CN111694116A - High-expansibility FC optical fiber bus - Google Patents
High-expansibility FC optical fiber bus Download PDFInfo
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- CN111694116A CN111694116A CN202010437442.8A CN202010437442A CN111694116A CN 111694116 A CN111694116 A CN 111694116A CN 202010437442 A CN202010437442 A CN 202010437442A CN 111694116 A CN111694116 A CN 111694116A
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- interface
- heat
- heat absorption
- control chip
- bus
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- 239000013307 optical fiber Substances 0.000 title abstract description 10
- 238000004891 communication Methods 0.000 claims abstract description 14
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 238000010521 absorption reaction Methods 0.000 claims description 78
- 230000017525 heat dissipation Effects 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 239000005441 aurora Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000003993 interaction Effects 0.000 description 8
- 238000013507 mapping Methods 0.000 description 6
- 230000006978 adaptation Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L12/40006—Architecture of a communication node
- H04L12/40013—Details regarding a bus controller
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/40208—Bus networks characterized by the use of a particular bus standard
- H04L2012/40241—Flexray
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-expansibility FC (fiber channel) optical fiber bus, and particularly relates to the technical field of FC optical fiber buses, which comprises a board card body, wherein one side of the board card body is connected with an FC control chip, the FC control chip is in communication connection with a PCIE (peripheral component interface express) interface and a port multiplexing interface, the PCIE interface and the port multiplexing interface are both fixedly arranged on one side of the board card body, the FC control chip is in communication connection with a bus interface, the bus interface is fixedly arranged on one side of the board card body, the FC control chip is electrically connected with a power supply control chip, and the FC control chip is in board card communication connection with a memory. According to the invention, by arranging the port multiplexing interface and the cooling mechanism, the contact area of the heat radiating fins with air is effectively increased, so that the heat radiating efficiency is improved.
Description
Technical Field
The invention relates to the technical field of FC (fiber channel) optical fiber buses, in particular to a high-expansibility FC optical fiber bus.
Background
FC is a high-speed serial transport bus proposed in 1988 by the X3T11 group of the american standards institute (ANSI), which addresses the technical bottleneck encountered by parallel bus SCSI and allows more FC-4 upper layer protocols to be mapped within the same large protocol platform framework. The FC has the advantages of being dual in channel and network, high in bandwidth, reliability and stability, resistant to electromagnetic interference and the like, capable of providing very stable and reliable optical fiber connection, easy to construct large-scale data transmission and communication networks, and supporting bandwidth connection rates of 1x, 2x, 4x and 8x, and the bandwidth is continuously expanded along with continuous development of the technology so as to meet technical performance requirements of higher bandwidth data transmission.
In the prior art, the heat of the FC optical fiber bus cannot be well dissipated during data transmission, the normal work of a chip is influenced when the temperature is too high, the interface is mostly a common PCIE interface, the expandability performance is insufficient, and the use requirement cannot be well met.
Disclosure of Invention
In order to overcome the above-mentioned defects in the prior art, embodiments of the present invention provide a high-scalability FC fiber bus, and the technical problems to be solved by the present invention are: the FC optical fiber bus can not well emit heat during data transmission, normal work of a chip is affected when the temperature is too high, and most of interfaces are common PCIE interfaces, so that the expandability is insufficient.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a high expansibility FC fiber bus, includes the integrated circuit board body, integrated circuit board body one side is connected with FC control chip, FC control chip communication connection has PCIE interface and the multiplexing interface of port, and PCIE interface and the multiplexing interface of port all set firmly in integrated circuit board body one side, FC control chip communication connection has the bus interface, the bus interface sets firmly in integrated circuit board body one side, FC control chip electricity is connected with power control chip, FC control chip board card communication connection has memory interface and control interface, FC control chip one side fixed mounting has cooling body, cooling body is laminated with PCEI interface, the multiplexing interface of port, memory interface, control interface, bus interface and power control chip one side respectively.
The FC control chip is used for processing and converting data information of FC-VE network multiprotocol, realizing serial system bus interaction, FC network AV, RW, ASM, IP and other protocol interaction, the FC control chip adopts a port multiplexing mode on the basis of facing to central processor information interaction, expands the functions of an Aurora interface and a DP video output interface on a PCIE interface, realizes the mapping and remote RDMA operation of a FlexRay bus on the FC-ASM protocol, realizes the mapping and remote RDMA operation of a 1553B bus on the FC-ASM protocol by adopting a mode of sharing a parallel bus interface, simultaneously supports control interfaces such as GPIO, I2C and the like and a DDR3 memory interface, thereby effectively improving the expansibility of PCIE signals and the adaptation performance of the bus interface, simultaneously the heat of the FC control chip can be led in by attaching with a heat absorption base, meanwhile, heat absorbed by the heat absorption base is led into the plurality of heat dissipation fins through the heat conduction copper columns, the contact area between the heat dissipation fins and air is effectively increased, heat dissipation is improved, data adaptability of the PC control chip is improved, heat dissipation is accelerated, and connection adaptability is obviously improved.
In a preferred embodiment, the cooling mechanism comprises a heat absorption base, wherein threaded fixing seats are fixedly connected to the periphery of the heat absorption base, assembling seats are attached to the bottoms of the two threaded fixing seats corresponding to one side, the bottom of each assembling seat is fixedly connected with one side of the board card body, a threaded cap is embedded on one side of each assembling seat, threaded columns are in threaded penetrating connection with the threaded fixing seats and the threaded cap, a plurality of heat-conducting copper columns are fixedly connected to one side of the heat absorption base, radiating fins are embedded on the outer side walls of the heat-conducting copper columns, a first heat absorption sheet is fixedly connected to one side of the heat absorption base, which is close to the power control chip, and is attached to one side of the power control chip, two second heat absorption sheets are fixedly connected to one sides of the heat absorption base, which is close to the memory interface and the control interface, and are respectively attached to, the bottom of the heat absorption base is fixedly connected with a third heat absorption sheet, the bottom of the third heat absorption sheet is attached to the top of the bus interface, the top of the heat absorption base is fixedly connected with two fourth heat absorption sheets, and the two fourth heat absorption sheets are respectively attached to the bottoms of the PCIE interface and the port multiplexing interface.
In a preferred embodiment, heat-conducting silica gel pads are fixedly connected to one sides of the first heat absorbing sheet, the second heat absorbing sheet, the third heat absorbing sheet and the fourth heat absorbing sheet, and the heat-conducting silica gel pads are respectively attached to one sides of the power control chip, the memory interface, the control interface, the bus interface, the PCIE interface and the port multiplexing interface.
In a preferred embodiment, the heat sink base and the heat sink fins are both nickel-plated aluminum members.
In a preferred embodiment, the memory interface is a DDR3 memory interface.
In a preferred embodiment, the control interface is a GPIO and I2C interface.
In a preferred embodiment, the port multiplexing interface is an Aurora interface and a DP video output interface.
In a preferred embodiment, the bus interface is the FC-ASM protocol.
1. The invention realizes the protocol interaction of serial system bus, FC network AV, RW, ASM, IP and the like by arranging a port multiplexing interface and a cooling mechanism, expands the functions of Aurora interface and DP video output interface on a PCIE interface by adopting a port multiplexing mode, realizes the mapping and remote RDMA operation of a FlexRay bus on the FC-ASM protocol by a chip, realizes the mapping and remote RDMA operation of a 1553B bus on the FC-ASM protocol by adopting a mode of sharing a parallel bus interface, thereby effectively improving the expansibility of PCIE signals, simultaneously leading the heat of the FC control chip into a heat absorption base by attaching the FC control chip and leading the heat absorbed by the heat absorption base into a plurality of heat dissipation fins by a heat conduction copper column, effectively increasing the contact area of the heat dissipation fins with air and improving the heat dissipation efficiency, compared with the prior art, improving the data adaptability of the PC control chip and accelerating the heat dissipation, the connection adaptability is obviously improved;
2. according to the invention, the threaded fixing seat is arranged, the heat absorption base is in threaded connection with the board card body through the threaded fixing seat at the four corners, the first heat absorption sheet, the second heat absorption sheet, the third heat absorption sheet and the fourth heat absorption sheet can search the heat of the chip at the corresponding positions into the heat absorption base for heat dissipation, and meanwhile, the heat conduction silica gel pad connected with the first heat absorption sheet, the second heat absorption sheet, the third heat absorption sheet and the fourth heat absorption sheet can improve the contact and bonding effect with the corresponding chip, so that the conduction and dissipation of the accumulated heat are further improved.
Drawings
Fig. 1 is a schematic front sectional view of the present invention.
Fig. 2 is a schematic perspective view of the heat absorbing base of the present invention.
Fig. 3 is a schematic perspective view of the assembly base of the present invention.
Fig. 4 is a side view of the heat absorbing base of the present invention.
FIG. 5 is a schematic diagram of the system of the present invention.
The reference signs are: the heat-absorbing device comprises a 1 board card body, a 2FC control chip, a 3 cooling mechanism, a 301 heat-absorbing base, a 302 threaded fixing base, a 303 heat-radiating fin, a 304 heat-conducting copper column, a 305 first heat-absorbing sheet, a 306 second heat-absorbing sheet, a 307 threaded column, a 308 assembling base, a 309 third heat-absorbing sheet, a 310 threaded cap, a 311 fourth heat-absorbing sheet, a 4 bus interface, a 5PCIE interface, a 6 port multiplexing interface, a 7 heat-conducting silica gel pad, an 8 memory interface, a 9 control interface and a 10 power supply control chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a high-expansibility FC (fiber channel) optical fiber bus, which comprises a board card body 1, wherein one side of the board card body 1 is connected with an FC control chip 2, the FC control chip 2 is in communication connection with a PCIE (peripheral component interface express) interface 5 and a port multiplexing interface 6, the PCIE interface 5 and the port multiplexing interface 6 are fixedly arranged on one side of the board card body 1, the FC control chip 2 is in communication connection with a bus interface 4, the bus interface 4 is fixedly arranged on one side of the board card body 1, the FC control chip 2 is electrically connected with a power supply control chip 10, the FC control chip 2 is in board communication connection with a memory interface 8 and a control interface 9, one side of the FC control chip 2 is fixedly provided with a cooling mechanism 3, and the cooling mechanism 3 is respectively attached to one sides of the PCEI interface, the port multiplexing interface 6, the memory interface 8, the control.
The cooling mechanism 3 comprises a heat absorption base 301, wherein threaded fixing seats 302 are fixedly connected to the periphery of the heat absorption base 301, assembling seats 308 are attached to the bottoms of the two threaded fixing seats 302 on the corresponding side, the bottom of each assembling seat 308 is fixedly connected with one side of the board card body 1, a threaded cap 310 is embedded on one side of each assembling seat 308, threaded columns 307 are connected to the threaded fixing seats 302 and the threaded caps 310 in a penetrating manner, a plurality of heat-conducting copper columns 304 are fixedly connected to one side of the heat absorption base 301, heat-radiating fins 303 are embedded on the outer side walls of the heat-conducting copper columns 304, a first heat-absorbing sheet 305 is fixedly connected to one side of the heat absorption base 301 close to the power control chip 10, the first heat-absorbing sheet 305 is attached to one side of the power control chip 10, two second heat-absorbing sheets 306 are fixedly connected to one sides of the heat absorption base 301 close to the memory interface 8 and the control interface 9, the bottom of the heat absorption base 301 is fixedly connected with a third heat absorption sheet 309, the bottom of the third heat absorption sheet 309 is attached to the top of the bus interface 4, the top of the heat absorption base 301 is fixedly connected with two fourth heat absorption sheets 311, the two fourth heat absorption sheets 311 are respectively attached to the bottoms of the PCIE interface 5 and the port multiplexing interface 6, the heat dissipation fins 303 and the heat absorption base 301 are both nickel-plated aluminum members, the memory interface 8 is a DDR3 memory interface, the control interface 9 is a GPIO and I2C interface, the port multiplexing interface 6 is an Aurora interface and a DP video output interface, and the port multiplexing interface 6 is an Aurora interface and a DP video output interface.
As shown in fig. 1 to 5, the embodiment specifically is: the FC control chip 2 is used for processing and converting data information of FC-VE network multiprotocol, realizing serial system bus interaction, FC network AV, RW, ASM, IP and other protocol interaction, the FC control chip 2 adopts a port multiplexing mode on the basis of facing to central processor information interaction, the PCIE interface 5 is expanded with the functions of an Aurora interface and a DP video output interface, the chip realizes the mapping and remote RDMA operation of a FlexRay bus on the FC-ASM protocol, and realizes the mapping and remote RDMA operation of a 1553B bus on the FC-ASM protocol by adopting a mode of sharing a parallel bus interface 4, the chip simultaneously supports control interfaces 9 such as GPIO, I2C and the like and a DDR3 memory interface, thereby effectively improving the expansibility of PCIE signals, improving the adaptation performance of the bus interface 4, and simultaneously the heat of the FC control chip 2 can be led in by being attached to a heat absorption base 301, meanwhile, heat absorbed by the heat absorption base 301 is guided into the plurality of heat dissipation fins 303 through the heat conduction copper columns 304, the contact area between the heat dissipation fins 303 and air is effectively increased, and the heat dissipation efficiency is improved, so that the data adaptability of the PC control chip is improved, the heat dissipation is accelerated, and the connection adaptability is obviously improved.
One side of each of the first heat absorbing sheet 305, the second heat absorbing sheet 306, the third heat absorbing sheet 309 and the fourth heat absorbing sheet 311 is fixedly connected with a heat conducting silica gel pad 7, and the heat conducting silica gel pad 7 is respectively attached to one side of the power control chip 10, one side of the memory interface 8, one side of the control interface 9, one side of the bus interface 4, one side of the PCIE interface 5 and one side of the port multiplexing interface 6.
As shown in fig. 1 to 4, the embodiment specifically is: the heat absorption base 301 is in threaded connection with the board card body 1 through the threaded fixing seat 302 at the four corners, the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can enable the chip heat at the corresponding position to be detected into the heat absorption base 301 for heat dissipation, and meanwhile, the heat conduction silica gel pad 7 connected with the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can improve the contact and attachment effect with the corresponding chip, so that the conduction and dissipation of accumulated heat are further improved.
The working principle of the invention is as follows:
referring to the attached drawings 1-5 of the specification, the FC control chip 2 is used for realizing FC-VE network multiprotocol data information processing and conversion, the FC control chip 2 adopts a port multiplexing mode on the basis of facing to central processor information interaction, and the Aurora interface and DP video output interface functions are expanded on the PCIE interface 5, so that the expansibility of PCIE signals can be effectively improved, and the adaptation performance of the bus interface 4 is improved, meanwhile, the heat of the FC control chip 2 can be led in through the attachment with the heat absorption base 301, meanwhile, the heat absorbed by the heat absorption base 301 is led into a plurality of heat dissipation fins 303 through the heat conduction copper columns 304, the heat dissipation fins 303 effectively increase the contact area with air, the heat dissipation efficiency is improved, and the heat dissipation is accelerated while the data adaptation of the PC control chip is improved;
referring to the attached drawings 1-4 in the specification, the heat absorption base 301 is in threaded connection with the board card body 1 through the threaded fixing seat 302 at the four corners, the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can find the chip heat at the corresponding positions into the heat absorption base 301 for heat dissipation, and meanwhile, the heat conduction silicone rubber pad 7 connected with the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can improve the contact and bonding effect with the corresponding chip, so that the conduction and dissipation of accumulated heat are further improved.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (8)
1. The utility model provides a high expansibility FC fiber bus, includes integrated circuit board body (1), its characterized in that: one side of the board card body (1) is connected with an FC control chip (2), the FC control chip (2) is in communication connection with a PCIE interface (5) and a port multiplexing interface (6), and the PCIE interface (5) and the port multiplexing interface (6) are both fixedly arranged at one side of the board card body (1), the FC control chip (2) is in communication connection with a bus interface (4), the bus interface (4) is fixedly arranged on one side of the board card body (1), the FC control chip (2) is electrically connected with a power supply control chip (10), the FC control chip (2) board card is in communication connection with a memory interface (8) and a control interface (9), a cooling mechanism (3) is fixedly arranged on one side of the FC control chip (2), and the cooling mechanism (3) is respectively attached to one sides of the PCEI interface, the port multiplexing interface (6), the memory interface (8), the control interface (9), the bus interface (4) and the power control chip (10).
2. The FC fiber bus with high expandability according to claim 1, wherein: the cooling mechanism (3) comprises a heat absorption base (301), wherein threaded fixing seats (302) are fixedly connected to the periphery of the heat absorption base (301), an assembly seat (308) is attached to the bottoms of the two threaded fixing seats (302) on one side, the bottom of the assembly seat (308) is fixedly connected with one side of the board card body (1), a threaded cap (310) is embedded on one side of the assembly seat (308), threaded columns (307) are connected with the threaded fixing seats (302) and the threaded cap (310) in a penetrating manner, a plurality of heat conduction copper columns (304) are fixedly connected to one side of the heat absorption base (301), heat dissipation fins (303) are embedded on the outer side wall of each heat conduction copper column (304), a first heat absorption piece (305) is fixedly connected to one side of the heat absorption base (301) close to a power supply control chip (10), and the first heat absorption piece (305) is attached to one side of, the heat absorption base (301) is close to two second heat absorption sheets (306) on one side of the memory interface (8) and the control interface (9), the two second heat absorption sheets (306) are respectively attached to one sides of the memory interface (8) and the control interface (9), the bottom of the heat absorption base (301) is fixedly connected with a third heat absorption sheet (309), the bottom of the third heat absorption sheet (309) is attached to the top of the bus interface (4), the top of the heat absorption base (301) is fixedly connected with two fourth heat absorption sheets (311), and the two fourth heat absorption sheets (311) are respectively attached to the bottoms of the PCIE interface (5) and the port multiplexing interface (6).
3. The FC fiber bus with high expandability according to claim 2, wherein: and one sides of the first heat absorbing sheet (305), the second heat absorbing sheet (306), the third heat absorbing sheet (309) and the fourth heat absorbing sheet (311) are fixedly connected with a heat-conducting silica gel pad (7), and the heat-conducting silica gel pad (7) is respectively attached to one sides of the power control chip (10), the memory interface (8), the control interface (9), the bus interface (4), the PCIE interface (5) and the port multiplexing interface (6).
4. The FC fiber bus with high expandability according to claim 2, wherein: the heat radiating fins (303) and the heat absorbing base (301) are both nickel-plated aluminum components.
5. The FC fiber bus with high expandability according to claim 1, wherein: the memory interface (8) is a DDR3 memory interface.
6. The FC fiber bus with high expandability according to claim 1, wherein: the control interface (9) is a GPIO and I2C interface.
7. The FC fiber bus with high expandability according to claim 1, wherein: the port multiplexing interface (6) is an Aurora interface and a DP video output interface.
8. The FC fiber bus with high expandability according to claim 1, wherein: the bus interface (4) is an FC-ASM protocol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010437442.8A CN111694116A (en) | 2020-05-21 | 2020-05-21 | High-expansibility FC optical fiber bus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010437442.8A CN111694116A (en) | 2020-05-21 | 2020-05-21 | High-expansibility FC optical fiber bus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111694116A true CN111694116A (en) | 2020-09-22 |
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ID=72477030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010437442.8A Withdrawn CN111694116A (en) | 2020-05-21 | 2020-05-21 | High-expansibility FC optical fiber bus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111694116A (en) |
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2020
- 2020-05-21 CN CN202010437442.8A patent/CN111694116A/en not_active Withdrawn
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Application publication date: 20200922 |
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