JP7275919B2 - power converter - Google Patents

Description

The present invention relates to power converters.

In a power conversion device that converts input power into desired power through the switching operation of power semiconductor elements, how to cool the heat generated by the power (energy) loss of various parts within the device has become an important issue. there is In particular, large heat-generating members on par with power semiconductor devices include magnetic components such as reactors, which are configured by winding a cable around a core made of silicon steel plate, ferrite, or the like. Cooling of the magnetic parts themselves is also important in power converters, but if the reactor is housed in one housing along with other circuit parts, the heat generated by the magnetic parts will increase the temperature around the magnetic parts, The temperature of parts (circuit parts, housing waterproof packing, etc.) around the magnetic parts may exceed the allowable temperature.

Patent Literature 1 discloses a structure composed of a reactor, a metal cover that houses the reactor, and a heat transfer material that is provided inside the cover and transfers heat from the reactor to the cover. Further, in Patent Document 1, in order to prevent the heat of the structure from being transmitted to the surrounding parts, it is described that a partition separating the reactor housing space and the circuit unit housing space is provided inside the housing of the power converter. ing.

JP 2016-21817 A

However, in the conventional technology disclosed in Patent Document 1, a partition is provided inside the housing to separate the reactor housing space and the circuit unit housing space. Or, the flow of air inside the housing is blocked. Therefore, the amount of heat exchange between the parts (circuit parts, waterproof packing of the housing, etc.) provided around the magnetic parts and the air inside the housing decreases, and the temperature of the parts may exceed the allowable temperature. . Therefore, there is room for improvement in suppressing the stagnation of air inside the housing while reducing the heat transfer from the magnetic component to the components provided around the magnetic component.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object of the present invention is to obtain a power conversion device that suppresses the retention of air inside the housing.

In order to solve the above-described problems and achieve the object, the power conversion device according to the present invention includes a housing, a magnetic component provided inside the housing, and a periphery of the magnetic component inside the housing. and a circuit component provided in the The power conversion device includes a plate provided inside the housing so as to partition between the magnetic component and the circuit component. The plate is formed with a hole communicating between a first region of the plate on the side of the magnetic component and a second region of the plate on the side of the circuit component , and the hole is formed in a first portion closer to the magnetic component. The hole is formed in the second portion excluding the first portion.

ADVANTAGE OF THE INVENTION According to this invention, it is effective in the ability to suppress the retention of the air inside a housing|casing.

1 is an external view of a power conversion device 100 according to an embodiment of the present invention; A diagram showing an example of a circuit that configures the power conversion device 100 shown in FIG. The figure which shows the internal structure of the power converter device 100 in which the heat shield 10 was installed. FIG. 3B is a diagram showing the core 4, the DC reactor 5, etc., except for the heat shield plate 10 shown in FIG. 3A; FIG. 2 shows a state in which a lid body 20 is provided on a heat shield plate 10 and a state in which a lid body 21 is provided on the front side of a common mode choke coil 2; Perspective view of heat shield plate 10 The figure which shows the state by which the core 4 was fixed to the heat-insulating plate 10 of FIG. 4A. Enlarged view of the first plate member 10a FIG. 4 is a diagram showing the temperature distribution when the hole 12 is not formed in the heat shield plate 10; FIG. 3 is a diagram showing temperature distribution when holes 12 are formed in the heat shield plate 10;

A power converter according to an embodiment of the present invention will be described in detail below with reference to the drawings. In addition, this invention is not limited by this embodiment. In each form, deviations in parallel, right-angled, horizontal, vertical, up-down, left-right, etc. directions are allowed to the extent that the effects of the present invention are not impaired. The X-axis direction, the Y-axis direction, and the Z-axis direction respectively represent directions parallel to the X-axis, directions parallel to the Y-axis, and directions parallel to the Z-axis. The X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other. The XY plane, YZ plane, and ZX plane are virtual planes parallel to the X-axis direction and Y-axis direction, virtual planes parallel to the Y-axis direction and Z-axis direction, and virtual planes parallel to the Z-axis direction and X-axis direction, respectively. represents In FIG. 1 and subsequent figures, of the X-axis directions, the direction indicated by the arrow is the plus X-axis direction, and the opposite direction is the minus X-axis direction. Of the Y-axis directions, the direction indicated by the arrow is the positive Y-axis direction, and the opposite direction is the negative Y-axis direction. Of the Z-axis directions, the direction indicated by the arrow is the positive Z-axis direction, and the opposite direction is the negative Z-axis direction.

Embodiment FIG. 1 is an external view of a power converter 100 according to an embodiment of the present invention. The power conversion device 100 is an inverter having a housing 110 with a sealed structure that prevents entry of rain, dust, and the like, for example. The vertical direction of the housing 110 is equal to the X-axis direction, the horizontal direction of the housing 110 is equal to the Y-axis direction, and the depth direction of the housing 110 is equal to the Z-axis direction. The housing 110 is a bottomed box-shaped container. A front panel 120 that covers the opening of the housing 110 is provided on the plus Z-axis direction side of the housing 110 . The front panel 120 is provided openable and closable via a hinge 130 fixed to the housing 110 .

Note that the power conversion device 100 is not limited to a so-called inverter (a device that converts direct current to variable voltage, variable frequency alternating current), and may be a device that includes various reactors described later and switching elements for power conversion. That is, the power conversion device 100 includes a converter that converts DC power into AC power, a DC chopper that controls the value of DC power by switching (on/off) the DC power with a power semiconductor element, and a frequency lower than the input frequency. A cycloconverter or the like that obtains an alternating current of .

FIG. 2 is a diagram showing an example of a circuit that constitutes the power converter 100 shown in FIG. For example, the power converter 100 includes an EMC (Electromagnetic Compatibility) filter 101 , a diode rectifier 102 that rectifies a three-phase AC voltage, and a three-phase inverter main circuit 103 .

The EMC filter 101 includes a line capacitor 1, a common mode choke coil 2 (L _c ), a ground capacitor 3, and the like to remove noise.

The three-phase inverter main circuit 103 includes a core 4 (L _core ), a DC reactor 5 (L _DC ), a smoothing capacitor 7, and a plurality of switching elements S ₁ to S ₆ , and converts the rectified voltage into a three-phase AC voltage. Convert. The three-phase AC voltage converted by the three-phase inverter main circuit 103 is applied to a load (motor 200, etc.).

The core 4 is provided on the positive side DC bus and the negative side DC bus that connect the diode rectifier 102 and the three-phase inverter main circuit 103, and performs auxiliary suppression of electromagnetic noise.

The DC reactor 5 is provided, for example, on the positive side DC bus, and is provided to suppress harmonic current superimposed on the commercial voltage and to improve the power factor.

The plurality of switching elements S ₁ to S ₆ are three-phase bridge-connected semiconductor switching elements that convert the DC power supplied from the diode rectifier 102 into AC power. Hereinafter, the plurality of switching elements S ₁ to S ₆ will be referred to as "switching elements" when they are not distinguished from each other. The switching element is a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), or the like. Each switching element is turned on or off according to a PWM signal (gate drive signal) input from a gate drive circuit (not shown). The gate drive circuit is a circuit that converts a PWM signal input from a control circuit (not shown) into a gate drive signal, which is a voltage signal capable of driving the switching element, and inputs the gate drive signal to the switching element.

The common mode choke coil 2, the core 4, and the DC reactor 5 each include, for example, a core portion formed by laminating annular members punched from a plurality of silicon steel plates, a core portion formed by sintering ferrite, and the like. is formed by winding a winding on the . When the switching elements are energized, the switching elements, the common mode choke coil 2, the core 4, the DC reactor 5 and the like generate heat.

Heat generated by heat-generating components such as the common mode choke coil 2, the core 4, and the DC reactor 5 is transmitted to surrounding components, which may cause the temperature of the surrounding components to exceed the allowable temperature. The surrounding components are, for example, the line capacitor 1, the ground capacitor 3, the smoothing capacitor 7 (C _dc ), the rectifying element that constitutes the diode rectifier 102, and the like. The power conversion device 100 includes a heat shield plate, which is a metal member, in order to prevent the heat generated by the heat-generating components from being transmitted to surrounding components. The structure of the heat shield will be described with reference to FIG. 3A and the like.

FIG. 3A is a diagram showing the internal structure of power converter 100 in which heat shield plate 10 is installed. As shown in FIG. 3A , a DC reactor 5 , a heat shield plate 10 , a common mode choke coil 2 , a control board 8 and the like are provided inside a housing 110 forming the outer shell of the power converter 100 . A switching element is provided on an end face (not shown) of the control board 8 in the minus Z-axis direction. The core 4 shown in FIG. 3B is fixed to the heat shield plate 10 shown in FIG. 3A. The details of the method of fixing the core 4 to the heat shield plate 10 will be described later.

FIG. 3B is a diagram showing the core 4, the DC reactor 5, etc., excluding the heat shield plate 10 shown in FIG. 3A. The DC reactor 5 is positioned at a corner in the internal space of the housing 110 where an end surface (ceiling surface 110a) of the housing 110 in the positive X-axis direction and an end surface (side surface 110b) of the housing 110 in the negative Y-axis direction intersect. It is provided in the portion near 110c.

For example, when the DC reactor 5, the core 4, and the like, which are heat-generating components, are provided in a portion near the end face (bottom surface 110d) in the negative X-axis direction of the housing 110, the heat generated by the DC reactor 5 is dissipated into the housing 110. Since the heat rises from the bottom surface 110d of the DC reactor 5 toward the ceiling surface 110a, other components present in the upper part of the DC reactor 5 are easily affected by the heat.

In the power conversion device 100, the DC reactor 5 and the like are provided in a portion near the corner 110c of the housing 110, so that the components that are easily affected by heat are relatively under the heat-generating components such as the DC reactor 5. located on the side. Therefore, the influence of the heat generated by the DC reactor 5 or the like on the relevant parts is reduced. The heat generated by the DC reactor 5 and the like is transmitted to the ceiling surface 110 a of the housing 110 and radiated to the outside of the housing 110 .

In the power conversion device 100, as shown in FIG. 3A, a heat shield plate 10 is installed so as to surround the DC reactor 5. As shown in FIG. The heat shield plate 10 is fixed to the end surface of the radiation fin base 6 in the plus Z-axis direction. The radiating fin base 6 is a plate-like heat radiating member for radiating the heat generated in the internal parts of the housing 110 to the outside of the housing 110 . Examples of materials for the radiation fin base 6 include metals such as aluminum, austenitic stainless alloys, copper alloys, cast iron, steel, and iron alloys. A plurality of fins (not shown) are provided on the end surface of the radiation fin base 6 in the minus Z-axis direction. By installing the heat shield plate 10 around the DC reactor 5, the heat generated in the DC reactor 5 is less likely to be transmitted to surrounding components.

Also, in the power conversion device 100 , part of the heat-generating components (for example, the core 4 etc.) is fixed to the heat shield plate 10 . Materials for the heat shield plate 10 include copper, aluminum, chromium, molybdenum, nickel, iron, titanium, palladium, indium, tungsten, gold, platinum, silver, stainless steel (SUS), and alloys containing a plurality of these, such as Nickel-iron alloys and the like can be used. Since the heat shielding plate 10 is fixed to the heat dissipating fin base 6, part of the heat generated by the heat generating component is transferred to the heat shielding plate 10, and further transferred to the heat dissipating fin base 6 and the like. Therefore, the influence of heat on components provided around the heat-generating components is further reduced.

The heat shield plate 10 is desirably made of a material having a higher thermal conductivity than the heat-generating component (for example, the core 4). With this configuration, the heat generated by the core 4 is easily transmitted to the heat shield plate 10, and the heat generated by the core 4 is more difficult to be transmitted to surrounding components.

It is desirable that the core 4 be fixed on the heat shield plate 10, for example, at a position near the side surface 110b of the housing 110 shown in FIG. 3A. By configuring in this way, for example, the DC bus extending from the diode rectifier 102 to the three-phase inverter main circuit 103 can be wired at a position near the side surface 110b of the housing 110, so the extra space in the internal space of the housing 110 can be effectively used. The connection of the DC bus to the core 4 is facilitated while being used for

FIG. 3C is a diagram showing a state in which the heat shield plate 10 is provided with the lid 20 and a state in which the lid 21 is provided on the front side of the common mode choke coil 2 . The lids 20 and 21 shown in FIG. 3C are conductive members made of the same material as the heat shield plate 10 and formed in a plate shape.

The lid 20 is screwed to the end face of the heat shield plate 10 in the plus Z-axis direction. The lid 20 is fixed to the heat shield plate 10 so as to cover the entire front side (plus Z-axis direction side) of the DC reactor 5 . Lid 20 is fixed to heat shield plate 10 so as to partition front panel 120 shown in FIG. 1 and DC reactor 5 .

The lid 21 is fixed inside the housing 110 so as to cover the portion of the common mode choke coil 2 on the plus Z-axis direction side. The lid 21 is screwed, for example, to a pedestal provided inside the housing 110 . Lid 21 partitions between front panel 120 and common mode choke coil 2 shown in FIG. 1 and is provided inside housing 110 . For example, the lid 21 is arranged on the minus Z-axis side of the slit (hole 12) formed in the heat shield plate 10 so as not to block the slit.

Next, the structure of the heat shield plate 10 and a method of fixing the heat generating component to the heat shield plate 10 will be described with reference to FIG. 4A and the like.

FIG. 4A is a perspective view of the heat shield plate 10. FIG. FIG. 4A shows the state before the core 4 is fixed to the heat shield plate 10 . FIG. 4B is a diagram showing a state in which the core 4 is fixed to the heat shield plate 10 of FIG. 4A.

The heat shield plate 10 is a conductive member formed in an L shape when the XY plane is viewed in the Z-axis direction. The heat shield plate 10 includes a plate-like first plate member 10a that extends in the Y-axis direction and stands up in the Z-axis direction. It includes a plate-like second plate member 10b that extends and stands in the Z-axis direction, and a plurality of fixing members 10c.

The fixing member 10 c is a member for fixing the heat shield plate 10 to the heat radiation fin base 6 . The plurality of fixing members 10c extend in a direction perpendicular to the Z-axis direction from the ends in the negative Z-axis direction of each of the first plate-like member 10a and the second plate-like member 10b. An insertion opening into which a screw is inserted is formed in the fixing member 10c. The screw is a fastening member for fixing the heat shield plate 10 to the radiator fin base 6 .

A hole 10d is formed in the first plate member 10a. The hole 10d is a first hole that communicates with a space formed by the inner peripheral surface (wall surface) of the annular core 4 (a hole formed in the core 4). The shape of the hole 10 d is, for example, the same shape (circle) as the hole formed in the core 4 . The size of the hole 10d may be any size as long as it communicates with the hole formed in the core 4 and allows the wiring wound around the core 4 to pass therethrough.

As shown in FIG. 4B, the core 4 is fixed to the first plate member 10a. At this time, the end face of the core 4 in the minus X-axis direction is fixed in contact with the first plate member 10a. A plurality of binding members are used to fix the core 4 to the first plate member 10a.

A plurality of holes 12, which are slits penetrating in the X-axis direction, are formed in the first plate member 10a. The number of holes 12 is not limited to two, and may be one or more. The hole 12 is provided at a position near the end face 10a1 in the plus Z-axis direction and near the end face 10a2 in the minus Y-axis direction in the entire first plate-like member 10a. be done. That is, the hole 12 is not formed in the first portion 41 closer to the magnetic component, and the hole 12 is formed in the second portion 42 excluding the first portion 41 . The first portion 41 is a region formed by projecting the magnetic component toward the first plate member 10a in a substantially vertical direction, and the second portion 42 is a region provided near the side surface 110b of the housing 110. As shown in FIG. Note that the substantially vertical direction includes a direction parallel to a line segment forming an angle of, for example, 0° to 15° with respect to a plane parallel to the vertical direction.

The reason why the holes 12 are formed in this way is as follows. The temperature of the air existing in the area surrounded by the heat shield plate 10 and the lid 20 (the area surrounding the DC reactor 5 ) differs between a position near the DC reactor 5 and a position away from the DC reactor 5 . Specifically, the temperature of air present at a position relatively distant from DC reactor 5 (position near side surface 110 b of housing 110 ) is lower than the temperature of air present near the surface of DC reactor 5 . Therefore, it is possible to increase the temperature difference between the relatively low-temperature air existing at a position relatively distant from the DC reactor 5 and the air existing outside the first plate member 10a. By utilizing this temperature difference, the high-temperature air present in the outer region of the first plate-shaped member 10a (the region of the first plate-shaped member 10a in the negative X-axis direction) can be changed to the inner region of the first plate-shaped member 10a ( It becomes easier to introduce the first plate-shaped member 10a into the plus X-axis direction area). Therefore, since it is possible to suppress the accumulation of high-temperature air in the outer region of the first plate-shaped member 10a, circuit components provided around the DC reactor 5, for example, diodes provided in the outer region of the first plate-shaped member 10a A temperature rise of each diode of the rectifier 102, the smoothing capacitor 7, etc. is suppressed.

The position where the hole 12 is formed is not limited to the position shown in the illustrated example, and may be formed in the second plate member 10b, for example. When a through-hole similar to the hole 12 is formed in the second plate-shaped member 10b, for example, in the entire second plate-shaped member 10b, a position near the end face 10b1 in the plus Z-axis direction on a plane in the Y-axis direction It is desirable to provide it at a position close to the end face (connection portion between the second plate-like member 10b and the first plate-like member 10a) in the minus X-axis direction. Even when configured in this way, the temperature of the air present below the DC reactor 5 is lower than the temperature of the air present above the DC reactor 5, so the air present below the DC reactor 5 and The temperature difference with the air existing outside the second plate member 10b can be increased. Using this temperature difference, the outer region of the first plate-shaped member 10a or the second plate-shaped member 10b (region in the negative X-axis direction of the first plate-shaped member 10a, positive Y-axis direction of the second plate-shaped member 10b) area) is easily introduced into the inner area of the second plate-like member 10b (the area of the second plate-like member 10b in the plus Y-axis direction). Therefore, it is possible to prevent high-temperature air from remaining in the outer region of the first plate-like member 10a or the second plate-like member 10b.

The heat shield plate 10, which is a plate in which the holes 12 are formed in this way, is effective for the power conversion device 100 having the enclosure 110 with a closed structure in which outside air is not introduced, and at the same time, the air inside the enclosure 110 is removed. It is also effective for a cooling fanless power converter 100 that does not have a circulating cooling fan. Since the temperature inside the housing 110 tends to be higher in the case 110 with the sealed structure than in the case with the non-sealed structure, if air stagnation occurs, the service life of circuit components such as the smoothing capacitor 7 will be greatly shortened. can be shorter. In addition, in the case 110 without a cooling fan, air is more likely to stagnate than in a case with a cooling fan, and thus the life of circuit components can be greatly shortened. Therefore, by using the heat shield plate 10 in which the holes 12 are formed, the service life of the circuit parts can be extended and, for example, the junction temperature of the switching element can be reduced. A high power electronics device 100 can be obtained.

A method of fixing the core 4 to the first plate member 10a using a binding member will be described with reference to FIG. FIG. 5 is an enlarged view of the first plate member 10a. Two holes 10e1 and 10e2 provided around the hole 10d are formed in the first plate member 10a. The two holes 10e1 and 10e2 are a second hole and a third hole formed near the inner peripheral surface (wall surface 10d1) forming the hole 10d. The two holes 10e1 and 10e2 are holes formed independently in the first plate member 10a without being connected to the hole 10d. The two holes 10e1 and 10e2 are formed at positions symmetrical with respect to an imaginary line passing through the center CL of the hole 10d so as to straddle the hole 10d when the first plate member 10a is viewed in plan on the YZ plane, for example. be done. A virtual line VL is a line parallel to the YZ plane and extending in the Y-axis direction. The virtual line VL is also a line that bisects the hole 10d into upper and lower regions.

A first binding member 11a for binding the lower side of the core 4 to the first plate member 10a is inserted into the hole 10d and the hole 10e1. A second binding member 11b for binding the upper side of the core 4 to the first plate member 10a is inserted into the hole 10d and the hole 10e2. In this state, the first binding member 11a and the second binding member 11b are tightened so that they cannot be reversed. As a result, the core 4 and the first plate member 10a are bound together while being in close contact with each other. The first binding member 11a and the second binding member 11b are, for example, binding bands made of resin or metal. Binding bands are required to have physical and chemical properties such as weather resistance, heat resistance, and chemical resistance. Cable ties are therefore made of materials such as nylon, polypropylene, and stainless steel. The hole 10e1 and the hole 10e2 may be formed near the wall surface 10d1 forming the hole 10d so that the hole 10d exists on the line of sight GL.

In this manner, the core 4 is fixed in close contact with the first plate-shaped member 10a by binding by the first binding member 11a and the second binding member 11b. After binding by the first binding member 11a and the second binding member 11b, the tip portions (tips of the band portions) of the first binding member 11a and the second binding member 11b are cut off, resulting in the state shown in FIG. 4B. For example, even if the binding members deteriorate over time and become slightly loose due to temperature changes around the power conversion device 100, the first binding member 11a and the second binding member 11a and the second binding member 11a and the second binding member 11a remain in a state in which gravity is applied to the core 4 in the vertical direction. The core 4 can be fixed by at least one of 11b. Therefore, it is possible to prevent the core 4 from coming off due to vibration during operation of the power conversion device 100 .

In addition, since the core 4 is fixed in close contact with the first plate-like member 10a, the core 4 and the first plate-like member 10a are more stable than when the core 4 is fixed by being fitted into the hole 10d of the first plate-like member 10a, for example. 1 The contact area with the plate member 10a is increased. Therefore, the heat generated in the core 4 can be effectively transferred to the first plate-shaped member 10a, and the influence of the heat on surrounding parts can be reduced.

Moreover, the core 4 can be easily fixed only by forming a simple structure into which the first binding member 11a and the second binding member 11b can be inserted in the first plate member 10a.

In addition, since the first binding member 11a and the second binding member 11b are general-purpose products, the first binding member 11a and the second binding member 11b can be easily obtained, and the first binding member 11a and the second binding member 11b can be easily obtained according to the size of the core 4 and the like. It is also possible to easily change the length, width, etc. of the member 11a and the second binding member 11b. The shape of the heat shield plate 10 may have a shield structure capable of reducing the influence of the heat generated by the heat-generating member on the surrounding parts. may be used, or a flat plate-like one may be used. Also, the number of binding members may be two or more.

FIG. 6A is a diagram showing the temperature distribution when the hole 12 is not formed in the heat shield plate 10. FIG. FIG. 6B is a diagram showing the temperature distribution when the hole 12 is formed in the heat shield plate 10. As shown in FIG. If the hole 12 is not formed in the heat shield plate 10, the air heated by the heat generated by the core 4 and the like stays in the lower area of the heat shield plate 10 as shown in FIG. The upper surface temperature rises to nearly 107°C. On the other hand, when the hole 12 is formed in the heat shield 10, the air in the area below the heat shield 10 is introduced into the area surrounded by the heat shield 10 as shown in FIG. The surface temperature of the core 4 is lowered without stagnation of high temperature air. In addition, since high-temperature air does not remain, the influence of temperature rise on not only the core 4 but also circuit components such as a smoothing capacitor provided around the heat shield plate 10 is reduced.

As described above, power converter 100 according to the embodiment includes housing 110, magnetic components provided inside housing 110, and circuit components provided around the magnetic components inside housing 110. Prepare. Power conversion device 100 includes a plate (heat shield plate 10 ) provided inside housing 110 so as to partition magnetic components and circuit components. The heat shield plate 10 has a hole 12 that communicates between a first region 31 (see FIG. 3A) on the magnetic component side of the heat shield plate 10 and a second region 32 (see FIG. 3A) on the circuit component side of the heat shield plate 10. is formed.

With this configuration, the high-temperature air existing in the outer region of the heat shield plate 10 can be introduced into the inner region of the heat shield plate 10, and the high-temperature air existing in the outer region of the heat shield plate 10 can be introduced into the heat shield plate 10. It is possible to suppress staying in the surroundings. Therefore, the temperature rise of the circuit parts provided around the heat shield plate 10 is suppressed, the life of the circuit parts is extended, and the power converter 100 with high reliability can be obtained.

Further, in the power converter 100 according to the embodiment, the plate (heat shield plate 10) does not have the hole 12 in the first portion 41 closer to the magnetic component, and the hole 12 is formed in the second portion 42 excluding the first portion 41. may be configured to be formed. The first portion 41 and the second portion 42 may exist, for example, in the first plate-like member 10a or the second plate-like member 10b shown in FIG. 4A. It may exist on both sides of the member 10b.

With this configuration, it is possible to increase the temperature difference between the low-temperature air existing at a position away from the magnetic component and the high-temperature air existing outside the heat shield plate 10 among the air existing inside the heat shield plate 10. . By utilizing this temperature difference, the air existing outside the heat shield plate 10 can be easily introduced to the inside of the heat shield plate 10 . Therefore, compared to the case where the holes 12 are formed in the first portion 41 closer to the magnetic component, it is possible to suppress the retention of high-temperature air outside the heat shield plate 10, and the circuit components provided around the magnetic component can be prevented. Temperature rise is suppressed. Therefore, it is possible to further extend the life of the circuit components, extend the maintenance cycle of the power conversion device 100, suppress an increase in maintenance costs, and obtain the power conversion device 100 with high reliability.

Further, in the power conversion device 100 according to the embodiment, the first portion 41 is a region formed by projecting the magnetic component toward a plate (for example, the first plate member 10a of the heat shield plate 10) in a substantially vertical direction. The second portion 42 may be configured to be a region provided closer to the side surface of the housing than the first portion 41 .

With this configuration, the first portion 41 in which the hole 12 is not formed and the second portion 42 in which the hole 12 is formed are provided in the substantially vertical direction of the magnetic component, and the hole 12 is formed on the side surface of the housing 110. 110b. As a result, compared to the case where the holes 12 are formed in the first portion 41, the air existing below the first plate-like member 10a (substantially vertically below) and the vicinity of the side surface 110b of the housing 110 Heat exchange takes place with the cold air present. Therefore, the air passing through the holes 12 is introduced inside the first plate member 10a while lowering its temperature. As a result, the temperature rise of the magnetic component provided inside the first plate member 10a can be suppressed, and the temperature difference between the inside and outside of the first plate member 10a can be increased. The stagnation of air existing outside can be further reduced. Therefore, the life of the circuit components is further extended, and the maintenance cycle of the power conversion device 100 can be further extended.

The configuration shown in the above embodiment shows an example of the content of the present invention, and it is possible to combine it with another known technology, and one configuration can be used without departing from the scope of the present invention. It is also possible to omit or change the part.

Reference Signs List 1: Line capacitor 2: Common mode choke coil 3: Grounding capacitor 4: Core 5: DC reactor 6: Radiation fin base 7: Smoothing capacitor 8: Control board 10: Heat shield plate 10a: First plate member 10a1: End surface 10a2: end surface 10b: second plate member 10b1: end surface 10c: fixing member 10d: hole 10d1: wall surface 10e1: hole 10e2: hole 11a: first binding member 11b: second binding member 12: hole 20: lid 21: Lid 31 : First region 32 : Second region 41 : First part 42 : Second part 100 : Power converter 101 : EMC filter 102 : Diode rectifier 103 : Three-phase inverter main circuit 110 : Housing 110a : Ceiling surface 110b: Side 110c: Corner 110d: Bottom 120: Front panel 130: Hinge 200: Motor CL: Center GL: Line of sight S1: Switching element S2: Switching element S3: Switching element S4: Switching element S5: Switching element S6: Switching Element VL: virtual line

Claims (2)

a housing;
a magnetic component provided inside the housing;
a circuit component provided around the magnetic component inside the housing;
a plate provided to partition between the magnetic component and the circuit component inside the housing,
The plate is formed with a hole communicating between a first region of the plate on the side of the magnetic component and a second region of the plate on the side of the circuit component , and the hole is formed in a first portion closer to the magnetic component. power conversion device , wherein the hole is formed in a second portion excluding the first portion . the first portion is a region formed by projecting the magnetic component in a substantially vertical direction toward the plate;
The power converter according to claim 1 , wherein the second portion is a region provided closer to the side surface of the housing than the first portion.

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