CN215679245U

CN215679245U - High-performance server mainboard based on PCIE interface interconnection

Info

Publication number: CN215679245U
Application number: CN202121956076.3U
Authority: CN
Inventors: 向枭
Original assignee: Shenzhen Zhongke Xinhua Intelligent Technology Co ltd
Current assignee: Shenzhen Zhongke Xinhua Intelligent Technology Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-01-28
Anticipated expiration: 2031-08-19

Abstract

The utility model relates to the technical field of server mainboards, in particular to a high-performance server mainboard based on PCIE interface interconnection, which comprises a main body, wherein a PCIE interface is arranged on the upper surface of the main body, fixed blocks are symmetrically and fixedly arranged on the upper surface of the main body positioned on two sides of the PCIE interface, clamping grooves are clamped on the inner sides of the fixed blocks, clamping plates are symmetrically and slidably connected between the two groups of fixed blocks, clamping blocks are symmetrically and fixedly arranged at two ends of each clamping plate and inserted in the clamping grooves, springs are fixedly arranged between the clamping blocks and the clamping grooves, a mounting groove is formed in one side of each clamping block, which is close to the clamping grooves, a ball is embedded in the inner wall of the mounting groove, and a heat conduction mechanism is arranged on the lower surface of the main body. According to the utility model, by arranging the clamping plate, under the connecting action of the clamping groove, the clamping block and the spring, after the connection of the wire harness and the PCIE interface is completed, the clamping effect on the wire harness can be realized, so that the wire harness is externally fixed, the wire harness and the PCIE interface are firmly connected, and the condition that the service performance of a server mainboard is influenced by the loosening of the wire harness is prevented.

Description

High-performance server mainboard based on PCIE interface interconnection

Technical Field

The utility model relates to the technical field of server motherboards, in particular to a high-performance server motherboard based on PCIE interface interconnection.

Background

The PCIE interface is a bus interface, can improve the data transmission rate to a very high frequency, provide higher bandwidth with this, improve the wholeness ability of server mainboard with this, at the in-process that current PCIE interface and pencil are connected, be different from traditional interface, when the PCIE interface is connected with the pencil, adopt point-to-point serial connection, because the width broad of junction, lead to connecting to appear becoming flexible easily, appear becoming flexible even a bit and all can influence the holistic use of server mainboard.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a high-performance server mainboard based on PCIE interface interconnection.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides a high performance server mainboard based on interconnection of PCIE interface, includes the main part, the upper surface of main part is provided with the PCIE interface, is located PCIE interface both sides the upper surface symmetry fixed mounting of main part has the fixed block, the inboard card of fixed block is equipped with the draw-in groove, and is two sets of symmetrical sliding connection has splint between the fixed block, the both ends symmetry fixed mounting of splint has the fixture block, the inside at the draw-in groove is inserted to the fixture block, fixed mounting has the spring between fixture block and the draw-in groove, the lower surface of main part is provided with heat conduction mechanism.

In order to ensure the smoothness of the movement of the clamping block, the utility model improves that one side of the clamping block, which is close to the clamping groove, is provided with a mounting groove, and a ball is embedded in the inner wall of the mounting groove.

In order to facilitate the normal use of the PCIE interface, the utility model has the improvement that a slope-shaped block is fixedly arranged on the upper surface of the clamping plate.

In order to improve the clamping effect of the clamping plate, the utility model has the improvement that the clamping plate and the slope-shaped block are made of heat-conducting and insulating elastic rubber.

In order to improve the heat conduction effect of the server mainboard, the utility model improves that the heat conduction mechanism comprises a heat conduction silica gel sheet which is fixedly arranged on the lower surface of the main body, an internal groove is formed in the heat conduction silica gel sheet, and copper pipes are uniformly and fixedly arranged between the inner walls of the internal groove.

In order to improve the heat dissipation effect of the heat-conducting silica gel sheet, the utility model is improved in that through holes are formed in both sides of the built-in groove.

Compared with the prior art, the utility model has the advantages and positive effects that:

1. according to the utility model, by arranging the clamping plate, under the connecting action of the clamping groove, the clamping block and the spring, after the connection of the wire harness and the PCIE interface is completed, the clamping effect on the wire harness can be realized, so that the wire harness is externally fixed, the wire harness and the PCIE interface are firmly connected, and the condition that the service performance of a server mainboard is influenced by the loosening of the wire harness is prevented.

2. According to the utility model, by arranging the heat conduction mechanism, under the heat conduction action of the heat conduction silica gel sheet and the copper pipe, heat generated when the server mainboard works can be quickly taken away, and is quickly dissipated through the through hole and the heat conduction silica gel sheet, so that the server mainboard is ensured not to be easily overheated in the use process, and the use performance of the whole server mainboard is improved.

Drawings

Fig. 1 is a schematic diagram of a three-dimensional structure of a high-performance server motherboard based on PCIE interface interconnection provided in the present invention;

fig. 2 is a schematic diagram of an explosion structure of a high-performance server motherboard based on PCIE interface interconnection according to the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2 of a high-performance server motherboard based on PCIE interface interconnection according to the present invention;

fig. 4 is an enlarged view of a portion B in fig. 2 of a high-performance server motherboard based on PCIE interface interconnection according to the present invention;

fig. 5 is a bottom cross-sectional view of a high performance server motherboard based on PCIE interface interconnection according to the present invention;

fig. 6 is an enlarged view of a high performance server motherboard based on PCIE interface interconnection shown in fig. 5 at C.

Illustration of the drawings:

1. a main body; 2. a PCIE interface; 3. a fixed block; 4. a card slot; 5. a splint; 6. a clamping block; 7. a spring; 8. a ball bearing; 9. a heat-conducting silica gel sheet; 10. a built-in groove; 11. a copper pipe; 12. and a through hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1-6, the present invention provides a technical solution: a high-performance server mainboard based on PCIE interface interconnection comprises a main body 1, PCIE interfaces 2 are arranged on the upper surface of the main body 1, fixing blocks 3 are symmetrically and fixedly arranged on the upper surface of the main body 1 at two sides of the PCIE interfaces 2, clamping grooves 4 are clamped on the inner sides of the fixing blocks 3, clamping plates 5 are symmetrically and slidably connected between the two groups of fixing blocks 3, clamping blocks 6 are symmetrically and fixedly arranged at two ends of each clamping plate 5, the clamping blocks 6 are inserted into the clamping grooves 4, springs 7 are fixedly arranged between the clamping blocks 6 and the clamping grooves 4, in the present invention, when the wiring harness is inserted into the PCIE interface 2, the two sets of clamping plates 5 are first pressed, under the matching action of the spring 7, the clamping block 6 and the clamping groove 4, after the wire harness is completely inserted, the clamping plate 5 can directly clamp the wire harness, so that the wire harness is fixed again on the outside, thereby achieving the purpose of preventing the wire harness from loosening and improving the service performance of the whole server mainboard.

The mounting groove has been seted up to one side that fixture block 6 is close to draw-in groove 4, the inner wall of mounting groove is inlayed and is had ball 8, inlay this ball 8 in the inside of fixture block 6, can make things convenient for the motion of fixture block 6 in draw-in groove 4 inside, guarantee that the pencil can normally insert in PCIE interface 2, the last fixed surface of splint 5 installs the sloping piece, the sloping piece mainly plays a direction cushioning effect, ensure that the pencil is inserting PCIE interface 2's in-process, two sets of splint 5 can open smoothly, the material of splint 5 and sloping piece is heat conduction insulating elastic rubber, heat conduction insulating elastic rubber both possesses insulating nature, and possess elasticity again, consequently both can not influence the normal signal transmission between pencil and the PCIE interface 2, can utilize self elasticity again, guarantee that the pencil is pressed from both sides tightly.

The lower surface of the main body 1 is provided with a heat conduction mechanism, the heat conduction mechanism comprises a heat conduction silica gel sheet 9, the heat conduction silica gel sheet 9 is fixedly arranged on the lower surface of the main body 1, an internal groove 10 is formed in the heat conduction silica gel sheet 9, copper pipes 11 are uniformly and fixedly arranged between the inner walls of the internal groove 10, and through holes 12 are formed in two sides of the internal groove 10.

The working principle is as follows: when the staff is connecting this server mainboard, in-process inserting PCIE interface 2 when the pencil, at first under the effect of sloping block, the pencil can be crowded two sets of splint 5 to both sides and open, this moment fixture block 6 can be along with splint 5 moves together, can compression spring 7 simultaneously, after the pencil inserts PCIE interface 2 completely, at this moment under splint 5 self elasticity and the effect of spring 7 resilience force, the pencil can be pressed from both sides to two sets of splint 5, thereby prevent that the pencil from becoming flexible, when this server mainboard begins work, the heat that produces can be under the effect of heat conduction silica gel piece 9, can be introduced in built-in groove 10 and copper pipe 11, and move constantly in built-in groove 10 and copper pipe 11, at last rethread heat conduction silica gel piece 9 and through-hole 12 effect, directly from the inside effluvium of heat conduction silica gel piece 9, thereby realize quick heat conduction cooling effect to the server mainboard.

Although the present invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a high performance server mainboard based on interconnection of PCIE interface, includes main part (1), its characterized in that: the upper surface of main part (1) is provided with PCIE interface (2), is located PCIE interface (2) both sides the last surface symmetry fixed mounting of main part (1) has fixed block (3), the inboard card of fixed block (3) is equipped with draw-in groove (4), and is two sets of symmetry sliding connection has splint (5) between fixed block (3), the both ends symmetry fixed mounting of splint (5) has fixture block (6), fixture block (6) are inserted the inside of establishing at draw-in groove (4), fixed mounting has spring (7) between fixture block (6) and draw-in groove (4), the lower surface of main part (1) is provided with heat conduction mechanism.

2. The PCIE interface interconnection-based high-performance server motherboard of claim 1, wherein: one side of the clamping block (6) close to the clamping groove (4) is provided with a mounting groove, and a ball (8) is embedded in the inner wall of the mounting groove.

3. The PCIE interface interconnection-based high-performance server motherboard of claim 1, wherein: the upper surface of the clamping plate (5) is fixedly provided with a slope-shaped block.

4. The PCIE interface interconnection-based high-performance server motherboard of claim 3, wherein: the clamping plate (5) and the slope-shaped block are both made of heat-conducting insulating elastic rubber.

5. The PCIE interface interconnection-based high-performance server motherboard of claim 1, wherein: the heat conduction mechanism comprises a heat conduction silica gel sheet (9), the heat conduction silica gel sheet (9) is fixedly installed on the lower surface of the main body (1), a built-in groove (10) is formed in the heat conduction silica gel sheet (9), and copper pipes (11) are uniformly and fixedly installed between the inner walls of the built-in grooves (10).

6. The PCIE interface interconnection-based high-performance server motherboard of claim 5, wherein: through holes (12) are formed in the two sides of the built-in groove (10).