CN208985059U - Micromainframe - Google Patents

Micromainframe Download PDF

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Publication number
CN208985059U
CN208985059U CN201820991808.4U CN201820991808U CN208985059U CN 208985059 U CN208985059 U CN 208985059U CN 201820991808 U CN201820991808 U CN 201820991808U CN 208985059 U CN208985059 U CN 208985059U
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China
Prior art keywords
radiator
box body
hard disk
hole
fixed
Prior art date
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Active
Application number
CN201820991808.4U
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Chinese (zh)
Inventor
李家富
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Jiye Intelligent Technology Co.,Ltd.
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Nanjing Suzhou Electronics Co Ltd
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Priority to CN201820991808.4U priority Critical patent/CN208985059U/en
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Publication of CN208985059U publication Critical patent/CN208985059U/en
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Abstract

The utility model provides a kind of micromainframe, including box body, box body is made of cover board and box body, and the lid surface is equipped with switch key and heat release hole, box body is made of one piece of bottom plate and four blocks of side plates perpendicular to bottom plate, and host side plate upper surface is fixed with hard disk bracket;Box body is internally provided with computer motherboard, the upper surface of mainboard is equipped with CPU, battery, wireless network card, memory bar, solid state hard disk, loudspeaker, switch button and various interfaces, the upper surface CPU is fixed with radiator, there are two receiving antennas for wireless network card one end setting, receive external signal;The loudspeaker is fixed on USB interface top.Rationally, in the upper surface heater element CPU radiator is arranged in the design of the utility model space layout, is conducive to radiate.

Description

Micromainframe
Technical field
The utility model relates to a kind of micromainframes more particularly to a kind of with suspension type hard disk bracket and cooling system Micromainframe.
Background technique
With the development of integrated circuit, host computer increasingly tends to be miniaturized, and saves office space, conveniently moving.So And when the operation of these hosts, the electronic component on computer main board can generate a large amount of heat, if these heats cannot be had Effect ground disperses, and will result directly in temperature and steeply rises, and seriously affects the working efficiency of electronic component.For this purpose, usually existing One radiator is installed to radiate on electronic component.Traditional radiator is installed on central processing unit including one (CPU) radiator on and the fan being fixed on radiator.General radiator is parallel by most vertical heat dissipation scales It rearranges, but the orientation of heat dissipation scales is single, the airflow efficiency of fan cannot be improved, do not can effectively solve inside host Heat dissipation problem.
Furthermore it usually requires to be used to storing data comprising one or more hard disks inside most of computing terminal. Generally, in order to ensure the safety and reliability of data storage, often hard disk is initially mounted on hard disk bracket, so as to more Fixed disk well.Hard disk bracket in the prior art, typical shape are a U-typed structure, including a bottom plate and two sides Side plate.Multiple screw holes are set on side plate, when hard disk push-in, the screw hole on these screw holes and hard disk is corresponded, spiral shell is screwed on Hard disk and hard disk bracket are firmly locked together after silk.However, making winner due to the development of desk computer micromation Space layout inside machine is more and more compacter, and hard disk volume is larger and heat can be generated in storing process, it is therefore desirable to have The problems such as effect solves the placement and heat dissipation of hard disk using the inner space of host.Therefore the utility model design scheme will be solved effectively The certainly above problem.
Utility model content
The purpose of this utility model is to provide a kind of micromainframes, to solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides the following technical solutions:
A kind of micromainframe, including box body, box body are made of cover board and box body, and the lid surface is equipped with switch and presses Key and heat release hole, box body are made of one piece of bottom plate and four blocks of side plates perpendicular to bottom plate, and host side plate upper surface is fixed with Hard disk bracket;Box body is internally provided with computer motherboard, the upper surface of mainboard be equipped with CPU, battery, wireless network card, memory bar, Solid state hard disk, loudspeaker, switch button and various interfaces, the upper surface CPU are fixed with radiator, the wireless network card There are two receiving antennas for one end setting, receive external signal;The loudspeaker is fixed on USB interface top.
Preferably, the heat release hole is located at the two sides of switch key, it is made of the hole of three kinds of diameters, outermost collar aperture is straight The minimum CPU of diameter and scattered, mesosphere bore dia increase, it is maximum positioned at center-hole diameter.
Preferably, the side plate of the front and rear sides is equipped with interface holes corresponding with interfaces various on computer motherboard.
Preferably, the hard disk bracket is made of host fixed plate and hard disk fixed plate, the host fixed plate is in length Bar shaped, rear and front end are provided with screw mounting hole corresponding with host side plate upper surface, hard disk fixed plate upper surface water Flat to set there are two screw mounting hole, lower end faces upward bending, and section is L-shaped.
Preferably, the side boards of computer host machine and hard disk fixed plate screw mounting hole corresponding section are set, there are two strips Screw fixing groove.
Preferably, the radiator includes radiator fan, radiator and thermally conductive sheet, the radiator fan is placed on modeling Motor is housed, the plastic casing is surrounded by screw mounting hole inside material shell body center;The radiator top half For Circular plate structure, lower half portion is square plate structure, sees that radiator is divided into four regions by baffle on the whole, each region is set The heat dissipation scales that inclination angle is -60 degree are equipped with, the baffle front end face is equipped with opening screw hole, and baffle side is equipped with fan attachment Opening screw hole, radiator centre be equipped with section be rectangle entity structure;The thermally conductive sheet is placed in radiator lower end In the rectangle frame of face, thermally conductive sheet is close to the heat that the electronic components such as the CPU on computer motherboard absorb its generation.
The utility model has the advantages that
Rationally, in the upper surface heater element CPU radiator is arranged in the design of the utility model space layout, while according to making It is dissipated with the design feature of the micromainframe of fan cooling by what the heat release hole on cover board was designed to be made of three kinds of different-diameter holes Hot hole group is conducive to heat extraction of radiating, bring noise when host operation can also be effectively reduced.
In addition hard disk is suspended vacantly, the inner space of host can be efficiently used, it can also be by hard disk and other fever members Part separates, it helps heat dissipation.
Detailed description of the invention
Fig. 1 is the utility model casing structure schematic diagram;
Fig. 2 is the utility model cabinet disassemblying structure schematic diagram;
Fig. 3 is the utility model motherboard layout figure;
In figure: 1, box body;2, cover board;3, box body;4, switch key;5, heat release hole;6, bottom plate;7, side plate;8, hard disk Bracket;9, computer motherboard;10,CPU;11, battery;12, wireless network card;13, memory bar;14, solid state hard disk;15, loudspeaker; 16, USB interface;17, interface holes;18, host fixed plate;19, hard disk fixed plate;
20, screw mounting hole;21, screw mounting hole;22, screw fixing groove;23, radiator fan;24, radiator;25, it leads Backing;26, baffle;27, heat dissipation scales;28, be open screw hole;29, the opening screw hole of fan attachment.
Specific embodiment
As shown, a kind of micromainframe, including box body 1, box body are made of cover board 2 and box body 3, the cover board 2 Surface is equipped with switch key 4 and heat release hole 5, and box body 3 is made of one piece of bottom plate 6 and four blocks of side plates 7 perpendicular to bottom plate, the master 7 upper surface of pusher side plate is fixed with hard disk bracket 8;Box body 1 is internally provided with computer motherboard 9, and the upper surface of mainboard 9 is equipped with CPU10, battery 11, wireless network card 12, memory bar 13, solid state hard disk 14, loudspeaker 15, switch button 16 and various interfaces, The upper surface CPU10 is fixed with radiator, and there are two receiving antennas 17 for 12 one end of wireless network card setting, receives external Signal;The loudspeaker 15 is fixed on 6 top of usb 1.
Preferably, the heat release hole 5 is located at the two sides of switch key 4, it is made of the hole of three kinds of diameters, outermost collar aperture The minimum CPU of diameter and scattered, mesosphere bore dia increase, it is maximum positioned at center-hole diameter.
Preferably, the side plate 7 of the front and rear sides is equipped with interface holes corresponding with interfaces various on computer motherboard 9 17。
Preferably, the hard disk bracket 8 is made of host fixed plate 18 and hard disk fixed plate 19, the host fixed plate 18 is elongated, and rear and front end is provided with screw mounting hole 20 corresponding with host side plate upper surface, the hard disk fixed plate 19 upper surface levels are set there are two screw mounting hole 21, and lower end faces upward bending, and section is L-shaped.
Preferably, the side boards of computer host machine 7 is set with 21 corresponding section of hard disk fixed plate screw mounting hole, there are two long Bar shaped screw fixing groove 22.
Preferably, the radiator includes radiator fan 23, radiator 24 and thermally conductive sheet 25, the radiator fan 23 It is placed on equipped with motor inside plastic casing center, the plastic casing is surrounded by screw mounting hole;The radiator 24 top halfs are Circular plate structure, and lower half portion is square plate structure, see that radiator is divided into four areas by baffle 26 on the whole Domain, each region are provided with the heat dissipation scales 27 that inclination angle is -60 degree, and 26 front end face of baffle is equipped with opening screw hole 28, gear 26 side of plate is equipped with the opening screw hole 29 of fan attachment, and radiator centre is equipped with the entity structure that section is rectangle;It is described Thermally conductive sheet 25 is placed in the rectangle frame of radiator lower end surface, and thermally conductive sheet 25 is close to the electronic components such as the CPU10 on computer motherboard 9 Absorb the heat of its generation.
Rationally, in the upper surface heater element CPU radiator is arranged in the design of the utility model space layout, while according to making It is dissipated with the design feature of the micromainframe of fan cooling by what the heat release hole on cover board was designed to be made of three kinds of different-diameter holes Hot hole group is conducive to heat extraction of radiating, bring noise when host operation can also be effectively reduced.
In addition hard disk is suspended vacantly, the inner space of host can be efficiently used, it can also be by hard disk and other fever members Part separates, it helps heat dissipation.
Disclosed above is only specific implementation of the patent example, but this patent is not limited to this, for the general of this field For logical technical staff, without departing from the principle of this utility model, the deformation made should be regarded as belonging to the utility model Protection scope.

Claims (4)

1. a kind of micromainframe, including box body, it is characterised in that: box body is made of cover board and box body, the lid surface Equipped with switch key and heat release hole, box body is made of one piece of bottom plate and four blocks of side plates perpendicular to bottom plate, on the host side plate Surface is fixed with hard disk bracket;Box body is internally provided with computer motherboard, and the upper surface of mainboard is equipped with CPU, battery, wireless network Card, memory bar, solid state hard disk, loudspeaker, switch button and interface, the upper surface CPU are fixed with radiator, the nothing There are two receiving antennas for the setting of gauze card one end, receive external signal;The loudspeaker is fixed on USB interface top, described to dissipate Hot hole is located at the two sides of switch key, is made of the hole of three kinds of diameters, and outmost turns bore dia is minimum, and mesosphere bore dia increases Greatly, it is located at center-hole diameter maximum, the hard disk bracket is made of host fixed plate and hard disk fixed plate, the host fixed plate Elongated, rear and front end is provided with screw mounting hole corresponding with host side plate upper surface, table in the hard disk fixed plate Face level is set there are two screw mounting hole, and lower end faces upward bending, and section is L-shaped.
2. a kind of micromainframe according to claim 1, it is characterised in that: the side plate of the front and rear sides is equipped with and computer The corresponding interface holes of interface on mainboard.
3. a kind of micromainframe according to claim 1, it is characterised in that: side boards of computer host machine and the fixed plate bolt peace of hard disk Dress hole corresponding section is set there are two strip screw fixing groove.
4. a kind of micromainframe according to claim 1, it is characterised in that: the radiator includes radiator fan, heat dissipation Device and thermally conductive sheet, the radiator fan are placed on equipped with motor inside plastic casing center, and the plastic casing surrounding is set There is screw mounting hole;The radiator top half is Circular plate structure, and lower half portion is square plate structure, sees radiator on the whole Four regions are divided by baffle, each region is provided with the heat dissipation scales that inclination angle is -60 degree, and the baffle front end face is equipped with Be open screw hole, and baffle side is equipped with the opening screw hole of fan attachment, and radiator centre is equipped with the entity knot that section is rectangle Structure;The thermally conductive sheet is placed in the rectangle frame of radiator lower end surface, and thermally conductive sheet is close to the electronic component on computer motherboard and is absorbed Its heat generated.
CN201820991808.4U 2018-06-26 2018-06-26 Micromainframe Active CN208985059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820991808.4U CN208985059U (en) 2018-06-26 2018-06-26 Micromainframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820991808.4U CN208985059U (en) 2018-06-26 2018-06-26 Micromainframe

Publications (1)

Publication Number Publication Date
CN208985059U true CN208985059U (en) 2019-06-14

Family

ID=66779350

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820991808.4U Active CN208985059U (en) 2018-06-26 2018-06-26 Micromainframe

Country Status (1)

Country Link
CN (1) CN208985059U (en)

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GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Room 406, 56 Yudao street, Qinhuai District, Nanjing, Jiangsu 210000

Patentee after: Jiangsu Jiye Intelligent Technology Co.,Ltd.

Address before: Room 406, 56 Yudao street, Qinhuai District, Nanjing, Jiangsu 210000

Patentee before: NANJING SUGOU ELECTRONICS Co.,Ltd.

CP01 Change in the name or title of a patent holder