JP2005110406A - Power conversion module device and power supply device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion module device improvable in design efficiency, small in size, reduced in heat generation, reduced in loss, and low in noise, and to provide a power supply device equipped with the same. <P>SOLUTION: The power conversion module device is characterized by mounting a transformer 11 on a printed wiring board 16 so that power elements 14, 15 contact with each other at their faces, and by not mounting a control circuit. This constitution makes wiring impedance small, reduces a loss, and improves a voltage waveform of an FET, thus achieving low noise. By forming a heat dissipation pattern on the printed wiring board 16, heat generations of the transformer 11 and the power elements 14, 15 are reduced, and the transformer can be made small in size. Furthermore, the design of a block is easy since the complicated control circuit is not mounted. As a result, the power conversion module device largely improvable in development efficiency, small in size, reduced in heat generation, reduced in loss, and low in noise can be provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a power supply device such as a switching power supply used for an electronic device and the like, and a power conversion module device mounted on the power supply device.

  In recent years, power consumption has been increasing in all electronic devices with a large increase in the amount of information communication, and low power consumption has become a social problem. In particular, the power supply section of these electronic devices is mainly composed of a switching power supply, and there is a technical issue of miniaturization and low noise as well as high efficiency of this power supply section. Speeding up development is an important point in developing electronic devices.

  Conventionally, this type of switching power supply has a configuration as shown in FIGS.

  Hereinafter, a conventional example will be described with reference to FIGS. FIG. 5 is a circuit block diagram of a conventional switching power supply, and FIG. 6 is an external perspective view of the conventional switching power supply.

  As shown in FIGS. 5 and 6, the conventional switching power supply generally includes an input circuit unit 1, a converter unit 2, and an output circuit unit 3 mounted on a single main board 9. .

  The input circuit unit 1 includes an input filter, an input rectifier circuit, a power factor correction circuit 4, a smoothing circuit, and the like. The converter unit 2 includes a control circuit 5, a transformer 6, a primary power element 7, a secondary power element 8, and the like. Here, the primary power element 7 is an FET, and the secondary power element 8 is often a diode. However, an FET may be used as a switch instead of the diode. Further, the output circuit unit 3 includes an output smoothing unit, an output conversion circuit unit, an output filter, and the like.

  The prior art document information related to this application is formed by modularizing a circuit block including a control circuit as in Patent Document 1, Patent Document 2, and Patent Document 3, for example.

Further, as another prior art document information of the present application, a wiring pattern for transferring heat to a printed coil transformer, a primary switch element, and a heat sink attached to a secondary rectifier circuit is provided on the mounting substrate as in Patent Document 4. There are also other configurations.
JP 2001-359281 A JP-A-5-198445 JP 2001-103756 A JP-A-8-45748

  However, in the configuration of FIGS. 5 and 6 showing the most general conventional example, each circuit block and all the components are mounted on one main board 9, and therefore each specification is slightly intertwined. As a result, it was difficult to determine the final specification, requiring skilled engineers with a lot of experience in design, and the development lead time was very long. In addition, when the output of the power supply increases, the size of the transformer 6 mounted on the converter unit 2 becomes extremely large, exceeding the size limitation of the power supply shape, exceeding the predetermined value even in terms of temperature rise, etc. There were also problems in terms of downsizing and low heat generation.

  Further, in Patent Documents 1 to 3, although a specific part is modularized and miniaturized, it is a complex module block full of functions having many parts such as a control circuit. Compared to the conventional example of FIG. For this reason, the development time and development cost are greatly increased, and the power supply block becomes expensive, so that there are many problems such as limited fields and applications in developing the market.

Further, in Patent Document 4, since the transformer terminal and the heat sink are connected by a wiring pattern, pattern design is restricted. In addition, since the wiring becomes longer, the wiring impedance also increases, and there are problems such as increased noise and increased loss. In addition, because the heat is transferred using the wiring pattern, the distance to the heat sink is increased, and the heat transfer effect does not improve beyond a certain level.
The present invention solves the above-mentioned conventional problems, and provides a small, low heat generation, low loss, low noise power conversion module device capable of greatly improving design and development efficiency and a switching power supply device equipped with the same. It is the purpose.

  In order to solve the above problems, the present invention has the following configuration.

  According to the first aspect of the present invention, in particular, the transformer and at least one of the primary and secondary power elements are mounted on the printed wiring board so as to be in surface contact with each other, and are provided on the printed wiring board. It is characterized in that it is connected to a control circuit provided on another substrate via an external connection terminal.

  With this configuration, since the wiring distance between the transformer and the power element can be minimized, the wiring impedance can be reduced and the loss on the wiring can be extremely reduced. In addition, the drain-source voltage (Vds) of the FET that becomes a noise source. The ringing waveform (Vp-p) of the diode, the waveform of the voltage across the diode, etc. are also greatly improved, so that the noise of the power supply can be reduced. In addition, since the transformer, the primary power element, and the secondary power element are mounted so as to be in surface contact with the printed wiring board, the heat of the transformer, the primary power element, and the secondary power element, which are main components of heat generation of the power source It is possible to transfer heat directly to the printed wiring board through the contact surface. Thus, the heat generation of the transformer, the primary power element, and the secondary power element can be greatly reduced, and the size of the transformer can be reduced. Furthermore, unlike the conventional case, the block of the present invention is not mounted with a complicated control circuit having many parts, so the design of this block becomes very simple, and even if it is not an expert in power supply design, it can be designed in a short time. It will be possible. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

  According to the second aspect of the present invention, in particular, the transformer and at least one of the primary and secondary power elements are mounted on one main plane of the printed wiring board on the printed wiring board. This provides a great effect that even a heavy component can be easily mounted by reflow or the like.

  The invention according to claim 3 of the present invention is the power conversion module device according to claim 1, wherein a single-sided printed wiring board having a pattern formed on one side is used as the printed wiring board. By using it, a great effect is obtained that a low-cost power conversion module device can be provided.

  Invention of Claim 4 of this invention is a power conversion module device of Claim 1 which used the double-sided printed wiring board which formed the pattern in both sides especially as a printed wiring board, Thereby, by this, more compactly Not only does this improve design flexibility. In addition, it is possible to form a pattern for transferring heat of the transformer, the primary power element, and the secondary power element, and a great effect is obtained that a power conversion module device with lower heat generation can be provided.

  The invention according to claim 5 of the present invention is the power conversion module device according to claim 1 in which a multilayer printed wiring board is used as the printed wiring board, whereby the transformer, primary power element, secondary The heat of the power element can be radiated more effectively by using the pattern, and a great effect is obtained that a power conversion module device with lower heat generation can be provided.

  According to the sixth aspect of the present invention, in particular, the transformer and the primary or second side are mounted on the opposite surface of the printed wiring board on which at least one of the primary and secondary power elements is mounted. The power conversion module device according to claim 2, wherein a pattern electrically isolated from a surface on which at least one of the following power elements is mounted is formed, thereby being electrically insulated from a component: The heat of the component can also be transferred to the pattern, and a great effect can be obtained that the temperature rise of the thin transformer and the primary and secondary power elements that are likely to become high temperature can be suppressed.

  The invention according to claim 7 of the present invention is the power conversion module device according to claim 1, wherein a metal base substrate in which an insulating resin layer is formed on a metal plate and a metal foil is formed thereon is used as a printed wiring board. In addition, since the metal base substrate has a low thermal resistance, the heat generation of the transformer, the primary power element, and the secondary power element can be greatly reduced, and a great effect can be obtained in that a power conversion module device with lower heat generation can be provided.

  The invention according to claim 8 of the present invention is the power conversion module device according to claim 1 attached so that the lower surface of the magnetic core of the transformer is in contact with the printed wiring board. Heat can be transferred, and the effect of significantly reducing the temperature rise of the transformer is born.

  The invention described in claim 9 of the present invention is the power conversion module device according to claim 8 in which a pattern of a printed wiring board is formed on a surface opposite to the magnetic core. Heat can be transferred, and the heat generated by the transformer can be further greatly reduced.

  The invention according to claim 10 of the present invention is the power conversion module device according to claim 8 in which the heat conducting member is sandwiched between the magnetic core and the printed wiring board. Since it is filled with the conductive member, there is an effect that variation in heat conduction is reduced.

  The invention according to claim 11 of the present invention is the power conversion module device according to claim 1 in which a transformer is disposed between the primary and secondary power elements, and thereby the transformer for insulation isolation is provided. The wiring pattern connecting the primary and the secondary can also be formed with the shortest distance, so that an effect of easily realizing a pattern design capable of greatly reducing the wiring loss is produced.

  The invention according to claim 12 of the present invention is a power supply device in which the first component and the second component are integrated, and the power according to claim 1 is used as the second component. A power supply device using a conversion module device and provided with a control circuit for controlling the second structural body on a first substrate forming the first structural body.

  With this configuration, the small size, low heat generation, and low loss, which are the characteristics of power conversion module devices, can be used as they are, which greatly simplifies thermal design and structural design, and has the great effect of significantly reducing development lead time. . In addition, the control circuit can be designed without being affected by the noise generated by the second structure, and the development lead time of the control circuit can be shortened.

  According to the thirteenth aspect of the present invention, in particular, a hollow is provided in the first substrate that forms the first structure of the portion facing the thin transformer that forms the second structure. Accordingly, the height of the transformer does not affect the overall height of the power supply device, and if other components are reduced in height, an effect that a thin power supply device can be realized is produced.

  The invention described in claim 14 of the present invention is mounted in such a manner that the surface of the printed wiring board forming the second structural body, on which no component is mounted, is in surface contact with the casing of the power supply device. As a result, the heat generated by the second structural body can be dissipated to the casing of the power source, so that a special heat sink for heat dissipation is not required.

  The invention according to claim 15 of the present invention is mounted so that the top surface of the transformer that forms the second structure and the surface of the first substrate that forms the first structure are in surface contact. 13. The power supply device according to claim 12, wherein the printed wiring board forming the second structure can be used as a heat sink sheet sink, so that the heat generation of the transformer, primary and secondary power elements can be reduced. In addition, a heat sink sheet sink is unnecessary or can be reduced.

  The power conversion module device of the present invention is characterized in that the transformer and at least one of the primary and secondary power elements are mounted on the printed wiring board so as to be in surface contact, and the control circuit is not mounted. In addition to the fact that wiring loss can be greatly reduced, FETs that serve as noise sources, the waveform of diode voltage, and the like are also greatly improved, so noise reduction of the power supply can be achieved. Further, the heat generation of the transformer and the power element can be greatly reduced, and the size of the transformer can be reduced. Further, since a complicated control circuit having many parts is not mounted, the design of this block becomes very simple, and even a person who is not skilled in power supply design can design in a short time. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

  Moreover, the power supply device of the present invention is a power supply device in which a first structural body and a second structural body are integrated, and the power conversion according to any one of claims 1 to 11 of the present invention as the second structural body. It is characterized by the use of a module device, and since the small size, low heat generation, low loss, and low noise that are the characteristics of the power conversion module device can be used as they are, thermal design and structural design become very simple, The big effect that the development lead time can be greatly reduced is born.

(Embodiment 1)
The invention according to the first to eleventh aspects of the present invention will be described below with reference to the first embodiment.

  FIG. 1 is an external view of a power conversion module device according to Embodiment 1 of the present invention.

  In FIG. 1, 11 is a thin transformer, 12 is a magnetic core, 13 is a thin laminated coil, 14 is a primary power element, 15 is a secondary power element, 16 is a printed wiring board, 17 is a wiring pattern, and 18 is an external connection terminal. Is shown.

  1 differs greatly from FIG. 5 showing the conventional example in that only the heat generating components of the transformer 6, the primary power element 7 and the secondary power element 8 except the control circuit 5 of the converter unit 2 in FIG. In the present invention, the transformer 6 is further changed to a thin transformer 11, and the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted on the printed wiring board 16. The difference is that the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted so as to be in surface contact with the printed wiring board 16.

  As described above, according to the configuration of FIG. 1 showing the first embodiment of the present invention, the thin transformer 11 and the primary power element 14 and the secondary power element 15 can be arranged as close as possible, and the wiring distance can be reduced. It can be as short as possible. As a result, the wiring impedance is reduced, and the loss on the wiring can be extremely reduced. In addition, the ringing waveform (Vp-p) of the drain-source voltage (Vds) of the FET serving as the noise source, and the waveform of the voltage across the diode. As a result, the power supply noise can be reduced. In addition, since the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted so as to be in surface contact with the printed wiring board 16, the thin transformer 11 and the primary power that are the main components of heat generation of the power source are mounted. The heat of the element 14 and the secondary power element 15 can be directly transferred to the printed wiring board 16 through the contact surface. Thus, the heat generation of the thin transformer 11, the primary power element 14, and the secondary power element 15 can be greatly reduced, and the size of the thin transformer 11 can be reduced. Furthermore, unlike the conventional case, the block of the present invention is not mounted with a complicated control circuit having many parts, so the design of this block becomes very simple, and even if it is not an expert in power supply design, it can be designed in a short time. It will be possible. As a result, it is possible to provide a small, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency.

  Here, the primary power element 14 is mainly an FET, and the secondary power element 15 is mainly an FET or a diode, but may be other elements. The effects of the present invention can be obtained even when at least one of the primary power element 14 and the secondary power element 15 is mounted.

  As shown in FIG. 1, the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted on one main plane of the printed wiring board 16. Thereby, even a heavy component can be easily mounted by reflow or the like.

  Further, as shown in FIG. 1, since the thin transformer 11, the primary power element 14, and the secondary power element 15 can be mounted on one main plane of the printed wiring board 16, the printed wiring board is inexpensive. A power conversion module device can be produced using a single-sided substrate.

  A double-sided board can also be used as the printed wiring board 16. In order to lower the temperature of the heat generating component, it is necessary to install a material having good heat conductivity as close as possible to the heat generating component. The resin used for the printed wiring board has a small heat conduction, and the heat conduction is mainly performed by copper foil. For this reason, it is necessary to increase the wiring pattern of the printed wiring board 16 on which the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted. There are cases where a pattern cannot be obtained. For this reason, by providing a copper foil pattern for heat dissipation on the surface opposite to the surface on which the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted using a double-sided board, It is possible to reduce the size of the equipment and suppress the temperature rise of the parts at the same time.

  Furthermore, in order to suppress the temperature rise of the components, it is necessary to reduce the thickness of the insulating resin layer of the printed wiring board 16, but the thin transformer 11, the primary power element 14, and the secondary power element 15 are held. Therefore, the thickness of the insulating resin layer needs to be 0.6 mm or more. For this reason, by using a multilayer board instead of a double-sided board and leaving a copper pattern for heat dissipation in the inner layer, the thickness of each insulating layer can be reduced to about 0.1 mm, further increasing the temperature of the components. Can be suppressed.

  Furthermore, the thin transformer 11, the primary power element 14, and the secondary power are disposed on the surface of the printed wiring board 16 opposite to the surface on which the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted. A pattern that is electrically insulated from the surface on which the element 15 is mounted can be provided, and the insulated pattern can be attached to a heat sink or a housing of a device to improve heat dissipation. The temperature rise of the power element 14 and the secondary power element 15 can be reduced.

  A similar power conversion module device can also be realized by using a metal base substrate as the printed wiring board 16.

  According to FIG. 1 showing the embodiment of the present invention, in particular, the thin transformer 11 is attached so that the lower surface of the magnetic core 12 is in contact with the printed wiring board 16. Heat can also be transferred from the surface, and the effect of greatly reducing the temperature rise of the transformer is born.

  Further, as shown in FIG. 1, a printed wiring board pattern is formed on the surface opposite to the magnetic core 12. As a result, the heat of the magnetic core can be transferred also to this pattern, and the heat generated by the transformer can be further greatly reduced.

  Although not shown in the drawing, in the embodiment of the present invention, a heat conducting member is sandwiched between the magnetic core 12 and the printed wiring board 16 in particular. Thereby, since the space | gap which arises between the magnetic core 12 and the printed wiring board 16 is filled up with a heat conductive member, the effect that the dispersion | variation in heat conduction becomes small is produced. Here, a material having good heat conductivity is preferable as the heat conducting member, but it is not necessary to dare to limit the material as long as the gap can be filled. Epoxy, silicon, acrylic resin, etc. can be used.

  Furthermore, in the first embodiment of the present invention, as shown in FIG. 1, the thin transformer 11 is particularly arranged between the primary power element 14 and the secondary power element 15. As a result, the wiring pattern connecting the transformer and the primary and the secondary that are insulated and separated can be formed at the shortest distance, and an effect of easily realizing a pattern design that can greatly reduce the wiring loss is produced.

(Embodiment 2)
Hereinafter, the invention described in claims 12 to 15 of the present invention will be described using the second embodiment.

  2 is a block diagram of a power supply circuit according to the second embodiment of the present invention, FIG. 3 is an external perspective view of the power supply in the same embodiment, and FIG. 4 is an external perspective view of the power supply showing another example in the same embodiment. FIG.

  2 to 4, reference numeral 21 denotes a second structural body, 22 denotes a first structural body, 23 denotes a control circuit, 27 denotes a first substrate, 28 denotes a hollow, and 29 denotes a housing. Components having the same configuration as that of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  2 to 4 are different from the conventional examples shown in FIGS. 5 and 6 in that the power conversion module device proposed in the first embodiment of the present invention is used as the second structure 21 in the converter section 2. Is a point.

  As shown in FIG. 2, in the circuit block diagram, the second structural body 21 is formed as a separate block by the thin transformer 11, the primary power element 14, and the secondary power element 15, and this second structural body. The input filter excluding 21, the power factor correction circuit, the control circuit 23, the output conversion circuit, the output filter, and the like are formed on a separate substrate as the first structure 22. The first structural body 22 and the second structural body 21 are connected in a circuit and integrated to complete a power source.

  FIG. 3 is an external perspective view of a power supply showing Embodiment 2 of the present invention. As shown in FIG. 3, the second structure 21 is formed on the first substrate 27 on which the first structure 22 is formed. A cutout hole 28 is provided in an opposing portion of the thin transformer 11 to be formed. The first structural body 22 and the second structural body 21 are connected in a circuit using the external connection terminal 18 or the like. Further, the printed wiring board 16 forming the second structural body 21 is mounted so as to be in surface contact with the casing 29 of the power source.

  As described above, according to FIG. 2 and FIG. 3 showing the second embodiment of the present invention, the first structural body 22 and the second structural body 21 are integrated, and the second structural body Since the power conversion module device proposed in Embodiment 1 of the present invention is used as 21, the small size, low heat generation, low loss, and low noise that are the characteristics of the device can be used as they are. As a result, the thermal design and the structural design become very simple, and the great effect is obtained that the development lead time can be greatly reduced.

  In addition, a control circuit 23 for controlling the second structural body 21 is provided on the first substrate 27 that forms the first structural body 22, and is connected by the external connection terminal 18. As a result, the control circuit can be designed without being affected by noise or the like generated by the second structure, and an effect of shortening the development design lead time of the control circuit is produced.

  Further, the first substrate 27 that forms the first structure 22 is provided with a cut-out hole in the opposing portion of the transformer that forms the second structure 21. As a result, the height of the transformer does not affect the overall height of the power supply device, and if other components are reduced in height, an effect that a thin power supply device can be realized is produced.

  Further, the printed wiring board 16 forming the second structural body 21 is mounted so as to be in surface contact with the power supply casing 29, whereby the heat generated by the second structural body 21 is reduced to the power supply casing 29. Therefore, there is an effect that a dedicated heat sink 10a for heat dissipation as shown in FIG.

  Further, as shown in FIG. 4 showing another example in the second embodiment of the present invention, the top surface of the thin transformer 11 that forms the second structure 21 and the first structure 22 that forms the first structure 22. It can also be mounted in such a direction that the surface of the substrate 27 is in surface contact. As a result, the printed wiring board 16 forming the second structure 21 can be used as a heat sink for heat dissipation, so that heat generation of the transformer, primary and secondary power elements can be reduced, and a heat sink sheet sink is unnecessary or reduced. The effect of being born is born.

  The power conversion module device and the power supply device using the power conversion module device according to the present invention have the effect of greatly improving the design and development efficiency of the power supply in addition to the effects of small size, low heat generation, low loss, and low noise, It can be applied to any electronic device equipped with a switching power supply.

Structure diagram of power conversion module device in Embodiment 1 of the present invention Block diagram of a power supply circuit in Embodiment 2 of the present invention External perspective view of the power supply in the same embodiment External perspective view of a power supply showing another example of the embodiment Circuit diagram of conventional switching power supply External perspective view of a conventional switching power supply

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Input circuit part 2 Converter part 3 Output circuit part 4 Power factor improvement circuit 5,23 Control circuit 6 Transformer 7,14 Primary power element 8,15 Secondary power element 9 Main board 10a Heat sink 10b, 29 Case 11 Thin type Transformer 12 Magnetic core 13 Thin laminated coil 16 Printed wiring board 17 Wiring pattern 18 External connection terminal 21 Second component 22 First component 27 First substrate 28 Hollow hole

Claims (15)

A transformer and at least one of the primary and secondary power elements are mounted on the printed wiring board so as to be in surface contact with each other, and are provided on a separate substrate via external connection terminals provided on the printed wiring board. A power conversion module device that is connected to a control circuit. The power conversion module device according to claim 1, wherein a transformer and at least one of primary and secondary power elements are mounted on one main plane of the printed wiring board on the printed wiring board. The power conversion module device according to claim 1, wherein a single-sided printed wiring board having a pattern formed on one side is used as the printed wiring board. The power conversion module device according to claim 1, wherein a double-sided printed wiring board having patterns formed on both sides is used as the printed wiring board. The power conversion module device according to claim 1, wherein a multilayer printed wiring board is used as the printed wiring board. A surface on which the transformer and at least one of the primary and secondary power elements are mounted on the opposite surface of the printed wiring board on which the transformer and at least one of the primary and secondary power elements are mounted; The power conversion module device according to claim 2, wherein an electrically insulated pattern is formed. The power conversion module device according to claim 1, wherein a metal base substrate having an insulating resin layer formed on a metal plate and a metal foil formed thereon is used as the printed wiring board. The power conversion module device according to claim 1, wherein the power conversion module device is attached so that a lower surface of a magnetic core of the transformer is in contact with a printed wiring board. The power conversion module device according to claim 8, wherein a pattern of a printed wiring board is formed on a surface facing the magnetic core. The power conversion module device according to claim 8, wherein a heat conducting member is sandwiched between the magnetic core and the printed wiring board. The power conversion module device according to claim 1, wherein a transformer is disposed between the primary and secondary power elements. A power supply device in which a first structure and a second structure are integrated, wherein the power conversion module device according to claim 1 is used as the second structure and the first structure is formed. A power supply apparatus comprising a control circuit for controlling the second structural body on the first substrate. 13. The power supply device according to claim 12, wherein a hollow is provided in the first substrate forming the first structure at a portion facing the thin transformer forming the second structure. The power supply device according to claim 12, wherein a surface of the printed wiring board forming the second structural body on which a component is not mounted is mounted so as to be in surface contact with the casing of the power supply device. 13. The power supply device according to claim 12, wherein the power supply device is mounted such that the top surface of the transformer forming the second structure and the surface of the first substrate forming the first structure are in surface contact.

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