JP2008072033A - Inductance component, module device using the same and electronic apparatus - Google Patents

Inductance component, module device using the same and electronic apparatus Download PDF

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Publication number
JP2008072033A
JP2008072033A JP2006251053A JP2006251053A JP2008072033A JP 2008072033 A JP2008072033 A JP 2008072033A JP 2006251053 A JP2006251053 A JP 2006251053A JP 2006251053 A JP2006251053 A JP 2006251053A JP 2008072033 A JP2008072033 A JP 2008072033A
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coil
inductance component
heat
module device
magnetic core
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Koji Nakajima
浩二 中嶋
Toshiyuki Taniguchi
俊幸 谷口
Toshiyuki Nakada
俊之 中田
Tatsuichi Yamanouchi
辰一 山之内
Toru Onishi
徹 大西
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Coils Or Transformers For Communication (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a temperature rise in a coil in an inductance component having the coil, a module device using the same, and an electronic apparatus. <P>SOLUTION: In order to achieve this purpose, the present invention is provided with closed-circuit shaped magnetic cores 4 and 5 having a leg 4A and a coil 7 built in the leg 4A, and has such a structure that the coil 7 is adherently provided with a heat dissipating member 9. By such a structure, heat generated by the coil 7 can be efficiently transmitted to the heat dissipating member 9 without interposing the magnetic core 4 between the coil 7 and the heat dissipating member 9. As a result, a temperature rise in the coil 7 can be largely reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、コイルを有するインダクタンス部品に関するものである。   The present invention relates to an inductance component having a coil.

従来この種のインダクタンス部品は、図６に示されるように、トランス１の引出電極１Ａを実装基板２に設けた貫通孔２Ａに挿入する構成とするとともに、トランス１における磁心１Ｂの下面に放熱板３を設けることにより、コイル１Ｃで発生した熱を放熱させていた。   Conventionally, as shown in FIG. 6, this type of inductance component has a configuration in which the lead electrode 1A of the transformer 1 is inserted into a through hole 2A provided in the mounting substrate 2, and a heat sink is formed on the lower surface of the magnetic core 1B of the transformer 1. By providing 3, the heat generated in the coil 1C was dissipated.

なお、この出願に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００５−８０３８２号公報 As prior art document information relating to this application, for example, Patent Document 1 is known.
JP 2005-80382 A

このような従来のインダクタンス部品はコイル内部における温度上昇が問題となっていた。   Such a conventional inductance component has a problem of temperature rise inside the coil.

すなわち、上記従来の構成においては、コイル１Ｃと放熱板３との間に磁心１Ｂが介在してしまうため、コイル１Ｃから放熱板３への放熱効率が悪く、その結果として、コイル１Ｃ内部における温度上昇を生んでいた。   That is, in the above conventional configuration, since the magnetic core 1B is interposed between the coil 1C and the heat radiating plate 3, the heat radiation efficiency from the coil 1C to the heat radiating plate 3 is poor, and as a result, the temperature inside the coil 1C is reduced. A rise was born.

そこで本発明は、コイルを有するインダクタンス部品と、これを用いたモジュールデバイス、及び電子機器において、そのコイル内部における温度上昇の低減を目的とする。   Accordingly, an object of the present invention is to reduce an increase in temperature inside the coil in an inductance component having a coil, a module device using the inductance component, and an electronic apparatus.

そして、この目的を達成するために本発明は、脚を有する閉路状磁心と、前記脚に組み込まれたコイルとを備え、前記コイルには放熱部材を密着させて設ける構成としたものである。   In order to achieve this object, the present invention comprises a closed magnetic core having legs and a coil incorporated in the leg, and a heat radiating member is provided in close contact with the coil.

本発明のインダクタンス部品と、これを用いたモジュールデバイス、及び電子機器は、放熱部材をコイルに密着させる構成としたことにより、コイルと放熱部材の間に磁心を介在させること無く、コイルで発生した熱を効率よく放熱部材に伝達することができる。その結果として、コイル内部における温度上昇を大幅に低減することができる。   The inductance component of the present invention, the module device using the same, and the electronic apparatus are generated in the coil without interposing a magnetic core between the coil and the heat dissipation member by adopting a configuration in which the heat dissipation member is in close contact with the coil. Heat can be efficiently transmitted to the heat dissipation member. As a result, the temperature rise inside the coil can be greatly reduced.

（実施の形態１）
以下、本発明の実施の形態１におけるインダクタンス部品と、これを用いたモジュールデバイス、及び電子機器について図面を参照しながら説明する。 (Embodiment 1)
Hereinafter, an inductance component, a module device using the inductance component, and an electronic apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings.

図１において、磁心４の中脚４Ａと、磁心５の中脚５Ａとを互いに対向させ閉路状磁心を構成しており、この中脚４Ａ、５Ａには、ボビン６を介してコイル７を巻回している。   In FIG. 1, a middle leg 4A of a magnetic core 4 and a middle leg 5A of a magnetic core 5 are opposed to each other to form a closed magnetic core. A coil 7 is wound around the middle legs 4A and 5A via a bobbin 6. It is turning.

ここで、この中脚４Ａは、図２に示すごとく、放熱部材としての放熱板９における貫通孔９Ａに挿入させており、図１に示すごとく、コイル７と磁心４との間に介在させている。   Here, as shown in FIG. 2, the middle leg 4A is inserted into the through hole 9A in the heat radiating plate 9 as a heat radiating member, and is interposed between the coil 7 and the magnetic core 4 as shown in FIG. Yes.

そして、磁心４の外脚４Ｃを、図２に示すごとく、放熱板９形成平面に垂直な方向に、図１に示す背脚４Ｂから、コイル７及び中脚４Ａを覆うごとく形成している。これと同様に磁心５の外脚を、図１に示す背脚５Ｂから、コイル７及び中脚５Ａを覆うごとく形成し、前述の外脚４Ｃと対向させている。   As shown in FIG. 2, the outer legs 4C of the magnetic core 4 are formed so as to cover the coils 7 and the middle legs 4A from the back legs 4B shown in FIG. Similarly, the outer leg of the magnetic core 5 is formed so as to cover the coil 7 and the middle leg 5A from the back leg 5B shown in FIG. 1, and is opposed to the aforementioned outer leg 4C.

ここで、このボビン６の下側（磁心４の背脚部４Ｂ対向面側）には切欠き６Ｂを設けており、この切欠き６Ｂから露出させたコイル７と、銅等の導電性の高い金属等からなる放熱板９とを、接着剤などの固着手段１０により固着している。   Here, a notch 6B is provided on the lower side of the bobbin 6 (on the side facing the back leg 4B of the magnetic core 4), and the coil 7 exposed from the notch 6B and a highly conductive material such as copper. The heat radiating plate 9 made of metal or the like is fixed by fixing means 10 such as an adhesive.

さらに、この放熱板９には、図２に示すごとく、その貫通孔９Ａから外側部にまでスリット９Ｂを形成している。これは、１次巻線に電流が流れることにより発生した磁束に起因して、放熱板９において短絡電流が発生し、この短絡電流の発生による逆方向の磁束の発生を防ぐためである。   Further, as shown in FIG. 2, the heat radiating plate 9 is formed with a slit 9B from the through hole 9A to the outer side. This is because a short circuit current is generated in the heat radiating plate 9 due to the magnetic flux generated by the current flowing through the primary winding, and the generation of a reverse magnetic flux due to the generation of the short circuit current is prevented.

さらに、この放熱板９は、図１に示すごとく、コイルと対向する部分９Ｃからコイルと対向しない部分９Ｄにまで設ける構成としている。   Further, as shown in FIG. 1, the heat radiating plate 9 is configured to be provided from a portion 9C facing the coil to a portion 9D not facing the coil.

なお、このスリット９Ｂは、図３に示すごとく、貫通孔９Ａの径（あるいは幅）よりも太い幅を有するよう形成してもかまわない。ただし、図１に示すごとく、少なくとも放熱板９の一部がコイルと対向する部分９Ｃから形成される構成とすることが、放熱特性を向上させる上で望ましい。   As shown in FIG. 3, the slit 9B may be formed so as to have a width larger than the diameter (or width) of the through hole 9A. However, as shown in FIG. 1, it is desirable that at least a part of the heat radiating plate 9 is formed of a portion 9C facing the coil in order to improve the heat radiation characteristics.

そして、図１、４に示すごとく、コイルと対向しない部分９Ｄにまで引き出された放熱板９の上側（磁心５の背脚部５Ｂ対向面側）には熱伝導性樹脂１１を設けるとともに、この熱伝導性樹脂１１の上側（磁心５の背脚部５Ｂ対向面側）には銅等からなるリードフレーム１２を設けている。このリードフレーム１２は、図１に示すごとく、その一端がコイル７の引出端子７Ａと電気的に接続される構成とするとともに、その他端が実装基板１３に設けられた貫通孔１３Ａに挿入される構成とすることにより、コイル７の電極を実装基板１３表面まで引き出すことを可能としている。   As shown in FIGS. 1 and 4, a heat conductive resin 11 is provided on the upper side of the heat sink 9 drawn to the portion 9D not facing the coil (on the side facing the back leg 5B of the magnetic core 5). A lead frame 12 made of copper or the like is provided on the upper side of the thermal conductive resin 11 (on the side facing the back leg 5B of the magnetic core 5). As shown in FIG. 1, the lead frame 12 is configured such that one end thereof is electrically connected to the lead terminal 7 </ b> A of the coil 7, and the other end is inserted into a through hole 13 </ b> A provided in the mounting substrate 13. With the configuration, the electrode of the coil 7 can be drawn to the surface of the mounting substrate 13.

さらに、本実施形態においては、実装基板１３に貫通孔１３Ｂを設け、この貫通孔１３Ｂに磁心５の背脚部５Ｂを陥没させることにより、このモジュールデバイス全体の低背化を可能としている。   Furthermore, in the present embodiment, the through-hole 13B is provided in the mounting substrate 13, and the back leg portion 5B of the magnetic core 5 is recessed in the through-hole 13B, whereby the overall height of the module device can be reduced.

このように、本実施形態のモジュールデバイスは、コイル７と放熱板９の間に磁心４を介在させること無く、放熱板９をコイル７に密着させる構成としたことにより、コイル７と放熱板９の間に磁心４を介在させること無く、コイル７で発生した熱を効率よく放熱板９に伝達することができる。そして、放熱板９をコイルと対向する部分９Ｃから、コイル７と対向しない部分９Ｄにまで設ける構成とすることにより、コイル７から伝達されたその熱をコイルと対向しない部分９Ｄへ放出させることができるため、コイル７内部における温度上昇を大幅に低減することができる。   As described above, the module device of the present embodiment is configured such that the heat sink 9 is in close contact with the coil 7 without interposing the magnetic core 4 between the coil 7 and the heat sink 9. The heat generated in the coil 7 can be efficiently transmitted to the heat radiating plate 9 without interposing the magnetic core 4 therebetween. Then, by providing the heat radiating plate 9 from the portion 9C facing the coil to the portion 9D not facing the coil 7, the heat transmitted from the coil 7 can be released to the portion 9D not facing the coil. Therefore, the temperature rise inside the coil 7 can be greatly reduced.

さらに、本実施形態においては、放熱板９における熱伝導性樹脂１１非形成面側にヒートシンク１４を設けることにより放熱性を高めている。   Furthermore, in this embodiment, the heat dissipation is improved by providing the heat sink 14 on the heat conductive resin 11 non-formation surface side in the heat sink 9.

なお、コイル７と放熱板９との間に固着手段１０を介在させない構成としてもかまわないが、本実施の形態に示すごとく、コイル７と放熱板９との間に接着剤などの固着手段１０を設けることにより、コイル７と放熱板９との密着性を高め、コイル７から放熱板９への伝熱特性を高めることができるため望ましい。また、この固着手段１０は熱伝導性の高い材料を用いることが望ましい。   The fixing means 10 may not be interposed between the coil 7 and the heat radiating plate 9, but as shown in the present embodiment, the fixing means 10 such as an adhesive is provided between the coil 7 and the heat radiating plate 9. It is desirable because the adhesiveness between the coil 7 and the heat sink 9 can be improved and the heat transfer characteristics from the coil 7 to the heat sink 9 can be improved. Further, it is desirable to use a material having high thermal conductivity for the fixing means 10.

なお、図１に示すごとく、リードフレーム１２の表面に、ＦＥＴ１５やダイオード１６などの電子部品を実装することも可能である。このＦＥＴ１５やダイオード１６からの発熱も、熱伝導性樹脂１１を介して放熱板９に伝達され、ヒートシンク１４により放熱させることができる。   As shown in FIG. 1, electronic components such as FET 15 and diode 16 can be mounted on the surface of the lead frame 12. Heat generated by the FET 15 and the diode 16 is also transmitted to the heat radiating plate 9 through the heat conductive resin 11 and can be radiated by the heat sink 14.

なお、コイル７は巻線タイプのものでも、偏平形のものでもかまわないが、偏平形のものを用いると、放熱板９との接触面積を容易に確保することができるため望ましい。   The coil 7 may be of a winding type or a flat type, but it is preferable to use a flat type because the contact area with the heat sink 9 can be easily secured.

また、コイル７の形状は偏平形、巻線タイプに限られず、磁心４、５に組み込まれる構成であればよい。   Further, the shape of the coil 7 is not limited to the flat shape and the winding type, and may be any configuration as long as it is incorporated in the magnetic cores 4 and 5.

なお、放熱部材は板形状のものに限定しない。   The heat dissipation member is not limited to a plate shape.

（実施の形態２）
以下、本発明の実施の形態２におけるインダクタンス部品と、これを用いたモジュールデバイス、及び電子機器について図５を参照しながら説明する。 (Embodiment 2)
Hereinafter, an inductance component, a module device using the inductance component, and an electronic apparatus according to the second embodiment of the present invention will be described with reference to FIG.

なお、実施の形態１と同様の構成を有するものについては、同一符号を付し、その説明を省略する。   In addition, about the thing which has the structure similar to Embodiment 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

本実施の形態において、放熱板１７にはコイル７を覆うごとく形成された屈曲部１７Ａを設けており、この屈曲部１７Ａを設けることにより、モジュールデバイス全体の低背化を可能としている。なお、屈曲部１７Ａの形状は省スペース化を適える形状であればコイル７を覆うごとく形成される形状に限定されないが、コイル７を覆う形状とすることにより、よりコイル７の熱を放熱することができ望ましい。   In the present embodiment, the heat radiating plate 17 is provided with a bent portion 17A formed so as to cover the coil 7. By providing the bent portion 17A, the overall height of the module device can be reduced. Note that the shape of the bent portion 17A is not limited to the shape formed so as to cover the coil 7 as long as the shape is suitable for space saving. However, by forming the shape to cover the coil 7, the heat of the coil 7 is further radiated. It can be desirable.

また、磁心４の背脚部４Ｂと放熱板１７との間に接着剤などの固着手段１８を設けることにより、磁心４の熱を効率よく放熱板１７に伝達することができる構成としている。   Further, by providing a fixing means 18 such as an adhesive between the back leg portion 4 </ b> B of the magnetic core 4 and the heat radiating plate 17, the heat of the magnetic core 4 can be efficiently transmitted to the heat radiating plate 17.

さらに、コイル７の引出電極１９をリードフレーム１２に接続することなく、直接実装基板１３の貫通孔１３Ｃに挿入する構成とすることにより、実装基板１３におけるＦＥＴ１５、ダイオード１６の電極引出部分から離れた場所に、コイル７の電極引出部分を配置する構成を実現している。   Further, the lead electrode 12 of the coil 7 is inserted directly into the through hole 13C of the mounting board 13 without being connected to the lead frame 12, so that it is separated from the electrode lead portions of the FET 15 and the diode 16 on the mounting board 13. The structure which arrange | positions the electrode extraction part of the coil 7 in the place is implement | achieved.

また、本実施の形態においては、中央部分に貫通孔２０Ａを有し、ピン端子２１により実装基板１３と電気的に接続される制御基板２０を設けている。この貫通孔２０Ａに磁心５及びボビン６を埋め込む構造とするとともに、ボビン６に設けた位置決め手段としての位置決め部６Ａによって制御基板２０を位置決めすることにより、本モジュールデバイス内における制御基板２０の位置を一定とすることができる。   Further, in the present embodiment, a control board 20 having a through hole 20A in the central portion and electrically connected to the mounting board 13 by a pin terminal 21 is provided. In addition to the structure in which the magnetic core 5 and the bobbin 6 are embedded in the through-hole 20A, the position of the control board 20 in the module device is determined by positioning the control board 20 by the positioning unit 6A as positioning means provided in the bobbin 6. Can be constant.

このようなパワーを変換するブロックを取り扱うモジュールデバイス内に、制御基板２０を一定の位置に組み込むことにより、本モジュールデバイスの入出力特性の安定化を図ることができる。そのことにより、パワーの変換ブロックの標準化を図ることができるため、モジュールを使わない一品一様設計時の無駄を大幅に削減することができる。ここで言う設計時の無駄としては、基板設計工数、誤作動対策、異常試験の実施、異常対策等が挙げられる。   By incorporating the control board 20 in a fixed position in a module device that handles such power converting blocks, the input / output characteristics of the module device can be stabilized. As a result, it is possible to standardize the power conversion block, and therefore it is possible to drastically reduce the waste during uniform design of a single product that does not use modules. Examples of design waste here include board design man-hours, countermeasures against malfunctions, implementation of abnormality tests, countermeasures against abnormalities, and the like.

なお、本実施の形態においては、位置決め手段としての位置決め部６Ａをボビン６に設ける構成としたが、実装基板１３や放熱板１７などに設けてもかまわない。   In the present embodiment, the positioning portion 6A as positioning means is provided on the bobbin 6. However, it may be provided on the mounting board 13, the heat radiating plate 17, or the like.

本発明のインダクタンス部品と、これを用いたモジュールデバイス、及び電子機器は、コイル内部における温度上昇を大幅に低減することができるという効果を有し、有用である。   The inductance component of the present invention, a module device using the inductance component, and an electronic apparatus have an effect that the temperature rise inside the coil can be greatly reduced, and are useful.

本発明の実施の形態１におけるモジュールデバイスの断面図Sectional drawing of the module device in Embodiment 1 of this invention 本発明の実施の形態１のモジュールデバイスにおける磁心と放熱板とを組み合わせた状態の上面図The top view of the state which combined the magnetic core and heat sink in the module device of Embodiment 1 of this invention 本発明の実施の形態１のモジュールデバイスにおける磁心と放熱板とを組み合わせた状態の上面図The top view of the state which combined the magnetic core and heat sink in the module device of Embodiment 1 of this invention 本発明の実施の形態１のモジュールデバイスにおける放熱板と熱伝導性樹脂とリードフレームとを組み合わせた状態の上面図The top view of the state which combined the heat sink, heat conductive resin, and lead frame in the module device of Embodiment 1 of this invention 本発明の実施の形態２におけるモジュールデバイスの断面図Sectional drawing of the module device in Embodiment 2 of this invention 従来のインダクタンス部品の断面図Sectional view of a conventional inductance component

符号の説明Explanation of symbols

４ 磁心（閉路状磁心）
４Ａ 中脚（脚）
５ 磁心（閉路状磁心）
７ コイル
９ 放熱板（放熱部材） 4 Magnetic core (closed magnetic core)
4A Middle leg (leg)
5 Magnetic core (closed magnetic core)
7 Coil 9 Heat sink (Heat dissipation member)

Claims (13)

脚を有する閉路状磁心と、
前記脚に組み込まれたコイルとを備え、
前記コイルには放熱部材を密着させて設けた
インダクタンス部品。 A closed magnetic core having legs;
A coil built into the leg,
An inductance component provided with a heat dissipation member in close contact with the coil. 放熱部材は、コイルと対向する部分からコイルと対向しない部分にまで形成した請求項１に記載のインダクタンス部品。 The inductance component according to claim 1, wherein the heat dissipating member is formed from a portion facing the coil to a portion not facing the coil. 放熱部材には屈曲部を設けた請求項１に記載のインダクタンス部品。 The inductance component according to claim 1, wherein the heat dissipating member is provided with a bent portion. 放熱部材は放熱板とし、
この放熱板には脚に挿入される貫通孔を設けた
請求項１に記載のインダクタンス部品。 The heat dissipation member is a heat sink,
The inductance component according to claim 1, wherein the heat radiating plate is provided with a through hole inserted into the leg. 放熱板には、貫通孔から放熱板外側部にまで形成されたスリットを設けた請求項４に記載のインダクタンス部品。 The inductance component according to claim 4, wherein the heat sink is provided with a slit formed from the through hole to the outer side of the heat sink. 放熱板には、コイルを覆うごとく形成された屈曲部を設けた
請求項４に記載のインダクタンス部品。 The inductance component according to claim 4, wherein the heat radiating plate is provided with a bent portion formed so as to cover the coil. コイルは偏平形コイルとした請求項４に記載のインダクタンス部品。 The inductance component according to claim 4, wherein the coil is a flat coil. 請求項１に記載のインダクタンス部品における放熱部材に
電子部品を実装したモジュールデバイス。 The module device which mounted the electronic component in the heat radiating member in the inductance component of Claim 1. 放熱部材の表面に熱伝導性樹脂を形成し、
この熱伝導性樹脂に熱的に接触されたリードフレームを設けた
請求項８に記載のモジュールデバイス。 Form a heat conductive resin on the surface of the heat dissipation member,
The module device according to claim 8, further comprising a lead frame that is in thermal contact with the thermally conductive resin. リードフレームとコイルの引出端子とを電気的に接続した請求項９に記載のモジュールデバイス。 The module device according to claim 9, wherein the lead frame and the lead terminal of the coil are electrically connected. 放熱部材の裏面にヒートシンクを設けた請求項８に記載のモジュールデバイス。 The module device according to claim 8, wherein a heat sink is provided on the back surface of the heat dissipation member. 請求項１〜７に記載のインダクタンス部品又は請求項８〜１１に記載のモジュールデバイスの内、少なくともいずれか１つが搭載された電子機器。 An electronic device on which at least one of the inductance component according to claim 1 or the module device according to claims 8 to 11 is mounted. 請求項８〜１１に記載のモジュールデバイスに位置決め手段を設け、
この位置決め手段に位置決めされる制御基板を設けた電子機器。 Positioning means is provided in the module device according to claim 8-11,
Electronic equipment provided with a control board positioned by the positioning means.
JP2006251053A 2006-09-15 2006-09-15 Inductance component, module device using the same and electronic apparatus Pending JP2008072033A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026597A (en) * 2011-07-26 2013-02-04 Shindengen Electric Mfg Co Ltd Transformer module and dc-dc converter device
WO2017159010A1 (en) * 2016-03-14 2017-09-21 オムロン株式会社 Heat dissipation structure of coil part, and coil part used therefor
CN111373496A (en) * 2017-11-08 2020-07-03 三菱电机株式会社 Transformer and power conversion device

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JPH08140349A (en) * 1994-11-08 1996-05-31 Sansha Electric Mfg Co Ltd Portable power supply device and manufacture of its enclosure
JP2003244959A (en) * 2002-02-20 2003-08-29 Tdk Corp Switching power source and its manufacturing method
JP2005080382A (en) * 2003-08-29 2005-03-24 Matsushita Electric Ind Co Ltd Power converting module device and power unit using it

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JPH0420217A (en) * 1990-05-14 1992-01-23 Mitsubishi Kasei Vinyl Co Vinyl chloride based resin film for agriculture
JPH08140349A (en) * 1994-11-08 1996-05-31 Sansha Electric Mfg Co Ltd Portable power supply device and manufacture of its enclosure
JP2003244959A (en) * 2002-02-20 2003-08-29 Tdk Corp Switching power source and its manufacturing method
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026597A (en) * 2011-07-26 2013-02-04 Shindengen Electric Mfg Co Ltd Transformer module and dc-dc converter device
WO2017159010A1 (en) * 2016-03-14 2017-09-21 オムロン株式会社 Heat dissipation structure of coil part, and coil part used therefor
CN111373496A (en) * 2017-11-08 2020-07-03 三菱电机株式会社 Transformer and power conversion device
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