridge, the north bridge and the like are provided with the cooling fans, and the heat generated by the CPU is taken away to achieve the cooling effect in a mode of accelerating air circulation through the rotation of the fans, so that the desktop is heavy and large in size. Generally put on the desk, occupy the area of official working, cause relatively more in a jumble on the desk, some then put the desk below subaerial, cause the radiating effect poor. With the advent of low-power-consumption CPUs, the heat productivity of computers can be greatly reduced, and a brand-new fan-free passive heat dissipation mode is provided. However, many manufacturers design the space layout of the passive heat dissipation host to be unreasonable, and many interfaces are connected in a wire connection mode, so that the size of the chassis is large; meanwhile, the radiating scale structure of the box body is small, the contact area with the external environment is small, and the radiating effect cannot be guaranteed. Therefore, the utility model relates to a scheme will effectively solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a compact structure's miniature host computer of dispelling heat passively to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a passive heat dissipation micro-host with a compact structure comprises a host cover plate with a plurality of heat dissipation scales and a host box body with an L-shaped cross section, wherein a computer mainboard is arranged in the host box body, one surface of the mainboard, which is tightly attached to the host cover plate, is provided with heating elements such as a CPU (central processing unit), and the other surface of the mainboard is provided with a battery, a wireless network card, a memory bank, a solid state disk, a USB (universal serial bus) interface, a network interface, an audio interface and a COM (component object model).

Further, the upper end of the CPU is provided with a heat-conducting latex pad, the upper end of the latex pad is provided with a copper plate, the end face of the copper plate is provided with two threaded through holes, and a screw can be installed to be fixedly connected with the host cover body.

Preferably, the latex cushion is adhered to the surface of the CPU.

Preferably, the radiating fins are arranged in parallel and are in a rectangular dentate structure.

Furthermore, interface holes corresponding to various interfaces on the computer mainboard are formed in the side surface of the host cover plate and the side surface of the host bottom plate.

Has the advantages that:

the utility model reasonably designs the space layout, arranges the heating element on one side of the computer mainboard, which is close to the host cover plate, and is beneficial to utilizing the heat dissipation scale of the host cover plate to dissipate heat; and set up battery, memory bank, hard disk and various interfaces etc. in the another side of mainboard, wherein various interfaces are welded directly on the computer motherboard for the inside overall arrangement of quick-witted case is compacter, and the space obtains effectively utilizing, and the size of whole micro-host is littleer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a view of the reverse side of the computer motherboard;

in the figure: 1. heat dissipation scales; 2. a host cover plate; 3. a host backplane; 4. a computer motherboard; 5. a CPU; 6. a battery; 7. a wireless network card; 8. a memory bank; 9. a solid state disk; 10. a USB interface; 11. a network interface; 12. an audio interface; 13. COM interface 14, latex pad; 15. a copper plate; 16. a threaded through hole; 17. an interface hole.

Detailed Description

As shown in fig. 1 and 2, a passive heat dissipation micro-host with a compact structure includes a case body composed of a host cover plate 2 with a plurality of heat dissipation scales 1 and a host bottom plate 3 with an L-shaped cross section, a computer motherboard 4 is arranged inside the case body, one surface of the motherboard 4, which is tightly attached to the host cover plate 2, is provided with heating elements such as a CPU5, and the other surface of the motherboard is provided with a battery 6, a wireless network card 7, a memory bank 8, a solid state disk 9, a USB interface 10, a network interface 11, an audio interface 12 and a COM interface 13.

Further, the upper end of the CPU5 is provided with a heat-conducting latex pad 14, the upper end of the latex pad 14 is provided with a copper plate 15, the end face of the copper plate 15 is provided with two threaded through holes 16, and the mountable screw 16 is fixedly connected with the host cover plate 2.

Preferably, the latex pad 14 is glued to the surface of the CPU 5.

Preferably, the heat dissipation scales 1 are arranged in parallel and have a rectangular dentate structure.

Further, the side of the host cover plate 2 and the side of the host bottom plate 3 are provided with interface holes 17 corresponding to various interfaces on the computer motherboard.

The above disclosure is only for the specific embodiment of the present patent, but the present patent is not limited thereto, and it should be understood that the modifications made by the person skilled in the art without departing from the principle of the present invention shall belong to the protection scope of the present invention.

Claims

1. The utility model provides a compact structure's miniature host computer of passively dispelling heat, is the quick-witted box of the host computer bottom plate constitution that L shape is including the host computer apron that has most heat dissipation scale and cross-section, its characterized in that: a computer mainboard is arranged in the case body, one surface of the mainboard, which is tightly attached to the host cover plate, is provided with heating elements such as a CPU, and the other surface of the mainboard is provided with a battery, a wireless network card, a memory bank, a solid state disk, a USB interface, a network interface, an audio interface and a COM interface.

2. The compact, passive heat dissipating micro-host of claim 1, wherein: the CPU upper end is provided with heat conduction latex pad, and the latex pad upper end is equipped with the copper, and the copper terminal surface is equipped with two screw thread through-holes, mountable screw and host computer lid fixed connection.

3. The compact, passive heat dissipating micro-host of claim 2, wherein: the latex cushion is adhered to the surface of the CPU.

4. The compact, passive heat dissipating micro-host of claim 1, wherein: the radiating fins are arranged in parallel to form a rectangular toothed structure.

5. The compact, passive heat dissipating micro-host of claim 1, wherein: and interface holes corresponding to the interfaces on the computer mainboard are formed in the side surface of the host cover plate and the side surface of the host bottom plate.