JP2005184883A - Power supply device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power supply device which can reduce switching noise generated as ringing voltages at both ends of a transformer by wiring impedance, and which can turn on/off at a high speed in a method of shortening a wiring length from the transformer or a coil to a semiconductor and a capacitor. <P>SOLUTION: The power supply device can shorten wiring by connecting a wiring board having a heat sink plate 21 for mounting an input terminal 24 or output terminals 25, 26 of the transformer, an insulator 22 and wiring 23, directly to a wiring board 3 which does not mount the transformer. Accordingly, the wiring impedance is reduced, and the current of the semiconductor can be turned on/off at a high speed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention particularly relates to input / output connections in a transformer used in a power supply apparatus.

  Conventionally, this type of power supply device has a configuration as shown in FIG.

  FIG. 6 is a front view of a conventional power supply device.

  In the figure, reference numeral 1 denotes a transformer. The transformer 1 has an input / output terminal 2 of the transformer and is soldered to a printed wiring board 3. An input connector 4, a primary side capacitor 5, and a primary side semiconductor 6 are also mounted on the same printed wiring board, and power is supplied from the input connector 4 to transmit energy to the transformer 1.

  On the other printed wiring board 3, a secondary side semiconductor 7, a secondary side capacitor 8, and an output connector 9 are attached, and power is supplied to the output. The transformer 1 and the secondary semiconductor 7 are connected by a connector 10 and a lead wire 11. In this example, the primary side semiconductor 6 and the secondary side semiconductor 7 each have a heat sink 12.

  Each printed wiring board 3 is attached to the housing 15 with spacers 13 and screws 14. With the above configuration, the power supply device is configured using two printed wiring boards in a space-saving manner.

For example, Patent Documents 1 and 2 are known as prior art document information relating to the invention of this application.
JP-A-8-45748 JP-A-9-293941

  However, in the above-mentioned conventional configuration, the length of the rectifying / smoothing wiring becomes longer because the transformer is connected to the printed wiring board once and then connected to a semiconductor that requires a heat sink, and ringing occurs at both ends of the transformer due to the wiring impedance. There was a problem that switching noise was generated as a voltage and the current could not be turned ON / OFF at high speed.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object of the present invention is to provide a transformer or a coil and a power supply device that can turn on / off current at a higher speed with lower noise.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, in particular, in a power supply device having at least one wiring board on which a transformer or a coil is mounted and at least one wiring board on which the transformer or coil is not mounted, input / output terminals of the transformer or coil are provided. It has a configuration of a power supply device characterized by being directly connected to both wiring boards, thereby shortening the wiring length from the transformer to the rectifying and smoothing circuit, so that the wiring impedance can be minimized, Since unnecessary wiring impedance can prevent the occurrence of switching noise as a ringing voltage at both ends of the transformer, an effect of being able to turn on and off the current at high speed can be obtained.

  The invention according to claim 2 of the present invention, in addition to the configuration of claim 1, in particular, at least one of the input / output terminals of the transformer or the coil is connected via a connector mounted on a printed wiring board. As a result, soldering work is reduced, and workability is greatly improved. Further, since the connecting contact portion is elastic, it is strong against vibration.

  The invention according to claim 3 of the present invention, in addition to the configuration of claim 1, in particular, mounts a component that requires heat dissipation on at least one wiring board, and does not require heat dissipation on other wiring boards. The component is mounted, and this makes it possible to minimize the wiring impedance in a state where the component that is weak against heat generation is separately mounted from the wiring board that generates heat, and the effect of reducing heat conduction can be obtained.

  The invention according to claim 4 of the present invention is such that, in addition to the invention of claim 3, in particular, the heat radiating plate provided on one of the wiring boards on which components that require heat radiation are mounted face-to-face. Since the heat generated by the transformer and semiconductor can be transferred to the housing, the temperature of the heat-generating component can be greatly reduced. As a result, there is no thermal influence on the capacitor that is vulnerable to heat generation, and it is not necessary to use a high heat resistance capacitor, so that the cost can be reduced. In addition, there is an effect that the problem of shortening the capacitor life can be solved.

  The invention according to claim 5 of the present invention is such that, in addition to the configuration of claim 1, in particular, the wiring from the transformer or coil and the semiconductor is connected between the wiring patterns connecting both ends of the capacitor used in parallel. For this reason, an effect of being able to wire the two capacitors equally and with low impedance can be obtained.

  In the power supply apparatus having at least one wiring board on which a transformer or a coil is mounted and at least one wiring board on which the transformer or coil is not mounted, the input / output terminals of the transformer or the coil are directly connected to both wiring boards. The feature is that the wiring length can be further shortened, and by suppressing the wiring impedance, the occurrence of switching noise can be suppressed, and the current can be turned ON / OFF at a higher speed. It plays.

(Embodiment 1)
Hereinafter, the first and second aspects of the present invention will be described with reference to the first embodiment.

  FIG. 1 is a front view of a power supply device according to Embodiment 1 of the present invention.

  In the figure, reference numeral 1 denotes a transformer. The transformer 1 has an input terminal 2 of the transformer and is soldered to a printed wiring board 3. An input connector 4, a primary side capacitor 5, and a primary side semiconductor 6 are also mounted on the same printed wiring board, and power is supplied from the input connector 4 to transmit energy to the transformer 1.

  On the other printed wiring board 3, a secondary side semiconductor 7, a secondary side capacitor 8, and an output connector 9 are attached, and power is supplied to the output.

  Further, the transformer 1 has an output terminal 16 that protrudes on the opposite side to the mounting surface of the transformer. The output terminal 16 can be connected to the secondary-side semiconductor 7 in the shortest time. As a result, since the wiring length is shortened, the switching noise that has conventionally been generated as a ringing voltage at both ends of the transformer can be reduced from 450 Vpp to 300 Vpp, and the current can be turned on and off at a higher speed. Was born. In the experiment in the present embodiment, the switching frequency could be increased from 66 kHz to 100 kHz.

  1 can be connected to the printed wiring board by soldering. However, if the output terminal 16 is inserted into the connector 17 mounted on the printed wiring board 3 as in this example, the soldering operation is performed. And the workability is greatly improved. Further, since the connection contact portion is elastic, it is strong against vibration.

  In this example, the primary side semiconductor 6 and the secondary side semiconductor 7 each have a heat sink 12. Each printed wiring board 3 is attached to the housing 15 with spacers 13 and screws 14. Further, since there is no lead wire as in the conventional example of FIG. 6, there is an effect that the assemblability is improved.

  It should be noted that the effect can be obtained even if all the parts expressed as transformers in the first embodiment are replaced with the expression of coils.

(Embodiment 2)
Hereinafter, the invention according to the third to fourth aspects of the present invention will be described using the second embodiment.

  2 is a front view of the second embodiment of the present invention, FIG. 3 is a top view of a transformer and a wiring board on which the transformer is mounted, and FIG. 4 is a top view of a power supply device in the same embodiment.

  In addition, about the thing which has the structure similar to the structure of Embodiment 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In FIG. 2, the difference from the first embodiment is that a transformer 1, a primary side semiconductor 6, and a secondary side semiconductor 7 that require heat dissipation are provided on one wiring board including a heat sink 21, an insulator 22, and a wiring 23. It is the point which is wearing.

  In the wiring board used here, a plate-like wiring 23 made of a metal such as copper is integrally formed on one surface of an insulator 22, and a heat radiating plate 21 made of a metal such as aluminum is pasted on the opposite surface to form an integrated structure. The one having a high heat dissipation function is used.

  The transformer 1 in this embodiment has an input terminal 24 and an output terminal 25 directly connected to the printed wiring board 3 on which the capacitors 5 and 8 are mounted, and an output terminal 26 connected to the wiring board on which the semiconductor 7 is mounted.

  In this embodiment, after the semiconductors 6 and 7 are mounted on the wirings 23 and 29, they are connected to the printed wiring board 3 by cutting the wirings 23 and 29 at right angles.

  Further, by isolating the capacitors 5 and 8 that are weak against heat from the transformer 1 and the semiconductors 6 and 7 that are heat generating materials via the printed wiring board 3, it is possible to prevent the heat generated by the transformer 1 from being transmitted to the capacitors 5 and 8. It was.

  In addition, the conventional transformer, semiconductor, and capacitor could only be arranged sequentially, but the three-dimensional structure of the present invention enables three-dimensional arrangement, and the wiring from the transformer of the present invention is held on an arbitrary wiring board. Along with this, the wiring length from the transformer to the secondary capacitor can be shortened from 9 cm to 3 cm as compared with the conventional design shown in FIG. 6, and the wiring impedance can be minimized. became.

  In this configuration, it is understood that the transformer output terminal 26 is connected to the secondary-side semiconductor 7 and connected to the printed wiring board 3 via the wiring 29, and is connected to the lead 28 of the secondary-side capacitor 8 from the position at the shortest. . Similarly, the transformer output terminal 25 is directly connected to the printed wiring board 3, and is connected to the lead 27 of the secondary capacitor 8 from that position.

  3 shows a top view of the wiring boards 21, 22, and 23 on which the heat generating components shown in FIG. 2 are mounted.

  The primary semiconductor 6 is attached to the wiring 23, and the end of the wiring 23 is bent at a right angle. The secondary semiconductor 7 is attached to the wirings 29 and 30, and the wiring 29 is also bent at a right angle. A transformer output terminal 26 is soldered to the wiring 30.

  The secondary side capacitor 8 indicated by a broken line shows the position of the same component on the other printed wiring board 3 for the sake of easy understanding, and is not actually mounted on the wiring board 22. . Further, in this description, the wiring 23 is bent. However, as long as a component that requires heat dissipation can be mounted and can be connected to the other printed wiring board 3 through a connector, a terminal, etc., regardless of the configuration of the wiring board. An effect can be obtained.

  Further, the heat sink 21 is attached to the housing 15 using screws or the like, and operates to efficiently transmit the heat generated by the semiconductors 6 and 7 and the transformer 1 to the housing 15. In the conventional case where a heat sink is attached to a printed wiring board, the temperature rise of the semiconductor was 19K, but in an experiment to which this embodiment was applied, it could be reduced to 7K. Furthermore, it was effective in dissipating internal heat generation outside the casing. Conventional Example In the example shown in FIG. 6, the capacitor 5 is mounted on the same surface and close to the heat generating material, and the capacitor 5 is affected by the heat generation. Will increase. In addition, there is a demerit that the life of the capacitor is shortened by heat. However, according to the present embodiment, since the heat sink 21 and the housing 15 are mounted so as to face each other, the transformer 1, the semiconductors 6, 7 Heat can be transferred to the casing 15, and the temperature of the heat generating component can be greatly reduced. As a result, there is no thermal influence on the capacitor that is vulnerable to heat generation, and it is not necessary to use a high heat resistance capacitor, so that the cost can be reduced. In addition, the problem of shortening the lifetime is also solved.

  In FIG. 4, a rectangular cutout 41 is provided on the printed wiring board 3 to project a part of the transformer 1. As a result, the distance between the wiring board 3 and the wiring board 22 can be shortened regardless of the height of the transformer. Further, when the height of the transformer 1 does not matter, there is no problem even if the cutout 41 is not provided.

  Providing a terminal for wiring to the capacitor from the position closest to the primary side capacitor 5 makes it possible to easily reduce the distance between the transformer input terminal 24 and the wiring 23 from the primary side semiconductor.

(Embodiment 3)
The third aspect of the present invention will be described below with reference to the third embodiment.

  FIG. 5 shows a wiring pattern diagram according to the third embodiment of the present invention. In the wiring pattern diagram shown in FIG. 5, a round 52 for connecting wiring from a transformer or a coil and a semiconductor is provided in the middle of a wiring pattern 51 that connects both ends of a capacitor 8 used in parallel. The round 52 and the round 53 of the two secondary capacitors 8 are wired at a short distance and the same distance. Due to the difference in the conventional wiring impedance, a large amount of high-frequency current flows through one capacitor, and heat generation due to the high-frequency current occurs on one side. The problem of concentration can be solved. Further, since the wiring impedance can be reduced to the same level as the two capacitors, the ripple current going out from the capacitor can also be reduced.

  As described above, according to the third embodiment of the present invention, it is possible to obtain an effect that wiring can be performed with equal and low impedance to two capacitors.

  In addition, although it demonstrated using the secondary side capacitor | condenser, it is the same also about a primary side capacitor | condenser.

  The power supply device according to the present invention has a structure that reduces the wiring impedance around the transformer and the coil, and is particularly useful for a power supply device that needs to reduce noise and heat generation.

Front view of power supply apparatus according to Embodiment 1 of the present invention Front view of power supply apparatus according to Embodiment 2 of the present invention Top view of transformer and wiring board on which it is mounted in the same embodiment Top view of the power supply device in the same embodiment Pattern diagram of wiring board in Embodiment 3 of the present invention Front view of conventional power supply

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transformer 2 Input / output terminal of a transformer 3 Printed wiring board 4 Input connector 5 Primary side capacitor 6 Primary side semiconductor 7 Secondary side semiconductor 8 Secondary side capacitor 9 Output connector 10 Connection connector 11 Lead wire 12 Heat sink 13 Spacer 14 Screw 15 Case 16 Output terminal of transformer of the present invention 17 Connector 21 Heat sink 22 Insulator 23 Wiring 24 Input terminal of transformer in Embodiment 2 of the present invention 25 Output terminal of transformer in Embodiment 2 of the present invention 26 The other output terminal of the transformer in the second embodiment 27 The lead of the capacitor 8 28 The other lead of the capacitor 8 29 The wiring 30 The wiring connecting the transformer and the semiconductor 41 The cutout provided in the printed wiring board 3 51 Pattern of printed wiring board in No. 3 52 Round for soldering the wiring from the other wiring board or transformer 53 Round for soldering the lead of the capacitor 8

Claims (5)

In a power supply apparatus having at least one wiring board on which a transformer or a coil is mounted and at least one wiring board on which no transformer or coil is mounted, an input / output terminal of the transformer or the coil is directly connected to both wiring boards. apparatus. 2. The power supply apparatus according to claim 1, wherein at least one of the input / output terminals of the transformer or the coil is connected via a connector mounted on the printed wiring board. 2. The power supply device according to claim 1, wherein a component that requires heat dissipation is mounted on at least one wiring board, and a component that does not require heat dissipation is mounted on another wiring board. 4. The power supply device according to claim 3, wherein a heat sink provided on one of the wiring boards on which a component that requires heat radiation is mounted and the housing are attached so as to face each other. 2. The power supply device according to claim 1, wherein a round for connecting wiring from a transformer or a coil and a semiconductor is provided in the middle of a wiring pattern for connecting both ends of capacitors used in parallel.

Images