CN211554398U - Optical module capable of rapidly dissipating heat - Google Patents

Optical module capable of rapidly dissipating heat Download PDF

Info

Publication number
CN211554398U
CN211554398U CN202020603702.XU CN202020603702U CN211554398U CN 211554398 U CN211554398 U CN 211554398U CN 202020603702 U CN202020603702 U CN 202020603702U CN 211554398 U CN211554398 U CN 211554398U
Authority
CN
China
Prior art keywords
shell
heat dissipation
optical module
heat
duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020603702.XU
Other languages
Chinese (zh)
Inventor
王耿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Kingway Electronic Technology Co ltd
Original Assignee
Chengdu Kingway Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Kingway Electronic Technology Co ltd filed Critical Chengdu Kingway Electronic Technology Co ltd
Priority to CN202020603702.XU priority Critical patent/CN211554398U/en
Application granted granted Critical
Publication of CN211554398U publication Critical patent/CN211554398U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses an optical module capable of fast heat dissipation, which comprises an optical module body, wherein the optical module body comprises a shell, and a photoelectric device and a circuit board which are arranged inside the shell; install the radiator unit that can extend into the shell inside on the shell, radiator unit is cylindricly including heat dissipation shell, mini cooling fan, guide duct, induced duct and a plurality of heat dissipation pipe, induced duct is the round platform form, and the induced duct is connected at the guide duct lower extreme, and the length of a plurality of heat dissipation pipes is different, and heat dissipation shell inboard is provided with a plurality of conducting strips. The utility model discloses have better radiating effect, can effectual improvement radiating efficiency, guarantee the normal use of optical module.

Description

Optical module capable of rapidly dissipating heat
Technical Field
The utility model relates to a photoelectric conversion technology field, concretely relates to can quick radiating optical module.
Background
With the continuous emergence of new services such as cloud computing, 5G, big data, AR/VR super-definition video and the like, the global data traffic is continuously increased, so that the development of a data center from 100G to higher speed, larger bandwidth and lower delay is promoted, and the ethernet is the inevitable trend of the data center. The optical module can not be constructed in a data center, and in order to meet the requirements of the data center on large bandwidth and low delay, the optical module is developed towards lower power consumption and smaller volume.
The optical module is used for photoelectric conversion, the transmitting end converts an electric signal into an optical signal, and the receiving end converts the optical signal into the electric signal after the optical signal is transmitted by the optical fiber. Generally, an optical module includes a housing, and an optoelectronic device, a circuit board, and the like, both disposed in the housing; the bandwidth and the speed of an optical module in the optical communication industry are getting larger, the processing power of a product IC is getting larger, and the heat dissipation requirement is getting higher.
The main difficulty of heat dissipation of the chip on the main board lies in that when the mother board or the single board is used, an element with large heat productivity is on the bottom surface, the heat of the chip cannot be timely transferred to the main heat dissipation surface, and the heat conduction and the heat dissipation of the optical module need to meet the requirements in order to solve the problem of heat dissipation of the optical module.
The prior heat dissipation method in the industry comprises the following steps: use structural component zinc alloy material self heat dissipation, also dispel the heat through the card cage (cage) that zinc alloy structural component will heat-conduct stainless steel material simultaneously, however, when using together at high in the clouds computer lab multirow array apart from hundreds or hundreds of modules, holistic heat is higher, and zinc alloy heat conductivity just 112W/MK, can't make the module dispel the heat fast like this.
Especially, in a large multi-interface optical module, the number of photoelectric conversion is large, more heat generating optical devices are arranged in the optical module, the heat generation amount in the optical module is larger, the heat is directly transferred to a shell of the optical module to dissipate heat, an expected heat dissipation effect cannot be achieved, and the inside of the optical module is overheated in the use process, so that the normal operation of the optical module is influenced.
The application numbers are: CN201920420327.2, publication no: CN 209982994U's utility model discloses an optical module with heat radiation structure, including the optical module body, still including set up in heat conduction structure on the surface of at least one side of optical module body, heat conduction structure includes a plurality of first baffles and supplies the bottom plate that each first baffle was installed, the bottom plate with the surface sets up relatively, each first baffle all is located the bottom plate with between the surface, and each the one end contact of bottom plate is kept away from to first baffle the surface. The utility model discloses a heat of surface is transmitted through heat conduction structure conduction optical module body to increase heat radiating area through bottom plate and a plurality of baffle, improved the radiating effect, the baffle is established between bottom plate and surface in addition, and the both ends opening that forms can form the air convection, can accelerate radiating rate and effective control electromagnetism and leak.
However, in practical use, the heat dissipation effect still needs to be further improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of poor heat dissipation effect of the optical module in the prior art, concentrated heat inside the optical module and influence on the normal use of the optical module; the utility model provides a can quick radiating optical module, the utility model discloses have better radiating effect, can effectual improvement radiating efficiency, guarantee the normal use of optical module.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
an optical module capable of rapidly dissipating heat comprises an optical module body, wherein the optical module body comprises a shell, and a photoelectric device and a circuit board which are arranged in the shell, and an optical signal input-output interface and an electric signal input-output interface which are connected with the circuit board are arranged on the shell; install the radiator unit that can extend into the inside of shell on the shell, radiator unit includes the radiating shell, mini cooling fan, the guide duct, induced duct and a plurality of heat dissipation pipe, the guide duct is cylindricly, induced duct is round platform form, induced duct connects at the guide duct lower extreme, the length of a plurality of heat dissipation pipe is different, radiating shell inboard is provided with a plurality of conducting strips, after the radiating shell suit on the shell between the adjacent conducting strip with radiating shell and shell formation heat dissipation channel, mini cooling fan installs back in the guide duct, guide duct fixed mounting is on the heat dissipation window that sets up on the shell, induced duct is located between radiating shell and the shell after being connected with the guide duct, a plurality of heat dissipation pipe one end are connected with the induced duct, the other end extends into the inside back of shell, the outside wall of cooling duct contacts with the inside photoelectric device of shell and circuit board.
Further defined, the heat dissipation conduit is made of soft, compressible, high thermal conductivity TIF600G thermal conductive silicone.
Further optimizing, the lateral wall of the heat dissipation conduit is provided with a plurality of flexible heat conduction fins, and the flexible heat conduction fins can be in contact with the photoelectric device and the circuit board inside the shell.
The utility model discloses in, heat dissipation window department installs the filter screen.
Further optimize, install the one-way diaphragm valve in the induced draft tube, the one-way diaphragm valve includes diaphragm and support frame, is provided with the mar on the diaphragm, and the support frame is installed in the induced draft tube, and the diaphragm edge is connected with the guide duct, and the diaphragm pastes on the support frame and the diaphragm is located and is close to mini cooling fan one side on the support frame.
It should be further explained that the heat dissipation shell mainly comprises an upper shell and a lower shell, the heat dissipation window is arranged on the upper shell, the upper shell is provided with a guide hole, the lower shell is provided with a guide pillar, and after the guide pillar passes through the upper shell, the upper shell and the lower shell are connected with each other in a clamping manner through a clamping groove and a clamping hook.
Wherein, coating has pressure sensitive adhesive or heat conduction glue between heat conduction piece and the shell.
Further optimize, be provided with a plurality of heat dissipation ribs on the heat dissipation shell.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses a plurality of heat dissipation points are formed inside the shell of optical module to the heat dissipation pipe of different length that sets up, and the heat on photoelectric device and the circuit board is transmitted to the heat dissipation pipe through the mode of heat conduction simultaneously, can bring out the heat on the heat dissipation pipe fast under the effect of mini cooling fan, carry out the forced heat transfer to the inside of optical module; meanwhile, the heat on the shell is transferred to the radiating shell, the radiating area can be greatly increased through the arranged heat conducting fins and the radiating shell, and meanwhile, the air in the formed radiating channel can realize convection, so that the radiating speed is further accelerated; therefore, the utility model discloses have better radiating effect, guarantee the normal operating of optical module.
More importantly, the heat dissipation pipes are different in length, so that the heat dissipation pipes can be distributed at different positions in the shell, and the pipe openings of the heat dissipation pipes are arranged in a local high-heat area, so that the heat in the optical module can be quickly discharged; meanwhile, the heat transfer area of the outer side surface of the heat dissipation pipe is larger, meanwhile, the area of the inner side of the heat dissipation pipe is also relatively larger, and the largest heat exchange can be realized when the mini heat dissipation fan acts.
2. The utility model can further improve the heat transfer efficiency by the contact of the flexible heat-conducting fins with the photoelectric device and the circuit board inside the shell, so that the heat generated by the part inside the shell can be removed in the shortest time; meanwhile, the flexible heat conducting fins increase the heat dissipation area and further increase the contact area between the flexible heat conducting fins and the photoelectric device and the circuit board, so that the heat dissipation effect is ensured.
3. The utility model discloses a filter screen that sets up can block the large granule, avoids outside large granule impurity to get into inside the photoelectric module, avoids the foreign matter to get into the inside normal work that influences the photoelectric module of photoelectric module.
4. The utility model has the advantages that through the one-way diaphragm valve, when the mini heat dissipation fan works, the diaphragm is opened, the hot air in the mini heat dissipation fan can be discharged from the shell, and the purpose of heat dissipation is realized; when the mini cooling fan does not work, the diaphragm is in a closed state, and when the external humidity is high, the condition that wet air enters the shell from the air guide cylinder and the air draft cylinder to cause the abnormity of the photoelectric module can be avoided; the photoelectric module is ensured to be more stable in operation.
5. The utility model discloses the heat dissipation shell mainly comprises last casing and lower casing, goes up the casing and leads through the guide pillar with lower casing, then realizes the block through the mode of trip and draw-in groove, and is more convenient in the time of the installation.
6. The utility model discloses a set up a plurality of heat dissipation ribs on the heat dissipation shell, the heat dissipation rib on the heat dissipation shell has further increased the area that heat dissipation shell and air carry out the heat exchange, in the use of reality, can further improve the radiating effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic cross-sectional structure diagram of the present invention.
Fig. 3 is a schematic cross-sectional structure view of the heat dissipation pipe of the present invention.
Fig. 4 is a partially enlarged view of a portion a in fig. 1 according to the present invention.
Fig. 5 is the installation position diagram of the mini cooling fan in the cooling module of the present invention.
Reference numerals: 1 optical module body, 2 shells, 3 photoelectric device, 4 circuit boards, 5 optical signal input/output interfaces, 6 electrical signal input/output interfaces, 7 radiator unit, 8 radiating shell, 9 mini cooling fan, 10 air duct, 11 induced draft tube, 12 radiating guide tube, 13 conducting strip, 14 radiating channel, 15 flexible heat conducting fin, 16 filter screen, 17 upper shell, 18 lower shell, 19 one-way diaphragm valve, 20 diaphragms, 21 support frame, 22 radiating rib, 23 support, 24 trip, 25 draw-in groove.
Detailed Description
The present invention will be further described with reference to the following examples, which are only some, but not all, of the examples of the present invention. Based on the embodiments in the present invention, other embodiments used by those skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
The embodiment discloses an optical module capable of rapidly dissipating heat, which comprises an optical module body 1, wherein the optical module body 1 comprises a shell 2, and a photoelectric device 3 and a circuit board 4 which are arranged inside the shell 2, and an optical signal input/output interface 5 and an electrical signal input/output interface 6 which are connected with the circuit board 4 are arranged on the shell 2; the shell 2 is provided with a heat dissipation component 7 which can extend into the shell 2, the heat dissipation component 7 comprises a heat dissipation shell 8, a mini heat dissipation fan 9, an air duct 10, an air induction barrel 11 and a plurality of heat dissipation pipes 12, the air duct 10 is cylindrical, the air induction barrel 11 is in a circular truncated cone shape, the air induction barrel 11 is connected with the lower end of the air duct 10, the lengths of the heat dissipation pipes 12 are different, the inner side of the heat dissipation shell 8 is provided with a plurality of heat conducting fins 13, the heat dissipation shell 8 is sleeved on the shell 2, a heat dissipation channel 14 is formed between the adjacent heat conducting fins 13 and the heat dissipation shell 8 as well as the shell 2, after the mini heat dissipation fan 9 is arranged in the air duct 10 through a bracket 23, the air duct 10 is fixedly arranged on a heat dissipation window arranged on the shell 2, the air induction barrel 11 is connected with the air duct 10 and then positioned between the heat dissipation shell 8 and the shell 2, the outer side wall of the heat dissipation conduit 12 is in contact with the optoelectronic device 3 and the circuit board 4 inside the housing 2.
It should be noted that, in practical use, two ends of the formed heat dissipation channel 14 are communicated with the outside, so that convection of air is facilitated to improve heat dissipation efficiency.
In this embodiment, the heat sink conduit 12 is made of soft, compressible, high thermal conductivity TIF600G thermal conductive silicone.
Further preferably, the outer side wall of the heat dissipation conduit 12 is provided with a plurality of flexible heat conduction fins 15, and the flexible heat conduction fins 15 can be in contact with the photoelectric device 3 and the circuit board 4 inside the housing 2.
Wherein, a filter screen 16 is arranged at the position of the heat dissipation window; this prevents large particulate matter in the air from entering the housing 2 and affecting the proper operation of the photovoltaic module.
In this embodiment, the heat dissipation case 8 mainly comprises an upper case 17 and a lower case 18, the heat dissipation window is arranged on the upper case 17, the upper case 17 is provided with a guide hole, the lower case 18 is provided with a guide post, and after the guide post passes through the upper case 17, the upper case 17 and the lower case 18 are connected with each other by a clamping groove 25 and a clamping hook 24; the clamping is realized through the mode of the clamping hook 24 and the clamping groove 25, and the installation is more convenient.
The utility model discloses a two kinds of modes are dispelled the heat, firstly carry out the heat transfer through shell 2 and heat dissipation shell 8, the heat that optical module inside photoelectric device 3 and circuit board 4 produced passes through the air and transmits to shell 2, then the heat transfer is to heat dissipation shell 8 on, owing to be provided with conducting strip 13 on the heat dissipation shell 8, heat dissipation shell 8 suit is on shell 2 after between the adjacent conducting strip 13 with heat dissipation shell 8 and shell 2 form heat dissipation channel 14, can be more quick with the heat transfer on the shell 2 to heat dissipation shell 8 on, and the heat radiating area of the heat dissipation shell 8 that sets up is bigger, can further accelerate the radiating rate; meanwhile, the heat dissipation channel 14 formed between the heat dissipation shell 8 and the shell 2 further accelerates the heat dissipation and improves the heat dissipation effect; the heat dissipation shell 8 can also protect the photoelectric module; meanwhile, partial electromagnetic leakage can be controlled.
Secondly, the heat in the photoelectric module is taken out through the mini cooling fan 9, due to the fact that the cooling guide pipe 12 attached to the photoelectric device 3 and the circuit board 4 is arranged, the generated heat can be transmitted to the cooling guide pipe 12 at the first time, then the heat is rapidly discharged under the action of the mini cooling fan 9, the temperature inside the photoelectric module is reduced, the photoelectric module is enabled to be always at a proper working temperature condition, the accelerated aging of the internal components of the photoelectric module can be effectively prevented, the service life is prolonged, and the influence of the working time on photoelectric conversion can be effectively reduced.
More importantly, as the outer side wall of the heat dissipation conduit 12 is provided with the plurality of flexible heat conduction fins 15, the flexible heat conduction fins 15 can be in contact with the photoelectric device 3 and the circuit board 4 inside the shell 2; thus, a part of the flexible heat conducting fins 15 is in contact with the photoelectric device 3 and the circuit board 4, and the efficiency of direct heat conduction is improved; the other part is contacted with the air in the shell 2, thereby further improving the heat conduction area and further accelerating the heat dissipation efficiency.
Example 2
This embodiment is further optimized on the basis of embodiment 1, and in this embodiment, the one-way diaphragm valve 19 is installed in the induced draft tube 11, and the one-way diaphragm valve 19 includes the diaphragm 20 and the support frame 21, is provided with the mar on the diaphragm 20, and the support frame 21 is installed in the induced draft tube 11, and the edge of the diaphragm 20 is connected with the air duct 10, and the diaphragm 20 pastes on the support frame 21 and the diaphragm 20 is located on the support frame 21 and is close to one side of the mini cooling fan 9.
It should be noted that the scratch is cross-shaped, Y-shaped or X-shaped, so that the diaphragm 20 is in a closed state when the mini cooling fan 9 is in a shutdown state.
Therefore, when the mini cooling fan 9 works, the diaphragm 20 is opened, and the hot air in the mini cooling fan can be discharged outwards from the shell 2, so that the purpose of cooling is achieved; when the mini cooling fan 9 does not work, the diaphragm 20 is in a closed state, when the external humidity is large, the wet air can be prevented from entering the shell 2 from the air duct 10 and the air draft tube 11, the photoelectric module is abnormal, and the photoelectric module is more stable when in operation.
Wherein, the pressure-sensitive adhesive or the heat-conducting adhesive is coated between the heat-conducting fin 13 and the shell 2; the efficiency of heat transfer can be effectively improved, and the resistance of heat transfer is reduced.
Example 3
This embodiment is further optimized based on embodiment 1 or 2, and in this embodiment, the heat dissipation shell 8 is provided with a plurality of heat dissipation ribs 22.
Thus, by additionally arranging the heat dissipation ribs 22 on the heat dissipation shell 8, not only can the heat dissipation area between the heat dissipation shell 8 and the air be increased, but also the heat dissipation shell 8 can be protected by the heat dissipation ribs 22.
Example 4
This embodiment is substantially the same as embodiment 3, except that: the heat dissipation pipe 12 is made of copper material, and an insulating heat conduction layer is formed after the surface of the heat dissipation pipe 12 is coated with insulating heat conduction material; the plurality of flexible heat conducting fins 15 arranged on the outer side wall of the heat radiating conduit 12 are made of TIF600G heat conducting silica gel with high heat conducting material, so that the heat radiating efficiency can be further improved.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention. The above description is only exemplary of the present invention and should not be taken as limiting, and all changes, equivalents, and improvements made within the spirit and principles of the present invention should be understood as being included in the scope of the present invention.

Claims (8)

1. The utility model provides an optical module that can dispel the heat fast which characterized in that: the optical module comprises an optical module body, wherein the optical module body comprises a shell, and a photoelectric device and a circuit board which are arranged in the shell; install the radiator unit that can extend into the inside of shell on the shell, radiator unit includes the radiating shell, mini cooling fan, the guide duct, induced duct and a plurality of heat dissipation pipe, the guide duct is cylindricly, induced duct is round platform form, induced duct connects at the guide duct lower extreme, the length of a plurality of heat dissipation pipe is different, radiating shell inboard is provided with a plurality of conducting strips, after the radiating shell suit on the shell between the adjacent conducting strip with radiating shell and shell formation heat dissipation channel, mini cooling fan installs back in the guide duct, guide duct fixed mounting is on the heat dissipation window that sets up on the shell, induced duct is located between radiating shell and the shell after being connected with the guide duct, a plurality of heat dissipation pipe one end are connected with the induced duct, the other end extends into the inside back of shell, the outside wall of cooling duct contacts with the inside photoelectric device of shell and circuit board.
2. The optical module capable of dissipating heat rapidly according to claim 1, wherein: the heat dissipation conduit is made of soft, compressible, high thermal conductivity TIF600G thermal conductive silicone.
3. The optical module capable of dissipating heat rapidly according to claim 1, wherein: the outer side wall of the heat dissipation conduit is provided with a plurality of flexible heat conduction fins which can be in contact with the photoelectric device and the circuit board inside the shell.
4. The optical module capable of dissipating heat rapidly according to claim 1, wherein: a filter screen is arranged at the position of the heat dissipation window.
5. The optical module capable of dissipating heat rapidly according to any one of claims 1 to 4, wherein: install one-way diaphragm valve in the induced draft tube, one-way diaphragm valve includes diaphragm and support frame, is provided with the mar on the diaphragm, and the support frame is installed in the induced draft tube, and the diaphragm edge is connected with the guide duct, and the diaphragm pastes on the support frame and the diaphragm is located and is close to mini cooling fan one side on the support frame.
6. The optical module capable of dissipating heat rapidly according to claim 1, wherein: the heat dissipation shell mainly comprises an upper shell and a lower shell, a heat dissipation window is arranged on the upper shell, a guide hole is formed in the upper shell, a guide pillar is arranged on the lower shell, and after the guide pillar penetrates through the upper shell, the upper shell and the lower shell are clamped and connected through a clamping groove and a clamping hook.
7. The optical module capable of dissipating heat rapidly according to claim 1, wherein: the pressure-sensitive adhesive or the heat-conducting adhesive is coated between the heat-conducting sheet and the shell.
8. The optical module capable of dissipating heat rapidly according to claim 1, wherein: the heat dissipation shell is provided with a plurality of heat dissipation ribs.
CN202020603702.XU 2020-04-21 2020-04-21 Optical module capable of rapidly dissipating heat Active CN211554398U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020603702.XU CN211554398U (en) 2020-04-21 2020-04-21 Optical module capable of rapidly dissipating heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020603702.XU CN211554398U (en) 2020-04-21 2020-04-21 Optical module capable of rapidly dissipating heat

Publications (1)

Publication Number Publication Date
CN211554398U true CN211554398U (en) 2020-09-22

Family

ID=72496607

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020603702.XU Active CN211554398U (en) 2020-04-21 2020-04-21 Optical module capable of rapidly dissipating heat

Country Status (1)

Country Link
CN (1) CN211554398U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112178578A (en) * 2020-09-28 2021-01-05 安徽江淮汽车集团股份有限公司 Automobile LED lamp
WO2022083149A1 (en) * 2020-10-19 2022-04-28 青岛海信宽带多媒体技术有限公司 Optical module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112178578A (en) * 2020-09-28 2021-01-05 安徽江淮汽车集团股份有限公司 Automobile LED lamp
WO2022083149A1 (en) * 2020-10-19 2022-04-28 青岛海信宽带多媒体技术有限公司 Optical module

Similar Documents

Publication Publication Date Title
CN211554398U (en) Optical module capable of rapidly dissipating heat
WO2022100106A1 (en) Pluggable device, information communication device, heat dissipation system, and manufacturing method
CN113031273B (en) Head-mounted display device and heat dissipation mechanism thereof
CN214800416U (en) Head-mounted display device and heat dissipation mechanism thereof
CN212970620U (en) Switch
US11431415B2 (en) Expansion bracket with heat dissipation for optical transceiver system
CN219042384U (en) Adapter device for communication
CN213876621U (en) VPX machine case
CN216904681U (en) STS module of energy storage converter
CN219496740U (en) Optical communication module with high heat dissipation rate
CN215605569U (en) Heat radiation structure, light guide part and endoscope
CN210983290U (en) Computer heat abstractor
CN218039173U (en) Heat radiator for integrated circuit chip
CN220965441U (en) Network access device of internet of things monitoring terminal
CN210427881U (en) Optical module with superstrong heat dissipation function
CN211822283U (en) UVLED light source heat radiation structure
CN211207269U (en) Cold plate of data processing module
CN220456400U (en) Arithmetic device and heat dissipation device
CN220114570U (en) Vehicle-mounted host and automobile
CN216282947U (en) Heat pipe radiator
CN216748197U (en) Optical module structure with anti-interference function
CN215450109U (en) Computer CPU radiator
CN216905703U (en) Heat dissipation device for virtual head display equipment and virtual head display equipment
CN210130058U (en) Self-discharging pressure type water-cooling heat dissipation plate
CN218041512U (en) Intelligent night vision security camera mainboard

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant