CN212696391U

CN212696391U - Heat radiation structure for 5G transmission

Info

Publication number: CN212696391U
Application number: CN202020619637.XU
Authority: CN
Inventors: 夏燕
Original assignee: Zhankuo Electronic Technology Suzhou Co ltd
Current assignee: Zhankuo Electronic Technology Suzhou Co ltd
Priority date: 2020-04-22
Filing date: 2020-04-22
Publication date: 2021-03-12
Anticipated expiration: 2030-04-22

Abstract

The utility model is suitable for the technical field of heat dissipation, and provides a 5G transmission heat dissipation structural part, which mainly comprises a base assembly, a heat dissipation assembly and a heat conduction assembly; the base assembly comprises a base, the heat dissipation assembly comprises a heat dissipation plate, and the heat dissipation plate horizontally covers the heat dissipation groove; the heat conducting assembly comprises a heat conductor and a connecting column, the device is made of a novel graphene material, heat conducting and heat resisting effects are better, and heat can be evenly distributed and effectively transferred; the whole complete heat dissipation structural part is provided with the notches on the base, and the heat dissipation assembly and the heat conduction assembly are placed in the notches to realize heat dissipation, so that the device is low in thickness and more portable; the light and thin design is combined with better heat dissipation performance, so that the user experience is better; all the accessories are simple accessories, the installation mode is simple, no complex process is adopted, the cost performance is high, and the cost is low.

Description

Heat radiation structure for 5G transmission

Technical Field

The utility model belongs to the technical field of the heat dissipation, especially, relate to a heat radiation structure spare is used in 5G transmission.

Background

With the development of 5G technology, 5G is more and more widely used, and the fifth generation mobile communication technology is the latest generation cellular mobile communication technology, i.e. the extension behind 4G, 3G and 2G systems. The performance goals of 5G are high data rates, reduced latency, energy savings, reduced cost, increased system capacity, and large-scale device connectivity. The transmission device is a common device in the communication field, and the 5G mobile communication transmission can normally work, and a heat dissipation structure is usually needed to effectively dissipate heat generated when the transmission device works.

At present, a common heat dissipation structure is generally formed by splicing an aluminum plate and a heat transfer fin, and for the heat dissipation structure, the thermal contact resistance at the splicing part of the heat transfer fin and the aluminum plate is larger, so that the heat dissipation effect of the heat dissipation structure is poor; if the heat radiation structure uses multiple components to combine to improve the heat radiation effect, the thickness is often high, the weight is heavy, and the user experience is often influenced by the poor heat radiation and the medium-weight characteristics.

SUMMERY OF THE UTILITY MODEL

The utility model provides a 5G is heat radiation structure spare for transmission aims at solving the problem that the radiating effect who mentions among the above-mentioned background art is poor, weight is heavy, user experience is not good.

The utility model is realized in such a way, the heat dissipation structure for 5G transmission comprises a base assembly, a heat dissipation assembly and a heat conduction assembly;

the base assembly comprises a base, the base is a cuboid, radiating holes are formed in four sides of the base, a radiating groove is formed in the top of the base, and the radiating groove is rectangular;

the heat dissipation assembly comprises a heat dissipation plate, and the heat dissipation plate horizontally covers the heat dissipation groove;

the heat conduction assembly comprises four heat conductors and connecting columns, the four heat conductors are parallel to each other and symmetrically distributed on the heat dissipation plate, a plurality of slots distributed in an array are formed in the top of each heat conductor, and two ends of the bottom of each heat conductor are fixedly connected with one connecting column respectively.

Preferably, the heat dissipation assembly further comprises heat dissipation chips, the number of the heat dissipation chips is consistent with that of the slots, and each heat dissipation chip is inserted into one slot respectively.

Preferably, the heat dissipation plate and the heat dissipation chip are made of graphene.

Preferably, a plurality of limiting plugs are welded on the heat dissipation plate, and the limiting plugs are mutually and symmetrically distributed on the upper surface of the heat dissipation plate in parallel.

Preferably, the column cap of the connecting column is provided with a joint jack, and the limiting plug is matched with the joint jack on the connecting column.

Preferably, the edge of the heat dissipation groove, which is attached to the heat dissipation plate, is provided with an easy-to-tear strip.

Compared with the prior art, the beneficial effects of the utility model are that: the heat dissipation structure for 5G transmission of the utility model uses the novel graphene material for the heat dissipation plate and the heat dissipation chip, has better heat conduction and heat resistance effects, and can evenly distribute and effectively transfer heat; the whole complete heat dissipation structural part is provided with the notches on the base, and the heat dissipation assembly and the heat conduction assembly are placed in the notches to realize heat dissipation, so that the device is low in thickness and more portable; the light and thin design is combined with better heat dissipation performance, so that the user experience is better; all the accessories are simple accessories, the installation mode is simple, no complex process is adopted, the cost performance is high, and the cost is low.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a heat dissipation plate according to an embodiment of the present invention;

FIG. 3 is a schematic view of the bottom structure of the heat conductor of the present invention;

FIG. 4 is a schematic side view of the heat conductor of the present invention;

in the figure: 1-base component, 11-base, 12-radiating hole, 13-radiating groove, 2-radiating component, 21-radiating plate, 22-limiting plug, 23-radiating chip, 24-easy-to-tear strip, 3-heat-conducting component, 31-heat conductor, 32-connecting column, 321-connector jack and 33-slot.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1-4, the present invention provides a technical solution of a heat dissipation structure for 5G transmission: A5G transmission heat dissipation structure comprises a base assembly 1, a heat dissipation assembly 2 and a heat conduction assembly 3;

the base assembly 1 comprises a base 11, wherein the base 11 is a cuboid, heat dissipation holes 12 are formed in four sides of the base, a heat dissipation groove 13 is formed in the top of the base 11, and the heat dissipation groove 13 is rectangular.

The heat sink assembly 2 includes a heat sink 21, and the heat sink 21 is horizontally covered in the heat sink 13.

Heat conduction assembly 3 is including heat conductor 31 and spliced pole 32, and heat conductor 31 has four, and four heat conductors 31 are parallel to each other the symmetric distribution on heating panel 21, and a plurality of slots 33 and the spliced pole 32 of bottom both ends difference fixedly connected with of array distribution are seted up at heat conductor 31 top.

In the present embodiment, a horizontally disposed heat dissipation plate 21 is connected to the heat dissipation groove 13 in the base 11 by the easy-to-tear strip 24, and a limit plug 22 matched with the connector jack 321 on the heat conductor 31 is welded on the heat dissipation plate 21, so that the heat dissipation plate 21 is connected to the heat conductor 31, and the heat dissipation chip 23 is inserted into the slots 33 of the heat conductor 31, so that the heat accumulated on the heat conductor 31 can be effectively transferred by the heat dissipation chip 23 and the heat dissipation plate 21, thereby achieving heat dissipation.

Further, the heat dissipation assembly 2 further includes heat dissipation chips 23, the number of the heat dissipation chips 23 is the same as that of the slots 33, and each heat dissipation chip 23 is inserted into one slot 33.

In the present embodiment, by providing the heat dissipating chip 23 and inserting the heat dissipating chip 23 into the slot 33, the heat in the heat conductor 31 can be effectively transferred by the heat dissipating chip 23.

Further, the heat dissipation plate 21 and the heat dissipation chip 23 are made of graphene.

In this embodiment, the graphite alkene material has good heat conduction, hinders hot effect, and graphite alkene has special hexagonal plane network structure, can be with the even distribution of heat at two-dimensional plane and effectual transfer, uses the graphite alkene material to strengthen the heat dispersion of device greatly.

Furthermore, a plurality of limiting plugs 22 are welded on the heat dissipation plate 21, and the limiting plugs 22 are mutually and symmetrically distributed on the upper surface of the heat dissipation plate 21 in parallel.

In the present embodiment, the stopper plug 22 and the heat dissipation plate 21 are completely fixedly connected by welding.

Furthermore, a connector jack 321 is formed on the column head of the connecting column 32, and the limit plug 22 is matched with the connector jack 321 on the connecting column 32.

In the present embodiment, the connector socket 321 and the position limiting plug 22 are adapted to each other, so that the position limiting plug 22 can be inserted into the connector socket 321, thereby connecting the heat conductor 31 and the heat radiator 21.

Further, the edge of the heat dissipation groove 13, which is attached to the heat dissipation plate 21, is provided with an easy-to-tear strip 24.

In this embodiment, the easy strip 24 of pasting that tears that adopts is the black strip of pasting of using always in the mainboard device, easily tear strip 24 and can bond heat sink 13 and heating panel 21 fixed together, and use and easily tear strip 24 rather than other coupling assembling such as bolt etc. because the material of easily tearing strip 24 can not hinder work such as heat dissipation to heat conduction and produce the influence, weight is lighter simultaneously, the mounting means is more simple and convenient, low cost, black easily tear strip 24, let the people just can see at a glance, labour saving and time saving more when dismantling.

The utility model discloses a theory of operation and use flow: after the utility model is installed, the heat dissipation plate 21 is horizontally placed in the heat dissipation groove 13 of the base 11, and the heat dissipation plate 21 are fixed by the easy-to-tear strip 24, the limit plug 22 is welded on the heat dissipation plate 21 and is mutually matched with the connector jack 321 arranged on the column head of the connecting column 32 of the heat conductor 31, so that the heat conductor 31 and the heat dissipation plate 21 are mutually connected, the heat conductor 31 is provided with a plurality of slots 33, the heat dissipation chips 23 matched with the slots 33 are respectively arranged on the slots 33, the heat conductor 31 can gather heat generated in the 5G transmission process around the heat conductor 31, the heat conductor 31 is vertically provided with a plurality of heat dissipation chips 23, and the heat conductor 31 is arranged on the heat dissipation plate 21, the heat dissipation plate 21 and the heat dissipation chips are both made of graphene material, thereby having good horizontal heat conduction and heat resistance effects, the graphene has a special hexagonal plane, the heat can be uniformly distributed on, and can effectual transfer to can realize effective heat dissipation, if the heat is gathered on base 11, because a plurality of louvres 12 have all been seted up to four sides at base 11, the heat also can be through louvre 12 effectively dispel the heat, thereby accomplish whole radiating process.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a 5G transmission is with heat dissipation structure spare which characterized in that: comprises a base assembly (1), a heat radiation assembly (2) and a heat conduction assembly (3);

the base assembly (1) comprises a base (11), the base (11) is a cuboid, heat dissipation holes (12) are formed in four sides of the base, a heat dissipation groove (13) is formed in the top of the base (11), and the heat dissipation groove (13) is rectangular;

the heat dissipation assembly (2) comprises a heat dissipation plate (21), and the heat dissipation plate (21) horizontally covers the heat dissipation groove (13);

the heat conduction assembly (3) comprises heat conductors (31) and connecting columns (32), the number of the heat conductors (31) is four, the heat conductors (31) are parallelly and symmetrically distributed on the heat dissipation plate (21), a plurality of slots (33) distributed in an array mode are formed in the top of each heat conductor (31), and two ends of the bottom of each heat conductor (31) are fixedly connected with one connecting column (32) respectively.

2. The heat dissipation structure for 5G transmission as claimed in claim 1, wherein: the heat dissipation assembly (2) further comprises heat dissipation chips (23), the number of the heat dissipation chips (23) is consistent with that of the slots (33), and each heat dissipation chip (23) is inserted into one slot (33) respectively.

3. The heat dissipation structure for 5G transmission as claimed in claim 1, wherein: the heat dissipation plate (21) and the heat dissipation chip (23) are made of graphene.

4. The heat dissipation structure for 5G transmission as claimed in claim 1, wherein: a plurality of limiting plugs (22) are welded on the heat dissipation plate (21), and the limiting plugs (22) are mutually and symmetrically distributed on the upper surface of the heat dissipation plate (21) in parallel.

5. The heat dissipation structure for 5G transmission as claimed in claim 4, wherein: the connector plug hole (321) is formed in the column head of the connecting column (32), and the limiting plug (22) is matched with the connector plug hole (321) in the connecting column (32).

6. The heat dissipation structure for 5G transmission as claimed in claim 1, wherein: and an easy-to-tear adhesive strip (24) is arranged at the joint edge of the heat dissipation groove (13) and the heat dissipation plate (21).