JP2017216772A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an electric power conversion system capable of suppressing the increase of a temperature of an electronic component.SOLUTION: An electric power conversion system comprises: a first component used for an electric power conversion; a second component that is used for the electric power conversion, and of which an allowable temperature is lower than that of the fist component; a housing 2 that houses the first and second components; a fan 15 that allows an air in an inner part of the housing 2 to be circulated; and a control substrate that is provided between the first component and the fan. In the fan 15, an angle formed by a blow-off face of the fan 15 and the control substrate 23 is a sharp angle, and the blow-off face is provided at a position faced to the control substrate 23. The second component is provided on the fan 15 side from an extension line of the control substrate 23.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a power conversion device including a heat sink that dissipates heat generated by an electronic component and a fan that generates cooling air that promotes heat dissipation of the heat sink.

  A power conversion device that interconnects power generation facilities such as a solar power generation facility and a fuel cell power generation facility converts DC power supplied from the power generation facility into AC power by using electronic components. Electronic components such as a reactor and a switching element used for power conversion in the power conversion device generate heat when a current flows. In addition, electronic components such as relays and capacitors that generate less heat than reactors and switching elements are also used in power conversion devices. Generally, the power conversion device is provided with a cooling mechanism such as a cooling fan and a heat sink. By providing the cooling mechanism, the electronic components in the housing constituting the power conversion device are cooled, so that the temperature rise of these electronic components can be suppressed and the product life of the power conversion device can be extended. Cooling the electronic components in this way is important for extending the product life. However, electronic components used for power conversion are housed in a housing in order to avoid adhesion of water and dust. In particular, the casing of the outdoor-type power conversion device has a sealed waterproof structure in which no air intake / exhaust port is provided in order to prevent rain from entering the casing. Therefore, in a power conversion device in which an electronic component used for power conversion is housed in a housing, a structure for dissipating heat generated in the electronic component to the outside of the housing is important.

  The inverter device disclosed in Patent Document 1 includes a housing case, an opening formed in the housing case for introducing air into the housing case, and air formed in the housing case and introduced from the opening. Ventilation holes exhausted to the outside of the housing case, an insulation transformer that is a heat-generating component installed between the opening and the ventilation holes, and a calorific value compared to the insulation transformer installed between the insulation transformer and the ventilation holes A small electric field capacitor and a convection prevention plate installed between the insulating transformer and the electric field capacitor. Moreover, the inverter apparatus disclosed by patent document 1 is equipped with the radiation fin which radiates the heat which generate | occur | produced in the heat-emitting component, and the fan which cools a radiation fin.

  In the conventional power converter disclosed in Patent Document 1, air convection from the opening to the vent hole is generated inside the housing case due to heat generated by the insulating transformer. In the inverter device disclosed in Patent Document 1, by providing a convection prevention plate between the electric field capacitor located downstream of the insulating transformer and the insulating transformer, the temperature increase of the electric field capacitor due to the heat generated in the insulating transformer is prevented. Suppressed. Moreover, the inverter apparatus disclosed by patent document 1 is a structure which dissipates the heat | fever which generate | occur | produced in the heat-emitting component actively by using a radiation fin and a fan.

JP 2008-92632 A

  When the power conversion device disclosed in Patent Document 1 is configured with a sealed casing that is installed outdoors, the power conversion device generates a large amount of heat by using a fan installed inside the sealed casing. Although the temperature rise of the electronic component can be suppressed, there is a problem that the ambient temperature in the sealed casing rises due to the heat generated in the electronic component, leading to a temperature rise of the electronic component having a small allowable temperature.

  This invention is made | formed in view of the above, Comprising: It aims at obtaining the power converter device which can suppress the temperature rise of an electronic component.

  In order to solve the above-described problems and achieve the object, a power conversion device according to the present invention includes a first component used for power conversion, and an allowable temperature used for power conversion is higher than an allowable temperature of the first component. Lower second component, a casing for storing the first component and the second component, a fan for circulating the air inside the casing, and a partition installed between the first component and the fan The fan has an acute angle between the blowout surface of the fan and the partition plate, and is installed at a position where the blowout surface faces the partition plate. The second component is located with respect to the extended surface of the partition plate. And it is installed in the area | region of the fan side rather than a partition plate, It is characterized by the above-mentioned.

  According to the present invention, it is possible to suppress an increase in the temperature of the electronic component.

1 is an external view of a power conversion device according to Embodiment 1 of the present invention. Exploded view of the power converter shown in FIG. FIG. 2 is a front view of the first heat sink, the second heat sink, and the fan shown in FIG. 2 when viewed from the housing toward the lower cover. FIG. 2 is a front view of the first board, the second board, the third board, the control board, the power board, and the fan installed in the casing shown in FIG. 2 when viewed from the casing toward the lower cover. Interior view when the control board, power supply board, fan, and casing of the power conversion device according to the first embodiment are viewed from the first virtual plane shown in FIG. FIG. 2 is a front view of the first heat sink, the second heat sink, and the housing shown in FIG. 2 when viewed from the first heat sink and the second heat sink toward the bottom surface of the housing. The block diagram of the power converter device which concerns on Embodiment 1 of this invention. The figure which shows the result of having analyzed the air path when operating the fan of the power converter device which concerns on Embodiment 1 of this invention. The figure which shows the result of having analyzed the air path when operating the fan of the power converter device which concerns on a comparative example The figure which shows the temperature evaluation result when operating the fan of the power converter device which concerns on Embodiment 1 of this invention. The figure which shows the temperature evaluation result when operating the fan of the power converter device which concerns on a comparative example The exploded view of the power converter device concerning Embodiment 2 of the present invention. FIG. 12 is a front view of the first heat sink, the second heat sink, the reactor cover, and the housing shown in FIG. 12 when viewed from the first heat sink and the second heat sink toward the bottom surface of the housing. Interior view when the fan, control board, power supply board, and reactor cover of the power conversion device according to the second embodiment are viewed from the second virtual plane shown in FIG.

  Below, the power converter concerning an embodiment of the invention is explained in detail based on a drawing. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is an external view of a power conversion device according to Embodiment 1 of the present invention. FIG. 2 is an exploded view of the power converter shown in FIG. FIG. 3 is a front view of the first heat sink, the second heat sink, and the fan shown in FIG. 2 when viewed from the housing toward the lower cover. 4 is a front view of the first board, the second board, the third board, the control board, the power supply board, and the fan installed in the housing shown in FIG. 2 when viewed from the housing toward the lower cover. FIG. FIG. 5 is an interior view when the control board, the power supply board, the fan, and the casing of the power conversion device according to the first embodiment are viewed from the first virtual plane shown in FIG. FIG. 6 is a front view of the first heat sink, the second heat sink, and the housing shown in FIG. 2 when viewed from the first heat sink and the second heat sink toward the bottom surface of the housing. 1 to 6, in the right-handed XYZ coordinates, the vertical direction of the power conversion device 100 is the Z-axis direction, the direction orthogonal to the Z-axis direction is the X-axis direction, and both the Z-axis direction and the X-axis direction are The direction orthogonal to the Y-axis direction. However, the X-axis direction is the longitudinal direction of the side surface 2d of the housing 2 described later, the Y-axis direction is the short direction of the side surface 2d of the housing 2, and the Z-axis direction is the thickness direction of the side surface 2d of the housing 2. It is.

  As shown in FIG. 1, a power conversion device 100 according to Embodiment 1 includes a housing 2 that houses a first component and a second component, which will be described later, and a housing 2 that is installed on the upper side of the housing 2. An upper cover 1 that protects the components and a lower cover 3 that is installed on the lower side of the housing 2 and that accommodates the components in the housing 2 that requires heat dissipation are provided. The lower cover 3 is connected to components in the housing 2 and is connected to components outside the power conversion device 100. The lower cover 3 protects cables (not shown), and intake / exhaust for promoting cooling of components that require heat dissipation. A mouth 7; The cable cover 4 is provided on a part of the side surface 3 b of the lower cover 3.

  As shown in FIG. 2, in addition to the configuration shown in FIG. 1, the power conversion apparatus 100 includes a first board 20, a second board 21, a third board 22, a control board 23, A power supply board 24 is provided. Details of the components installed on these boards and details of the installation positions of these boards will be described later.

  The power conversion device 100 includes a first heat sink 6 and a second heat sink 5 housed in a lower cover 3 that is a first cover. The second heat sink 5 includes a plurality of fins 5a for increasing the heat dissipation effect and a base portion 5b for fixing the plurality of fins 5a. The second heat sink 5 is installed so that the plurality of fins 5a face the bottom surface 3a of the lower cover 3 formed in a bottomed quadrangular shape. The eight first IGBTs 12 mounted on the second substrate 21 are in contact with the base portion 5 b of the second heat sink 5. The first heat sink 6 includes a plurality of fins 6a for increasing the heat dissipation effect and a base portion 6b for fixing the plurality of fins 6a. The first heat sink 6 is installed such that the plurality of fins 6 a face the bottom surface 3 a of the lower cover 3. A DC reactor 10 and an AC reactor 11, which are first components used for power conversion, are installed on the base 6 b of the first heat sink 6 so as to face the housing 2 or the third substrate 22. Examples of the material of the second heat sink 5 and the first heat sink 6 include aluminum alloys, austenitic stainless alloys, copper alloys, cast iron, steel, and iron alloys.

  The bottom surface 2a of the housing 2 formed in a bottomed quadrangular shape has first holes 2b for contacting the eight first IGBTs 12 mounted on the first substrate 20 with the second heat sink 5. Is formed. In addition, a second hole 2 c for accommodating the DC reactor 10 and the AC reactor 11 installed in the first heat sink 6 in the housing 2 is formed in the bottom surface 2 a of the housing 2. Although not shown in FIG. 2, a hole for contacting the second IGBT 13 mounted on the third substrate 22 with the first heat sink 6 is formed in the bottom surface 2 a of the housing 2.

  A fan 15 that circulates air inside the housing 2, that is, air inside the power conversion device 100, is installed on the bottom surface 2 a of the housing 2. On the side surface 2 d of the housing 2, an upper cover packing 9 that is in contact with the upper cover 1 to ensure waterproofness is installed.

  As shown in FIG. 3, a first heat sink packing 16-1 is attached to the base portion 5 b of the second heat sink 5. The first heat sink packing 16-1 is attached so as to surround the outer edge portion of the base portion 5 b of the second heat sink 5. A second heat sink packing 16-2 is attached to the base portion 6 b of the first heat sink 6. The second heat sink packing 16-2 is attached so as to surround the outer edge portion of the base portion 6 b of the first heat sink 6. The first heat sink packing 16-1 and the second heat sink packing 16-2 are in contact with the bottom surface 2 a of the casing 2 to ensure waterproofness between each heat sink and the housing 2. is there.

  In FIG. 4, the DC reactor 10, the AC reactor 11, the first substrate 20, the second substrate 21, the third substrate 22, the control substrate 23, the power supply substrate 24, and the fan 15 when the housing 2 is viewed in plan view. Some of the components of the power conversion apparatus 100 are shown. In FIG. 4, a surface including the third substrate 22, the control substrate 23, the power supply substrate 24, the fan 15, and the bottom surface 2 a of the housing 2 is defined as a first virtual surface A, and the direct current reactor 10 and the alternating current reactor 11 illustrated in FIG. The surface including the first substrate 20 and the second substrate 21 is a second virtual surface B.

  The housing 2 has a rectangular shape including a pair of long surfaces 2d1 and 2d2 facing each other in plan view of the housing 2 and short surfaces 2d3 and 2d4 facing each other.

  The installation positions of the AC reactor 11, the DC reactor 10, the first substrate 20, the second substrate 21, the third substrate 22, the control substrate 23, the power supply substrate 24, and the fan 15 will be specifically described.

  The AC reactor 11 and the DC reactor 10 are installed near one long surface 2d1 in the Y-axis direction and are installed near one short surface 2d3 in the X-axis direction.

  The third substrate 22 is installed between the AC reactor 11 and the other longitudinal surface 2d2 in the Y-axis direction, and is installed between the DC reactor 10 and the other longitudinal surface 2d2. Specifically, the length L1 from one longitudinal surface 2d1 to the outer peripheral edge of the third substrate 22 is L1, and the length from the other longitudinal surface 2d2 to the outer peripheral edge of the third substrate 22 is L2. When the length L3 from the short surface 2d3 to the outer peripheral edge of the third substrate 22 and the length L4 from the other short surface 2d4 to the outer peripheral edge of the third substrate 22, the third substrate 22 is , L1> L2 and L4> L3 so that they are installed on the bottom surface 2a of the housing 2.

  A control board 23 and a power supply board 24 are installed on the third board 22. The power supply substrate 24 and the control substrate 23 are fixed to the third substrate 22 in the Z-axis direction so that their outer peripheral edges are in contact with the substrate surface of the third substrate 22. That is, the power supply substrate 24 and the control substrate 23 are fixed with their substrate surfaces standing in the Z-axis direction with respect to the substrate surface of the third substrate 22. The power supply board 24 and the control board 23 are installed so that their board surfaces face each other.

  In FIG. 4, the power supply board 24 is installed between the control board 23 and one short surface 2d3, and the control board 23 is installed between the power supply board 24 and the other short surface 2d4. The positions of the substrate 24 and the control substrate 23 may be reversed.

  The third board 22 is provided with a capacitor 25 and a relay 26, which are second components used for power conversion. The capacitor 25 and the relay 26 are electronic components whose allowable temperature is lower than the allowable temperature of the DC reactor 10 and the AC reactor 11 that are the first components. The capacitor 25 and the relay 26 are installed between the power supply board 24 and one short surface 2d3. Moreover, the capacitor | condenser 25 and the relay 26 are installed between the direct current | flow reactor 10 or the alternating current reactor 11, and the other long surface 2d2.

  The first substrate 20 and the second substrate 21 are disposed near one long surface 2d1 in the Y-axis direction, and are disposed near the other short surface 2d4 in the X-axis direction. The second substrate 21 is fixed to the bottom surface 2 a of the housing 2. A plurality of components including a capacitor 25 are installed on the second substrate 21. These components installed on the second substrate 21 are components that generate less heat than the DC reactor 10 and the AC reactor 11.

  The first substrate 20 is fixed to the substrate surface of the second substrate 21 in the Z-axis direction. The substrate surface of the first substrate 20 faces the substrate surface of the second substrate 21. A plurality of components including a relay 26 that is a second component used for power conversion are installed on the first substrate 20. These components installed on the first substrate 20 are components that generate less heat than the DC reactor 10 and the AC reactor 11.

  The fan 15 is located in a region closer to the fan 15 than the control substrate 23 functioning as a partition plate in the region inside the housing 2, that is, in a region 18 between the second substrate 21 and the other longitudinal surface 2d2. It is fixed to the bottom surface 2 a of the housing 2. The board surface of the control board 23 is installed in parallel with the Y-axis direction, and the fan 15 has an angle θ formed by the blowing face 15a of the fan 15 and the board face of the control board 23 of 60 °, and the fan 15 Fifteen blowing surfaces 15 a are installed so as to face the substrate surface of the control substrate 23.

  In a region 18 between the second substrate 21 and the other longitudinal surface 2d2, the bottom surface 2a of the housing 2 is provided with a plurality of cable holes 13 for introducing a cable (not shown) into the housing 2. ing. A cable packing 8 for securing waterproofness is attached to the cable hole 13.

  As shown in FIG. 5, the control board 23 and the power supply board 24 are fixed to the third board 22 in the Z-axis direction. The second IGBT 13 mounted on the third substrate 22 is in contact with the first heat sink 6. The first substrate 20 is installed on the upper side of the second substrate 21 in the Z-axis direction. The relay 26 is installed on the board surface of the first board 20 so as to face the upper cover 1.

  As shown in FIG. 6, the area of the second heat sink 5 on the XY plane is larger than that of the first heat sink 6 on the XY plane. The second heat sink 5 and the first heat sink 6 are directly fixed to the housing 2 in order to ensure waterproofness.

  FIG. 7 is a block diagram of the power conversion apparatus according to Embodiment 1 of the present invention. The power conversion device 100 includes a booster circuit 91, an inverter circuit 92, a filter circuit 93, a control circuit 94, and a power supply circuit 95. The plurality of booster circuits 91 boost the voltage of the DC power generated by the solar cell 90 and supply the boosted DC power to the inverter circuit 92. The inverter circuit 92 converts the DC power supplied from the booster circuit 91 into AC power. The filter circuit 93 attenuates the high-frequency component of the AC power output from the inverter circuit 92 and outputs it to the commercial system 96. The booster circuit 91 includes components such as a DC reactor, a switching element, a diode, and a capacitor. Moreover, the inverter circuit 92 and the filter circuit 93 are comprised from components, such as an AC reactor, a switching element, a capacitor | condenser, and a relay. The operation of the inverter circuit 92 is controlled by the control circuit 94. The power supply circuit 95 supplies electric power for driving these components.

  As described above, in the power converter 100, the DC voltage output from the solar cell 90 is boosted by the booster circuit 91, converted from the DC voltage to the AC voltage by the inverter circuit 92 and the filter circuit 93, and supplied to the commercial system 96. . As described above, when the power conversion apparatus 100 operates, various components generate heat. In particular, in the booster circuit 91, the DC reactor and the switching element used for boosting generate heat. In the inverter circuit 92 and the filter circuit 93, the AC reactor and the switching element used when converting the direct current into the alternating current generate heat. A DC reactor and an AC reactor are obtained by winding a copper wire with an insulation coating around a magnetic core in a coil shape, and have a relatively high allowable temperature at which operation is guaranteed. Examples of the switching element include semiconductor elements such as IPM (Intelligent Power Module) or IGBT (Insulated Gate Bipolar Transistor). The switching element generally has a lower allowable temperature than the reactor, but since it is a semiconductor element, the switching element has a structure that easily radiates its own heat generation compared to the reactor. Capacitors and relays are components that generate a small amount of heat but generally have a lower allowable temperature than reactors and switching elements.

  FIG. 8 is a diagram showing a result of analyzing the air path when the fan of the power conversion device according to Embodiment 1 of the present invention is operated. As shown in FIG. 8, the relay 26, which is the second component, is installed in the area C on the fan 15 side with respect to the virtual extension surface 23 a of the control board 23. The AC reactor 11 and the DC reactor 10 are installed in a region D opposite to the fan 15 side with respect to the virtual extension surface 23 a of the control board 23. As described above, the fan 15 is installed with an inclination of 60 ° with respect to the board surface of the control board 23. That is, the fan 15 is installed to be inclined with respect to the Y-axis direction so that an angle θ ′ formed by the shaft 15b and the Y-axis 40 shown in FIG. 8 is 30 °. The fan 15 is directed in the direction of the control board 23 that functions as a partition plate, and is installed at a position where the blowing surface 15 a of the fan 15 faces the control board 23. The axis 15b is an axis that passes through the center of the fan 15 on the XY plane and is orthogonal to the blowing surface 15a of the fan 15. The Y axis 40 is an axis that passes through the center of the fan 15 and extends in the Y axis direction on the XY plane.

  The wind in the housing 2 generated by the fan 15 strikes the control board 23 and flows toward the relay 26 mounted on the first board 20. Since the control board 23 becomes a wall, it is difficult for the wind to flow through the AC reactor 11 and the DC reactor 10.

  FIG. 9 is a diagram illustrating a result of analyzing the air path when the fan of the power conversion device according to the comparative example is operated. In the power conversion device 100A according to the comparative example, unlike the first embodiment, the fan 15 is installed with an inclination of −7.5 ° with respect to the Y-axis direction. When configured in this manner, the blowout surface 15a of the fan 15 faces the relay 26 mounted on the first substrate 20 with respect to the Y-axis direction. Therefore, the wind blown from the fan 15 not only flows to the relay 26 side mounted on the first substrate 20 but also flows to the AC reactor 11 and the DC reactor 10 side. This is because the air blown from the fan 15 circulates in the housing 2 without being blocked by the control board 23.

  FIG. 10 is a diagram showing a temperature evaluation result when the fan of the power conversion device according to Embodiment 1 of the present invention is operated. FIG. 11 is a diagram illustrating a temperature evaluation result when the fan of the power conversion device according to the comparative example is operated. In FIG. 10, the temperatures indicated by (1) to (4) represent the temperature increase / decrease amount with respect to the temperature measured at the positions (1) to (4) shown in FIG. (1) represents the temperature near the relay 26 mounted on the first substrate 20, (2) represents the temperature near the DC reactor 10 and the AC reactor 11, and (3) represents the third substrate 22. The temperature near the mounted relay 26 is represented, and (4) represents the temperature near the fan 15.

  The temperature at the position (1) shown in FIG. 10 is reduced by 5.7 K with respect to the temperature at the position (1) shown in FIG. The temperatures at the positions (3) and (4) shown in FIG. 10 are reduced by 3.4K and 2.8K, respectively, with respect to the temperatures at the positions (3) and (4) shown in FIG. The temperature at the position (2) shown in FIG. 10 is increased by 1.4 K with respect to the temperature at the position (2) shown in FIG.

  By changing the inclination of the fan from −7.5 ° to 30 °, the power conversion device 100 according to the embodiment is mounted on the relay 26 and the third substrate 22 mounted on the first substrate 20. The ambient temperature with relay 26 decreases, and the ambient temperature of DC reactor 10 and AC reactor 11 increases. This is because the power board 24 and the control board 23 can suppress the wind blown from the fan 15 from flowing to the DC reactor 10.

  Moreover, in the power converter device 100 according to the first embodiment, the wind blown from the fan 15 circulates in the housing 2 so as to avoid the DC reactor 10, so that the heat generated in the DC reactor 10 is dispersed in the housing. The rise in temperature of other components due to the occurrence of this is suppressed. Thereby, the temperature at the positions (1), (3) and (4) shown in FIG. 10 is reduced.

  In power conversion device 100 according to Embodiment 1, components having a high allowable temperature and a large amount of heat generation, such as DC reactor 10 and AC reactor 11, are installed near the corner of casing 2 inside the casing. Further, in the power conversion device 100, the control board 23 or the power supply board 24 functioning as a partition plate is configured to separate the relay 26 and the capacitor 25 from the DC reactor 10 and the AC reactor 11 with a small allowable temperature and heat generation amount. In the power conversion device 100 according to the first embodiment, the fan 15 is installed so that the blowing air can be applied to the control board 23 or the power supply board 24.

  As a result, the temperature rise of the parts having a low allowable temperature and a low calorific value due to the heat generated in the parts having a high allowable temperature and a high calorific value is suppressed. Moreover, since the temperature rise of components having a low allowable temperature and a low calorific value can be suppressed, the surface area of the first heat sink 6 can be made smaller than the surface area of the second heat sink 5, and the power converter 100 can be downsized. is there.

  In the power conversion device 100 according to Embodiment 1, the second heat sink 5 is designed so that the temperatures of the DC reactor 10 and the AC reactor 11 are within the allowable temperature range. By designing the second heat sink 5 in this way, even if the amount of wind flowing near the DC reactor 10 and the AC reactor 11 is reduced by the partition plate, the heat dissipation effect can be enhanced.

Embodiment 2. FIG.
FIG. 12 is an exploded view of the power converter according to Embodiment 2 of the present invention. FIG. 13 is a front view of the first heat sink, the second heat sink, the reactor cover, and the housing shown in FIG. 12 when viewed from the first heat sink and the second heat sink toward the bottom surface of the housing. . FIG. 14 is an interior view when the fan, the control board, the power supply board, and the reactor cover of the power conversion device according to the second embodiment are viewed from the second virtual plane shown in FIG.

  The difference from the power conversion device 100 according to the first embodiment is that, in the power conversion device 100 according to the second embodiment, the second shape formed in a bottomed square shape that houses the DC reactor 10 and the AC reactor 11. The reactor cover 17 is provided as a cover. The reactor cover 17 is installed inside the lower cover 3 as the first cover, and is installed between the first heat sink 6 and the side surface 3b of the lower cover 3 in FIG.

  As shown in FIG. 13, the area of the second heat sink 5 on the XY plane is larger than that of the first heat sink 6 on the XY plane. Further, the reactor cover 17 is installed between the second heat sink 5 and the reactor cover 17 in the Y-axis direction, and is installed between the first heat sink 6 and the housing 2 in the X-axis direction.

  As shown in FIG. 14, the DC reactor 10 and the AC reactor 11 are accommodated in a reactor cover 17. The reactor cover 17 is installed between the first heat sink 6 and the side surface 3 b of the lower cover 3. With this configuration, the heat generated in the DC reactor 10 and the AC reactor 11 is radiated through the intake / exhaust port 7 provided in the lower cover 3, and is difficult to be transmitted to the inside of the housing 2. As a result, it is possible to further suppress the temperature rise of components having a low allowable temperature and a low calorific value as compared with the first embodiment.

  In the first and second embodiments, the configuration example has been described in which the control board 23 or the power supply board 24 functions as a partition plate to suppress the temperature rise of components having a low allowable temperature. Other resin or metal plate-like members may be used as the partition plate. By using the control board 23 or the power supply board 24 instead of such a resin or metal plate-like member, not only can the component installation space of the power conversion device 100 be used effectively, but also a resin or metal plate-like member can be used. Costs from manufacture to attachment of members can be reduced.

  In the first and second embodiments, the example in which the angle θ formed by the blowout surface 15a of the fan 15 and the substrate surface of the control board 23 is 60 ° has been described, but the fan 15 is controlled with the blowout surface 15a of the fan 15. It is only necessary that the angle formed with the substrate 23 is an acute angle, and the angle θ is not limited to 60 °.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

  DESCRIPTION OF SYMBOLS 1 Top cover, 2 housing | casing, 2a, 3a bottom surface, 2b 1st hole, 2c 2nd hole, 2d, 3b side surface, 2d1, 2d2 long surface, 2d3, 2d4 short surface, 3 lower cover, 4 cable cover 5 Second heat sink, 5a, 6a Fin, 5b, 6b Base, 6 First heat sink, 7 Air intake / exhaust port, 8 Cable packing, 9 Upper cover packing, 10 DC reactor, 11 AC reactor, 13 Cable hole , 15 fan, 15a blowing surface, 16-1 first heat sink packing, 16-2 second heat sink packing, 17 reactor cover, 18 region, 20 first substrate, 21 second substrate, 22 second 3 substrate, 23 control substrate, 24 power supply substrate, 25 capacitor, 26 relay, 90 solar cell, 91 booster circuit , 92 inverter circuit, 93 filter circuit, 94 control circuit, 95 power supply circuit, 96 commercial system, 100, 100A power converter.

Claims (6)

A first component used for power conversion;
A second component used for power conversion and having an allowable temperature lower than the allowable temperature of the first component;
A housing for housing the first component and the second component;
A fan for circulating the air inside the housing;
A partition plate installed between the first component and the fan,
The fan has an acute angle formed between the blowout surface of the fan and the partition plate, and is installed at a position where the blowout surface faces the partition plate,
The power converter according to claim 2, wherein the second component is installed in an area closer to the fan than the partition plate with respect to an extended surface of the partition plate.   The power converter according to claim 1, wherein the partition plate is a substrate used for power conversion.   The power converter according to claim 1, wherein the first component is a reactor used for power conversion.   The power conversion device according to claim 1, wherein the second component is a relay used for power conversion. A first heat sink that dissipates heat generated by the first component;
A second heat sink that dissipates heat generated by the second component;
5. The power conversion device according to claim 1, wherein a surface area of the second heat sink is smaller than a surface area of the first heat sink. 6. A first cover that is installed in the housing and houses at least the first heat sink and the second heat sink;
The power converter according to claim 5, further comprising a second cover that is installed inside the first cover and that houses the first component.

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