CN216673642U - Radio frequency power supply - Google Patents
Radio frequency power supply Download PDFInfo
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- CN216673642U CN216673642U CN202122906868.6U CN202122906868U CN216673642U CN 216673642 U CN216673642 U CN 216673642U CN 202122906868 U CN202122906868 U CN 202122906868U CN 216673642 U CN216673642 U CN 216673642U
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- heat dissipation
- heat
- power supply
- radio frequency
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses a radio frequency power supply which comprises a box body, a heat radiating piece and a first fan, wherein two ends of the heat radiating piece are connected with a coaming and a bottom plate of the box body, and the butt joint part of the heat radiating piece is in butt joint with a heating device in the radio frequency power supply and is used for conducting heat generated by the heating device to the bottom plate and the coaming so as to accelerate heat radiation in the heating device and the radio frequency power supply.
Description
Technical Field
The utility model relates to the field of power supplies, in particular to a radio frequency power supply.
Background
The radio frequency power supply can generate sine wave voltage with fixed frequency, the frequency is in the radio frequency range of about 3 KHz-300 GHz, and the power supply has certain power. Since the rf power source has a certain energy conversion rate, which is generally in the range of 0.2-0.95, the remaining energy is converted into internal heat generation of the circuit. For a radio frequency power supply capable of outputting multiple independent power supplies, the heat generated inside the radio frequency power supply is further increased due to the increase of the number of paths and the total power, so that the radio frequency power supply with better heat dissipation conditions is urgently needed.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a radio frequency power supply and aims to solve the problem that the existing radio frequency power supply is low in heat dissipation efficiency.
To achieve the above object, the present invention provides a radio frequency power supply, including:
the box body comprises a bottom plate, a surrounding plate and a cover plate, wherein a first heat dissipation hole is formed in the bottom plate, and a second heat dissipation hole is formed in the cover plate;
two ends of the heat dissipation part are connected with the enclosing plate, and the lower end of the heat dissipation part is butted with a heating device in the radio frequency power supply;
and the first fan is arranged at the second heat radiating hole and faces the heat radiating piece.
In one embodiment, the heat dissipation member includes vertically disposed pillars and a connection portion connecting upper ends of the two pillars, and a butt portion for butt joint with the heat generating device is formed on a lower surface of the connection portion.
In one embodiment, the enclosing plate comprises two end plates which are oppositely arranged and side plates which are connected with the two end plates, one end of the heat dissipation member is connected with one side plate, and the other end of the heat dissipation member is connected with the other side plate.
In one embodiment, the side plate is provided with a first limit groove corresponding to the upright post, and the bottom plate is further provided with a second limit groove corresponding to the upright post; and vertical heat dissipation grooves are formed in the inner sides of the enclosing plates.
In one embodiment, the radio frequency power supply further comprises a PCB board attached to the upper surface of the base board, the heating device comprises a main heating unit and a secondary heating unit arranged on the PCB board, and the number of the heat dissipation members is two, wherein one of the heat dissipation members is abutted to the main heating unit, and the other heat dissipation member is abutted to the secondary heating unit.
In an embodiment, the cover plate is provided with two second heat dissipation holes, and the two second heat dissipation holes are respectively provided with the first fans, wherein one of the first fans is disposed toward one of the heat dissipation members, and the other of the first fans is disposed toward the other heat dissipation member.
In an embodiment, the bottom plate is further provided with a mounting hole corresponding to the main heating unit, a heat dissipation block is arranged in the mounting hole, and the upper surface of the heat dissipation block is arranged in a manner of being attached to the PCB.
In one embodiment, the bottom plate and the enclosure plate are made of aluminum or aluminum alloy, and the heat dissipation block is made of copper or copper alloy.
In an embodiment, the rf power further includes a heat dissipation fin plate disposed on the lower surface of the bottom plate, and a second fan disposed on the heat dissipation fin plate, the heat dissipation fin plate further includes a third heat dissipation hole abutting against the first heat dissipation hole, and the second fan is disposed at the third heat dissipation hole.
In an embodiment, the heat dissipation fin plate includes a base plate and fins disposed on a lower surface of the base plate, two second fans are disposed on the lower surface of the base plate side by side, the fins are located at air outlets of the second fans, and extending directions of the fins are consistent with directions of the air outlets.
According to the utility model, the radio frequency power supply comprising the box body, the heat radiating part and the first fan is arranged, so that the two ends of the heat radiating part are connected with the enclosing plate and the bottom plate of the box body, and the butt joint part of the heat radiating part is in butt joint with the heating device in the radio frequency power supply and is used for conducting heat generated by the heating device to the bottom plate and the enclosing plate, thereby accelerating the heat radiation in the heating device and the radio frequency power supply.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of an RF power supply according to an embodiment of the present invention;
FIG. 2 is a schematic view of the mounting structure of the first and second heat dissipating bridges in the embodiment of FIG. 1;
FIG. 3 is a schematic structural diagram of a left side plate or a right side plate in the embodiment of FIG. 1;
FIG. 4 is a schematic structural diagram of a first heat sink bridge in the embodiment of FIG. 1;
FIG. 5 is a schematic diagram of an RF power supply according to another embodiment of the present invention;
FIG. 6 is a schematic diagram of an alternative view of the RF power source of the embodiment of FIG. 4;
fig. 7 is a schematic structural diagram of the bottom plate in the embodiment of fig. 1.
The reference numbers illustrate:
reference numerals | Name (R) | Reference numerals | Name (R) | |
10 | |
11 | |
|
11a | A first |
11b | |
|
11c | Extension end | 11d | |
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12 | |
12a | |
|
12b | |
| Connecting hole | |
13 | |
13a | Second avoiding |
|
14 | |
14a | Second |
|
15 | |
20 | |
|
21 | |
21a | |
|
21b | |
30 | First |
|
31 | First |
32 | First connecting |
|
33 | Butt |
34 | |
|
35 | |
36 | |
|
37 | |
40 | Second |
|
51 | |
52 | Third |
|
53 | |
54 | Fourth |
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55 | Third fan |
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a radio frequency power supply, and referring to fig. 1 to 7, the radio frequency power supply includes a case 10, a PCB 20, a first heat dissipation bridge 30, and a first fan 15. The box body 10 comprises a bottom plate 11, a surrounding plate 12 and a cover plate 14, wherein a first heat dissipation hole 11a is formed in the bottom plate 10, and a second heat dissipation hole 14a is formed in the cover plate 14; the PCB 20 is arranged on the bottom plate 10 and comprises two heating devices, two ends of the first heat dissipation bridge 30 are connected with the enclosing plate 12, and the lower end of the first heat dissipation bridge extends downwards to form a butt joint part 33 which is in butt joint with the heating devices; the first fan 15 is disposed at the second heat dissipation hole 14 a.
In the present invention, a radio frequency power supply including a box 10, a PCB 20, heat dissipation members, and a first fan 15 is provided, so that two ends of each heat dissipation member are connected to the enclosure 12 and the bottom plate 10 of the box 10. The two butt-joint parts 33 of the first heat-dissipating bridge 30 are butt-jointed with the two heating devices inside the radio frequency power supply, and are used for conducting heat generated by the heating devices to the bottom plate 11 and the enclosing plate 12, so as to accelerate heat dissipation inside the radio frequency chip 21 and the radio frequency power supply.
In an embodiment, referring to fig. 1 to 7, the first heat dissipating bridge 30 includes two first pillars 31 vertically disposed and a first connecting portion 32 connecting upper ends of the two first pillars 31, the abutting portion 33 is disposed between the two first pillars 31, and the abutting portion 33 extends downward from a lower surface of the first connecting portion 32. The butt joint part 33 is butt jointed with a heating device in the radio frequency power supply and is used for conducting heat generated by the heating device to the bottom plate 11 and the coaming 12 so as to accelerate heat dissipation of the heating device and the radio frequency power supply.
In an embodiment, referring to fig. 1 to 7, the first heat dissipating bridge 30 further includes a mounting groove 34 recessed downward from an upper surface of the first connecting portion 32, and two ends of the mounting groove 34 are located directly above the first connecting portion 32. In this embodiment, the mounting groove 34 is used for being abutted against the first fan 15, so as to accelerate the air circulation at both sides of the first heat dissipating bridge 30 and improve the heat dissipating efficiency.
In an embodiment, referring to fig. 1 to 7, the first heat dissipating bridge 30 further includes a first groove 35 disposed at a bottom of the mounting groove 34 and extending downward to a middle portion of the first connecting portion 32, and the first groove 35 extends from one of the first connecting portions 32 to the other first connecting portion 32. In the embodiment, the first groove 35 is disposed to increase the heat dissipation area, so that the airflow generated by the heat dissipation fan can take away more heat.
In an embodiment, referring to fig. 1 to 7, two first columns 31 are symmetrically disposed, two abutting portions 33 are also symmetrically disposed, and a symmetry plane of the first column 31 is coplanar with a symmetry plane of the abutting portions 33. In this embodiment, the first heat dissipating bridge 30 is a symmetrical member, so that the heat dissipating efficiency of the two connecting portions 33 is the same, and the uneven heat dissipation is avoided.
In an embodiment, referring to fig. 1 to 7, the first heat dissipating bridge 30 further includes a second groove 36 disposed at the bottom of the mounting groove 34 and extending downward to the middle of the abutting portion 33, and the second groove 36 is disposed perpendicular to the first groove 35. In the present embodiment, two second grooves 36 are provided at the upper end of each abutting portion 33, further increasing the heat dissipation area.
In an embodiment, referring to fig. 1 to 7, the radio frequency power supply further includes a PCB 20 attached to the upper surface of the base plate 10, the heating device includes a main heating unit 21a and a secondary heating unit 21b disposed on the PCB, and the number of the heat dissipation members is two, one of the heat dissipation members abuts against the main heating unit 21a, and the other heat dissipation member abuts against the secondary heating unit 21 b. In this embodiment, another heat dissipation member is a second heat dissipation bridge 40, and the second heat dissipation bridge 40 further includes two second pillars vertically disposed, and two second connection portions disposed at upper ends of the second pillars, and heat dissipation notches are further disposed at upper ends of the second connection portions. The cover plate 14 is provided with two second heat dissipation holes 14a, and two first fans 15 are correspondingly disposed, wherein one first fan 15 is in butt joint with the first heat dissipation bridge 30, and the other first fan 15 is in butt joint with the second heat dissipation bridge 40.
In an embodiment, referring to fig. 1 to 7, the enclosure 12 is made of a metal material, and the enclosure 12 is provided with a vertically arranged heat dissipation groove 12 b. The heat dissipation grooves 12b are uniformly distributed on the enclosing plate 12 along the length direction of the enclosing plate 12, the lower edge of the enclosing plate 12 is inwards recessed to form a first limiting groove 12a for accommodating the first upright post 31, the edge corresponding to the bottom plate 11 is inwards recessed to form a second limiting groove 11b corresponding to the first limiting groove 12a, and a screw hole is formed in the second limiting groove 11 b. The first upright 31 is inserted into the second stopper groove 11b, the first upright 31 is provided with a fixing hole 37 abutting against the screw hole, and the first upright 31 is fixed to the base plate 11 by a screw. When the enclosing plate 12 is installed, the upper end of the first upright column 31 is inserted into the first limiting groove 12a, so that the first upright column is butted with the enclosing plate 12. When the first heat dissipation bridge 30 is butted with the baseboard 11 of the coaming 12 and the heating device, silicone grease can be coated on the butted surface to improve the heat conduction efficiency.
In this embodiment, the enclosing plate 12 is disposed on the bottom plate 11, the bottom of the heat dissipation grooves 12b therein is closed, the connection holes 12c are disposed at the closed end of the bottom of the heat dissipation grooves 12b, and the bottom plate 11 is correspondingly provided with screw holes corresponding to the connection holes 12 c.
In an embodiment, the rf power supply described with reference to fig. 1 to 7 further includes a second heat dissipating bridge 40 disposed at one side of the first heat dissipating bridge 30, and both ends of the second heat dissipating bridge 40 are connected to the enclosure 12; the second heat dissipation bridge 40 further comprises two second upright columns which are vertically arranged, and two second connecting portions which are arranged at the upper ends of the second upright columns, wherein heat dissipation notches are further arranged at the upper ends of the second connecting portions. The inner side of the coaming 12 is provided with a vertical heat dissipation groove.
In one embodiment, the enclosure includes two end plates disposed opposite to each other, and side plates connecting the two end plates, and one end of the first heat dissipation bridge 30 and one end of the second heat dissipation bridge 40 are connected to one of the side plates, and the other end of the first heat dissipation bridge is connected to the other side plate. In one embodiment, the inner wall of the first heat dissipation hole 11a faces to the center
The core is extended to form an extended end 11c for attaching to the PCB and dissipating heat from the corresponding heating device. In this embodiment, the first avoiding hole 11d is formed in the upper surface of the bottom plate 11, the second avoiding hole 13a is formed in the upper surface of the heat dissipation block 13, and the avoiding holes correspond to the solder points and/or the components on the lower surface of the PCB 20, so that the PCB 20 is tightly attached to the bottom plate 11 and the heat dissipation block 13, and the heat dissipation efficiency is further improved.
In an embodiment, referring to fig. 1 to 7, the rf power supply further includes a heat dissipation fin plate 51 disposed on the lower surface of the base plate 11, and a second fan 53 disposed on the heat dissipation fin plate 51, wherein a third heat dissipation hole 52 is disposed on the heat dissipation fin plate 51 and is abutted to the first heat dissipation hole 11a, and the second fan 53 is disposed at the third heat dissipation hole 52. In this embodiment, the first fan 15 delivers air to the inside of the casing 10 from the second heat emission hole 14a, the second fan 53 includes a volute and a centrifugal wind wheel disposed in the volute, the second fan 53 enters air from two sides of the volute and exits air from one end of the volute, one air inlet of the volute faces the inside of the casing 10, the other air inlet faces the outside, and the air outlet of the volute faces the fins on the heat dissipation fin plate 51. Therefore, heat on the bottom plate 11 can be downwardly conducted to the fins, the extending direction of the fins is consistent with the direction of the air outlet, the second fan 53 can draw out hot air inside the box body 10, and cold air outside can be blown to the fins to accelerate the heat dissipation efficiency of the box body 10.
In an embodiment, referring to fig. 1 to 7, the cover plate 14 is provided with two second heat dissipation holes 14a, and includes two first fans 15 corresponding to the rf power source, wherein one of the first fans 15 is disposed toward the main heat generating unit 21a, the other one of the first fans 15 is disposed toward the secondary heat generating unit 21b, and the first fan 15 is disposed toward the lower heat generating unit, so as to increase the heat dissipation efficiency.
In an embodiment, referring to fig. 1 to 7, the rf power supply further includes a heat dissipation fin plate 51 disposed on the lower surface of the base plate 11, and a second fan 53 disposed on the heat dissipation fin plate 51, wherein a third heat dissipation hole 52 is disposed on the heat dissipation fin plate 51 and is abutted to the first heat dissipation hole 11a, and the second fan 53 is disposed at the third heat dissipation hole 52. In this embodiment, the first fan 15 delivers air to the inside of the casing 10 from the second heat emission hole 14a, the second fan 53 includes a volute and a centrifugal wind wheel disposed in the volute, the second fan 53 enters air from two sides of the volute and exits air from one end of the volute, one air inlet of the volute faces the inside of the casing 10, the other air inlet faces the outside, and the air outlet of the volute faces the fins on the heat dissipation fin plate 51. The heat dissipation fin plate 51 comprises a base plate and fins arranged on the lower surface of the base plate, wherein a second fan 53 is arranged on the lower surface of the base plate, the fins are located at an air outlet of the second fan 53, and the extending direction of the fins is consistent with the direction of the air outlet. Therefore, heat on the bottom plate 11 can be downwardly conducted to the fins, the extending direction of the fins is consistent with the direction of the air outlet, the second fan 53 can draw out hot air inside the box body 10, and cold air outside can be blown to the fins to accelerate the heat dissipation efficiency of the box body 10.
In an embodiment, referring to fig. 1 to 7, in the embodiment, a fourth heat dissipation hole 54 and a third fan 55 butted with the fourth heat dissipation hole 54 are further disposed on the fin plate 51, and the third fan 55 is used for dissipating heat outside the box body. In this embodiment, the two first fans are disposed along the extending direction of the side plate, the extending direction of the side plate is the length direction of the box body, and the heat dissipation fans are distributed in multiple rows as much as possible to improve the heat dissipation efficiency. The third fan 55 and the second fan are arranged side by side, along the extension direction of the end plate. Because the radio frequency power supply is arranged in the host, the radiating fin plate can be used as a part of the base of the host for increasing the radiating area, and the area of the radiating fin plate is larger than that of the bottom plate, so that the box body can be completely supported. The third fan 55 mainly radiates heat from the inside of the main unit, and draws out hot air in the main unit and hot air around the case from the fourth heat radiation hole 54. It should be noted that the fourth heat dissipating hole 54 may be communicated with the first heat dissipating hole and the external space of the case to accelerate the heat dissipation from the inside of the case.
The third fan 55 also includes a volute and a centrifugal wind wheel disposed in the volute, the third fan 55 enters air from two sides of the volute and exits air from one end of the volute, one of the air inlets is disposed upward and is communicated with the inside of the host, the other air inlet is disposed downward and is communicated with the outside of the host, and the air outlet of the volute faces the fins on the heat dissipation fin plate 51. The heat of the bottom plate 11 can be conducted downwards to the fins, the third fan 55 can suck the hot air inside the main unit into the volute, and can also suck the cold air outside into the volute, the hot air and the cold air are mixed inside the volute and blown to the fins, and the temperature of the mixed air is lower than that of the air in the room, so that the heat dissipation efficiency of the box body 10 and the main unit can be further improved.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention that are made by using the contents of the specification and the drawings or directly/indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. A radio frequency power supply, characterized in that the radio frequency power supply comprises:
the box body comprises a bottom plate, a surrounding plate and a cover plate, wherein a first heat dissipation hole is formed in the bottom plate, and a second heat dissipation hole is formed in the cover plate;
two ends of the heat dissipation part are connected with the enclosing plate, and the lower end of the heat dissipation part is butted with a heating device in the radio frequency power supply;
and the first fan is arranged at the second heat radiating hole and faces the heat radiating piece.
2. The radio frequency power supply according to claim 1, wherein the heat sink includes vertically disposed pillars and a connecting portion connecting upper ends of the two pillars, and a lower surface of the connecting portion is formed with an abutting portion abutting against the heat generating device.
3. The radio frequency power supply according to claim 2, wherein the enclosure comprises two end plates disposed opposite to each other, and a side plate connecting the two end plates, one end of the heat sink is connected to one of the side plates, and the other end of the heat sink is connected to the other side plate.
4. The radio frequency power supply according to claim 3, wherein the side plate is provided with a first limit groove corresponding to the upright post, and the bottom plate is further provided with a second limit groove corresponding to the upright post; and vertical heat dissipation grooves are formed in the inner sides of the enclosing plates.
5. A radio frequency power supply according to claim 1, further comprising a PCB board attached to the upper surface of the base board, wherein the heat generating device includes a main heat generating unit and a secondary heat generating unit disposed on the PCB board, and two heat dissipating members are disposed, one of the heat dissipating members abuts against the main heat generating unit and the other abuts against the secondary heat generating unit.
6. A radio frequency power supply according to claim 5, wherein the cover plate is provided with two of the second heat dissipation holes, and the first fans are respectively disposed at the two second heat dissipation holes, wherein one of the first fans is disposed toward one of the heat dissipation members, and the other of the first fans is disposed toward the other of the heat dissipation members.
7. The radio frequency power supply according to claim 6, wherein the bottom plate is further provided with a mounting hole corresponding to the main heating unit, a heat dissipation block is arranged in the mounting hole, and an upper surface of the heat dissipation block is arranged to be attached to the PCB.
8. The radio frequency power supply according to claim 7, wherein the bottom plate and the enclosure plate are made of aluminum or aluminum alloy, and the heat dissipation block is made of copper or copper alloy.
9. The radio frequency power supply according to claim 1, further comprising a heat dissipation fin plate disposed on a lower surface of the base plate, and a second fan disposed on the heat dissipation fin plate, wherein a third heat dissipation hole is disposed on the heat dissipation fin plate and is in butt joint with the first heat dissipation hole, and the second fan is disposed at the third heat dissipation hole; and the extending direction of the fins of the radiating fin plate is consistent with the air outlet direction of the second fan.
10. The rf power supply of claim 9, further comprising a fourth heat dissipation hole disposed on the heat dissipation fin plate, and a third fan corresponding to the fourth heat dissipation hole, wherein the third fan is configured to dissipate heat outside the box, and an air outlet direction of the third fan is consistent with an extending direction of the fins.
Priority Applications (1)
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CN202122906868.6U CN216673642U (en) | 2021-11-24 | 2021-11-24 | Radio frequency power supply |
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CN202122906868.6U CN216673642U (en) | 2021-11-24 | 2021-11-24 | Radio frequency power supply |
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CN216673642U true CN216673642U (en) | 2022-06-03 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114302586A (en) * | 2021-11-24 | 2022-04-08 | 深圳半岛医疗有限公司 | Multi-channel radio frequency power supply |
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2021
- 2021-11-24 CN CN202122906868.6U patent/CN216673642U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114302586A (en) * | 2021-11-24 | 2022-04-08 | 深圳半岛医疗有限公司 | Multi-channel radio frequency power supply |
CN114302586B (en) * | 2021-11-24 | 2024-06-25 | 深圳半岛医疗集团股份有限公司 | Multipath radio frequency power supply |
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Address after: 518000 3rd floor, block a, building F2, Changfeng Industrial Park, Liuxian 3rd road, 68 Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Peninsula Medical Group Co.,Ltd. Address before: 518000 3rd floor, block a, building F2, Changfeng Industrial Park, Liuxian 3rd road, 68 Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Peninsula Medical Co.,Ltd. |