JP4151526B2 - Power conversion module and power supply device using the same - Google Patents

Description

  The present invention relates to a power supply device such as a switching power supply used for an electronic device and the like, and a power conversion module device mounted on the power supply device.

  In recent years, power consumption has been increasing in all electronic devices with a large increase in the amount of information communication, and low power consumption has become a social problem. In particular, the power supply units of these electronic devices are mainly composed of switching power supplies, and there is a technical challenge to reduce the size and noise as well as increase the efficiency of the power supply units. Is an important point in developing electronic devices.

  Conventionally, this type of switching power supply has a configuration as shown in FIGS.

  Hereinafter, a conventional example will be described with reference to FIGS. FIG. 8 is a circuit block diagram of a conventional switching power supply, and FIG. 9 is an external perspective view of the conventional switching power supply.

  As shown in FIGS. 8 and 9, the conventional switching power supply generally has an input circuit unit 1, a converter unit 2, and an output circuit unit 3 mounted on a single main board 9. .

  The input circuit unit 1 includes an input filter 1a, an input rectifier circuit 1b, a power factor correction circuit 4, a smoothing circuit 1c, and the like. The converter unit 2 includes a control circuit 5, a transformer 6, a primary power element 7, a secondary power element 8, and the like. Here, the primary power element 7 is an FET, and the secondary power element 8 is often a diode. However, an FET may be used as a switch instead of the diode. Further, the output circuit unit 3 includes an output smoothing unit 3a, an output conversion circuit 3b, an output filter 3c, and the like.

  In addition, as prior art document information related to this application, for example, there is information obtained by modularizing a circuit block including a control circuit as in Patent Document 1, Patent Document 2, and Patent Document 3.

Further, as another prior art document information of the present application, a wiring pattern for transferring heat to a printed coil transformer, a primary switch element, and a heat sink attached to a secondary rectifier circuit is provided on the mounting substrate as in Patent Document 4. There are also other configurations.
JP 2001-359281 A JP-A-5-198445 JP 2001-103756 A JP-A-8-45748

  However, in the configuration of FIGS. 8 and 9 showing the most general conventional example, each circuit block and all the components are mounted on one main board 9, so that each specification is slightly intertwined. As a result, it was difficult to determine the final specification, requiring skilled engineers with a lot of experience in design, and the development lead time was very long. In addition, when the output of the power supply increases, the size of the transformer 6 mounted on the converter unit 2 becomes extremely large, exceeding the size limitation of the power supply shape, exceeding the predetermined value even in terms of temperature rise, etc. There were also problems in terms of downsizing and low heat generation.

  In addition, in Patent Documents 1 to 3, although a specific part is modularized and miniaturized, it is a complex module block full of functions having many parts such as a control circuit. Compared to the conventional example of FIG. For this reason, the development time and development cost are greatly increased, and the power supply block becomes expensive, so that there are many problems such as limited fields and applications in developing the market.

  Further, in Patent Document 4, since the transformer terminal and the heat sink are connected by a wiring pattern, pattern design is restricted. In addition, since the wiring becomes long, the wiring impedance also increases, and there are problems such as increased noise and increased loss. Further, since heat is transferred using the wiring pattern, the distance to the heat sink is increased, and the heat transfer effect is not improved more than a certain level.

  The present invention solves the above-described conventional problems, and provides a small, low heat generation, low loss, low noise power conversion module device capable of greatly improving design and development efficiency and a switching power supply device equipped with the power conversion module device. It is the purpose.

  In order to solve the above problems, the present invention has the following configuration.

The invention according to claim 1 of the present invention includes a metal plate, a high thermal conductive insulating layer made of a resin containing an inorganic filler, and a wiring made of a lead frame fixed by the insulating layer. Power consisting of a connection terminal for connecting to a control circuit section provided on the substrate, a high heat dissipation substrate, a plurality of power elements mounted in surface contact with the high heat dissipation substrate, and a transformer a conversion module, the wiring, the is a lead frame that is embedded in the high heat conductive insulating layer and the connection terminal, wherein all SANYO formed by bending a part of the lead frame, the transformer and the plurality of The power conversion module is characterized by being arranged close to the power element to form a blocked power conversion module.

  With this configuration, the wiring distance between the thin transformer and the power element can be minimized, so that the wiring impedance can be reduced and the loss on the wiring can be greatly reduced. In addition, the voltage between the drain and source of the FET that becomes a noise source The ringing waveform (Vp-p) of (Vds), the waveform of the voltage across the diode, and the like are greatly improved, so that the noise of the power supply can be reduced. Further, since the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted so as to be in surface contact with the high heat dissipation substrate 16, the thin transformer 11 and the primary which are the main components of heat generation of the power source are provided. The heat of the power element 14 and the secondary power element 15 can be directly transferred to the high heat dissipation substrate 16 through the contact surface. Thus, the heat generation of the thin transformer 11, the primary power element 14, and the secondary power element 15 can be greatly reduced, and the size of the thin transformer 11 can be reduced. Furthermore, unlike the conventional case, the block of the present invention is not mounted with a complicated control circuit having many parts, so the design of this block becomes very simple, and even if it is not an expert in power supply design, it can be designed in a short time. It will be possible. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

The invention according to claim 2 of the present invention includes a metal plate, a high thermal conductive insulating layer made of a resin containing an inorganic filler, and a wiring made of a lead frame fixed by the insulating layer, which is attached to the metal plate, A power conversion module comprising a connection element formed by bending a part of the lead frame, a high heat dissipation substrate, and a power element and a transformer mounted so as to be in surface contact with the high heat dissipation substrate, wherein the wiring, the all SANYO the lower surface of the are those embedded in the high thermal conductive insulating layer of the transformer core and the lead frame were surface contact with the high heat dissipation substrate, proximate the said transformer and said power element It arranged Te, which the power conversion module is blocked, which has a terminal for connecting at least one connection terminal to the control circuit unit, to Ri, it is possible to connect a control circuit unit that is configured on a separate substrate from another substrate control of the module devices, the effect is born that can be easily realized.

  According to the third aspect of the present invention, the lead frame is formed of a copper plate having a thickness of 0.3 mm or more, the resistance value can be reduced, and a large current can be supported.

According to a fourth aspect of the present invention, in the power conversion module according to any one of the first or second aspect, the metal plate is either aluminum or copper, and an attachment portion to the housing is provided. Therefore, weight reduction, thermal conductivity improvement, and low heat generation can be achieved.

The invention according to claim 5 of the present invention is the power conversion module according to claim 2 in which the transformer is installed between the plurality of power elements, and the control circuit can be designed without being affected by noise or the like. As a result, the lead time for developing and designing the control circuit can be shortened.

According to the sixth aspect of the present invention, the transformer is a choke coil, and since the wiring distance between the choke coil and the power element can be minimized, the wiring impedance is reduced and the wiring loss is extremely reduced. In addition to being able to do so, the voltage waveforms at both ends of the FET and diode are also improved, so that low noise is achieved. In addition, since the heat generated by the choke coil and the power element is transferred to the high heat dissipation substrate through the contact surface, the choke coil size can be reduced and the heat generated by the choke coil and the power element can be greatly reduced. Further, since the complicated control circuit section having many parts is excluded, the design of this block becomes very simple, and it is possible to design in a short time even if it is not an expert. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

The invention according to claim 7 of the present invention includes a metal plate, a high thermal conductive insulating layer made of a resin containing an inorganic filler, and a wiring made of a lead frame embedded in the high thermal conductive insulating layer. A power conversion module comprising a power element and a transformer mounted in surface contact with the high heat dissipation substrate, a connection terminal formed by bending a part of the lead frame, and another connected to the connection terminal A power supply device comprising a control circuit provided on a substrate , wherein the transformer and the power element are arranged close to each other to form a block power supply device without being affected by noise or the like. The control circuit can also be designed, and the lead time for development and design of the control circuit can be shortened.

The invention according to claim 8 of the present invention is a power supply device having a transformer as a choke coil, and since the wiring distance between the choke coil and the power element can be minimized, the wiring impedance is reduced and the wiring loss is extremely reduced. In addition to being able to do so, the voltage waveforms at both ends of the FET and diode are also improved, so that low noise is achieved. In addition, since the heat generated by the choke coil and the power element is transferred to the high heat dissipation substrate through the contact surface, the choke coil size can be reduced and the heat generated by the choke coil and the power element can be greatly reduced. Further, since the complicated control circuit section having many parts is excluded, the design of this block becomes very simple, and it is possible to design in a short time even if it is not an expert. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

  In the power conversion module device of the present invention, the thin transformer and at least one of the primary and secondary power elements are mounted on the high heat dissipation board so as to be in surface contact with each other, and the external connection provided on the high heat dissipation board is provided. It is characterized in that it is connected to a control circuit unit provided on a separate substrate via a terminal, and in addition to being able to reduce wiring loss very much, FET that becomes a noise source, waveform of diode voltage, etc. Since it is greatly improved, the noise of the power supply can be reduced. Further, the heat generation of the thin transformer and power element can be greatly reduced, and the size of the transformer can be reduced. Further, since a complicated control circuit having many parts is not mounted, the design of this block becomes very simple, and even a person who is not skilled in power supply design can design in a short time. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

  Moreover, the power supply device of the present invention is a power supply device in which a first structural body and a second structural body are integrated, and the power conversion module according to claim 1 of the present invention is used as the second structural body. A device is used, and a control circuit unit for controlling the second structural body is provided on the first substrate forming the first structural body, which is a characteristic of the power conversion module device. The small size, low heat generation, low loss, and low noise can be used as they are, which greatly simplifies the thermal design and structural design, and greatly reduces the development lead time.

(Embodiment 1)
Hereinafter, the invention described in the aspect of claim 1 of the present invention will be described using the first embodiment.

  FIG. 1 is an external perspective view of a power conversion module device according to Embodiment 1 of the present invention, FIG. 2 is a schematic cross-sectional view of a high heat dissipation substrate in the same embodiment, and FIG. It is a cross-sectional schematic diagram.

  1-3, 11 is a thin transformer, 12 is a magnetic core, 13 is a thin laminated coil, 14 is a primary power element, 15 is a secondary power element, 16 is a high heat dissipation substrate, 17 is an insulator, 18 is an insulator, A lead frame integrated wiring board, 19 is a lead frame, 19a is a lead frame for connecting a control circuit, 20 is a metal plate, 24 is a three-layer insulated wire coil, 25 is a copper plate coil, and 26 is an insulator.

  1 differs greatly from FIG. 9 showing the conventional example in that only the heat generating components of the transformer 6, the primary power element 7, and the secondary power element 8 except the control circuit 5 of the converter unit 2 in FIG. However, in the present invention, the transformer 6 is further changed to the thin transformer 11, and the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted on the high heat dissipation substrate 16. The thin transformer 11, the primary power element 14, and the secondary power element 15 are different in that they are mounted so as to be in surface contact with the high heat dissipation substrate 16.

  As described above, according to the configuration of FIG. 1 showing the first embodiment of the present invention, the thin transformer 11 and the primary power element 14 and the secondary power element 15 can be arranged as close as possible, and the wiring distance can be reduced. It can be as short as possible. As a result, the wiring impedance can be reduced and the loss on the wiring can be reduced very much. In addition, the ringing waveform (Vp-p) of the drain-source voltage (Vds) of the FET, which is a noise source, and the voltage across the diode Since the waveform and the like are also greatly improved, the noise of the power supply can be reduced. Further, since the thin transformer 11, the primary power element 14, and the secondary power element 15 are mounted so as to be in surface contact with the high heat dissipation substrate 16, the thin transformer 11 and the primary which are the main components of heat generation of the power source are provided. The heat of the power element 14 and the secondary power element 15 can be directly transferred to the high heat dissipation substrate 16 through the contact surface. Thus, the heat generation of the thin transformer 11, the primary power element 14, and the secondary power element 15 can be greatly reduced, and the size of the thin transformer 11 can be reduced. Furthermore, unlike the conventional case, the block of the present invention is not mounted with a complicated control circuit having many parts, so the design of this block becomes very simple, and even if it is not an expert in power supply design, it can be designed in a short time. It will be possible. As a result, it is possible to provide a small, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency.

  Here, the primary power element 14 is mainly an FET, and the secondary power element 15 is mainly an FET or a diode, but may be other elements. The effects of the present invention can be obtained even when at least one of the primary power element 14 and the secondary power element 15 is mounted.

  FIG. 2 is a schematic sectional view of the high heat dissipation substrate 16 constituting Embodiment 1 of the present invention. As shown in FIG. 2, the high heat dissipation substrate 16 has a structure in which a lead frame integrated wiring board 18 integrated with a lead frame 19 and an insulator 17 are bonded together, and in addition to a metal plate 20 on the back surface of the insulator 17. Are pasted together. The insulator 17 employed here is manufactured with an average thickness of 0.5 mm and a minimum of 0.4 mm or more. Here, 0.4 mm is the minimum thickness recognized as reinforced insulation in the safety standard. By securing this thickness, the thickness can be adapted to the safety standard.

  As described above, according to FIG. 2 showing the embodiment of the present invention, since the insulator 17 and the lead frame integrated wiring board 18 are bonded together as the high heat dissipation board 16, the wiring board is based on the lead frame. Can also be positioned. Further, by making the thickness of the insulator 17 equal to or greater than a predetermined thickness, the insulator 17 can be used as a high heat dissipation substrate that can meet safety standards.

  Further, by setting the thickness of the insulator to 0.4 mm or more, it becomes possible to provide reinforced insulation in accordance with safety standard requirements, and the range of use as a power source is expanded.

  Here, the insulator 17 which is a component is made of an insulating resin having good adhesion to the lead frame integrated wiring board 18 such as epoxy. Thereby, since the adhesiveness of the insulator 17 and the lead frame integrated wiring board 18 becomes very good, the heat transfer characteristics of the high heat dissipation substrate 16 can be enhanced.

  Furthermore, if the epoxy resin of the insulator 17 is filled with an inorganic filler such as silica or alumina, the thermal conductivity of the resin can be improved. Therefore, the thermal conductivity characteristics of the high heat dissipation substrate 16 can be further improved. I can do it. According to our experimental results, the thermal conductivity can be increased by an order of magnitude from 0.15 to 0.3 W / (m · K) (without filler) to 3 to 5 W / (m · K) (with filler). Confirmed.

  In addition, if the insulator 17 which is a component of the high heat dissipation substrate 16 is made of a ceramic material, in addition to further improving the thermal conductivity, a high heat dissipation substrate of a new method of applying a ceramic sheet substrate can be introduced. An effect is born.

  The lead frame integrated wiring board 18 has a thickness of 0.3 mm or more. The thickness of the copper foil used for ordinary printed wiring boards is produced in large quantities by the etching method, so the actual fact is that thick copper foil is not used because of its versatility and cost. However, it is very thin, about 0.2 to 0.25 mm, usually about 0.018 to 0.07 mm, and the cross-sectional area of the conductor cannot be increased. Was. As described above, in the present invention, a thin copper plate having a thickness of 0.3 mm or more, which is difficult to manufacture with a normal printed wiring board, is adopted so that the conductor cross-sectional area can be increased. As a result, the wiring impedance can be reduced to the ultimate, so that an effect that the wiring loss can be minimized and a large current can be dealt with is produced.

  In addition, as a manufacturing method of the lead frame used here, various methods such as a punching method using a die and etching are conceivable, but it is not necessary to limit them.

  Further, if the lead frame 19 is bent as shown in FIG. 2 to be used as an output lead wire, the lead frame 19 is also used as an output lead wire, which eliminates the need for an output connection pin. Connection process is also unnecessary. Many effects can be obtained such as reliability is improved because the number of connection points is reduced.

  Here, at least one of the lead wires for output connection is a lead wire 19a for connecting to the control circuit. Thereby, since it can connect with the control circuit comprised on another board | substrate, control of this module device will be easily realizable from another board | substrate.

  Further, as shown in FIG. 2, since the metal plate 20 is attached to the back surface of the insulator 17, the heat on the high heat dissipation substrate can also be transferred to the metal plate 20. Thereby, the temperature rise of the thin transformer 11, the primary power element 14, and the secondary power element 15 can be reduced.

  The material of the metal plate 20 used here is not particularly limited, but a metal having good thermal conductivity such as aluminum or copper is preferable. In particular, if aluminum is used, the weight can be reduced.

  In addition, if copper is used, the heat conduction characteristics can be further improved, so that the temperature rise of the thin transformer 11, the primary power element 14, and the secondary power element 15 can be greatly reduced.

  FIG. 3 is a schematic cross-sectional view of the thin transformer 11 constituting the first embodiment of the present invention. As shown in FIG. 3, this thin transformer 11 includes a thin plate-like three-layer insulated wire coil 24 made by winding a copper plate coil 25 made of a thin plate-like copper plate and a three-layer insulated wire in a spiral shape. After the thin laminated coil is completed by alternately laminating through the wire, the magnetic cores 12 are combined from above and below.

  As described above, according to FIG. 3 showing the embodiment of the present invention, at least one of the primary and secondary coils is formed as a thin plate coil as the thin transformer 11. This reduces the distance between the primary and secondary coils, thereby improving the coupling between the windings and improving the conversion efficiency. In addition, since the thin plate-shaped coil has a large surface area, heat dissipation is improved, and an effect of reducing the temperature rise of the transformer is also produced.

  Here, the thin plate-like coil 25 has a thickness of 0.3 mm or more. Another method for forming a thin plate-like coil is to use a printed wiring board. However, the thickness of the copper foil used in ordinary printed wiring boards is produced in large quantities by the etching method, so the actual situation is that thick copper foil is not used because of its versatility and cost. The problem is that the wiring impedance becomes high and the wiring loss increases because the conductor cross-sectional area cannot be increased because the conductor is not very thin, with a maximum thickness of about 0.2 to 0.25 mm, usually about 0.018 to 0.07 mm. Had. As described above, in the present invention, a thin copper plate having a thickness of 0.3 mm or more, which is difficult to manufacture with a normal printed wiring board, is adopted so that the conductor cross-sectional area can be increased. As a result, the resistance value of the coil can be reduced, so that the loss of the transformer can be reduced and a large current can be accommodated.

  In addition, although various methods, such as a punching method and an etching, can be considered as a manufacturing method of the thin plate-shaped copper plate coil used here, it does not need to dare to limit.

  According to FIG. 3 showing the embodiment of the present invention, at least one of the primary and secondary coils is formed as a thin transformer 11 by winding a three-layer insulated wire in a spiral shape. Yes. The three-layer insulated wire used here is a TIW wire made by Tokyo Special Electric Wire, and is a wire approved for reinforced insulation in each country's safety standard. As a result, the thin transformer 11 can be provided with reinforced insulation corresponding to the safety standard, so that it is possible to easily realize a transformer conforming to the safety standard at the time of high voltage input. Note that the three-layer insulated electric wire does not necessarily have to be particular about the above-mentioned wire, and may be other wire such as FEX DENKO's TEX wire as long as the wire is certified as a safety standard as reinforced insulation.

  Further, at least one of the primary coil and the secondary coil of the thin transformer 11 is formed by winding a winding, and thus the number of turns can be easily changed, which increases the degree of design freedom. An effect is born.

  Further, the winding coil has a fusion layer having a fusion layer on the surface. As a result, since the fixing can be performed with the windings being applied, the bobbin-less winding can be easily formed.

  Here, in particular, the fusion layer is an alcohol fusion type fusion layer. As a result, the winding can be easily fixed simply by applying alcohol, so that the equipment can be easily installed.

  The thin laminated coil 13 constituting the thin transformer 11 uses a three-layer insulated wire coil 24 and a thin copper plate coil 25 as shown in FIG. 3 in the embodiment of the present invention. Alternatively, if at least one of the secondary coils is formed of a printed circuit board, the position of the coil conductor is stabilized, so that variation in performance can be reduced.

  Furthermore, if the multilayer printed circuit board coil is manufactured by inserting an epoxy prepreg between the layers of the coil formed on this printed circuit board, the thickness and outer dimensions of the laminated coil are stabilized, so that the performance variation can be further reduced. The magnetic core 12 can be easily assembled.

  Further, according to FIG. 1 showing the embodiment of the present invention, the lower surface of the magnetic core 12 of the thin transformer 11 is mounted so as to be in contact with the high heat dissipation substrate 16, whereby the heat generation of the magnetic core can be reduced. Heat can also be transferred from the surface, and the effect of greatly reducing the temperature rise of the transformer is born.

  Further, although not shown here, a pattern of a high heat dissipation substrate is formed on the surface opposite to the magnetic core 12. As a result, the heat of the magnetic core can be transferred also to this pattern, and the heat generated by the transformer can be further greatly reduced.

  Although not shown in the drawings, in the embodiment of the present invention, in particular, a heat conducting member is sandwiched between the magnetic core 12 and the high heat dissipation substrate 16. Thereby, since the space | gap which arises between the magnetic core 12 and the high thermal radiation board | substrate 16 is filled up with a heat conductive member, the effect that the dispersion | variation in heat conduction becomes small is produced. Here, a material having good thermal conductivity is preferable as the heat conducting member, but it is not necessary to dare to limit the material as long as the gap can be filled. Epoxy, silicon, acrylic resin, etc. can be used.

  Furthermore, in the first embodiment of the present invention, as shown in FIG. 1, the thin transformer 11 is particularly arranged between the primary power element 14 and the secondary power element 15. As a result, the wiring pattern connecting the transformer and the primary and the secondary that are insulated and separated can be formed at the shortest distance, and an effect of easily realizing a pattern design that can greatly reduce the wiring loss is produced.

(Embodiment 2)
Hereinafter, the invention described in another aspect of the present invention will be described using the second embodiment.

  4 is a block diagram of a power supply circuit according to the second embodiment of the present invention, FIG. 5 is an external perspective view of the power supply in the same embodiment, and FIG. 6 is an external perspective view of the power supply showing another example in the same embodiment. FIG.

  4 to 6, reference numeral 21 denotes a second structure, 22 denotes a first structure, 23 denotes a control circuit, 27 denotes a first substrate, 28 denotes a hollow, and 29 denotes a housing. Components having the same configuration as that of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  4 to 6 are different from the conventional examples of FIGS. 8 to 9 in that the power conversion module device proposed in the first embodiment of the present invention is used as the second structure 21 in the converter section 2. Is a point.

  As shown in FIG. 4, in the circuit block diagram, the second structural body 21 is formed as a separate block by the thin transformer 11, the primary power element 14, and the secondary power element 15, and this second structural body. 21, the input filter 22 a, the input rectifier circuit 22 b, the power factor correction circuit 22 c, the smoothing circuit 22 d, the control circuit 23, the output smoothing unit 22 e, the output conversion circuit 22 f, the output filter 22 g and the like are different as the first component 22. It is formed on the substrate. The first structural body 22 and the second structural body 21 are connected in a circuit and integrated to complete a power source.

  FIG. 5 is an external perspective view of a power source showing Embodiment 2 of the present invention. As shown in FIG. 5, the second structure 21 is formed on the first substrate 27 on which the first structure 22 is formed. A cutout hole 28 is provided in an opposing portion of the thin transformer 11 to be formed. The first structural body 22 and the second structural body 21 are connected in a circuit using the lead frame 19 or the like. Further, the high heat dissipation substrate 16 forming the second structure 21 is mounted so as to be in surface contact with the casing 29 of the power source.

  As mentioned above, according to FIGS. 4-5 which show Embodiment 2 of this invention, it is a power supply device with which the 1st structure 22 and the 2nd structure 21 are integrated, and it is the 2nd structure 21 Since the power conversion module device proposed in the first embodiment of the present invention is used, the small, low heat generation, low loss, and low noise characteristics of the device can be used as they are. As a result, the thermal design and the structural design become very simple, and the great effect is obtained that the development lead time can be greatly reduced.

  Table 1 shows the experimental results of the characteristic comparison due to the difference in these basic configurations.

From Table 1, the characteristics in the configuration of FIG. 9 of the conventional example and the configuration of FIG. 5 showing the second embodiment of the present invention are compared. (1) Transformer size is "1/4 or less", greatly reducing size I was able to.

  (2) The temperature rise of the transformer was reduced to less than half, which was greatly reduced.

  (3) The efficiency of the power supply was greatly improved to "about 2.1% up".

  (4) The ringing voltage (Vp−p) of the drain-source voltage (Vds) of the FET can be “150 v reduced”, and the waveform can be greatly improved.

  (5) The noise terminal voltage was “reduced by 6 dB or more” in each band, and a significant reduction in noise was achieved.

  The large effects as described above were verified by the experimental results.

  Further, a control circuit 23 for controlling the second structural body 21 is provided on the first substrate 27 forming the first structural body 22 and is connected by a control circuit connecting lead frame 19a. As a result, the control circuit can be designed without being affected by noise or the like generated by the second structure, and an effect of shortening the development design lead time of the control circuit is produced.

  Further, the first substrate 27 that forms the first structure 22 is provided with a cut-out hole in the opposing portion of the transformer that forms the second structure 21. As a result, the height of the transformer does not affect the overall height of the power supply device, and if other components are reduced in height, an effect that a thin power supply device can be realized is produced.

  Further, the first and second components are connected by the lead frame 19 that forms the second component 21. As a result, since direct connection is performed without using connection pins or the like, the number of connection points is reduced, and the effects of improved reliability and stable connection strength are produced.

  Further, the high heat dissipation substrate 16 forming the second structural body 21 is mounted so as to be in surface contact with the power supply housing 29, whereby the heat generated by the second structural body 21 is reduced to the power supply housing 29. Therefore, there is an effect that a dedicated heat sink 10a for heat dissipation as shown in FIG.

  Further, as shown in FIG. 6 showing another example in the second embodiment of the present invention, the top surface of the thin transformer 11 that forms the second structure 21 and the first structure 22 that forms the first structure 22. It is also possible to mount the board 27 in the reverse direction so that the surface of the board 27 is in surface contact. Accordingly, since the high heat dissipation substrate 16 forming the second structure 21 can be used as a heat sink for heat dissipation, heat generation from the transformer, primary and secondary power elements can be reduced, and a heat sink for heat dissipation is unnecessary or reduced. The effect of being born is born.

(Embodiment 3)
Hereinafter, the invention described in another aspect of the present invention will be described using the third embodiment.

  FIG. 7 is a circuit block diagram of a power conversion module device for a power factor correction circuit according to Embodiment 3 of the present invention.

  In FIG. 7, reference numerals 14a and 15a denote power elements, 30 denotes a choke coil, and 31 denotes a third component. Components having the same configurations as those in the first and second embodiments are denoted by the same reference numerals. The description is omitted.

In FIG. 7, the main difference from the first embodiment is that the thin transformer 11 forming the power conversion module device is replaced with a choke coil 30 to form a third component 31, and an FET or a diode is used as a power element. The configuration mounted on the high heat dissipation substrate is the same.

  As shown in FIG. 7, in the circuit block diagram, the third component 31 is formed as a separate block with the choke coil 30, the power element 14a, and the power element 15a, and the control circuit is included in the third component. Not. The power conversion module device here is not shown, but the power element and the choke coil are mounted on the high heat dissipation substrate so as to come into surface contact with the power conversion module device, which is exactly the same as FIG. 1 showing the first embodiment.

  As described above, according to FIG. 7 showing the third embodiment of the present invention, the wiring distance between the choke coil and the power element can be minimized. As a result, the wiring impedance is reduced and the wiring loss can be greatly reduced. In addition, the voltage waveforms at both ends of the FET and the diode are also improved, so that low noise is achieved. In addition, since the heat generated by the choke coil and the power element is transferred to the high heat dissipation substrate through the contact surface, the choke coil size can be reduced and the heat generated by the choke coil and the power element can be greatly reduced. Further, since the complicated control circuit section having many parts is excluded, the design of this block becomes very simple, and it is possible to design in a short time even if it is not an expert. As a result, it is possible to provide a large effect that a compact, low heat generation, low loss, low noise power conversion module device capable of greatly improving development efficiency can be provided.

  In addition, since the power conversion module device is used as the third configuration body 31 as a power supply apparatus in which the first configuration body and the third configuration body 31 are integrated, the small size that is a feature of the power conversion module device is used. Low heat generation, low loss, and low noise can be used as they are. As a result, the thermal design and the structural design become very simple, and the great effect is obtained that the development lead time can be greatly reduced.

  Further, a control circuit 23 for controlling the third structural body 31 is provided on the first substrate forming the first structural body, and is connected by a control circuit connecting lead frame 19a. As a result, the control circuit can be designed without being affected by noise or the like generated by the third component 31, and the development lead time of the control circuit can be shortened.

  The power conversion module device and the power supply device using the power conversion module device according to the present invention have the effect of greatly improving the design and development efficiency of the power supply in addition to the effects of small size, low heat generation, low loss, and low noise, It can be applied to any electronic device equipped with a switching power supply.

1 is an external perspective view of a power conversion module device according to Embodiment 1 of the present invention. Cross-sectional schematic diagram of the high heat dissipation substrate in the same embodiment Cross-sectional schematic diagram of thin transformer in the same embodiment Block diagram of a power supply circuit in Embodiment 2 of the present invention External perspective view of the power supply in the same embodiment External perspective view of a power supply showing another example of the embodiment Circuit block diagram of a power conversion module device for a power factor correction circuit according to Embodiment 3 of the present invention Circuit diagram of conventional switching power supply External perspective view of a conventional switching power supply

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Input circuit part 2 Converter part 3 Output circuit part 4 Power factor improvement circuit 5, 23 Control circuit 6 Transformer 7, 14 Primary power element 8, 15 Secondary power element 9 Main board 10a Heat sink 10b, 29 Case 11 Thin type Transformer 12 Magnetic core 13 Thin laminated coil 14a Power element (FET)
15a Power element (diode)
16 High heat dissipation board 17, 26 Insulator 18 Lead frame integrated wiring board 19 Lead frame 19a Lead frame for connecting control circuit 20 Metal plate 21 Second component

Claims (8)

A metal plate,
A high thermal conductive insulating layer made of a resin containing an inorganic filler, affixed to the metal plate;
Wiring consisting of a lead frame fixed with this insulating layer;
A connection terminal for connecting to a control circuit unit provided on another substrate;
A high heat dissipation substrate consisting of
A plurality of power elements mounted in surface contact with this high heat dissipation substrate, a transformer,
A power conversion module comprising:
Wherein the wiring, the connecting terminal is in the lead frame by embedding the high heat conductive insulating layer state, and are not bent portions of the lead frame,
A power conversion module in which the transformer and the plurality of power elements are arranged close to each other to form a block . A metal plate,
A high thermal conductive insulating layer made of a resin with an inorganic filler, and affixed on the metal plate;
Wiring consisting of a lead frame fixed with this insulating layer;
A connection terminal formed by bending a part of the lead frame;
A high heat dissipation substrate consisting of
A power element and a transformer mounted so as to be in surface contact with this high heat dissipation substrate,
A power conversion module comprising:
The wiring state, and are not the lower surface of the is in the lead frame by embedding the high heat conductive insulating layer of the transformer core was surface contact with the high heat dissipation substrate,
A power conversion module in which the transformer and the power element are arranged close to each other to form a block . The power conversion module according to claim 1, wherein the lead frame is formed of a copper plate having a thickness of 0.3 mm or more. 3. The power conversion module according to claim 1, wherein the metal plate is aluminum or copper, and an attachment portion to the housing is provided. The power conversion module according to claim 2, wherein the transformer is installed between the plurality of power elements. The power conversion module according to claim 2, wherein the transformer is a choke coil. A metal plate,
A high thermal conductive insulating layer made of a resin containing an inorganic filler, affixed to the metal plate;
Wiring consisting of a lead frame embedded with this high thermal conductive insulating layer;
A power element and a transformer mounted so as to be in surface contact with this high heat dissipation substrate,
A power conversion module consisting of
A connection terminal formed by bending a part of the lead frame;
A control circuit provided on a separate substrate connected to the connection terminal;
A power supply unit comprising :
A power supply device in which the transformer and the power element are arranged close to each other to form a block . The power supply device according to claim 7 , wherein the transformer is a choke coil.

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