CN216207057U - Infrared thermal imaging core heat radiation structure - Google Patents
Infrared thermal imaging core heat radiation structure Download PDFInfo
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- CN216207057U CN216207057U CN202122761505.8U CN202122761505U CN216207057U CN 216207057 U CN216207057 U CN 216207057U CN 202122761505 U CN202122761505 U CN 202122761505U CN 216207057 U CN216207057 U CN 216207057U
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- heat
- thermal imaging
- infrared thermal
- infrared
- heat dissipation
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Abstract
The utility model discloses a heat dissipation structure of an infrared thermal imaging machine core, which relates to the technical field of heat dissipation devices and solves the technical problem that the overall installation is influenced due to the fact that the existing front heat dissipation structure is too large.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to the technical field of a heat dissipation structure of an infrared thermal imaging core.
Background
The heating chip on the PCB inside the infrared thermal imaging product conducts heat to the air through the radiating fins, or conducts the heat to the shell through the radiating fins. The prior art has two solutions, one is that the heat of a heating chip on a PCB circuit board in an infrared thermal imaging product is conducted to the air through a heat radiating fin and a heat conducting medium between the heat radiating fin and the chip, but the heat radiating fin is generally adhered to the heating chip through glue, and the heat radiating fin can fall off due to vibration and the like along with the prolonging of time, so that the heating chip loses heat conducting capability, the chip is overheated, and the normal work of the product is not facilitated; secondly, the heat-generating chip on the PCB inside the infrared thermal imaging product conducts heat to the air through the heat-radiating fins and the heat-conducting medium between the heat-radiating fins and the chip, but the heat-radiating fins of the scheme generally occupy larger space on the front surface of the chip, certain products cannot allow the larger space, and the heat-radiating structure has limitation. Therefore, the problem that the heat dissipation fins cannot be placed due to the fact that the heat dissipation fins fall off and the space near the heating chip is insufficient due to the fact that glue of the heat dissipation fins works and is aged for a long time in an infrared thermal imaging product is solved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to: in order to solve the technical problem, the utility model provides a heat radiation structure of an infrared thermal imaging machine core.
The technical scheme adopted by the utility model is as follows: the utility model provides an infrared thermal imaging core heat radiation structure, includes protecgulum and infrared core heat radiation structure, protecgulum and infrared core heat radiation structure threaded connection, infrared core heat radiation structure includes conducting strip, flexible heat conduction pad and PCB circuit board, be provided with the chip that generates heat on the PCB circuit board, should generate heat and fill up on the chip and have flexible heat conduction pad and compress tightly the back with the conducting strip, reuse screw fastening, compress tightly the back with flexible heat conduction pad through the conducting strip, reuse screw fastening is connected, makes the clearance of the chip and the conducting strip that generates heat fill, even with very long time, also can not make the conducting strip drop because of glue is ageing, loses the radiating effect.
The heat-conducting fin is a backward bending structure, is fully unfolded to dissipate heat backwards, and frees the heat dissipation space in front, so that the problem that the heat dissipation fins cannot be placed due to insufficient space near the heating chip can be solved.
The section of the heat conducting fin bent backwards to be L-shaped or bent backwards is snake-shaped, can conduct heat linearly or in a zigzag manner, and can be designed according to a rear space.
Infrared core heat radiation structure still includes mounting panel and fixed block, be provided with the mounting panel between PCB circuit board and the fixed block to with screwed connection, make the structure more stable, play the absorbing effect of protection to PCB circuit board.
The PCB is connected with the mounting plate through 3 screws in a triangular threaded manner, 2 screws are connected with the fixing block, and the triangle is stable in each structure and saves spare and accessory parts.
The heat conducting fins are connected with the fixing blocks through screws, so that components mounted on the fixing blocks can be tightly attached to the heat conducting fins.
The mounting panel is triangle-shaped threaded connection with 3 screws for the protecgulum, and connection structure is stable.
The heat conducting fin is made of iron, aluminum or copper, so that the heat conducting fin is good in heat conducting performance and low in cost.
The flexible heat conducting pad is a heat conducting pad or a heat conducting insulating silica gel pad filled with a liquid heat conducting medium, and is good in elasticity and strong in heat conductivity.
In summary, due to the adoption of the technical scheme, the utility model has the beneficial effects that:
the utility model improves the reliability and the service life of the infrared thermal imaging product, and solves the problems that the heat radiating fins fall off due to vibration caused by long-time working aging of the glue of the heat radiating fins in the infrared thermal imaging product and the heat radiating fins cannot be placed due to insufficient space near the heating chip.
Drawings
The utility model will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of an infrared movement of the present invention with the front cover disassembled;
fig. 3 is an exploded view of the heat dissipation structure of the infrared movement of the present invention;
labeled as: the method comprises the following steps of 1-front cover, 2-infrared movement heat dissipation structure, 3-screw, 4-heat conducting fin, 5-flexible heat conducting pad, 6-PCB, 7-mounting plate, 8-fixing block and 9-heating chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-3, this embodiment provides an infrared thermal imaging core heat radiation structure, including protecgulum 1 and infrared core heat radiation structure 2, protecgulum 1 and infrared core heat radiation structure 2 threaded connection, infrared core heat radiation structure 2 includes conducting strip 4, flexible heat conduction pad 5 and PCB circuit board 6, be provided with the chip 9 that generates heat on the PCB circuit board 6, should generate heat and fill up on the chip 9 and have flexible heat conduction pad 5 and compress tightly with conducting strip 4 after, reuse screw 3 fastening, compress tightly flexible heat conduction pad 5 through conducting strip 4, reuse screw 3 fastening connection, make the clearance of generating heat chip 9 and conducting strip 4 fill, even with very long time, also can not make conducting strip 4 drop because of glue is ageing, lose the radiating effect.
Example 2
On the basis of embodiment 1, the heat conducting fin 4 is a backward bending structure, and is fully unfolded to dissipate heat backward, so that the heat dissipating space in front is freed, and the problem that the heat dissipating fins cannot be placed due to insufficient space near the heat generating chip 9 can be solved.
Example 3
On the basis of embodiment 2, the section of the heat conducting fin 4 bent backward to be L-shaped or bent backward is snake-shaped, and can conduct heat linearly or in a zigzag manner, and can be designed according to the space behind.
Example 4
On the basis of embodiment 1, infrared core heat radiation structure 2 still includes mounting panel 7 and fixed block 8, be provided with mounting panel 7 between PCB circuit board 6 and the fixed block 8 to connect with screw 3, make the structure more stable, play the absorbing effect of protection to PCB circuit board 6.
Example 5
On the basis of embodiment 4, the PCB 6 and the mounting plate 7 are connected by 3 screws 3 in a triangular thread, wherein 2 screws 3 are further connected with a fixing block 8, and the triangle is more stable in each structure and saves more parts.
Example 6
On the basis of embodiment 4, the heat-conducting sheet 4 is connected to the fixing block 8 by the screw 3, so that the member mounted on the fixing block 8 can be closely attached to the heat-conducting sheet 4.
Example 7
On the basis of embodiment 4, the mounting plate 7 and the front cover 1 are connected in a triangular thread manner by using 3 screws 3, and the connection structure is stable.
Example 8
On the basis of the embodiment 1, the heat conducting sheet 4 is made of iron, aluminum or copper, so that the heat conducting performance is good, and the cost is low.
Example 9
On the basis of embodiment 1, the flexible heat conducting pad 5 is a heat conducting pad or a heat conducting insulating silica gel pad filled with a liquid heat conducting medium, and has good elasticity and strong heat conductivity.
The working principle of the utility model is as follows: when the infrared movement heat dissipation structure 2 is installed, heat of the heating chip 9 is conducted to the flexible heat conduction pad 5 and the heat conduction sheet 4, the heat conduction sheet 4 is arranged behind in a bending mode, front space is saved, and the infrared movement heat dissipation structure 2 is stable and anti-seismic for a long time; the specific assembly steps of the infrared movement heat dissipation structure 2 are as follows: fixing the heat conducting sheet 4 and the flexible heat conducting pad 5 on the PCB 6 and the mounting plate 7 by 1 screw 3, fastening the screw 3 on the fixing block 8, tightly pressing the flexible heat conducting pad 5 between the heating chip 9 and the heat conducting sheet 4, and filling the assembly gap with the flexible heat conducting pad 5; the PCB 6 and the mounting plate 7 are fastened on the fixing block 8 by 2 screws 3; then 1 screw 3 is used for reinforcing and fastening the PCB 6 on the mounting plate 7; after the infrared movement heat dissipation structure 2 is installed, the installation plate 7 is fastened on the front cover 1 together with the 3 screws 3, and then the infrared movement heat dissipation structure can be fixed on the front cover 1.
Claims (9)
1. The utility model provides an infrared thermal imaging core heat radiation structure, includes protecgulum (1) and infrared core heat radiation structure (2), protecgulum (1) and infrared core heat radiation structure (2) threaded connection, its characterized in that, infrared core heat radiation structure (2) are provided with chip (9) that generate heat on this PCB circuit board (6) including conducting strip (4), flexible heat conduction pad (5) and PCB circuit board (6), should generate heat chip (9) and go up to fill up and have flexible heat conduction pad (5) and compress tightly the back with conducting strip (4), reuse screw (3) fastening.
2. An infrared thermal imaging movement heat dissipation structure according to claim 1, wherein the heat conductive sheet (4) is of a bent-back structure.
3. The thermal imaging core cooling structure according to claim 2, wherein the section of the heat conducting sheet (4) bent backward in an L shape or bent backward in a serpentine shape.
4. The infrared thermal imaging movement heat dissipation structure according to claim 1, wherein the infrared thermal imaging movement heat dissipation structure (2) further comprises a mounting plate (7) and a fixing block (8), the mounting plate (7) is arranged between the PCB circuit board (6) and the fixing block (8), and the mounting plate (7) is connected with the fixing block (8) through a screw (3).
5. The infrared thermal imaging movement heat dissipation structure according to claim 4, wherein the PCB circuit board (6) and the mounting plate (7) are in triangular threaded connection with 3 screws (3), wherein 2 screws (3) are further connected with the fixing block (8).
6. The infrared thermal imaging movement heat dissipation structure according to claim 4, wherein the heat conduction sheet (4) is connected with the fixing block (8) through a screw (3).
7. The infrared thermal imaging movement heat dissipation structure according to claim 4, wherein the mounting plate (7) and the front cover (1) are in triangular threaded connection by using 3 screws (3).
8. An infrared thermal imaging movement heat radiation structure according to claim 1, characterized in that said heat conducting sheet (4) is made of iron or aluminum or copper.
9. The infrared thermal imaging movement heat dissipation structure according to claim 1, wherein the flexible heat conduction pad (5) is a heat conduction pad filled with a liquid heat conduction medium or a heat conduction insulating silicone pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122761505.8U CN216207057U (en) | 2021-11-11 | 2021-11-11 | Infrared thermal imaging core heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122761505.8U CN216207057U (en) | 2021-11-11 | 2021-11-11 | Infrared thermal imaging core heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216207057U true CN216207057U (en) | 2022-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122761505.8U Active CN216207057U (en) | 2021-11-11 | 2021-11-11 | Infrared thermal imaging core heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216207057U (en) |
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2021
- 2021-11-11 CN CN202122761505.8U patent/CN216207057U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 215, Building 7, Zhangqi Technology Business Incubator, No. 70, Zhongshan Port Avenue, Torch Development Zone, Zhongshan City, Guangdong Province, 528400 Patentee after: Guangdong Langyi Intelligent Technology Co.,Ltd. Address before: 528436 zone 209b, building 7, Zhangqi technology business incubator, No. 70, Zhongshan port Avenue, Torch Development Zone, Zhongshan City, Guangdong Province Patentee before: Zhongshan Langyi Intelligent Technology Co.,Ltd. |
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| CP03 | Change of name, title or address |