CN217515107U

CN217515107U - Vehicle instrument

Info

Publication number: CN217515107U
Application number: CN202220607433.3U
Authority: CN
Inventors: 邹瀴; 陈章华; 江永斌
Original assignee: Shenzhen Xinglida Technology Co ltd
Current assignee: Shenzhen Xinglida Technology Co ltd
Priority date: 2022-03-18
Filing date: 2022-03-18
Publication date: 2022-09-30
Anticipated expiration: 2032-03-18

Abstract

The embodiment of the utility model discloses on-vehicle instrument relates to the on-vehicle instrument field. The utility model discloses a vehicle-mounted instrument, which comprises a display screen, a mainboard assembly, a radiator and a heat conduction bracket; the radiator comprises a heat conducting fin and a radiating fin. The heat conducting fins are connected with the display screen to form a cavity, and the mainboard assembly is arranged in the cavity; the heat conducting fin is connected with the surface of the mainboard assembly and can conduct heat to the mainboard assembly; the heat dissipation fins are arranged on one surface of the heat conducting fin, which is far away from the mainboard assembly, and can dissipate heat for the heat conducting fin. One end of the heat conduction support is connected with the center console, the other end of the heat conduction support is connected with the radiator, and the heat conduction support can conduct heat for the radiator. The utility model relates to a there are tertiary heat dissipation of conducting strip, heat radiation fins and heat conduction support among the on-vehicle instrument, the radiating effect is good.

Description

Vehicle instrument

Technical Field

The utility model relates to an on-vehicle instrument field especially relates to an on-vehicle instrument.

Background

The vehicle-mounted instrument is provided with a main board assembly and a display screen, and the main board assembly is a core component of the vehicle-mounted instrument. The mainboard subassembly can realize various functions of on-vehicle instrument, for example navigation function, entertainment function and vehicle state monitoring function etc.. The mainboard subassembly generates heat easily when the procedure of operation is many, can influence the function of vehicle instrument when partial mainboard subassembly generates heat, and moreover, the mainboard subassembly is located the environment of high temperature for a long time and is damaged easily, makes vehicle instrument normal use not.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides an on-vehicle instrument for solve the on-vehicle instrument among the prior art and can't carry out effective radiating problem to the mainboard subassembly.

The utility model provides a vehicle-mounted instrument, which comprises a display screen, a mainboard assembly, a radiator and a heat conduction bracket; the radiator comprises a heat conducting fin and a radiating fin.

The heat-conducting fins are connected with the display screen to form a cavity, and the mainboard assembly is arranged in the cavity.

The heat conducting fins are connected with the surface of the main board assembly and can conduct heat to the main board assembly.

The heat dissipation fins are arranged on one surface of the heat conducting fins, which is far away from the mainboard assembly, and can dissipate heat for the heat conducting fins.

One end of the heat conduction support is connected with the center console, the other end of the heat conduction support is connected with the radiator, and the heat conduction support can conduct heat for the radiator.

Implement the embodiment of the utility model provides a, will have following beneficial effect:

through being connected conducting strip and mainboard subassembly face, make mainboard subassembly's heat direct transmission to the conducting strip on, then dispel the heat, the radiating effect is good. The heat dissipation fins are arranged on the heat conduction sheet, so that the heat of the heat conduction sheet is transmitted to the heat dissipation fins, and the heat dissipation fins perform heat dissipation. The heat-conducting bracket is connected with the radiator to help the radiator to radiate heat. The vehicle-mounted instrument has three-level heat dissipation of the heat-conducting fin, the heat-radiating fins and the heat-conducting support, and the heat dissipation effect is good.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

fig. 1 is a schematic view of an overall structure of a vehicle-mounted instrument according to an embodiment of the present invention.

Fig. 2 is a schematic view of an overall structure of a heat sink according to an embodiment of the present invention.

Fig. 3 is a front view of a heat sink according to an embodiment of the present invention.

Fig. 4 is a rear view of a heat sink in an embodiment of the invention.

Fig. 5 is a left side view of a heat sink according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a motherboard assembly according to an embodiment of the present invention.

In the figure, 10, a display screen; 20. a heat sink; 21. a first through hole; 22. heat dissipation fins; 23. a heat conductive sheet; 24. a second through hole; 25. a third through hole; 26. a fourth via hole; 27. an accommodating chamber; 28. first opening; 29. a heat dissipation boss; 30. a thermally conductive support; 40. a notched rear shell; 50. a motherboard assembly; 51. a main board main body; 52. an HSD socket; 53. a power amplifier IC; 54. a capacitor; 55. a power adapter; 56. a power socket; 57. radio antenna socket.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

Refer to fig. 1 to 6. The utility model provides a vehicle-mounted instrument, including display screen 10, mainboard subassembly 50, radiator 20 and heat conduction support 30. The heat sink 20 includes a heat conductive sheet 23 and heat radiating fins 22. The heat-conducting sheet 23 is in the shape of a sheet, and the heat-conducting sheet 23 in the shape of a sheet has good heat-conducting property. The heat dissipation fins 22 can increase the area of the heat conduction sheet 23, thereby increasing the heat dissipation performance.

The heat conducting sheet 23 is connected with the display screen 10 to form a cavity, the heat conducting sheet 23 is connected with the display screen 10 on the back of the display screen 10, the area of the heat conducting sheet 23 is the same as that of the display screen 10, the heat conducting sheet 23 can serve as a rear cover of a vehicle-mounted instrument, and the cavity is formed between the rear cover and the display screen 10. When the area of the heat-conducting sheet 23 is smaller than that of the display screen 10, a small-sized cavity may be formed between the heat-conducting sheet 23 and the display screen 10. The motherboard assembly 50 is disposed in the cavity, and the heat conduction sheet 23 serves as a rear cover to protect the motherboard assembly 50.

The conducting strip 23 is connected with the 50 faces of mainboard subassembly, and conducting strip 23 can give 50 heat conduction of mainboard subassembly, and the heat of mainboard subassembly 50 can conduct for conducting strip 23, because both faces are connected, and heat transfer efficiency is showing and is improving, and heat transfer effect is good. The one side of mainboard subassembly 50 keeping away from conducting strip 23 is connected with the display screen 10 electricity, and mainboard subassembly 50 is the core component of on-vehicle instrument, and mainboard subassembly 50 can realize the various functions of on-vehicle instrument, and mainboard subassembly 50 is connected with the display screen 10 electricity, can transmit signal between mainboard subassembly 50 and the display screen 10.

The heat dissipation fins 22 are disposed on a side of the heat conductive sheet 23 away from the main board assembly 50, and the heat dissipation fins 22 can dissipate heat from the heat conductive sheet 23. The heat dissipation fins 22 increase the area of the heat conduction sheet 23, can be fully contacted with air, can dissipate heat efficiently, and have good heat dissipation effect.

One end of the heat conductive bracket 30 is connected to the console, and the other end of the heat conductive bracket 30 is connected to the heat sink 20. The heat conducting support 30 is made of metal or nonmetal heat conducting materials such as graphite and diamond, and the heat radiator 20 is connected with the heat conducting support 30, so that the heat of the heat radiator 20 can be conducted to the heat conducting support 30, the heat conducting support 30 helps the heat radiator 20 to share the heat, the heat radiator 20 can be cooled, and the heat radiator 20 has good heat radiating performance. The heat conducting support 30 also plays a role in supporting and fixing the vehicle-mounted instrument on the center console.

In one embodiment, the heat conducting sheet 23 is provided with a containing cavity 27 at a side close to the main board assembly 50, the containing cavity 27 has a cavity wall, the cavity wall protrudes from the heat conducting sheet 23, the cavity wall has a tendency to be far away from the main board assembly 50, the main board assembly 50 includes a capacitor 54 and a power adapter 55, and the capacitor 54 and the power adapter 55 are disposed in the containing cavity 27. The cavity wall protrudes out of the heat conducting sheet 23, so that the heat dissipation area is increased, the cavity wall protrudes out of the heat conducting sheet 23, the area of the side face is increased, the cavity wall is in full contact with air, and the heat dissipation effect is improved; secondly, the heat conducting area is increased because the capacitor 54 and the power adapter 55 are arranged in the accommodating cavity 27 and can be fully contacted with the inner wall of the accommodating cavity 27, and the heat of the capacitor 54 and the power adapter 55 is fully conducted to the heat conducting sheet 23 due to sufficient heat conduction. The number of the accommodating chambers 27 may be one or more. The heat dissipation effect of the accommodating cavities 27 is better, the shapes of the heat dissipation cavities 27 are designed according to the shapes of the capacitors 54 or the power adapters 55, the accommodating cavities 27 with the similar shapes are good in fitting degree with the capacitors 54 and the power adapters 55, and the heat dissipation effect is better.

In a specific embodiment, the heat-conducting sheet 23 is further provided with a heat-dissipating boss 29 protruding from the side of the heat-conducting sheet 23 close to the main board assembly 50 toward the main board assembly 50, the main board assembly 50 further comprises a power amplifier IC53, the power amplifier IC53 is an indispensable part in various audio equipment, and the function of the heat-dissipating boss is mainly to amplify a relatively weak signal input by the audio equipment and then generate a sufficiently large current to push the speaker to reproduce sound. The heat dissipation boss 29 is connected with the power amplifier IC53 surface, and the heat dissipation boss 29 dissipates heat for the power amplifier IC 53. The heat dissipation boss 29 is connected with the power amplifier IC53, the power amplifier IC53 transfers heat to the heat dissipation boss 29, the heat dissipation boss 29 transfers heat of the power amplifier IC53 to the heat conducting sheet 23, the heat conducting sheet 23 directly transfers heat to air or transfers heat to the heat dissipation fins 22, and the heat dissipation fins 22 dissipate heat.

In one embodiment, the surface of the heat dissipating boss 29 is coated with a heat dissipating paste. The heat dissipating paste is used as a medium for transferring heat, takes polysiloxane as a base, is supplemented with high-heat-conducting filler, is nontoxic, tasteless and non-corrosive, has stable chemical and physical properties, has excellent electrical insulation and excellent heat conductivity, simultaneously has high and low temperature resistance, can work for a long time, and does not have the phenomenon of air-drying hardening or melting. The heat dissipation structure is used for filling the gap between the power amplifier IC53 and the heat dissipation boss 29, and the heat dissipation effect is improved. The heat dissipation paste added in the embodiment can improve the heat transfer efficiency of the power amplifier IC53 to the heat dissipation boss 29. However, the amount of the thermal paste used is not excessive, and excessive use adversely affects the heat transfer effect.

In one particular embodiment, one or both of the heat sink 20 and the thermally conductive holder 30 are black. The black color is the best heat absorption and dissipation compared to other colors, and therefore, to ensure the best heat dissipation effect, the colors of the heat sink 20 and the heat conductive bracket 30 are selected to be black, and may be black materials, or black treatment, such as coating black paint. Like this, in one side of laminating mainboard subassembly 50, can carry out abundant heat absorption, can fully dispel the heat in the one side that deviates from mainboard subassembly 50, effectively promote the radiating effect. After the accommodating cavity 27 and the heat dissipating fins 22 in the heat sink 20 are set to be black, the heat dissipating effect can be further improved.

In a specific embodiment, the heat-conducting sheet 23, the radiator fins 22, and the heat-conducting support are selected from one or both of metal and heat-conducting nonmetal. Wherein the metal is preferably one or more of aluminum, iron and copper. Wherein, the order of the heat transfer speed of the three is as follows: copper is more than aluminum and iron, and copper and aluminum are preferably selected as the materials of the heat conducting fins 23 and the heat radiating fins 22, so that the heat conducting fin has higher heat conducting performance; the non-metal is preferably graphite or diamond. The heat conducting support also has a supporting function, and a material which is heat conducting and has higher strength needs to be selected, so that the heat conducting support is preferably made of an iron material.

In one embodiment, the vehicle instrument further includes a rear case 40, the rear case 40 and the heat-conducting strip 23 are combined to form a complete rear case, and the complete rear case is connected with the display screen 10 to form a cavity. The notch rear shell 40 is provided in the embodiment because the main board assembly 50 includes the main board body 51, the heat generation amount of the main board body 51 is not large than the heat generation amounts of the capacitor 54, the power adapter 55 and the power amplifier IC53, the heat-conducting sheet 23 is not required to be used as the whole rear shell, the notch rear shell 40 is used at a position with small heat generation amount, and the cost can be reduced.

In one embodiment, the thermally conductive holder 30 is removably attached to the cooling fins 22. The detachable connection improves the convenience of the vehicle-mounted instrument. The connection position is selected at the heat dissipation fins 22 because the heat conduction sheet 23 covers many electronic components in the motherboard assembly 50, thereby avoiding damage to the electronic components during the detachment process.

In one embodiment, the heat dissipating fins 22 are provided with first through holes 21, the heat conducting bracket 30 is provided with matching through holes, and the screws pass through the first through holes 21 and the matching through holes to be detachably connected with the nuts. The screw and nut have high matching stability and lower cost.

In one particular embodiment, the shape of the thermally conductive holder 30 includes a sheet, a holder, a tube, or a honeycomb. Wherein the sheet shape and the honeycomb shape are beneficial to heat dissipation. Preferably, the thermally conductive support 30 is an iron sheet.

In one embodiment, the heat-conducting sheet 23 is provided with a second through-hole 24, a third through-hole 25, and a fourth through-hole 26. The mainboard assembly 50 comprises a radio antenna socket 57, a power socket 56 and an HSD socket 52, wherein the HSD socket 52 is a high speed data socket, namely a high speed transmission socket, and has the same function as a high speed transmission connector; the radio antenna socket 57, the power socket 56 and the HSD socket 52 are all provided on the main board body 51. The second through hole 24 is arranged corresponding to the position of the radio antenna socket 57, the third through hole 25 is arranged corresponding to the position of the power socket 56, and the fourth through hole 26 is arranged corresponding to the position of the HSD socket 52.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. A vehicle-mounted instrument is characterized by comprising a display screen, a mainboard assembly, a radiator and a heat conduction bracket; the radiator comprises a heat conducting fin and a heat radiating fin;

the heat conducting fins are connected with the display screen to form a cavity, and the mainboard assembly is arranged in the cavity;

the heat conducting fin is connected with the surface of the mainboard assembly and can conduct heat to the mainboard assembly;

the heat dissipation fins are arranged on one surface of the heat conducting fins, which is far away from the mainboard assembly, and can dissipate heat for the heat conducting fins;

2. The vehicle instrument of claim 1, wherein a side of the heat conductive sheet adjacent to the main board assembly is provided with a receiving cavity having a cavity wall protruding from the heat conductive sheet, the cavity wall having a tendency to move away from the main board assembly, the main board assembly including a capacitor and a power adapter, the capacitor and the power adapter being disposed in the receiving cavity.

3. The vehicle-mounted instrument of claim 2, wherein the heat-conducting plate further comprises a heat-dissipating boss protruding from a side of the heat-conducting plate close to the main board assembly toward the main board assembly, the main board assembly further comprises a power amplifier IC, the heat-dissipating boss is connected with a surface of the power amplifier IC, and the heat-dissipating boss dissipates heat for the power amplifier IC.

4. The vehicle instrument of claim 3, wherein a surface of the heat dissipating boss is coated with a heat dissipating paste.

5. The on-board meter of claim 4, wherein one or both of the heat sink and the thermally conductive bracket are black.

6. The vehicle instrument of claim 5, wherein the heat-conducting fin, the heat-radiating fin, and the heat-conducting bracket are selected from one or both of a metal and a heat-conducting nonmetal.

7. The vehicle instrument according to any one of claims 1 to 6, further comprising a notched rear case, wherein the notched rear case and the heat-conducting fin are combined to form a complete rear case.

8. The vehicle instrument of claim 1, wherein said thermally conductive bracket is removably attached to said heat sink fins.

9. The vehicle-mounted instrument according to claim 8, wherein a first through hole is formed in the heat dissipation fin, a matching through hole is formed in the heat conduction support, and a screw passes through the first through hole and the matching through hole and is detachably connected with a nut.

10. The vehicle instrument according to claim 1,

the heat conducting fin is provided with a second through hole, a third through hole and a fourth through hole;

the mainboard assembly comprises a radio antenna socket, a power socket and an HSD socket; the second through hole is arranged corresponding to the position of the radio antenna socket, the third through hole is arranged corresponding to the position of the power socket, and the fourth through hole is arranged corresponding to the position of the HSD socket.