CN216286533U - High-performance computing mainboard and equipment - Google Patents

Abstract

The utility model is suitable for the technical field of computing processing, and provides a high-performance computing mainboard and equipment, wherein the high-performance computing mainboard comprises a domestic substrate, a processor, a DDR4 internal memory, a bridge piece, a storage disk, a power supply module and a plurality of peripheral interfaces, the processor, the DDR4 internal memory, the bridge piece, the storage disk, the power supply module and the plurality of peripheral interfaces are all arranged on the substrate, the DDR4 internal memory and the bridge piece are both electrically connected with the processor, and the storage disk and the plurality of peripheral interfaces are all electrically connected with the bridge piece; the processor is FT-2000/4, and the bridge is X100. The utility model improves the processing performance of the computing mainboard, meets the requirements of users on data processing and graphic display, is home-made for other devices, and avoids the problem of overhigh cost caused by foreign introduction.

Description

High-performance computing mainboard and equipment

Technical Field

The utility model belongs to the technical field of computing processing, and particularly relates to a high-performance computing mainboard and high-performance computing equipment.

Background

At present, the existing processing chips in China are few in types and single in function, and the requirements of users on data processing and graphic display are difficult to meet, so that the processing chips adopted by the existing flat-panel computing main boards in China are basically introduced from abroad, and the foreign processing chips become a key factor for hindering the development of the flat-panel computing main boards in China to low price.

Based on the above, the existing domestic flat panel type computing main board has the problems that either domestic processing chips are produced and cannot meet the user requirements, or the cost is too high due to foreign introduction.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a high-performance computing mainboard, and aims to solve the problem that the existing domestic flat computing mainboard is either produced with a domestic processing chip and cannot meet the user requirements or is introduced abroad so as to cause overhigh cost.

The embodiment of the utility model provides a high-performance computing mainboard which comprises a domestic substrate, a processor, a DDR4 internal memory, a bridge plate, a storage disk, a power module and a plurality of peripheral interfaces, wherein the processor, the DDR4 internal memory, the bridge plate, the storage disk, the power module and the plurality of peripheral interfaces are all arranged on the substrate, the DDR4 internal memory and the bridge plate are both electrically connected with the processor, the storage disk and the plurality of peripheral interfaces are all electrically connected with the bridge plate, and the power module supplies power to the processor, the DDR4 internal memory, the bridge plate and the storage disk; the processor is FT-2000/4, and the bridge is X100.

Furthermore, the connection line of the processor and the bridge piece on the substrate is parallel to the long edge of the substrate.

Furthermore, the DDR4 memory has two paths, and each path has a capacity of 4 GB.

Furthermore, the two DDR4 memories are respectively arranged on two opposite sides of the processor in a front-back surface-to-back manner.

Furthermore, the address lines and the control signal lines of the DDR4 memory are arranged in a fly-by mode, and the data signal lines of the DDR4 memory are arranged in a point-to-point mode.

Further, the peripheral interfaces include a USB interface, an audio interface, and a network interface.

Furthermore, the USB interface, the audio interface, and the network interface are disposed at an edge of the substrate.

Further, the power module is a DC-DC power module.

The embodiment of the utility model also provides high-performance computing equipment which comprises a shell and the high-performance computing mainboard contained in the shell.

The utility model achieves the following beneficial effects: the high-performance computing mainboard adopts the high-performance processor with the model number of FT-2000/4 and is provided with the bridge chip with the model number of X100, so that the processing performance of the computing mainboard is improved, the requirements of a user on data processing and graphic display are met, in addition, other devices are made in China, and the problem of overhigh cost caused by foreign introduction is also avoided.

Drawings

Fig. 1 is a schematic structural diagram of a high-performance computing motherboard according to an embodiment of the present invention;

FIG. 2 is a partial frame diagram of a high performance computing motherboard according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of the address and control signal wiring of a high performance computing motherboard according to an embodiment of the present invention;

fig. 4 is a schematic diagram of data signal wiring of a high-performance computing motherboard according to an embodiment of the present invention.

100, calculating a mainboard; 1. a substrate; 2. a processor; 3. a DDR4 memory; 4. a bridge piece; 5. a storage disk; 6. a power supply module; 7. a peripheral interface; 71. a USB interface; 72. an audio interface; 73. a network interface.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is understood as "electrical connection", "communication connection", or the like if the connected circuits, modules, units, or the like have electrical signals or data transmission therebetween.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, the terminology used in this specification includes any and all combinations of the associated listed items.

Example one

The embodiment provides a high performance computing motherboard 100, which is shown in fig. 1 and fig. 2 and includes a domestic substrate 1, a processor 2(CPU), a DDR4 memory 3(DDR4), a bridge 4, a memory disk 5, a power module 6, and a plurality of peripheral interfaces 7, where the processor 2, the DDR4 memory 3, the bridge 4, the memory disk 5, the power module 6, and the plurality of peripheral interfaces 7 are all disposed on the substrate 1, the DDR4 memory 3 and the bridge 4 are all electrically connected to the processor 2, the memory disk 5, and the plurality of peripheral interfaces 7 are all electrically connected to the bridge 4, and the power module 6 supplies power to the processor 2, the DDR4 memory 3, the bridge 4, and the memory disk 5; the processor 2 is FT-2000/4, and the bridge 4 is X100.

The high-performance computing motherboard 100 is referred to as the computing motherboard 100 for short. The processor 2 and the bridge plate 4 are both of the Feiteng company, and are used together.

Since the power module 6 supplies power to the processor 2, the DDR4 memory 3, and the bridge chip 4 based on the storage disk 5, the processor 2, the DDR4 memory 3, and the bridge chip 4 are all connected to the power module 6 based on the storage disk 5, or the processor 2 and the power module 6, and the rest of the devices are indirectly supplied with power through the processor 2.

Accordingly, the substrate 1 is necessarily provided with a power interface for connecting an external power source.

In this embodiment, the connection line between the processor 2 and the bridge 4 on the substrate 1 is parallel to the long side of the substrate 1. In order to ensure smooth heat dissipation, the processor 2 and the bridge piece 4 are both arranged on the air duct of the fan.

In this embodiment, the DDR4 memory 3 has two ways, and the capacity of each way is 4 GB. This may provide more cache space for the computing motherboard 100.

The DDR4 memory 3 may also encrypt the stored data in real time.

In this embodiment, the two DDR4 memories 3 are respectively arranged on two opposite sides of the processor 2 in a front-back facing manner. This can satisfy the design requirements of the wiring.

In this embodiment, the address lines and the control signal lines of the DDR4 memory 3 are arranged in a fly-by manner (as shown by the thick black lines in fig. 3), and the data signal lines of the DDR4 memory 3 are arranged in a point-to-point manner (as shown by the thick black lines in fig. 4). This wiring ensures that the DDR4 memory 3 operates at the highest rate.

In this embodiment, the peripheral interface 7 includes a USB interface 71, an audio interface 72, and a network interface 73. Of course, other types of peripheral interfaces 7 may be provided according to actual requirements, which are not illustrated herein.

The network interface 73 can be connected with a WX1860-AL2 chip of network communication through PCIE expansion, supports PCIE X4, and can realize two paths of 10/100/1000Base-T self-adaptive 1000 Base-network ports.

In this embodiment, the USB interface 71, the audio interface 72, and the network interface 73 are all disposed at the edge of the substrate 1, so as to provide a sufficient space for disposing the substrate 1. Of course, the USB interface 71, the audio interface 72, and the network interface 73 may be disposed at other positions of the substrate 1 according to actual requirements.

In this embodiment, the storage board is a self-made PCIE solid state disk (PCIE disk), and the hardware circuit supports a function of destroying and irrecoverably removing data of the hard disk. Of course, conventional solid state disks, such as the S1200ITT4-T1M24T-C1 storage disk 5 of Beijing hundred million core technology, may also be used according to actual requirements.

In this embodiment, the power module 6 is a DC-DC power module, which can better supply power to the devices in the computing motherboard 100.

Of course, other necessary devices are disposed on the substrate 1 of the computing motherboard 100 according to actual requirements.

In the embodiment, the high-performance computing main board 100 adopts the high-performance processor 2 with the model of FT-2000/4 and is configured with the bridge chip 4 with the model of X100, so that the processing performance of the computing main board 100 is improved, and the computing main board meets the requirements of users on data processing and graphic display.

Example two

The present invention further provides another embodiment, which provides a high performance computing device, where the high performance computing device includes a housing and a high performance computing motherboard 100 accommodated in the housing.

The high-performance computing device may be a desktop computer, an all-in-one computer, a notebook computer, a tablet computer, or other devices capable of performing computing processing.

With reference to fig. 1 and fig. 2, the high performance computing motherboard 100 includes a domestic substrate 1, a processor 2, a DDR4 memory 3, a bridge 4, a disk 5, a power module 6, and a plurality of peripheral interfaces 7, where the processor 2, the DDR4 memory 3, the bridge 4, the disk 5, the power module 6, and the plurality of peripheral interfaces 7 are all disposed on the substrate 1, the DDR4 memory 3 and the bridge 4 are all electrically connected to the processor 2, the disk 5, and the plurality of peripheral interfaces 7 are all electrically connected to the bridge 4, and the power module 6 supplies power to the processor 2, the DDR4 memory 3, the bridge 4, and the disk 5; the processor 2 is FT-2000/4, and the bridge 4 is X100.

The high performance computing motherboard 100 in this embodiment is the same as or similar to the high performance computing motherboard 100 in the first embodiment, and therefore, detailed definitions and descriptions thereof are not repeated in this embodiment.

In this embodiment, the housing can better protect the high performance computing motherboard 100, and prevent the large high performance computing motherboard 100 from being damaged.

In addition, since the high performance computing motherboard 100 in the first embodiment uses the high performance computing motherboard 100 in the first embodiment, the high performance computing device can also achieve the technical effects that the high performance computing motherboard 100 in the first embodiment can achieve, and details are not described herein.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (9)

1. A high-performance computing mainboard is characterized by comprising a domestic base plate, a processor, a DDR4 internal memory, a bridge plate, a storage disk, a power supply module and a plurality of peripheral interfaces, wherein the processor, the DDR4 internal memory, the bridge plate, the storage disk, the power supply module and the plurality of peripheral interfaces are all arranged on the base plate, the DDR4 internal memory and the bridge plate are all electrically connected with the processor, the storage disk and the plurality of peripheral interfaces are all electrically connected with the bridge plate, and the power supply module supplies power to the processor, the DDR4 internal memory, the bridge plate and the storage disk; the processor is FT-2000/4, and the bridge is X100.

2. The high performance computing motherboard of claim 1 wherein a line connecting said processor and said bridge on said substrate is parallel to a long side of said substrate.

3. The high performance computing motherboard of claim 1 wherein said DDR4 memory has two ways and each way has a capacity of 4 GB.

4. The high-performance computing motherboard as recited in claim 3, wherein the two DDR4 memories are respectively disposed on opposite sides of the processor in a front-to-back manner.

5. The high performance computing motherboard as recited in claim 1, wherein address lines and control signal lines of said DDR4 memory are arranged in a fly-by manner, and data signal lines of said DDR4 memory are arranged in a point-to-point manner.

6. The high performance computing motherboard of claim 1 wherein said peripheral interfaces comprise a USB interface, an audio interface, and a network interface.

7. The high performance computing motherboard of claim 6 wherein said USB interface, said audio interface, and said network interface are all disposed at an edge of said substrate.

8. The high performance computing motherboard of claim 1 wherein said power module is a DC-DC power module.

9. A high-performance computing device comprising a housing and the high-performance computing motherboard of any one of claims 1 to 8 housed within the housing.

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