JP2018142590A - Power supply device, and switching hub comprising the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power supply device, and a switching hub comprising the same that can suppress local temperature rise of an enclosure.SOLUTION: A power supply device comprises a substrate 2, a plurality of circuit components 3, an enclosure and a heat dissipation structure 4. The plurality of circuit components 3 are mounted on the substrate 2, and constitute a power supply circuit. The heat dissipation structure 4 dissipates heat of a plurality of parallel components 31 that are parallely connected electrically and that have a common function to each other, among the plurality of circuit components 3. The enclosure encloses the substrate 2 such that a distance between a first mounting surface 201 and a first inner surface of the enclosure is shorter than a distance between a second mounting surface 202 and a second inner surface of the enclosure. The plurality of parallel components 31 are arranged on the first mounting surface 201 of the substrate 2. The substrate 2 has a first pad 21, each of which is connected to each of the plurality of parallel components 31. The heat dissipation structure 4 is arranged on the second mounting surface 202 side of the substrate 2, and is thermally coupled to each of the plurality of parallel components 31 through the first pad 21.SELECTED DRAWING: Figure 3

Description

  The present invention generally relates to a power supply device and a switching hub including the power supply device, and more particularly to a power supply device including a power supply circuit and a switching hub including the power supply device.

  Conventionally, a switching hub on which a switch LSI with a large amount of heat generation is mounted has been disclosed (see, for example, Patent Document 1). The switching hub of Patent Document 1 is equipped with a switch LSI that generates a large amount of heat and has a higher operating clock frequency and higher circuit integration for higher performance. The switching hub is provided with a large heat sink that is brought into contact with the switch LSI that generates a large amount of heat, and the fin portion of the heat sink is exposed outside the casing. Also, the housing cover and the heat sink are integrated.

JP 2001-156475 A

  However, in the switching hub of Patent Document 1, the casing and the heat sink are integrated, and the casing locally rises in temperature due to heat generated from the switch LSI (circuit component).

  This invention is made | formed in view of the said reason, The objective is to provide the power supply device which can suppress the local temperature rise of a housing | casing, and a switching hub provided with the same.

  A power supply device according to one embodiment of the present invention includes a substrate, a plurality of circuit components, a housing, and a heat dissipation structure. The substrate has a first mounting surface and a second mounting surface opposite to the first mounting surface. The plurality of circuit components are mounted on the substrate and constitute a power supply circuit. The housing houses the substrate and the plurality of circuit components, and has a first inner surface facing the first mounting surface of the substrate and a second inner surface facing the second mounting surface of the substrate. The heat dissipation structure dissipates a plurality of parallel components that are electrically connected in parallel and have a common function among the plurality of circuit components. The housing is configured such that a distance between the first mounting surface and the first inner surface of the housing is shorter than a distance between the second mounting surface and the second inner surface of the housing. In addition, the substrate is accommodated. The plurality of parallel components are disposed on the first mounting surface of the substrate. The substrate includes a pad provided on the first mounting surface and electrically connected to each of the plurality of parallel components. The heat dissipation structure is disposed on the second mounting surface side of the substrate and is thermally coupled to each of the plurality of parallel components via the pad.

  A switching hub according to an aspect of the present invention includes the power supply device and a communication control unit. The communication control unit is supplied with power from the power supply device and controls data communication between two or more electronic devices on a network.

  The power supply device of the present invention and the switching hub provided with the power source device have an effect that a local temperature rise of the housing can be suppressed.

FIG. 1 is an exploded perspective view of a power supply device according to an embodiment of the present invention. FIG. 2 is a system configuration diagram of a network using a switching hub including the above power supply apparatus. FIG. 3A is a plan view of a substrate in the above power supply apparatus. FIG. 3B is a bottom view of the substrate in the above power supply apparatus. FIG. 4 is a cross-sectional view of the above power supply apparatus. FIG. 5 is an enlarged cross-sectional view of the main part of the above power supply apparatus. FIG. 6A is a perspective view of the main part of the power supply device according to the first modification of the embodiment of the present invention, viewed from the second mounting surface side. FIG. 6B is a perspective view of the main part of the above power supply device as seen from the first mounting surface side. FIG. 7 is a perspective view of a main part of a power supply device according to a second modification of the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below is only one of various embodiments of the present invention. The following embodiment can be variously modified according to the design or the like as long as the object of the present invention can be achieved. In addition, each figure demonstrated in the following embodiment is a typical figure, and the dimension ratio of each component does not necessarily reflect an actual dimension ratio.

<Overview>
An exploded perspective view of the power supply device 1 of the present embodiment is shown in FIG. 1, and a system configuration diagram of a network using a switching hub 7 including the power supply device 1 is shown in FIG.

  The switching hub 7 of this embodiment includes a power supply device 1 having a power supply circuit 10 and a communication control unit 70.

  The switching hub 7 includes a plurality of connection ports to which communication lines such as LAN (Local Area Network) cables can be connected. A network is formed by connecting an electronic device 8 having a communication function to a connection port of the switching hub 7 via a communication line. In the example of FIG. 2, as the electronic device 8, a router 81, a personal computer 82, a wireless access point 83, an IP (Internet Protocol) telephone 84, and a network camera 85 are connected to the switching hub 7.

  The power supply circuit 10 of the power supply device 1 converts AC power supplied from a power source 9 such as a commercial power supply into DC power and outputs the DC power to the communication control unit 70. The power supply circuit 10 is composed of a plurality of circuit components 3 mounted on the substrate 2. The plurality of circuit components 3 are, for example, resistors, capacitors, inductors, diodes, transformers, semiconductor elements, and the like. The semiconductor element is, for example, a transistor such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), a diode, an IC component (IC: Integrated Circuit), or the like. The power supply circuit 10 includes, for example, a rectifier circuit, a step-up chopper circuit, a step-down chopper circuit, a control circuit, and the like. The rectifier circuit is configured by a bridge circuit including a plurality of diodes, for example. The step-up chopper circuit and the step-down chopper circuit are composed of, for example, an inductor, a diode, a switching element, and the like. The control circuit includes, for example, IC components that control the operation of the switching elements of the step-up chopper circuit and the step-down chopper circuit.

  The communication control unit 70 is configured to operate with power supplied from the power supply circuit 10. The communication control unit 70 is configured to control data communication between two or more electronic devices 8 on the network. Specifically, the communication control unit 70 relays (transfers) signals between two or more electronic devices 8 based on, for example, a MAC (Media Access Control) address. The communication control unit 70 refers to the MAC address of the electronic device 8 connected to the connection port, and transmits a signal to the electronic device 8 specified by the MAC address. Therefore, the communication efficiency in the network is improved and the communication load is reduced. The switching hub 7 may have a router function, a wireless access point function, and the like.

<Details>
Below, the power supply device 1 of this embodiment is demonstrated in detail with reference to FIG. 1, FIG. 3A-FIG. The power supply device 1 of the present embodiment includes a substrate 2, a plurality of circuit components 3, a heat dissipation structure 4, a heat conducting member 51, an insulating member 52, a heat dissipating member 53, and a housing 6.

  The board | substrate 2 is printed circuit boards, such as a glass epoxy board | substrate, for example, and the planar view from the thickness direction is formed in the substantially rectangular shape. The substrate 2 has a first mounting surface 201 that is one surface that intersects the thickness direction and a second mounting surface 202 opposite to the first mounting surface 201, and a plurality of circuit components 3 are mounted on the substrate 2. Yes. The board | substrate 2 has the conductor (for example, copper foil) which comprises a film-form wiring path. The plurality of circuit components 3 mounted on the substrate 2 are electrically connected to each other by the conductor of the substrate 2.

  In the present embodiment, among the plurality of circuit components 3, the circuit component 3 having a relatively small height dimension is disposed on the first mounting surface 201, and the circuit component 3 having a relatively large height dimension is disposed on the second mounting surface. 202. The height dimension here is a dimension along the thickness direction of the substrate 2 in a state where the circuit component 3 is mounted on the substrate 2.

  The circuit component 3 disposed on the first mounting surface 201 is a surface mounted component (SMD: Surface Mount Device). In the present embodiment, the surface-mounted component is, for example, a chip-type circuit element (such as a resistor, a capacitor, an inductor, or a diode), an IC component, or the like. The surface-mounted component is surface-mounted on the first mounting surface 201 of the substrate 2. Specifically, the electrodes of the surface mount component are electrically and mechanically connected to the conductor exposed from the resist layer on the first mounting surface 201 of the substrate 2 by solder.

  The circuit component 3 disposed on the second mounting surface 202 is a lead type component having a radial lead, an axial lead, or the like. In the present embodiment, the lead type component is, for example, an electrolytic capacitor, a transformer, a wound inductor, a varistor, an IC component, a connector, or the like. The lead type component is mounted on the substrate 2 through-holes. Specifically, the lead electrode of the lead type component is electrically and mechanically connected to the conductor of the substrate 2 with solder on the first mounting surface 201 of the substrate 2.

  The plurality of circuit components 3 include a plurality (two in this embodiment) of parallel components 31 (see FIG. 3B). The two parallel components 31 are circuit components that are electrically connected in parallel and have a common function. The two parallel components 31 are disposed on the first mounting surface 201. In the present embodiment, the case where the two parallel components 31 are circuit components of the same product type and the same product number, for example, n-channel MOSFETs constituting a boost chopper circuit in the power supply circuit 10 will be described as an example.

  The drain terminals of the two parallel components 31 (MOSFETs) are electrically connected to each other, and are electrically connected to the positive output side of the rectifier circuit via an inductor, for example. The source terminals of the two parallel components 31 (MOSFETs) are electrically connected to each other. The gate terminals of the two parallel components 31 (MOSFETs) are electrically connected to each other, and are electrically connected to, for example, a control circuit (for example, an IC component) that controls on / off. The two parallel components 31 (MOSFETs) are turned on / off at the same timing by the control circuit. The “same timing” here does not have to be strictly the same, and the on / off timing may be shifted due to individual differences of the parallel parts 31 (MOSFETs). Since the two parallel components 31 (MOSFETs) are electrically connected in parallel, the current flowing through each of the two parallel components 31 (MOSFETs) can be compared to the case where there is only one parallel component 31 (MOSFET). It becomes half. Thereby, the emitted-heat amount per one parallel component 31 (MOSFET) can be suppressed.

  The two parallel components 31 are surface-mounted components mounted on the first mounting surface 201, and each of the drain terminal, the source terminal, and the gate terminal is exposed from the resist layer on the first mounting surface 201 of the substrate 2. Are electrically and mechanically connected to the pads. In FIG. 3B, only the pad (first pad 21) to which the source terminals of the two parallel components 31 (MOSFETs) are connected among the plurality of pads provided on the first mounting surface 201 of the substrate 2 is shown. The other pads are not shown. That is, in FIG. 3B, among the plurality of circuit components 3 mounted on the first mounting surface 201, the circuit component 3 other than the parallel component 31 and the pad to which the drain terminal and the gate terminal of the parallel component 31 are connected are illustrated. Omitted.

  As described above, the first pad 21 is a conductor (copper foil) provided on the first mounting surface 201 of the substrate 2. The first pad 21 is thermally connected to the two parallel components 31 by being mechanically connected to each of the two parallel components 31 by solder. The first pad 21 is preferably formed with a larger area than other pads in order to improve heat dissipation. The first pad 21 may be partially covered with a resist layer.

  Further, the power supply device 1 of the present embodiment includes a heat dissipation structure 4 that radiates heat generated from the parallel component 31 to the second mounting surface 202 side of the substrate 2. The heat dissipation structure 4 of the present embodiment includes a second pad 22, a through-hole via 23, a conductive member 24, a heat conductive sheet 41, and a metal body 42 (see FIG. 5).

  The second pad 22 is a conductor (copper foil) provided on the second mounting surface 202 of the substrate 2 and is exposed from the resist layer. In FIG. 3A, only the second pad 22 is illustrated among the plurality of pads provided on the second mounting surface 202 of the substrate 2, and the other pads are not illustrated.

  The second pad 22 is configured to overlap at least a part of the first pad 21 in the thickness direction of the substrate 2. That is, the first pad 21 and the second pad 22 are partially opposed via the base material (glass epoxy resin) of the substrate 2. As a result, the second pad 22 is thermally coupled to the first pad 21. Accordingly, the second pad 22 is thermally coupled to the two parallel components 31 via the first pad 21, and the heat generated by the two parallel components 31 can be radiated on the second mounting surface 202 side of the substrate 2. it can. Similar to the first pad 21, the second pad 22 is preferably formed to have a larger area than other pads in order to improve heat dissipation. The second pad 22 may be partially covered with a resist layer.

  The through-hole via 23 is a through-hole penetrating the substrate 2 in the thickness direction, and a conductor (copper foil) is provided along the inner peripheral surface of the through-hole. The through-hole via 23 is formed in a portion of the substrate 2 where the first pad 21 and the second pad 22 overlap each other, and electrically connects the first pad 21 and the second pad 22. The second pad 22 is thermally coupled to the first pad 21 through the through-hole via 23. Therefore, the thermal resistance between the first pad 21 and the second pad 22 is reduced by the through-hole via 23. In the present embodiment, the heat dissipation structure 4 includes a plurality of through-hole vias 23 (nine in this embodiment), and the nine through-hole vias 23 are formed in a line along the longitudinal direction of the substrate 2. Thereby, the thermal resistance between the first pad 21 and the second pad 22 is further reduced. The number of through-hole vias 23 is not limited to nine and may be one or a plurality other than nine. A plurality of through-hole vias 23 may be formed in a plurality of rows.

  The conductive member 24 is, for example, solder, and is disposed inside the through-hole via 23. That is, each through-hole via 23 is filled with the solder that is the conductive member 24. Thereby, the thermal resistance between the first pad 21 and the second pad 22 is further reduced.

  As shown in FIGS. 4 and 5, the heat conductive sheet 41 is disposed so as to be sandwiched between the second pad 22 and the metal body 42. The heat conductive sheet 41 has a higher thermal conductivity than air, and reduces the thermal resistance between the second pad 22 and the metal body 42. The heat conductive sheet 41 is, for example, a silicone rubber formed in a sheet shape, and has electrical insulation and elasticity. The heat conductive sheet 41 is formed in a rectangular shape in plan view from the thickness direction of the substrate 2.

  The metal body 42 is a heat sink made of, for example, aluminum. The metal body 42 is formed in a rectangular plate shape when viewed from the thickness direction of the substrate 2, and is bonded to the heat conductive sheet 41. Thereby, the metal body 42 is thermally coupled to the second pad 22 via the heat conductive sheet 41. That is, the metal body 42 is thermally coupled to the two parallel components 31 through the heat conductive sheet 41, the second pad 22, the conductive member 24, the through-hole via 23, and the first pad 21. The metal body 42 can dissipate the heat generated by the two parallel components 31 on the second mounting surface 202 side of the substrate 2. The metal body 42 may have a plurality of grooves in order to improve heat dissipation.

  As shown in FIG. 1, a heat conducting member 51, an insulating member 52, and a heat radiating member 53 are provided on the first mounting surface 201 side with respect to the substrate 2.

  The heat conducting member 51 is a member that reduces the thermal resistance between the two parallel components 31 arranged on the first mounting surface 201 of the substrate 2 and the metal heat radiating member 53, and has a heat conductivity higher than that of air. Have a rate. The heat conducting member 51 is, for example, a silicone rubber that can be formed into a sheet shape, and has electrical insulation and elasticity. The heat conducting member 51 is formed in a rectangular shape when viewed from the thickness direction of the substrate 2. The heat conducting member 51 covers at least two parallel components 31 among the plurality of circuit components 3 arranged on the first mounting surface 201 of the substrate 2, and the one surface is in contact with the two parallel components 31 with respect to the substrate 2. Are arranged on the first mounting surface 201 side. In the present embodiment, the heat conducting member 51 is one surface facing the substrate 2 so as to cover all of the plurality of circuit components 3 (including the two parallel components 31) arranged on the first mounting surface 201 of the substrate 2. Are formed in substantially the same size as the first mounting surface 201 of the substrate 2.

  The insulating member 52 is made of an electrically insulating material (for example, resin) and is formed in a bendable sheet shape. The insulating member 52 ensures electrical insulation between the plurality of circuit components 3 (including the two parallel components 31) mounted on the substrate 2 and the metal heat radiating member 53. The insulating member 52 of the present embodiment is formed along the inner surface of the case body 61 in the rectangular housing 6 and includes an insulating main piece 521 and a pair of insulating side pieces 522. The insulating main piece 521 is formed in a rectangular plate shape having a slightly larger area than the first mounting surface 201 of the substrate 2, and is disposed so that one surface is in contact with the other surface of the heat conducting member 51. The pair of insulating side pieces 522 are formed so as to protrude from both ends in the short direction of the insulating main piece 521 in a direction intersecting the insulating main piece 521, and cover both ends of the substrate 2 in the short direction. . The insulating member 52 preferably includes a heat conductive filler in order to improve the heat conductivity.

  The heat radiating member 53 is made of, for example, a metal plate such as aluminum, and is configured to be thermally coupled to the parallel component 31 via the insulating member 52 and the heat conducting member 51. The heat dissipating part is bent along the inner surface of the case body 61 in the housing 6, and includes a heat dissipating main piece 531 and a pair of heat dissipating side pieces 532. The heat radiating main piece 531 is formed in a rectangular plate shape whose dimension in the short direction is slightly larger than that of the insulating main piece 521 of the insulating member 52. The heat dissipating main piece 531 is disposed on the other surface side of the insulating main piece 521 of the insulating member 52 and faces the insulating main piece 521. The pair of heat radiation side pieces 532 are formed so as to protrude from both ends in the short direction of the heat radiation main piece 531 in a direction intersecting with the heat radiation main piece 531. The pair of heat radiating side pieces 532 faces the pair of insulating side pieces 522 of the insulating member 52 in the short direction of the heat radiating main piece 531.

  The housing 6 is formed in a rectangular shape having a case main body 61 and a cover 62, and the substrate 2 on which the plurality of circuit components 3 are mounted, the heat dissipation structure 4, the heat conduction member 51, the insulating member 52, and the heat dissipation The member 53 is accommodated. The housing 6 is made of an electrically insulating material such as resin. The case main body 61 and the cover 62 are formed in a rectangular box shape whose one surface is open. The housing 6 forms a storage space inside by combining the case main body 61 and the cover 62. In this storage space, a plurality of mounting surfaces 201 such that the first mounting surface 201 of the substrate 2 faces the first inner surface 611 of the case body 61 and the second mounting surface 202 of the substrate 2 faces the second inner surface 621 of the cover 62. The substrate 2 on which the circuit component 3 is mounted is accommodated.

  As shown in FIG. 4, in a state where the substrate 2 is stored in the housing 6, the distance between the first mounting surface 201 of the substrate 2 and the first inner surface 611 of the case body 61 of the housing 6 is L1, The distance between the second mounting surface 202 of the substrate 2 and the second inner surface 621 of the cover 62 of the housing 6 is L2. The housing 6 accommodates the substrate 2 so that the distance L1 is shorter than the distance L2 (L1 <L2).

  Further, as shown in FIG. 4, the metal body 42 disposed on the second mounting surface 202 of the substrate 2 is separated from the second inner surface 621 of the cover 62 of the housing 6 in the thickness direction of the substrate 2. That is, the metal body 42 is arranged so that a gap is formed between the metal body 42 and the second inner surface 621 of the cover 62 of the housing 6. Therefore, the heat of the metal body 42 is not easily transmitted to the cover 62.

  The case body 61 has four rectangular protrusions 612 protruding from the four corners of the first inner surface 611. Each of the four protrusions 612 is formed with a screw hole 613 to which a screw 63 for fixing the substrate 2 to the case body 61 is mechanically coupled. The substrate 2 includes four fixing pieces 25 in which through holes 251 through which the screws 63 pass are formed. The four fixing pieces 25 are formed so as to protrude from the four corners of the substrate 2 in the longitudinal direction of the substrate 2. The substrate 2 is fixed to the case body 61 by the screws 63 passing through the through holes 251 and being coupled to the screw holes 613 of the case body 61. Further, the substrate 2 is fixed to the case body 61 by the screws 63, so that the heat conducting member 51 is compressed and deformed by the substrate 2 and the first inner surface 611 of the case body 61. Therefore, the heat conducting member 51 is in contact with the circuit component 3 (including the parallel component 31) disposed on the first mounting surface 201 of the substrate 2 and the insulating main piece 521 of the insulating member 52. In addition, the insulating main piece 521 of the insulating member 52 contacts the heat radiating main piece 531 of the heat radiating member 53. Thereby, the thermal resistance between the parallel component 31 and the heat radiating member 53 through the heat conducting member 51 and the insulating member 52 is reduced.

  In the power supply device 1 of the present embodiment, the heat generated by the plurality of parallel components 31 arranged on the first mounting surface 201 of the substrate 2 is radiated by the heat dissipation structure 4 arranged on the second mounting surface 202 side of the substrate 2. Is configured to do. In the substrate 2, the distance L1 between the first mounting surface 201 and the first inner surface 611 of the housing 6 is shorter than the distance L2 between the second mounting surface 202 and the second inner surface 612 of the housing 6. As shown in FIG. That is, in the power supply device 1, the heat generated by the parallel component 31 is radiated to the center side of the housing space of the housing 6 with respect to the substrate 2. Therefore, the local temperature rise of the housing 6 is suppressed.

<Modification>
Next, a first modification of the power supply device 1 of the present embodiment will be described with reference to FIGS. 6A and 6B.

  In the power supply device 1 of the first modification, the heat dissipation structure 4 includes a plurality of (two in the first modification) second pads 22, and the plurality of second pads 22 are electrically and thermally formed by the metal body 42 </ b> A. It is connected. The first pad 21 is divided into a plurality of (two in the first modification) divided pads 211.

  As shown in FIG. 6B, the first pad 21 is divided between the two parallel components 31, and the parallel component 31 is electrically connected to each of the two divided pads 211.

  The two second pads 22 are provided so as to face a part of the two divided pads 211 through the base material (glass epoxy resin) of the substrate 2. Specifically, a part of one divided pad 211 and a part of one second pad 22 face each other in the thickness direction of the substrate 2 with the base material of the substrate 2 interposed therebetween. Further, a part of the other divided pad 211 and a part of the other second pad 22 are opposed to each other in the thickness direction of the substrate 2 through the base material of the substrate 2.

  In the power supply device 1 of the first modified example, the heat dissipation structure 4 includes two through-hole vias 23. Of the two through-hole vias 23, one through-hole via 23 is formed so as to electrically connect one divided pad 211 and one second pad 22. The other through-hole via 23 is formed so as to electrically connect the other divided pad 211 and the other second pad 22.

  The metal body 42A is configured by a jumper wire. Both end portions of the metal body 42A are passed through the two through-hole vias 23 from the second mounting surface 202 side. The metal body 42A is electrically and mechanically connected to the two divided pads 211 by the conductive member 24 (solder). Therefore, the metal body 42 </ b> A is electrically connected to the two second pads 22 in a state in which a part protrudes from the second mounting surface 202 of the substrate 2.

  The metal body 42A electrically connects the two divided pads 211 and the two second pads 22. Since the metal body 42A is mechanically connected to the first pad 21 (two divided pads 211) via the conductive member 24, the metal body 42A is directly thermally coupled to the first pad 21, so that the metal The thermal resistance between the body 42A and the first pad 21 is reduced. Therefore, the thermal resistance between the metal body 42A and the two parallel parts 31 is reduced. Further, the metal body 42 </ b> A protrudes from the second mounting surface 202 of the substrate 2, thereby improving the heat dissipation. The number of metal bodies 42A is not limited to one and may be plural.

  In the present modification, the two divided pads 211 and the two second pads 22 are configured to face each other, but the present invention is not limited to this configuration. One second pad 22 provided on the substrate 2 may be configured to face the two divided pads 211. In addition, one first pad 21 that is not divided may be configured to face the two second pads 22.

  In the present modification, the metal body 42A electrically connects the two divided pads 211 and the two second pads 22, but the configuration is not limited thereto. The metal body 42A may be configured to be electrically and mechanically connected to one second pad 22. The metal body 42A may be configured to be electrically and mechanically connected to one first pad 21 that is not divided.

  A second modification of the power supply device 1 of the present embodiment will be described with reference to FIG.

  In the power supply device 1 of the second modification, the heat dissipation structure 4 includes a plurality of (two in the second modification) second pads 22, and the plurality of second pads 22 are electrically and thermally formed by the metal body 42 </ b> B. It is connected.

  The metal body 42B is made of a metal foil such as aluminum. As shown in FIG. 7, the metal body 42 </ b> B is provided on the second mounting surface 202 of the substrate 2 in a state of being bent so as to protrude in a direction away from the second mounting surface 202 of the substrate 2. The metal body 42B is electrically and mechanically connected to the two second pads 22 with solder. Therefore, the metal body 42 </ b> B is electrically connected to the two second pads 22 in a state of protruding from the second mounting surface 202 of the substrate 2. Since the metal body 42B is directly thermally coupled to the two second pads 22, the thermal resistance between the metal body 42B and the two second pads 22 is reduced. Further, the metal body 42 </ b> B protrudes from the second mounting surface 202 of the substrate 2, thereby improving the heat dissipation.

  The shape of the metal body 42 </ b> B is not limited to the above shape, and may be attached to the two second pads 202 along the second mounting surface 202 of the substrate 2.

  In the above-described example, the case where the parallel component 31 is a MOSFET has been described as an example. There may be. Further, the plurality of parallel parts 31 may not have the same product number. Further, the parallel component 31 is not limited to a surface mount component, and may be a lead type component. Further, the number of parallel components 31 is not limited to two, and may be three or more. Moreover, a plurality of sets of parallel parts 31 having a common function may be used.

  Further, the power supply device 1 may have a configuration in which the communication control unit 70 is housed in the housing 6. That is, the switching hub 7 may have a configuration in which the power supply circuit 10 and the communication control unit 70 are housed in a common housing.

<Summary>
The power supply device 1 according to the first aspect includes a substrate 2, a plurality of circuit components 3, a housing 6, and a heat dissipation structure 4. The substrate 2 has a first mounting surface 201 and a second mounting surface 202 opposite to the first mounting surface 201. The plurality of circuit components 3 are mounted on the substrate 2 and constitute the power supply circuit 10. The housing 6 accommodates the substrate 2 and the plurality of circuit components 3, and includes a first inner surface 611 facing the first mounting surface 201 of the substrate 2 and a second inner surface 621 facing the second mounting surface 202 of the substrate 2. Have. The heat dissipation structure 4 is configured to dissipate a plurality of parallel components 31 that are electrically connected in parallel and have a common function among the plurality of circuit components 3. In the housing 6, the distance L <b> 1 between the first mounting surface 201 and the first inner surface 611 of the housing 6 is shorter than the distance L <b> 2 between the second mounting surface 202 and the second inner surface 621 of the housing 6. The board | substrate 2 is accommodated so that it may become. The plurality of parallel components 31 are arranged on the first mounting surface 201 of the substrate 2. The substrate 2 has a first pad 21 (pad) provided on the first mounting surface 201 and electrically connected to each of the plurality of parallel components 31. The heat dissipation structure 4 is disposed on the second mounting surface 202 side of the substrate 2 and is thermally coupled to each of the plurality of parallel components 31 via the first pad 21.

  With the above configuration, in the power supply device 1, the heat generated from the parallel component 31 is radiated on the second mounting surface 202 side where the distance from the first mounting surface 201 to the inner surface of the housing 6 is farther from the first mounting surface 201. The local temperature rise of the housing 6 can be suppressed.

  In the power supply device 1 according to the second aspect, in the first aspect, the heat dissipation structure 4 includes the second pad 22 at least partially overlapping the first pad 21 in the thickness direction of the substrate 2.

  With the above configuration, in the power supply device 1, the second pad 22 is thermally coupled to the first pad 21, and the heat dissipation structure 4 efficiently dissipates heat generated from the parallel component 31 on the second mounting surface 202 side of the substrate 2. be able to.

  In the power supply device 1 according to the third aspect, in the second aspect, the heat dissipation structure 4 further includes a through-hole via 23 that electrically connects the first pad 21 and the second pad 22.

  With the above configuration, in the power supply device 1, the thermal resistance between the first pad 21 and the second pad 22 is reduced, and the heat dissipation structure 4 is configured to transfer the heat generated from the parallel component 31 to the second mounting surface 202 side of the substrate 2. Can efficiently dissipate heat.

  In the power supply device 1 according to the fourth aspect, in the third aspect, the heat dissipation structure 4 further includes a conductive member 24 disposed inside the through-hole via 23.

  With the above configuration, in the power supply device 1, the thermal resistance between the first pad 21 and the second pad 22 is reduced, and the heat dissipation structure 4 is configured to transfer the heat generated from the parallel component 31 to the second mounting surface 202 side of the substrate 2. Can efficiently dissipate heat.

  In the power supply device 1 according to the fifth aspect, in any one of the second to fourth aspects, the heat dissipation structure 4 further includes a metal body 42 (42A, 42B) that is thermally coupled to the second pad 22.

  With the above configuration, in the power supply device 1, the heat dissipation efficiency of the heat dissipation structure 4 can be improved, and the heat generated from the parallel component 31 can be efficiently dissipated on the second mounting surface 202 side of the substrate 2.

  In the power supply device 1 according to the sixth aspect, in the fifth aspect, the metal body 42A (42B) protrudes from the second mounting surface 202 and is electrically connected to the second pad 22.

  With the above configuration, in the power supply device 1, the heat dissipation efficiency of the metal body 42A (42B) is improved, and the thermal resistance between the metal body 42A (42B) and the second pad 22 is reduced. Thereby, in the power supply device 1, the heat radiating structure 4 can efficiently radiate the heat generated from the parallel component 31 on the second mounting surface 202 side of the substrate 2.

  In the power supply device 1 according to the seventh aspect, in the fifth or sixth aspect, the heat dissipation structure 4 includes a plurality of second pads 22. The plurality of second pads 22 are thermally coupled to each other via the metal body 42.

  With the above configuration, in the power supply device 1, the heat dissipation efficiency of the heat dissipation structure 4 can be improved, and the heat generated from the parallel component 31 can be efficiently dissipated on the second mounting surface 202 side of the substrate 2.

  In the power supply device 1 according to the eighth aspect, in any one of the fifth to seventh aspects, a gap is formed between the metal body 42 and the second inner surface 621 of the housing 6.

  With the above configuration, in the power supply device 1, the heat generated from the metal body 42 is not easily transmitted to the housing 6, and a local temperature increase on the second inner surface 621 of the housing 6 can be suppressed.

  In the power supply device 1 according to the ninth aspect, in any one of the first to eighth aspects, the first pad 21 (pad) is divided into a plurality of divided pads 211 that are electrically connected to each other. Each of the plurality of divided pads 211 is electrically connected to at least one parallel component 31 among the plurality of parallel components 31.

  With the above configuration, in the power supply device 1, the plurality of divided pads 211 can be arranged apart from each other, and the plurality of parallel components 31 can be easily arranged on the first mounting surface 201.

  In any one of the first to ninth aspects, the power supply device 1 according to the tenth aspect further includes a heat conducting member 51, an insulating member 52, and a heat radiating member 53. The heat conducting member 51 covers the plurality of parallel parts 31 and is thermally coupled to the plurality of parallel parts 31. The insulating member 52 has electrical insulation. The heat dissipating member 53 is made of metal and is thermally coupled to the heat conducting member 51 via the insulating member 52.

  With the above configuration, in the power supply device 1, the heat generated from the parallel component 31 can be radiated also on the first mounting surface 201 side of the substrate 2.

  The switching hub 7 according to the eleventh aspect includes the power supply device 1 according to any one of the first to tenth aspects and a communication control unit 70. The communication control unit 70 is supplied with power from the power supply device 1 and controls data communication between two or more electronic devices 8 on the network.

  With the above configuration, the switching hub 7 can suppress a local temperature rise in the housing 6 of the power supply device 1.

DESCRIPTION OF SYMBOLS 1 Power supply device 2 Board | substrate 201 1st mounting surface 202 2nd mounting surface 21 1st pad 211 Split pad 22 2nd pad 24 Conductive member 3 Circuit component 31 Parallel component 4 Heat dissipation structure 42 Metal body 6 Case 611 1st inner surface 621 1st 2 inner surface 51 heat conduction member 52 insulation member 53 heat dissipation member 7 switching hub 8 electronic device

Claims (11)

A substrate having a first mounting surface and a second mounting surface opposite to the first mounting surface;
A plurality of circuit components mounted on the substrate and constituting a power supply circuit;
A housing that houses the substrate and the plurality of circuit components, and that has a first inner surface facing the first mounting surface of the substrate and a second inner surface facing the second mounting surface of the substrate;
A heat dissipation structure for radiating heat from a plurality of parallel components electrically connected in parallel and having a common function among the plurality of circuit components,
The housing is configured such that a distance between the first mounting surface and the first inner surface of the housing is shorter than a distance between the second mounting surface and the second inner surface of the housing. And storing the substrate,
The plurality of parallel components are disposed on the first mounting surface of the substrate,
The substrate includes a pad provided on the first mounting surface and electrically connected to the plurality of parallel components;
The heat dissipation structure is disposed on the second mounting surface side of the substrate, and is thermally coupled to each of the plurality of parallel components via the pad. The power supply device according to claim 1, wherein the heat dissipation structure includes a second pad that at least partially overlaps the first pad that is the pad in the thickness direction of the substrate. The power supply device according to claim 2, wherein the heat dissipation structure further includes a through-hole via that electrically connects the first pad and the second pad. The power supply device according to claim 3, wherein the heat dissipation structure further includes a conductive member disposed inside the through-hole via. The power supply device according to any one of claims 2 to 4, wherein the heat dissipation structure further includes a metal body thermally coupled to the second pad. The power supply device according to claim 5, wherein the metal body protrudes from the second mounting surface and is electrically connected to the second pad. The heat dissipation structure has a plurality of the second pads,
The power supply apparatus according to claim 5, wherein the plurality of second pads are thermally coupled to each other through the metal body. The power supply device according to claim 5, wherein a gap is formed between the metal body and the second inner surface of the housing. The pad is divided into a plurality of divided pads that are electrically connected to each other;
The power supply device according to claim 1, wherein each of the plurality of divided pads is electrically connected to at least one parallel component among the plurality of parallel components. A heat conducting member that covers the plurality of parallel parts and is thermally coupled to the plurality of parallel parts;
An insulating member having electrical insulation;
The power supply device according to any one of claims 1 to 9, further comprising a heat radiating member made of metal and thermally coupled to the heat conducting member via the insulating member. The power supply device according to any one of claims 1 to 10,
A communication control unit that is supplied with power from the power supply device and performs data communication control between two or more electronic devices on the network.

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