JP2018018888A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prolong the life of an electronic component even while achieving the miniaturization of the electronic apparatus.SOLUTION: A heating part 31 is covered with a metal case 17. According to this fact, even if each capacitor 40 is arranged between the heating part 31 of a coil 30 and a substrate 20 so as to be overlapped on each other in a thickness direction of the substrate 20, heat from the heating part 31 is transferred to the metal case 17. Accordingly, each capacitor 40 is less likely to be affected by heat from the heating part 31. Then, since there is no need of using large physique of the capacitor taking life prolongation of each capacitor 40 into consideration, an electronic apparatus 10 can be down-sized.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device.

  Generally, an electronic device includes a substrate, a heat-generating component such as a coil mounted on the substrate, and an electronic component such as a capacitor mounted on the substrate. For example, in Patent Document 1, a first printed circuit board is held vertically with respect to a second printed circuit board via a connection member, and a component mounted on the first printed circuit board and a second printed circuit board The components mounted on the electronic device are arranged so as to overlap with each other in the thickness direction of the second printed circuit board, so that the size of the electronic device in the planar direction of the second printed circuit board is reduced.

JP 63-127591 A

  By the way, among electronic components, particularly in an electronic component whose characteristics change due to a change in ambient temperature, there is a problem that the lifetime is shortened when affected by heat from the heat-generating component. For example, as in Patent Document 1, when the heat generating component and the electronic component are arranged so as to overlap in the thickness direction of the substrate and the electronic component can be affected by the heat from the heat generating component, consider extending the life of the electronic component. Then, it is necessary to use an electronic component having a large physique, which becomes a factor of increasing the size of the electronic device.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic device capable of extending the life of an electronic component while reducing the size of the electronic device. is there.

  An electronic device that solves the above problems includes a substrate, a heat generating component that is mounted on the substrate and has a heat generating portion and connected to the substrate, and an electronic component that is mounted on the substrate and changes its characteristics due to a change in ambient temperature. The heat generating portion is covered with a metal case, and the other of the heat generating portion and the electronic component is interposed between the heat generating portion and the electronic component and the substrate. Are arranged so as to overlap in the thickness direction of the substrate.

  According to this, even if it arrange | positions so that the other of a heat generating part and an electronic component may overlap with the thickness direction of a board | substrate between one of a heat generating part and an electronic component, and a board | substrate, a heat generating part is a metal case. The heat from the heat generating part is transmitted to the metal case. Therefore, the electronic component is hardly affected by the heat from the heat generating portion, and the life of the electronic component can be extended. In addition, it is not necessary to use an electronic component having a large physique in consideration of extending the life of the electronic component, and thus the electronic device can be reduced in size.

  The said electronic device WHEREIN: The said metal case may be provided with the fin. According to this, since the heat transmitted from the heat generating part to the metal case is radiated from the fins, the electronic component is further less affected by the heat from the heat generating part.

  The electronic device may include a fan, and the metal case may be cooled by wind of the fan. According to this, since the metal case is cooled by the wind of the fan, the electronic component is further hardly affected by the heat from the heat generating portion.

  The electronic apparatus may include a fan, another component provided between the fan and the heat generating portion, and a housing, and the heat generating portion may face the wall portion of the housing. Good. According to this, other parts are provided between the fan and the heat generating part, and the fan wind is blocked by the other parts, so that the heat generating part cannot be efficiently cooled by the fan wind. However, the heat from the heat generating part is transmitted to the wall part of the housing and radiated from the wall part. Therefore, the electronic component is hardly affected by the heat from the heat generating portion.

  According to the present invention, it is possible to extend the life of the electronic component while reducing the size of the electronic device.

Sectional drawing which shows the principal part of the electronic device in embodiment. Sectional drawing which shows the principal part of the electronic device in another embodiment. Sectional drawing which shows the principal part of the electronic device in another embodiment. Sectional drawing which shows the principal part of the electronic device in another embodiment.

Hereinafter, an embodiment embodying an electronic device will be described with reference to FIG. The electronic device of this embodiment is mounted on a vehicle.
As shown in FIG. 1, the electronic device 10 includes a housing 11, a substrate 20 disposed in the housing 11, a coil 30 that is a heat generating component mounted on the substrate 20, and a capacitor mounted on the substrate 20. 40. The capacitor 40 is an electronic component whose characteristics change depending on a change in ambient temperature. For example, when the capacitor 40 is affected by heat, its electrical characteristics are lowered and its life is shortened.

  The housing 11 is made of metal made of aluminum, for example. The casing 11 has a rectangular frame-shaped main body 12 that is open on both sides facing each other, a flat plate-like first cover 13 that closes one of both openings of the main body 12, and the other of both openings of the main body 12. And a flat second cover 14.

  The main body 12 has a partition wall 15 that partitions the inside of the housing 11 into a first space 11a on the first cover 13 side and a second space 11b on the second cover 14 side. The partition wall 15 extends along the first cover 13 and the second cover 14.

  The substrate 20 is disposed in the first space 11a. That is, the substrate 20 is disposed closer to the first cover 13 than the partition wall 15. The substrate 20 is supported by a support member 16 provided on the first cover 13 so that the planar direction of the substrate 20 is the same as the direction in which the first cover 13 extends.

  The coil 30 is a toroidal coil in which a winding (not shown) is wound around an annular core (not shown). In the coil 30, a portion formed by winding a winding around the core is a heat generating portion 31 that generates heat when a current flows through the coil 30. Therefore, the coil 30 has the heat generating part 31.

  The heat generating portion 31 of the coil 30 is disposed in the second space 11b. That is, the heat generating portion 31 of the coil 30 is disposed closer to the second cover 14 than the partition wall 15. The coil 30 has a lead 32 that is an end of a winding extending from the heat generating portion 31. The lead 32 passes through the through hole 15 a formed in the partition wall 15, protrudes into the first space 11 a, and is electrically connected to the substrate 20. Therefore, the coil 30 is connected to the substrate 20. The width L1 in the planar direction of the substrate 20 in the through hole 15a is larger than the width L2 in the planar direction of the substrate 20 in the coil 30.

  On the second surface 152 of the partition wall 15 on the second cover 14 side, the metal case 17 that houses the heat generating portion 31 of the coil 30 bulges toward the second cover 14. In the present embodiment, the metal case 17 is integrally formed with the partition wall 15. Therefore, the metal case 17 is thermally coupled to the partition wall 15. A connection portion of the metal case 17 to the second surface 152 of the partition wall 15 is around the through hole 15 a in the second surface 152. The inner side of the metal case 17 communicates with the through hole 15a. The metal case 17 covers the through hole 15a from the second space 11b side. A portion of the metal case 17 on the second cover 14 side is curved in an arc shape so as to protrude toward the second cover 14.

  The heat generating portion 31 of the coil 30 is sealed with a potting resin 18 injected into the inside of the metal case 17. The coil 30 is fixed inside the metal case 17 via a potting resin 18 and is supported by the partition wall 15 via the metal case 17. The heat generating portion 31 is covered with the metal case 17. A plurality of fins 19 are provided on the outer surface of the metal case 17. The plurality of fins 19 protrude outward from the outer surface of the metal case 17.

  A plurality of capacitors 40 are arranged in the first space 11a. That is, the plurality of capacitors 40 are arranged closer to the first cover 13 than the partition wall 15. The plurality of capacitors 40 are mounted on the surface 20a of the substrate 20 facing the first surface 151 of the partition wall 15 on the first cover 13 side. A part of each capacitor 40 enters the through hole 15a. In the present embodiment, each capacitor 40 is arranged between the heat generating portion 31 of the coil 30 and the substrate 20 so as to overlap in the thickness direction of the substrate 20 (the direction of the arrow Y1 shown in FIG. 1).

  The electronic device 10 includes a fan 50 and another component 51 provided between the fan 50 and the heat generating unit 31. The other component 51 is a transformer, for example, and is mounted on the surface 20 a of the substrate 20. The other component 51 is a component whose height in the direction orthogonal to the surface 20a of the substrate 20 is higher than the height in the direction orthogonal to the surface 20a of the substrate 20 in the capacitor 40, for example. A part of the other component 51 passes through the hole 15b formed in the partition wall 15 and protrudes into the second space 11b. The portion of the other component 51 that protrudes into the second space 11 b is located between the fan 50 and the heat generating portion 31 in the planar direction of the substrate 20. The fan 50 blows air toward a portion projecting into the second space 11 b of the other component 51 in the planar direction of the substrate 20. In the plane direction of the substrate 20, a portion of the heat generating portion 31 opposite to the other components 51 faces the wall portion 12 a of the main body 12 of the housing 11 through the metal case 17.

Next, the operation of this embodiment will be described.
Even if each capacitor 40 is disposed between the heat generating portion 31 of the coil 30 and the substrate 20 so as to overlap in the thickness direction of the substrate 20, the heat generating portion 31 is covered with the metal case 17, and thus the heat generating portion 31. Heat is transferred to the metal case 17. Therefore, each capacitor 40 is hardly affected by the heat from the heat generating portion 31. Since the metal case 17 is thermally coupled to the partition wall 15, the heat transmitted to the metal case 17 is transmitted to the partition wall 15 and radiated from the housing 11. Furthermore, since the plurality of fins 19 are provided in the metal case 17, the heat transmitted from the heat generating portion 31 to the metal case 17 is radiated from the plurality of fins 19. Moreover, since the site | part on the opposite side to the other components 51 in the heat generating part 31 has opposed the wall part 12a of the main body 12 of the housing | casing 11 via the metal case 17, the heat from the heat generating part 31 is metal case. 17 is transmitted to the wall portion 12a and radiated from the wall portion 12a.

In the above embodiment, the following effects can be obtained.
(1) The heat generating portion 31 is covered with the metal case 17. According to this, even if each capacitor 40 is arranged between the heat generating portion 31 of the coil 30 and the substrate 20 so as to overlap in the thickness direction of the substrate 20, the heat from the heat generating portion 31 is transmitted to the metal case 17. Is done. Therefore, each capacitor 40 is hardly affected by the heat from the heat generating portion 31, and the life of each capacitor 40 can be extended. Further, in consideration of extending the life of each capacitor 40, it is not necessary to use a capacitor having a large physique, and thus the electronic device 10 can be downsized.

  (2) The metal case 17 is provided with a plurality of fins 19. According to this, since the heat transmitted from the heat generating portion 31 to the metal case 17 is radiated from the plurality of fins 19, each capacitor 40 is further less affected by the heat from the heat generating portion 31.

  (3) The electronic device 10 includes a fan 50, another component 51 provided between the fan 50 and the heat generating portion 31, and the housing 11, and the heat generating portion 31 is the main body 12 of the housing 11. It faces the wall portion 12a. According to this, another component 51 is provided between the fan 50 and the heat generating unit 31, and the wind of the fan 50 is blocked by the other component 51, and the heat generating unit 31 is efficiently cooled by the wind of the fan 50. Even if it cannot be performed, the heat from the heat generating portion 31 is transmitted to the wall portion 12a and radiated from the wall portion 12a. Therefore, each capacitor 40 is hardly affected by the heat from the heat generating portion 31.

  (4) The coil 30 is supported by the partition wall 15 via the metal case 17. According to this, compared with the case where the coil 30 is supported by the board | substrate 20, the load concerning the board | substrate 20 can be reduced, for example. Moreover, since it is not necessary to ensure the space which supports the coil 30 in the surface 20a of the board | substrate 20, the physique of the planar direction of the board | substrate 20 can be reduced in size.

  (5) When another component 51 higher than the height in the direction orthogonal to the surface 20a of the substrate 20 in the capacitor 40 is mounted on the substrate 20, for example, the thickness of the substrate 20 in the housing 11 In the direction, the space opposite to the substrate 20 with respect to the capacitor 40 becomes a dead space. Therefore, in the present embodiment, each capacitor 40 is disposed so as to overlap in the thickness direction of the substrate 20 between the heat generating portion 31 of the coil 30 and the substrate 20. In other words, since the heat generating portion 31 of the coil 30 is arranged in the space on the opposite side of the capacitor 20 from the capacitor 40 in the thickness direction of the substrate 20 in the housing 11, the space in the housing 11 is effectively used. Thus, the electronic device 10 is downsized.

  (6) The width L1 in the planar direction of the substrate 20 in the through hole 15a is larger than the width L2 in the planar direction of the substrate 20 in the coil 30. According to this, for example, the size of the through hole 15a is relatively small enough to allow the lead 32 to pass therethrough, and the work of connecting the lead 32 through the through hole 15a to the substrate 20 is performed. It can be easy.

  (7) A part of each capacitor 40 enters the through hole 15a. According to this, compared with the case where a part of each capacitor | condenser 40 does not penetrate in the through-hole 15a, size reduction of the thickness direction of the board | substrate 20 in the electronic device 10 can be achieved.

In addition, you may change the said embodiment as follows.
As shown in FIG. 2, in the electronic device 10, there is no other part 51, or the other part 51 is arranged at a place different from the above embodiment, and the metal case 17 is caused by the wind of the fan 50. The structure which is cooled may be sufficient. According to this, since the metal case 17 is cooled by the wind of the fan 50, each capacitor 40 is further less affected by the heat from the heat generating portion 31.

  As shown in FIG. 3, for example, the size of the through hole 15a may be a relatively small hole through which the lead 32 can pass. In this case, each capacitor 40 and the heat generating portion 31 of the coil 30 are separated by the partition wall 15 in the thickness direction of the substrate 20. Therefore, since the heat from the heat generating part 31 is blocked by the partition wall 15, each capacitor 40 is hardly affected by the heat from the heat generating part 31.

  As shown in FIG. 3, a recess 15 c is formed on the first surface 151 of the partition wall 15, and a part of each capacitor 40 may enter the inside of the recess 15 c. According to this, compared with the case where a part of each capacitor | condenser 40 does not enter inside the recessed part 15c, size reduction of the physique of the thickness direction of the board | substrate 20 in the electronic device 10 can be achieved.

  As shown in FIG. 3, the metal case 17 may be a separate member from the partition wall 15. The metal case 17 includes a plate-like support portion 17a supported by the second surface 152 of the partition wall 15, and a covering portion 17b that protrudes from the edge of the support portion 17a and bulges toward the second cover 14. Have. The heat generating portion 31 of the coil 30 is covered with the support portion 17a and the covering portion 17b. A through hole 17c is formed in the support portion 17a. The through hole 17c is a relatively small hole through which the lead 32 can pass. The through hole 17 c communicates with the through hole 15 a of the partition wall 15.

  As shown in FIG. 4, the metal case 17 may be fixed to the first surface 151 of the partition wall 15. Therefore, the coil 30 is disposed in the first space 11a. In addition, a standing substrate 60 erected in a direction orthogonal to the surface 20 a of the substrate 20 is electrically connected to the substrate 20 via a connection member 61. The standing substrate 60 passes through the through hole 15a formed in the partition wall 15 and protrudes into the second space 11b. A capacitor 40 is mounted on a portion of the standing substrate 60 that protrudes into the second space 11b. Therefore, the capacitor 40 is disposed in the second space 11b. In this way, the heat generating portion 31 of the coil 30 may be arranged between the capacitor 40 and the substrate 20 so as to overlap in the thickness direction of the substrate 20.

In the embodiment, the fins 19 may not be provided in the metal case 17.
In the embodiment, the metal case 17 is not supported by the partition wall 15, and may be supported by the case of the capacitor 40, for example.

In the embodiment, the heat generating component may be other than the coil 30 and is not particularly limited as long as it generates heat.
In embodiment, the potting resin 18 is an example and what is necessary is just what is excellent in heat dissipation and insulation like the potting resin 18. FIG.

In the embodiment, the electronic component may be other than the capacitor 40 and is not particularly limited as long as the electronic component changes in characteristics due to a change in ambient temperature.
In the embodiment, the electronic device 10 may not be mounted on the vehicle.

  DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Housing | casing, 12a ... Wall part, 17 ... Metal case, 19 ... Fin, 20 ... Board | substrate, 30 ... Coil which is a heat-emitting component, 31 ... Heat-generating part, 40 ... Capacitor which is an electronic component, 50 ... Fan, 51 ... Other parts.

Claims (4)

A substrate,
A heat generating component mounted on the substrate and having a heat generating portion and connected to the substrate;
An electronic device that is mounted on the substrate and has an electronic component whose characteristics change according to a change in ambient temperature,
The heat generating part is covered with a metal case,
An electronic device, wherein one of the heat generating part and the electronic component and the other of the heat generating part and the electronic component are arranged so as to overlap each other in a thickness direction of the substrate. .   The electronic device according to claim 1, wherein the metal case is provided with fins. With a fan,
The electronic device according to claim 1, wherein the metal case is cooled by the wind of the fan. A fan, other components provided between the fan and the heat generating unit, and a housing,
The electronic device according to claim 1, wherein the heat generating portion faces a wall portion of the housing.

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