CN210377350U

CN210377350U - Radiating fin for notebook computer

Info

Publication number: CN210377350U
Application number: CN201921552348.6U
Authority: CN
Inventors: 向兵
Original assignee: Shenzhen Yongmao Technology Co Ltd
Current assignee: Shenzhen Yongmao Technology Co Ltd
Priority date: 2019-09-18
Filing date: 2019-09-18
Publication date: 2020-04-21
Anticipated expiration: 2029-09-18

Abstract

The utility model discloses a fin for notebook computer is last, the utility model discloses a fin includes two parts, is CPU lid fishplate bar and heat dissipation lamination respectively. The CPU cover plate is used for covering and fixing the CPU and has a heat dissipation function, and one side of the CPU cover plate is provided with an L-shaped bent plate which abuts against the shell of the notebook computer. The heat dissipation lamination is stacked together by a plurality of heat dissipation fin bodies, and it has the heat dissipation function and has the function of supporting tightly the notebook casing, and its height-adjustable is in order to cooperate different notebook casings, has the heat conduction to the notebook shell after with the casing contact, helps the heat dissipation. The utility model discloses a fin improves CPU's radiating efficiency and the stability of CPU installation. The radiating fin body and the CPU cover connecting plate are both sprayed with radiating paint, and the radiating paint increases the thermal conductivity and also effectively protects the radiating fin body and the CPU cover connecting plate body.

Description

Radiating fin for notebook computer

Technical Field

The utility model relates to a fin, specific saying so relates to a fin for on notebook computer.

Background

The main heating areas on the notebook computer are the CPU, the display card and the power supply, the CPU dissipates heat by air cooling, and the notebook computer has small volume and thin thickness, and the air cooling heat dissipation needs to arrange a fan device on the CPU, and the fan device is matched with the air pipe to dissipate heat of the heating source.

Because CPU, display card and power need the heat conductor to lead the heat to the outside, consequently, how to improve the stability of radiating efficiency and heat dissipation installation is the utility model discloses a problem that needs the solution.

SUMMERY OF THE UTILITY MODEL

To the not enough among the prior art, the to-be-solved technical problem of the utility model lies in providing a fin for notebook computer is last, and the purpose of designing this fin is the stability that improves CPU's radiating efficiency and CPU installation.

In order to solve the technical problem, the utility model discloses a following scheme realizes: a heat sink for a notebook computer, the heat sink being disposed at a CPU heat dissipating portion of the notebook computer, comprising:

the CPU cover connecting plate comprises a square box body with an opening on one surface, convex plates are connected along the edges of three side edges of the opening of the square box body, and an L-shaped bent plate is connected to the fourth side surface of the square box body to tightly abut against the shell of the notebook computer;

the two groups of heat dissipation laminated sheets are respectively arranged on two sides of the square box body and are pressed and held on the convex plate through screws, the convex plate is fixed on the notebook shell, and the heat dissipation laminated sheets comprise a plurality of heat dissipation sheet bodies which are overlapped together.

Furthermore, after the CPU cover plate is fixed, one surface of the L-shaped bent plate is parallel to the cover surface of the square box body.

Furthermore, the radiating fin body is Z-shaped, and two corners of the radiating fin body are larger than 120 degrees.

Furthermore, the surface of the CPU cover connection plate is sprayed with first heat dissipation paint.

Further, the first heat-dissipating paint is a paint layer formed of nanoparticles.

Further, the height of the heat dissipation lamination is greater than or equal to the height of the plane part of the L-shaped bent plate.

Furthermore, the surface of the radiating fin body is sprayed with second radiating paint.

Further, the second heat-dissipating paint is a paint layer formed of nanoparticles.

Furthermore, the CPU cover connection plate is a copper plate body.

Further, the heat dissipation lamination is an aluminum alloy sheet.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a fin includes two parts, is CPU lid fishplate bar and heat dissipation lamination respectively. The CPU cover plate is used for covering and fixing the CPU and has a heat dissipation function, and one side of the CPU cover plate is provided with an L-shaped bent plate which abuts against the shell of the notebook computer. The heat dissipation lamination is stacked together by a plurality of heat dissipation fin bodies, and it has the heat dissipation function and has the function of supporting tightly the notebook casing, and its height-adjustable is in order to cooperate different notebook casings, has the heat conduction to the notebook shell after with the casing contact, helps the heat dissipation. The utility model discloses a fin improves CPU's radiating efficiency and the stability of CPU installation. The radiating fin body and the CPU cover connecting plate are both sprayed with radiating paint, and the radiating paint increases the thermal conductivity and also effectively protects the radiating fin body and the CPU cover connecting plate body.

Drawings

Fig. 1 is a schematic diagram of the position of the heat sink installed in the notebook housing according to the present invention.

Fig. 2 is a schematic view of the structure of the heat sink of the present invention.

Fig. 3 is a schematic view of the structure of the heat sink sheet of the present invention.

Fig. 4 is a schematic diagram of the structure of the CPU cover plate of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Embodiment 1, the utility model discloses a specific structure as follows:

referring to fig. 1-4, the present invention provides a heat sink for a notebook computer, wherein the heat sink 4 is disposed in a CPU heat sink portion of the notebook computer, and includes:

a CPU cover board 41, which comprises a square box body with an opening on one side, wherein a convex board 42 is connected along the edges of three sides of the opening of the square box body, and the fourth side of the CPU cover board is connected with an L-shaped bent board to tightly abut against the shell of the notebook computer;

two sets of heat dissipation lamination 43, the branch live in the both sides of square box body and through the screw pressure hold in on the flange 42 and its with the flange 42 is fixed on the notebook casing, heat dissipation lamination 43 includes a plurality of fin lamellar bodies, and a plurality of fin lamellar bodies are folded together.

A preferred technical solution of this embodiment: after the CPU cover plate 41 is fixed, one surface of the L-shaped bent plate is parallel to the cover surface of the square box body.

A preferred technical solution of this embodiment: the radiating fin body is Z-shaped, and two corners of the radiating fin body are larger than 120 degrees.

A preferred technical solution of this embodiment: the surface of the CPU cover attaching plate 41 is sprayed with a first heat dissipating paint.

A preferred technical solution of this embodiment: the first heat-dissipating paint is a paint layer formed of nanoparticles.

A preferred technical solution of this embodiment: the height of the heat dissipation lamination 43 is greater than or equal to the height of the plane part of the L-shaped bent plate.

A preferred technical solution of this embodiment: and spraying second heat dissipation paint on the surface of the heat dissipation fin body.

A preferred technical solution of this embodiment: the second heat-dissipating paint is a paint layer formed of nanoparticles.

A preferred technical solution of this embodiment: the CPU cover plate 41 is a copper plate.

A preferred technical solution of this embodiment: the heat dissipation lamination 43 is an aluminum alloy sheet.

Example 2:

as shown in fig. 1, a heat dissipation fan device 2 is installed on the notebook computer casing, a fan 3 is disposed on the heat dissipation fan device 2, an air inlet end of the heat dissipation fan device 2 is connected with a plurality of copper heat dissipation pipes 1, the plurality of copper heat dissipation pipes 1 respectively extend to a display card, a CPU and a power supply, and through the operation of the heat dissipation fan device 2, the air inside the notebook computer casing is pumped out to form air-cooling heat dissipation.

Example 3:

the utility model discloses in, CPU fishplate bar 41 lid is on CPU5, and the flange thickness at CPU fishplate bar 41 edge is 1.5mm, and the thickness of fin lamellar body 431 is 1.5mm, passes through the screw fixation after the coincide of a plurality of fin lamellar body 431, and it highly will be flat mutually with L type bent plate at least.

Example 4:

CPU generates heat, and its heat sends into CPU fishplate bar 41 through the heat transfer on, CPU fishplate bar 41 passes through first heat dissipation lacquer and transmits for notebook shell inner chamber, fin lamellar body 431 and L type bent plate, and L type bent plate supports in the notebook casing, and its heat passes through L type bent plate and transmits for the notebook casing, improves the radiating efficiency. The radiating fin body 431 is determined according to the height of the CPU cover plate, if the height is not enough, the radiating fin body 431 is added to be flat, the upper end face of the radiating fin body abuts against the notebook shell, the part of the heat received by the radiating fin body is radiated to the inner cavity of the notebook, and the top face of the radiating fin body is transmitted to the notebook shell. The heat in the inner cavity can be extracted by the heat radiation fan device.

Example 5:

the first heat dissipation paint and the second heat dissipation paint are both selected from ZS-411 heat dissipation paint solutions, the diameters of the heat dissipation paint solutions are smaller than 100 nanometers, and the heat dissipation paint solution film-forming bodies cover the outer surfaces of the heat dissipation fins.

To sum up, the utility model discloses a fin includes two parts, is CPU lid fishplate bar and heat dissipation lamination respectively. The CPU cover plate is used for covering and fixing the CPU and has a heat dissipation function, and one side of the CPU cover plate is provided with an L-shaped bent plate which abuts against the shell of the notebook computer. The heat dissipation lamination is stacked together by a plurality of heat dissipation fin bodies, and it has the heat dissipation function and has the function of supporting tightly the notebook casing, and its height-adjustable is in order to cooperate different notebook casings, has the heat conduction to the notebook shell after with the casing contact, helps the heat dissipation. The utility model discloses a fin improves CPU's radiating efficiency and the stability of CPU installation. The radiating fin body and the CPU cover connecting plate are both sprayed with radiating paint, and the radiating paint increases the thermal conductivity and also effectively protects the radiating fin body and the CPU cover connecting plate body.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims

1. A fin for notebook computer, its characterized in that: this heat sink (4) is provided in a CPU heat dissipating section of a notebook computer, and includes:

the CPU cover plate (41) comprises a square box body with an opening on one side, a convex plate (42) is connected along the edges of three side edges of the opening of the square box body, and an L-shaped bent plate is connected to the fourth side surface of the square box body to tightly abut against the shell of the notebook computer;

two sets of heat dissipation lamination (43), the branch live in the both sides of square box body are held through the screw pressure on flange (42) and its with flange (42) are fixed on the notebook casing, heat dissipation lamination (43) include a plurality of fin lamellar bodies (431), superpose together.

2. The heat sink for the notebook computer as claimed in claim 1, wherein: after the CPU cover plate (41) is fixed, one surface of the L-shaped bent plate is parallel to the cover surface of the square box body.

3. The heat sink for the notebook computer as claimed in claim 1, wherein: the radiating fin body (431) is Z-shaped, and two corners of the radiating fin body are larger than 120 degrees.

4. The heat sink for the notebook computer as claimed in claim 1, wherein: and a first heat dissipation paint is sprayed on the surface of the CPU cover connection plate (41).

5. The heat sink for the notebook computer as claimed in claim 4, wherein: the first heat-dissipating paint is a paint layer formed of nanoparticles.

6. The heat sink for the notebook computer as claimed in claim 1, wherein: the height of the heat dissipation lamination (43) is larger than or equal to that of the plane part of the L-shaped bent plate.

7. The heat sink for the notebook computer as claimed in claim 1, wherein: and the surface of the radiating fin sheet body (431) is sprayed with second radiating paint.

8. The heat sink for the notebook computer as claimed in claim 7, wherein: the second heat-dissipating paint is a paint layer formed of nanoparticles.

9. The heat sink for the notebook computer as claimed in claim 1, wherein: the CPU cover connecting plate (41) is a copper plate body.

10. The heat sink for the notebook computer as claimed in claim 1, wherein: the heat dissipation lamination (43) is an aluminum alloy sheet body.