JP4640313B2 - LED lighting device - Google Patents

LED lighting device Download PDF

Info

Publication number
JP4640313B2
JP4640313B2 JP2006284722A JP2006284722A JP4640313B2 JP 4640313 B2 JP4640313 B2 JP 4640313B2 JP 2006284722 A JP2006284722 A JP 2006284722A JP 2006284722 A JP2006284722 A JP 2006284722A JP 4640313 B2 JP4640313 B2 JP 4640313B2
Authority
JP
Japan
Prior art keywords
power supply
supply device
led
main body
instrument
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006284722A
Other languages
Japanese (ja)
Other versions
JP2008103195A (en
Inventor
哲 森
良二 横谷
茂章 山崎
浩行 迫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Corp
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Works Ltd filed Critical Panasonic Corp
Priority to JP2006284722A priority Critical patent/JP4640313B2/en
Publication of JP2008103195A publication Critical patent/JP2008103195A/en
Application granted granted Critical
Publication of JP4640313B2 publication Critical patent/JP4640313B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本願発明は、ＬＥＤが光源として実装されたＬＥＤユニットと、電源装置と、前記ＬＥＤユニットと前記電源装置とが取り付けられた器具本体と、を備えたＬＥＤ照明装置に関するものである。   The present invention relates to an LED lighting device including an LED unit in which an LED is mounted as a light source, a power supply device, and a fixture main body to which the LED unit and the power supply device are attached.

従来から、特開２００２−３０４９０４号公報（特許文献１）に示されるようなＬＥＤ照明装置は知られている。このＬＥＤ照明装置は図２２に示すように、器具本体１０１、器具外郭１０２、レンズ体１０３およびＬＥＤ１０４を備えているほか、器具本体１０１にＬＥＤ電源供給部１０５が内蔵されている。そして、このＬＥＤ電源供給部１０５はＬＥＤ１０４が実装された配線基板の裏面側に設けられている。   2. Description of the Related Art Conventionally, an LED lighting device as shown in JP-A-2002-304904 (Patent Document 1) is known. As shown in FIG. 22, the LED illumination device includes an instrument body 101, an instrument shell 102, a lens body 103, and an LED 104, and an LED power supply unit 105 is built in the instrument body 101. And this LED power supply part 105 is provided in the back surface side of the wiring board in which LED104 was mounted.

これにより、天井裏からの交流電源をＬＥＤ照明装置に直接接続し、一般家庭で使用されているシーリング器具としての展開が容易にできた。
特開２００２−３０４９０４号公報 As a result, an AC power source from the back of the ceiling was directly connected to the LED lighting device, and the development as a sealing device used in general households was facilitated.
JP 2002-304904 A

しかしながら、ＬＥＤ電源供給部１０５が器具本体１０１に内蔵されていると、ＬＥＤ１０４からの熱の影響を受けやすく、ＬＥＤ電源供給部１０５の部品温度が上昇してしまう恐れがある。また、ＬＥＤ１０４が発する熱はＬＥＤ電源供給部１０５との取付部を介してＬＥＤ電源供給部１０５に伝わり、更にＬＥＤ電源供給部１０５から器具本体１０１に伝わって外部に放熱されるので、ＬＥＤ１０４の放熱性が低下してしまう恐れがある。   However, if the LED power supply unit 105 is built in the instrument main body 101, the LED power supply unit 105 is likely to be affected by heat from the LED 104, and the component temperature of the LED power supply unit 105 may increase. Further, the heat generated by the LED 104 is transmitted to the LED power supply unit 105 via the mounting portion with the LED power supply unit 105, and further transmitted from the LED power supply unit 105 to the instrument body 101 to be radiated to the outside. May decrease.

よって、特開２００２−３０４９０４号公報に示される上記従来例のＬＥＤ照明装置にあっては、ＬＥＤ電源供給部１０５及びＬＥＤ１０４の温度を低減するために器具サイズを大きくする必要があるという問題があった。   Therefore, the conventional LED lighting device disclosed in Japanese Patent Application Laid-Open No. 2002-304904 has a problem that it is necessary to increase the instrument size in order to reduce the temperature of the LED power supply unit 105 and the LED 104. It was.

本願発明は、上記課題を解決するためになされたものであり、その目的は、電源装置が本体に内蔵されたＬＥＤ照明装置において、器具の放熱性を高める構造とすることで、コンパクトなＬＥＤ照明装置を提供することにある。   The present invention has been made in order to solve the above-described problems, and the object of the present invention is to provide a compact LED illumination by providing a structure that enhances the heat dissipation of the fixture in the LED illumination device in which the power supply device is built in the main body. To provide an apparatus.

上記課題を解決するために、本願請求項１記載の発明では、ＬＥＤが光源として実装されたＬＥＤユニットと、電源装置と、前記ＬＥＤユニットと前記電源装置とが取り付けられた器具本体と、を備えたＬＥＤ照明装置であって、ＬＥＤユニットが器具本体の板部の表面に取り付けられ、電源装置が器具本体の板部の裏面に取り付けられ、電源装置の中央付近に開口部が設けられ、この開口部の内側位置に送風手段が設けられていることを特徴としている。   In order to solve the above-mentioned problems, the invention according to claim 1 of the present application includes an LED unit in which an LED is mounted as a light source, a power supply device, and an appliance main body to which the LED unit and the power supply device are attached. LED lighting device, wherein the LED unit is attached to the surface of the plate portion of the appliance body, the power supply device is attached to the back surface of the plate portion of the appliance body, and an opening is provided near the center of the power supply device. It is characterized in that air blowing means is provided at the inner position of the part.

又、本願請求項２記載の発明では、ＬＥＤが光源として実装されたＬＥＤユニットと、電源装置と、前記ＬＥＤユニットと前記電源装置とが取り付けられた器具本体と、を備えたＬＥＤ照明装置であって、ＬＥＤユニットが器具本体の板部の表面に取り付けられ、電源装置が器具本体の板部の裏面に取り付けられ、電源装置の中央付近に開口部が設けられ、この開口部の内側位置にペルチェ素子が設けられたことを特徴とする。   According to the second aspect of the present invention, there is provided an LED illumination device comprising: an LED unit in which an LED is mounted as a light source; a power supply device; and a fixture main body to which the LED unit and the power supply device are attached. The LED unit is attached to the front surface of the plate portion of the instrument body, the power supply device is attached to the back surface of the plate portion of the instrument body, and an opening is provided near the center of the power supply device. An element is provided.

又、本願請求項３記載の発明では、上記請求項１又は２記載のＬＥＤ照明装置において、器具本体と電源装置との間に隙間を設けたことを特徴とする。   Further, the invention according to claim 3 of the present application is characterized in that in the LED lighting device according to claim 1 or 2, a gap is provided between the instrument main body and the power supply device.

又、本願請求項４記載の発明では、上記請求項１〜３のいずれか１項記載のＬＥＤ照明装置において、器具本体の板部の、電源装置の開口部の内側位置に放熱孔を設けたことを特徴とする。   Further, in the invention according to claim 4 of the present application, in the LED lighting device according to any one of claims 1 to 3, a heat radiating hole is provided at a position inside the opening of the power supply device of the plate portion of the fixture body. It is characterized by that.

本願請求項１記載の発明のＬＥＤ照明装置においては、電源装置が器具本体によって、ＬＥＤユニットと分離されていることで、ＬＥＤユニットと電源装置の熱が互いに殆ど伝わらないため、ＬＥＤユニットと電源装置の温度上昇を抑制できる。また、電源装置の中央付近に開口部を設けることによって電源装置の表面積が増大するため、放熱性が向上する。また、電源中央付近の開口部の内側位置にファンを設けることによって能動的な対流を発生させ、自然対流よりも流速が増し、器具全体の放熱が促進できる。これにより、ＬＥＤ及び電源装置の熱が効率よく放熱されるため、器具本体をコンパクトにすることが可能となる。   In the LED lighting device according to the first aspect of the present invention, since the power supply device is separated from the LED unit by the fixture body, the heat of the LED unit and the power supply device is hardly transmitted to each other. Temperature rise can be suppressed. Moreover, since the surface area of a power supply device increases by providing an opening part near the center of a power supply device, heat dissipation improves. In addition, by providing a fan inside the opening near the center of the power supply, active convection is generated, the flow velocity is increased compared to natural convection, and heat dissipation of the entire instrument can be promoted. Thereby, since the heat | fever of LED and a power supply device is thermally radiated efficiently, it becomes possible to make an instrument main body compact.

本願請求項２記載の発明のＬＥＤ照明装置においては、電源装置が器具本体によって、ＬＥＤユニットと分離されていることで、ＬＥＤユニットと電源装置の熱が互いに殆ど伝わらないため、ＬＥＤユニットと電源装置の温度上昇を抑制できる。また、電源装置の中央付近に開口部を設けることによって電源装置の表面積が増大するため、放熱性が向上する。また、電源中央付近の開口部の内側位置にペルチェ素子を設けることによって器具本体の板部の裏面の温度を低下させることができる。また、器具本体の板部の裏面を冷却すると同時に、熱が移動してペルチェ素子自体が発熱し、ペルチェ素子の温度が周囲に比べて高温になることから、器具本体側から上向きに流速の速い対流が発生し、器具全体の放熱を促進できる。これにより、ＬＥＤ及び電源装置の熱が効率よく放熱されるため、器具本体をコンパクトにすることが可能となる。   In the LED lighting device according to the second aspect of the present invention, since the power supply device is separated from the LED unit by the fixture body, the heat of the LED unit and the power supply device is hardly transmitted to each other. Temperature rise can be suppressed. Moreover, since the surface area of a power supply device increases by providing an opening part near the center of a power supply device, heat dissipation improves. Moreover, the temperature of the back surface of the plate | board part of an instrument main body can be lowered | hung by providing a Peltier element in the inner position of the opening part near the center of a power supply. Also, as the back surface of the plate portion of the instrument body is cooled, heat is transferred and the Peltier element itself generates heat, and the temperature of the Peltier element becomes higher than that of the surroundings, so the flow velocity is fast upward from the instrument body side. Convection occurs and heat dissipation of the entire instrument can be promoted. Thereby, since the heat | fever of LED and a power supply device is thermally radiated efficiently, it becomes possible to make an instrument main body compact.

本願請求項３記載の発明のＬＥＤ照明装置においては、特に、器具本体と電源装置との間に隙間を設けているので、隙間から電源装置下方に流入する空気の対流の電源装置下方付近での抵抗が低減し、対流速度が増すため、電源装置の放熱が促進される。これにより、ＬＥＤ及び電源装置の熱が効率よく放熱されるため、更に器具本体をコンパクトにすることが可能となる。   In the LED lighting device according to the third aspect of the present invention, in particular, since a gap is provided between the fixture body and the power supply device, the convection of air flowing from the gap below the power supply device near the lower portion of the power supply device. Since the resistance is reduced and the convection speed is increased, the heat dissipation of the power supply device is promoted. Thereby, since the heat | fever of LED and a power supply device is thermally radiated efficiently, it becomes possible to make an instrument main body more compact.

本願請求項４記載の発明のＬＥＤ照明装置においては、特に、器具本体の板部の、電源装置の開口部の内側位置に放熱孔を設けているので、放熱孔から電源装置に空気が流れ込む。そして、放熱孔から電源装置への到達距離が短いので、温度の低い空気が電源装置に流れ込むこととなる。これにより、ＬＥＤ及び電源装置の熱が効率よく放熱されるため、器具本体を更にコンパクトにすることが可能となる。   In the LED lighting device according to the fourth aspect of the present invention, in particular, since the heat radiation hole is provided at the inner side of the opening of the power supply device in the plate portion of the fixture body, air flows into the power supply device from the heat radiation hole. And since the reach | attainment distance from a thermal radiation hole to a power supply device is short, air with low temperature will flow into a power supply device. Thereby, since the heat | fever of LED and a power supply device is thermally radiated efficiently, it becomes possible to make an instrument main body further compact.

以下、本願発明を添付図面に示す実施形態に基づいて説明する。   Hereinafter, the present invention will be described based on embodiments shown in the accompanying drawings.

図１〜６は、本願請求項１に対応した第一の実施形態であるＬＥＤ照明装置を示している。   1-6 has shown the LED illuminating device which is 1st embodiment corresponding to this-application Claim 1. FIG.

本実施形態のＬＥＤ照明装置は、ＬＥＤ５が光源として実装されたＬＥＤユニット４と、電源装置２と、前記ＬＥＤユニット４と前記電源装置２とが取り付けられた器具本体１と、を備えたＬＥＤ照明装置であって、ＬＥＤユニット４が器具本体１の板部の表面に取り付けられ、電源装置２が器具本体１の板部の裏面に取り付けられ、電源装置２の中央付近に開口部が設けられ、この開口部の内側位置に送風手段８が設けられている。   The LED illumination device of this embodiment includes an LED unit 4 in which an LED 5 is mounted as a light source, a power supply device 2, and an appliance body 1 to which the LED unit 4 and the power supply device 2 are attached. An LED unit 4 is attached to the surface of the plate portion of the instrument body 1, the power supply device 2 is attached to the back surface of the plate portion of the instrument body 1, and an opening is provided near the center of the power supply device 2, The air blowing means 8 is provided inside the opening.

以下、この実施形態のＬＥＤ照明装置をより具体的詳細に説明する。   Hereinafter, the LED lighting device of this embodiment will be described in more detail.

器具本体１は、図１〜６に示すように、板部である円状の底部と、底部の外周縁から下方に延設された円筒部と、円筒部の下端から外側に延設されて円筒部を取り囲む縁部と、を一体に有する形状に形成されている。図示されていないが、電源装置２に電気的に接続される接続部（コネクタ）が底部の下面中央付近に設けられている。なお、器具本体１は例えばアルミなどからなる。   1-6, the instrument main body 1 is extended outside from the circular bottom part which is a board part, the cylindrical part extended below from the outer periphery of the bottom part, and the lower end of the cylindrical part. It is formed in the shape which has the edge part surrounding a cylindrical part integrally. Although not shown, a connection portion (connector) that is electrically connected to the power supply device 2 is provided near the center of the bottom surface of the bottom portion. The instrument body 1 is made of, for example, aluminum.

ＬＥＤユニット４は、ＬＥＤ５、コンデンサ、トランジスタ等の電子部品が実装された器具本体１内に収納される円状の実装基板（プリント基板）である。そして、図示されていないが、器具本体１に設けられた接続部にコネクタ接続される接続部をＬＥＤユニット４の上面中央に備えている。   The LED unit 4 is a circular mounting board (printed board) that is housed in the instrument body 1 on which electronic components such as LEDs 5, capacitors, and transistors are mounted. And although not shown in figure, the connection part connected by the connector to the connection part provided in the instrument main body 1 is provided in the upper surface center of the LED unit 4. FIG.

ＬＥＤ５の前方にはレンズを含むレンズ体６が配置されている。このレンズ体６は、例えば絶縁性の樹脂成形により形成され、ＬＥＤ５の光を制御するためのレンズが各ＬＥＤ５に配置されている。   A lens body 6 including a lens is disposed in front of the LED 5. The lens body 6 is formed by, for example, insulating resin molding, and a lens for controlling the light of the LED 5 is disposed in each LED 5.

なお、レンズ体６及びＬＥＤユニット４は器具本体１内に着脱自在に収納されるようになっていてもよい。   The lens body 6 and the LED unit 4 may be detachably accommodated in the instrument body 1.

器具本体１の底部の裏面には、放熱フィン３が外周縁付近に平行状に設けられている。この放熱フィン３はアルミなどからなり、略矩形状に形成されている。なお、放熱フィン３が放射状に設けられていてもよい。   On the back surface of the bottom of the instrument main body 1, heat radiating fins 3 are provided in parallel near the outer periphery. The heat radiating fins 3 are made of aluminum or the like and are formed in a substantially rectangular shape. In addition, the radiation fin 3 may be provided radially.

電源装置２は中央に開口部を有するロの字形状であり、器具本体１の底部の裏面に設けられた取付穴７にネジ止め固定されている。この電源装置２は器具本体１の底部の裏面に設けられ、放熱フィン３よりも内側に位置し、放熱フィン３に囲まれている。   The power supply device 2 has a square shape having an opening in the center, and is fixed to a mounting hole 7 provided on the back surface of the bottom of the instrument body 1 with screws. The power supply device 2 is provided on the back surface of the bottom portion of the instrument body 1, is located on the inner side of the radiation fins 3, and is surrounded by the radiation fins 3.

能動的な対流を発生させる送風手段８は器具本体１の底部の裏面に設けられ、電源装置２の中央開口部の内側位置にある。電源装置２と同様に、器具本体１の底部の裏面に設けられた取付穴７にネジ止め固定されている。この送風手段８として、例えばファンなどがある。   The air blowing means 8 for generating active convection is provided on the back surface of the bottom of the instrument body 1 and is located inside the central opening of the power supply device 2. Similar to the power supply device 2, it is fixed to a mounting hole 7 provided on the back surface of the bottom of the instrument body 1 with screws. Examples of the air blowing means 8 include a fan.

この送風手段８が作動して対流を発生させると、図３に示すように、対流の向きは器具本体１の上側方向となる。また、図４に示すように、対流の向きを器具本体１の下側方向とすることもできる。これは、例えば送風手段８がファンである場合等に、対流の向きを上側方向にしたい場合は通常回転、対流の向きを下側方向にしたい場合は逆回転、とすることで実現する。   When the air blowing means 8 is activated to generate convection, the direction of convection is the upward direction of the instrument body 1 as shown in FIG. In addition, as shown in FIG. 4, the direction of convection can be the lower direction of the instrument body 1. For example, when the air blowing means 8 is a fan, this is realized by normal rotation when the convection direction is desired to be in the upward direction and reverse rotation when the convection direction is desired as the downward direction.

したがって、電源装置２が器具本体１によってＬＥＤユニット４と分離されていることで、ＬＥＤユニット４と電源装置２の熱が互いに殆ど伝わらないため、ＬＥＤユニット４と電源装置２の温度上昇を抑制できる。また、電源装置２の中央付近に開口部を設けることによって電源装置２の表面積が増大するため、放熱性が向上する。また、電源中央付近の開口部にファンを設けることによって能動的な上側方向の対流を発生させ、自然対流よりも流速が増し、器具全体の放熱が促進できる。また、下側方向の対流を発生させると、最も高温になる電源装置中央付近の器具本体１の底部の裏面に外部の冷たい空気を吹き付けることができるため、効率よく温度を低下させることができる。   Therefore, since the power supply device 2 is separated from the LED unit 4 by the fixture body 1, the heat of the LED unit 4 and the power supply device 2 is hardly transmitted to each other, so that the temperature rise of the LED unit 4 and the power supply device 2 can be suppressed. . Moreover, since the surface area of the power supply device 2 is increased by providing the opening near the center of the power supply device 2, heat dissipation is improved. In addition, by providing a fan in the opening near the center of the power source, active convection in the upward direction is generated, the flow velocity is increased compared to natural convection, and heat dissipation of the entire instrument can be promoted. Further, when convection in the lower direction is generated, the external cold air can be blown to the back surface of the bottom portion of the appliance body 1 near the center of the power supply device where the temperature is highest, so that the temperature can be efficiently lowered.

これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１をコンパクトにすることが可能となる。   Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 compact.

なお、図５に示すように、電源装置２の形状をコの字形状にしてもよい。この場合は、電源装置２の配線基板を形成する際、コの字形状とすることで互い違いに基板を配置させることができるので、単位面積当たりの取り数が増え、コストが低減できる。   In addition, as shown in FIG. 5, you may make the shape of the power supply device 2 into a U-shape. In this case, when forming the wiring board of the power supply device 2, it is possible to arrange the boards alternately by using a U-shape, so that the number of units per unit area increases and the cost can be reduced.

また、図６に示すように、電源装置２の形状をＬ字形状にしてもよい。この場合は、電源装置２の配線基板を形成する際、Ｌ字形状とすることでこの配線基板の取り数の自由度が増すため、コスト低減ができる。   Moreover, as shown in FIG. 6, you may make the shape of the power supply device 2 into L shape. In this case, when the wiring board of the power supply device 2 is formed, the L-shape increases the degree of freedom of the number of wiring boards to be taken, so that the cost can be reduced.

図７〜１１は、本願請求項２に対応した第二の実施形態であるＬＥＤ照明装置を示している。   FIGS. 7-11 has shown the LED illuminating device which is 2nd embodiment corresponding to this-application Claim 2. FIG.

なお、ここでは、上記第一の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第一の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the first embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the first embodiment, and the description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、ＬＥＤ５が光源として実装されたＬＥＤユニット４と、電源装置２と、前記ＬＥＤユニット４と前記電源装置２とが取り付けられた器具本体１と、を備えたＬＥＤ照明装置であって、ＬＥＤユニット４が器具本体１の底部の表面に取り付けられ、電源装置２が器具本体１の底部の裏面に取り付けられ、電源装置２の中央付近に開口部が設けられ、この開口部の内側位置にペルチェ素子９が設けられている。   The LED illumination device of this embodiment includes an LED unit 4 in which an LED 5 is mounted as a light source, a power supply device 2, and an appliance body 1 to which the LED unit 4 and the power supply device 2 are attached. The LED unit 4 is attached to the bottom surface of the appliance main body 1, the power supply device 2 is attached to the back of the bottom of the appliance main body 1, and an opening is provided near the center of the power supply device 2. A Peltier element 9 is provided at an inner position of the part.

本実施形態のＬＥＤ照明装置は、上記の第一の実施形態のＬＥＤ照明装置に設けられている送風手段８の代わりにペルチェ素子９を設けたものであり、その他の構成は第一の実施形態のＬＥＤ照明装置と同様である。   The LED lighting device of this embodiment is provided with a Peltier element 9 instead of the air blowing means 8 provided in the LED lighting device of the first embodiment, and other configurations are the first embodiment. This is the same as the LED lighting device.

このペルチェ素子９は器具本体１の底部の裏面に設けられ、電源装置２の中央開口部の内側位置にある。電源装置２と同様に、器具本体１の底部の裏面に設けられた取付穴７にネジ止め固定されている。   The Peltier element 9 is provided on the back surface of the bottom of the instrument body 1 and is located inside the central opening of the power supply device 2. Similar to the power supply device 2, it is fixed to a mounting hole 7 provided on the back surface of the bottom of the instrument body 1 with screws.

したがって、図９に示すように、電源中央付近の開口部にペルチェ素子９を設けることによって器具本体１の底部の裏面の温度を低下させることができる（図９に示す、Ｂ部分の温度が低下する）。また、器具本体１の底部の裏面を冷却すると同時に、熱が移動してペルチェ素子９自体が発熱し（図９に示す、Ａ部分が発熱する）、ペルチェ素子９の温度が周囲に比べて高温になることから、器具本体１側から上向きに流速の速い対流が発生し、器具全体の放熱を促進できる。これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１をコンパクトにすることが可能となる。   Therefore, as shown in FIG. 9, the temperature of the back surface of the bottom of the instrument body 1 can be lowered by providing the Peltier element 9 in the opening near the center of the power source (the temperature of the portion B shown in FIG. 9 is lowered). To do). Further, at the same time as the back surface of the bottom of the instrument body 1 is cooled, the heat moves and the Peltier element 9 itself generates heat (the portion A shown in FIG. 9 generates heat), and the temperature of the Peltier element 9 is higher than the surroundings. Therefore, convection with a high flow velocity is generated upward from the instrument body 1 side, and heat dissipation of the entire instrument can be promoted. Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 compact.

なお、図１０に示すように、電源装置２の形状をコの字形状にしてもよい。この場合は、電源装置２の配線基板を形成する際、コの字形状とすることで互い違いに基板を配置させることができるので、単位面積当たりの取り数が増え、コストが低減できる。   In addition, as shown in FIG. 10, you may make the shape of the power supply device 2 into a U-shape. In this case, when forming the wiring board of the power supply device 2, it is possible to arrange the boards alternately by using a U-shape, so that the number of units per unit area increases and the cost can be reduced.

また、図１１に示すように、電源装置２の形状をＬ字形状にしてもよい。この場合は、電源装置２の配線基板を形成する際、Ｌ字形状とすることでこの配線基板の取り数の自由度が増すため、コスト低減ができる。   Moreover, as shown in FIG. 11, the shape of the power supply device 2 may be L-shaped. In this case, when the wiring board of the power supply device 2 is formed, the L-shape increases the degree of freedom of the number of wiring boards to be taken, so that the cost can be reduced.

図１２、１３は、本願請求項１、３に対応した第三の実施形態であるＬＥＤ照明装置を示している。   12 and 13 show an LED illumination device according to a third embodiment corresponding to claims 1 and 3 of the present application.

なお、ここでは、上記第一の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第一の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the first embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the first embodiment, and the description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、器具本体１と電源装置２との間に隙間を設けている。   In the LED lighting device of the present embodiment, a gap is provided between the instrument main body 1 and the power supply device 2.

具体的には、器具本体１の底部の上方に、電源装置２を固定するための固定用リブ１１が設けられている。電源装置２はこの固定用リブ１１の上にネジ止め固定されている。これにより器具本体１と電源装置２との間の隙間が形成される。   Specifically, a fixing rib 11 for fixing the power supply device 2 is provided above the bottom of the instrument body 1. The power supply device 2 is fixed to the fixing rib 11 with screws. Thereby, the clearance gap between the instrument main body 1 and the power supply device 2 is formed.

したがって、電源装置２と器具本体１とは、大部分がネジ止めされた固定用リブ１１で接続されているだけであり、熱的には殆ど分離された状態であるので電源装置２の熱がＬＥＤ５の放熱を殆ど阻害しない。よって、器具本体１と放熱フィン３からＬＥＤ５の放熱が促進される。   Therefore, most of the power supply device 2 and the appliance main body 1 are connected by the fixing ribs 11 which are screwed to each other, and are almost separated from each other thermally, so that the heat of the power supply device 2 is reduced. It hardly inhibits the heat dissipation of LED5. Therefore, heat dissipation of the LED 5 from the instrument main body 1 and the radiation fin 3 is promoted.

また、図１３に示すように、前記の隙間を設けることによって、空気の対流の電源装置下方付近での抵抗が低減し、対流速度が増すため、電源装置２の放熱が促進される。   Further, as shown in FIG. 13, by providing the gap, the resistance of the air convection near the lower portion of the power supply device is reduced and the convection speed is increased, so that the heat dissipation of the power supply device 2 is promoted.

図１４、１５は、本願請求項１、３、４に対応した第四の実施形態であるＬＥＤ照明装置を示している。   14 and 15 show an LED lighting device according to a fourth embodiment corresponding to claims 1, 3, and 4 of the present application.

なお、ここでは、上記第一の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第一の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the first embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the first embodiment, and the description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、器具本体１と電源装置２との間に隙間を設けている。そして、器具本体１の板部の、電源装置２の開口部の内側位置に放熱孔１０を設けている。   In the LED lighting device of the present embodiment, a gap is provided between the instrument main body 1 and the power supply device 2. And the heat radiating hole 10 is provided in the board part of the instrument main body 1 in the position inside the opening part of the power supply device 2.

具体的には、器具本体１の底部の上方に、電源装置２を固定するための固定用リブ１１が設けられている。電源装置２はこの固定用リブ１１の上にネジ止め固定されている。これにより器具本体１と電源装置２との間の隙間が形成される。そして、送風手段８であるファンの下方に放熱孔１０が設けられている。また、放熱孔１０の下方にはＬＥＤユニット４及びＬＥＤ５及びレンズ体６は設けられていない。   Specifically, a fixing rib 11 for fixing the power supply device 2 is provided above the bottom of the instrument body 1. The power supply device 2 is fixed to the fixing rib 11 with screws. Thereby, the clearance gap between the instrument main body 1 and the power supply device 2 is formed. And the heat radiating hole 10 is provided under the fan which is the ventilation means 8. FIG. Further, the LED unit 4, the LED 5, and the lens body 6 are not provided below the heat radiation hole 10.

したがって、器具本体１に放熱孔１０を設けているので、図１５に示すように、放熱孔１０から電源装置２に空気が流れ込む。そして、放熱孔１０から電源装置２への到達距離が短いので、温度の低い空気が電源装置２に流れ込むこととなる。また、電源装置２と器具本体１とは、大部分がネジ止めされた固定用リブ１１で接続されているだけであり、熱的には殆ど分離された状態であるので電源装置２の熱がＬＥＤ５の放熱を殆ど阻害しない。よって、器具本体１と放熱フィン３からＬＥＤ５の放熱が促進される。また、前記の隙間を設けることによって、空気の対流の電源装置下方付近での抵抗が低減し、対流速度が増すため、電源装置２の放熱が促進される。これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１を更にコンパクトにすることが可能となる。   Therefore, since the heat radiating hole 10 is provided in the instrument body 1, air flows from the heat radiating hole 10 into the power supply device 2 as shown in FIG. And since the reach | attainment distance from the thermal radiation hole 10 to the power supply device 2 is short, air with low temperature will flow into the power supply device 2. FIG. In addition, the power supply device 2 and the instrument body 1 are mostly connected by fixing ribs 11 which are screwed to each other, and are almost separated thermally, so that the heat of the power supply device 2 is reduced. It hardly inhibits the heat dissipation of LED5. Therefore, heat dissipation of the LED 5 from the instrument main body 1 and the radiation fin 3 is promoted. Further, by providing the gap, the resistance of the air convection in the vicinity of the lower portion of the power supply device is reduced and the convection speed is increased, so that the heat dissipation of the power supply device 2 is promoted. Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 further compact.

図１６は、本願請求項１、４に対応した第五の実施形態であるＬＥＤ照明装置を示している。   FIG. 16 shows an LED lighting device according to a fifth embodiment corresponding to claims 1 and 4 of the present application.

なお、ここでは、上記第一の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第一の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the first embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the first embodiment, and the description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、器具本体１の板部の、電源装置２の開口部の内側位置に放熱孔１０を設けている。   The LED lighting device of the present embodiment is provided with a heat dissipation hole 10 at a position inside the opening of the power supply device 2 in the plate portion of the instrument main body 1.

具体的には、送風手段８であるファンの下方に放熱孔１０が設けられている。また、放熱孔１０の下方にはＬＥＤユニット４及びＬＥＤ５及びレンズ体６は設けられていない。   Specifically, a heat radiating hole 10 is provided below a fan that is the air blowing means 8. Further, the LED unit 4, the LED 5, and the lens body 6 are not provided below the heat radiation hole 10.

したがって、器具本体１に放熱孔１０を設けているので、図１６に示すように、放熱孔１０から電源装置２に空気が流れ込む。そして、放熱孔１０から電源装置２への到達距離が短いので、温度の低い空気が電源装置２に流れ込むこととなる。これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１を更にコンパクトにすることが可能となる。   Therefore, since the heat radiating hole 10 is provided in the instrument body 1, air flows from the heat radiating hole 10 into the power supply device 2 as shown in FIG. And since the reach | attainment distance from the thermal radiation hole 10 to the power supply device 2 is short, air with low temperature will flow into the power supply device 2. FIG. Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 further compact.

図１７は、本願請求項２、３に対応した第六の実施形態であるＬＥＤ照明装置を示している。   FIG. 17 shows an LED lighting device according to a sixth embodiment corresponding to claims 2 and 3 of the present application.

なお、ここでは、上記第二の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第二の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the second embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the second embodiment, and thus description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、電源装置２の開口部の内側位置にペルチェ素子９が設けられている。そして、器具本体１と電源装置２との間に隙間を設けている。   In the LED lighting device of the present embodiment, a Peltier element 9 is provided at an inner position of the opening of the power supply device 2. A gap is provided between the instrument body 1 and the power supply device 2.

具体的には、器具本体１の底部の上方に、電源装置２を固定するための固定用リブ１１が設けられている。電源装置２はこの固定用リブ１１の上にネジ止め固定されている。これにより器具本体１と電源装置２との間の隙間が形成される。   Specifically, a fixing rib 11 for fixing the power supply device 2 is provided above the bottom of the instrument body 1. The power supply device 2 is fixed to the fixing rib 11 with screws. Thereby, the clearance gap between the instrument main body 1 and the power supply device 2 is formed.

したがって、電源装置２と器具本体１とは、大部分がネジ止めされた固定用リブ１１で接続されているだけであり、熱的には殆ど分離された状態であるので電源装置２の熱がＬＥＤ５の放熱を殆ど阻害しない。よって、器具本体１と放熱フィン３からＬＥＤ５の放熱が促進される。   Therefore, most of the power supply device 2 and the appliance main body 1 are connected by the fixing ribs 11 which are screwed to each other, and are almost separated from each other thermally, so that the heat of the power supply device 2 is reduced. It hardly inhibits the heat dissipation of LED5. Therefore, heat dissipation of the LED 5 from the instrument main body 1 and the radiation fin 3 is promoted.

また、図１７に示すように、前記の隙間を設けることによって、空気の対流の電源装置下方付近での抵抗が低減し、対流速度が増すため、電源装置２の放熱が促進される。   In addition, as shown in FIG. 17, by providing the gap, the resistance of the air convection in the vicinity of the lower portion of the power supply device is reduced and the convection speed is increased, so that the heat dissipation of the power supply device 2 is promoted.

これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１を更にコンパクトにすることが可能となる。   Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 further compact.

図１８〜２０は、本願請求項２、４に対応した第七の実施形態であるＬＥＤ照明装置を示している。   FIGS. 18-20 has shown the LED illuminating device which is 7th embodiment corresponding to this-application Claim 2, 4. FIG.

なお、ここでは、上記第二の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第二の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the second embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the second embodiment, and thus description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、電源装置２の開口部の内側位置にペルチェ素子９が設けられている。そして、器具本体１の板部の、電源装置２の開口部の内側位置に放熱孔１０を設けている。   In the LED lighting device of the present embodiment, a Peltier element 9 is provided at an inner position of the opening of the power supply device 2. And the heat radiating hole 10 is provided in the board part of the instrument main body 1 in the inner position of the opening part of the power supply device 2. As shown in FIG.

具体的には、ペルチェ素子９の下方に放熱孔１０が設けられている。また、放熱孔１０の下方にはＬＥＤユニット４及びＬＥＤ５及びレンズ体６は設けられていない。そして、図１８、１９に示すように、ペルチェ素子９の一端及び他端には器具本体１の底部との間にそれぞれ取付治具１２が設けられている。この取付治具１２は、ペルチェ素子９のそれぞれの端部よりも、器具本体１との接触面積が大きい。よって、器具本体１から発生した熱が効率よくペルチェ素子９に伝わることとなる。なお、図２０に示すように、放熱孔１０に隣接するようにペルチェ素子９を設けてもよい。   Specifically, a heat radiating hole 10 is provided below the Peltier element 9. Further, the LED unit 4, the LED 5, and the lens body 6 are not provided below the heat radiation hole 10. Then, as shown in FIGS. 18 and 19, attachment jigs 12 are provided between one end and the other end of the Peltier element 9 and the bottom of the instrument body 1, respectively. The attachment jig 12 has a larger contact area with the instrument body 1 than each end of the Peltier element 9. Therefore, the heat generated from the instrument body 1 is efficiently transmitted to the Peltier element 9. As shown in FIG. 20, a Peltier element 9 may be provided so as to be adjacent to the heat dissipation hole 10.

したがって、器具本体１に放熱孔１０を設けているので、放熱孔１０から電源装置２に空気が流れ込む。そして、放熱孔１０から電源装置２への到達距離が短いので、温度の低い空気が電源装置２に流れ込むこととなる。これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１を更にコンパクトにすることが可能となる。   Therefore, since the heat radiating hole 10 is provided in the instrument main body 1, air flows from the heat radiating hole 10 into the power supply device 2. And since the reach | attainment distance from the thermal radiation hole 10 to the power supply device 2 is short, air with low temperature will flow into the power supply device 2. FIG. Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 further compact.

図２１は、本願請求項２、３、４に対応した第八の実施形態であるＬＥＤ照明装置を示している。   FIG. 21 shows an LED lighting device according to an eighth embodiment corresponding to claims 2, 3, and 4 of the present application.

なお、ここでは、上記第二の実施形態と相違する事項についてのみ説明し、その他の事項（構成、作用効果等）については、上記第二の実施形態と同様であるのでその説明を省略する。   Here, only matters different from those in the second embodiment will be described, and other matters (configuration, operational effects, and the like) are the same as those in the second embodiment, and thus description thereof will be omitted.

本実施形態のＬＥＤ照明装置は、電源装置２の開口部の内側位置にペルチェ素子９が設けられている。そして、器具本体１と電源装置２との間に隙間を設けている。そして、器具本体１の板部の、電源装置２の開口部の内側位置に放熱孔１０を設けている。   In the LED lighting device of the present embodiment, a Peltier element 9 is provided at an inner position of the opening of the power supply device 2. A gap is provided between the instrument body 1 and the power supply device 2. And the heat radiating hole 10 is provided in the board part of the instrument main body 1 in the position inside the opening part of the power supply device 2.

具体的には、器具本体１の底部の上方に、電源装置２を固定するための固定用リブ１１が設けられている。電源装置２はこの固定用リブ１１の上にネジ止め固定されている。これにより器具本体１と電源装置２との間の隙間が形成される。そして、ペルチェ素子９の下方に放熱孔１０が設けられている。また、放熱孔１０の下方にはＬＥＤユニット４及びＬＥＤ５及びレンズ体６は設けられていない。そして、ペルチェ素子９の一端及び他端には器具本体１の底部との間にそれぞれ取付治具１２が設けられている。この取付治具１２は、ペルチェ素子９のそれぞれの端部よりも、器具本体１との接触面積が大きい。よって、器具本体１から発生した熱が効率よくペルチェ素子９に伝わることとなる。なお、放熱孔１０に隣接するようにペルチェ素子９を設けてもよい。   Specifically, a fixing rib 11 for fixing the power supply device 2 is provided above the bottom of the instrument body 1. The power supply device 2 is fixed to the fixing rib 11 with screws. Thereby, the clearance gap between the instrument main body 1 and the power supply device 2 is formed. A heat dissipation hole 10 is provided below the Peltier element 9. Further, the LED unit 4, the LED 5, and the lens body 6 are not provided below the heat radiation hole 10. An attachment jig 12 is provided between one end and the other end of the Peltier element 9 and the bottom of the instrument body 1. The attachment jig 12 has a larger contact area with the instrument body 1 than each end of the Peltier element 9. Therefore, the heat generated from the instrument body 1 is efficiently transmitted to the Peltier element 9. Note that the Peltier element 9 may be provided so as to be adjacent to the heat radiation hole 10.

したがって、器具本体１に放熱孔１０を設けているので、図２１に示すように、放熱孔１０から電源装置２に空気が流れ込む。そして、放熱孔１０から電源装置２への到達距離が短いので、温度の低い空気が電源装置２に流れ込むこととなる。また、電源装置２と器具本体１とは、大部分がネジ止めされた固定用リブ１１で接続されているだけであり、熱的には殆ど分離された状態であるので電源装置２の熱がＬＥＤ５の放熱を殆ど阻害しない。よって、器具本体１と放熱フィン３からＬＥＤ５の放熱が促進される。また、前記の隙間を設けることによって、空気の対流の電源装置下方付近での抵抗が低減し、対流速度が増すため、電源装置２の放熱が促進される。これにより、ＬＥＤ５及び電源装置２の熱が効率よく放熱されるため、器具本体１を更にコンパクトにすることが可能となる。   Therefore, since the heat radiating hole 10 is provided in the instrument body 1, air flows from the heat radiating hole 10 into the power supply device 2 as shown in FIG. And since the reach | attainment distance from the thermal radiation hole 10 to the power supply device 2 is short, air with low temperature will flow into the power supply device 2. FIG. In addition, the power supply device 2 and the instrument body 1 are mostly connected by fixing ribs 11 which are screwed to each other, and are almost separated thermally, so that the heat of the power supply device 2 is reduced. It hardly inhibits the heat dissipation of LED5. Therefore, heat dissipation of the LED 5 from the instrument main body 1 and the radiation fin 3 is promoted. Further, by providing the gap, the resistance of the air convection in the vicinity of the lower portion of the power supply device is reduced and the convection speed is increased, so that the heat dissipation of the power supply device 2 is promoted. Thereby, since the heat | fever of LED5 and the power supply device 2 is thermally radiated efficiently, it becomes possible to make the instrument main body 1 further compact.

本願発明の第一の実施形態であるＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus which is 1st embodiment of this invention. 同ＬＥＤ照明装置を示す図１でのＡ−Ａ’断面図。The A-A 'sectional view in Drawing 1 showing the LED lighting device. 同ＬＥＤ照明装置における空気の対流の動きを示す図１でのＡ−Ａ’断面図。FIG. 2 is a cross-sectional view taken along line A-A ′ in FIG. 1, showing air convection movement in the LED lighting device. 同ＬＥＤ照明装置における空気の対流の動きを示す図１でのＡ−Ａ’断面図。FIG. 2 is a cross-sectional view taken along line A-A ′ in FIG. 1, showing air convection movement in the LED lighting device. 電源装置がコの字形状である同ＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus whose power supply device is U-shaped. 電源装置がＬ字形状である同ＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting device whose power supply device is L-shaped. 本願発明の第二の実施形態であるＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus which is 2nd embodiment of this invention. 同ＬＥＤ照明装置を示す図７でのＡ−Ａ’断面図。The A-A 'sectional view in Drawing 7 showing the LED lighting device. 同ＬＥＤ照明装置における空気の対流の動きを示す図７でのＡ−Ａ’断面図。FIG. 8 is a cross-sectional view taken along the line A-A ′ in FIG. 電源装置がコの字形状である同ＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus whose power supply device is U-shaped. 電源装置がＬ字形状である同ＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting device whose power supply device is L-shaped. 本願発明の第三の実施形態であるＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus which is 3rd embodiment of this invention. 同ＬＥＤ照明装置における空気の対流の動きを示す断面図。Sectional drawing which shows the motion of the air convection in the LED lighting apparatus. 本願発明の第四の実施形態であるＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus which is 4th embodiment of this invention. 同ＬＥＤ照明装置における空気の対流の動きを示す断面図。Sectional drawing which shows the motion of the air convection in the LED lighting apparatus. 本願発明の第五の実施形態であるＬＥＤ照明装置を示す断面図。Sectional drawing which shows the LED lighting apparatus which is 5th embodiment of this invention. 本願発明の第六の実施形態であるＬＥＤ照明装置を示す断面図。Sectional drawing which shows the LED lighting apparatus which is 6th embodiment of this invention. 本願発明の第七の実施形態であるＬＥＤ照明装置を示す断面図。Sectional drawing which shows the LED lighting apparatus which is 7th embodiment of this invention. 同ＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus. 電源装置が放熱孔の隣に位置している同ＬＥＤ照明装置を示す斜視図。The perspective view which shows the LED lighting apparatus with which a power supply device is located next to a thermal radiation hole. 本願発明の第八の実施形態であるＬＥＤ照明装置を示す断面図。Sectional drawing which shows the LED illuminating device which is 8th embodiment of this invention. 従来例であるＬＥＤ照明装置を示す断面図。Sectional drawing which shows the LED lighting apparatus which is a prior art example.

符号の説明Explanation of symbols

１ 器具本体
２ 電源装置
３ 放熱フィン
４ ＬＥＤユニット
５ ＬＥＤ
６ レンズ体
７ 取付穴
８ 送風手段
９ ペルチェ素子
１０ 放熱孔
１１ 固定用リブ
１２ 取付治具 DESCRIPTION OF SYMBOLS 1 Instrument body 2 Power supply device 3 Radiation fin 4 LED unit 5 LED
6 Lens body 7 Mounting hole 8 Air blowing means 9 Peltier element 10 Heat radiation hole 11 Fixing rib 12 Mounting jig

Claims (4)

ＬＥＤが光源として実装されたＬＥＤユニットと、電源装置と、前記ＬＥＤユニットと前記電源装置とが取り付けられた器具本体と、を備えたＬＥＤ照明装置であって、ＬＥＤユニットが器具本体の板部の表面に取り付けられ、電源装置が器具本体の板部の裏面に取り付けられ、電源装置の中央付近に開口部が設けられ、この開口部の内側位置に送風手段が設けられたことを特徴とするＬＥＤ照明装置。   An LED lighting device comprising: an LED unit in which an LED is mounted as a light source; a power supply device; and an appliance main body to which the LED unit and the power supply device are attached. LED which is attached to the front surface, the power supply device is attached to the back surface of the plate portion of the instrument body, an opening is provided in the vicinity of the center of the power supply device, and an air blowing means is provided inside the opening. Lighting device. ＬＥＤが光源として実装されたＬＥＤユニットと、電源装置と、前記ＬＥＤユニットと前記電源装置とが取り付けられた器具本体と、を備えたＬＥＤ照明装置であって、ＬＥＤユニットが器具本体の板部の表面に取り付けられ、電源装置が器具本体の板部の裏面に取り付けられ、電源装置の中央付近に開口部が設けられ、この開口部の内側位置にペルチェ素子が設けられたことを特徴とするＬＥＤ照明装置。   An LED lighting device comprising: an LED unit in which an LED is mounted as a light source; a power supply device; and an appliance main body to which the LED unit and the power supply device are attached. LED which is attached to the front surface, the power supply device is attached to the back surface of the plate portion of the instrument body, an opening is provided near the center of the power supply device, and a Peltier element is provided at an inner position of the opening Lighting device. 器具本体と電源装置との間に隙間を設けたことを特徴とする請求項１又は２記載のＬＥＤ照明装置。   The LED lighting device according to claim 1, wherein a gap is provided between the appliance main body and the power supply device. 器具本体の板部の、電源装置の開口部の内側位置に放熱孔を設けたことを特徴とする請求項１〜３のいずれか１項記載のＬＥＤ照明装置。   The LED illumination device according to any one of claims 1 to 3, wherein a heat radiating hole is provided at a position inside the opening of the power supply device in the plate portion of the appliance main body.
JP2006284722A 2006-10-19 2006-10-19 LED lighting device Expired - Fee Related JP4640313B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006284722A JP4640313B2 (en) 2006-10-19 2006-10-19 LED lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006284722A JP4640313B2 (en) 2006-10-19 2006-10-19 LED lighting device

Publications (2)

Publication Number Publication Date
JP2008103195A JP2008103195A (en) 2008-05-01
JP4640313B2 true JP4640313B2 (en) 2011-03-02

Family

ID=39437372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006284722A Expired - Fee Related JP4640313B2 (en) 2006-10-19 2006-10-19 LED lighting device

Country Status (1)

Country Link
JP (1) JP4640313B2 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413536B (en) * 2008-06-02 2013-11-01 Advanced Optoelectronic Tech Photocatalyst lamp module
JP5222644B2 (en) * 2008-07-16 2013-06-26 高砂熱学工業株式会社 Lighting device
EP2154419B1 (en) 2008-07-31 2016-07-06 Toshiba Lighting & Technology Corporation Self-ballasted lamp
JP5062433B2 (en) * 2008-10-30 2012-10-31 東芝ライテック株式会社 Light bulb shaped lamp
JP5320548B2 (en) * 2008-10-24 2013-10-23 東芝ライテック株式会社 Lighting device
JP5028466B2 (en) * 2008-11-27 2012-09-19 サムソン エルイーディー カンパニーリミテッド． Car headlights
CN101858505B (en) * 2009-04-13 2013-04-24 富准精密工业(深圳)有限公司 Light-emitting diode (LED) lamp
US20100301728A1 (en) * 2009-06-02 2010-12-02 Bridgelux, Inc. Light source having a refractive element
KR101055771B1 (en) 2009-06-30 2011-08-11 서울반도체 주식회사 Convection Cooled LED Module
JP5417085B2 (en) * 2009-08-24 2014-02-12 スタンレー電気株式会社 LED lighting device
KR100970747B1 (en) * 2009-12-24 2010-07-16 쎄딕(주) Bending type heat sink
JP5166580B2 (en) * 2010-08-06 2013-03-21 ポスコ アイシーティ カンパニー リミテッド Optical semiconductor lighting device
KR101248731B1 (en) 2010-08-06 2013-04-03 주식회사 포스코아이씨티 Lighting apparatus having optic-semiconductor
CN104748095A (en) * 2010-08-06 2015-07-01 普司科Ict股份有限公司 Optical semiconductor lighting apparatus
JP5097254B2 (en) * 2010-09-29 2012-12-12 建準電機工業股▲分▼有限公司 Lamp
JP2012164512A (en) * 2011-02-07 2012-08-30 Jvc Kenwood Corp Light source device
JP2012226959A (en) * 2011-04-19 2012-11-15 Panasonic Corp Lighting fixture
JP2012226960A (en) * 2011-04-19 2012-11-15 Panasonic Corp Lighting fixture
US9476581B2 (en) 2011-05-18 2016-10-25 Nanker (Guang Zhou) Semiconductor Manufacturing Corp. Dustproof and waterproof multipurpose LED-light power source assembly and dustproof and waterproof LED light
JP6057543B2 (en) * 2011-05-23 2017-01-11 エルジー イノテック カンパニー リミテッド Lighting device
US8529099B2 (en) * 2011-08-25 2013-09-10 Tai-Her Yang Heat dissipating lamp device having electric turbine axial fan
JP5950630B2 (en) * 2012-03-08 2016-07-13 オスラム ゲーエムベーハーＯＳＲＡＭ ＧｍｂＨ LED light source module for headlight
JP5940372B2 (en) * 2012-05-21 2016-06-29 シャープ株式会社 Lighting device
AU2012385007B2 (en) 2012-07-10 2015-05-07 Posco Led Company Ltd. Optical semiconductor illumination device
JP6061638B2 (en) * 2012-11-20 2017-01-18 株式会社小糸製作所 Vehicle lighting
CN103836430B (en) * 2012-11-23 2016-12-21 展晶科技(深圳)有限公司 Illuminator
JP5370608B2 (en) * 2013-04-23 2013-12-18 東芝ライテック株式会社 lamp
JP5387933B2 (en) * 2013-07-22 2014-01-15 東芝ライテック株式会社 lamp
FR3064049B1 (en) * 2017-03-16 2021-07-09 Valeo Vision OPTICAL MODULE INCLUDING A RADIATOR EQUIPPED WITH A VENT
JP6967666B2 (en) 2017-10-13 2021-11-17 シグニファイ ホールディング ビー ヴィSignify Holding B.V. Ceiling element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110731U (en) * 1990-02-27 1991-11-13
JPH03125067U (en) * 1990-03-30 1991-12-18
JP2006253274A (en) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd Light source of display apparatus
JP2008098020A (en) * 2006-10-13 2008-04-24 Matsushita Electric Works Ltd Led lighting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110731U (en) * 1990-02-27 1991-11-13
JPH03125067U (en) * 1990-03-30 1991-12-18
JP2006253274A (en) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd Light source of display apparatus
JP2008098020A (en) * 2006-10-13 2008-04-24 Matsushita Electric Works Ltd Led lighting device

Also Published As

Publication number Publication date
JP2008103195A (en) 2008-05-01

Similar Documents

Publication Publication Date Title
JP4640313B2 (en) LED lighting device
JP2008098020A (en) Led lighting device
JP4797970B2 (en) LED lighting device
US8692444B2 (en) Solid state low bay light with integrated and sealed thermal management
US7637635B2 (en) LED lamp with a heat sink
JP6021863B2 (en) Electrical equipment
JP4853278B2 (en) Lighting device
JP4775267B2 (en) Lighting device
JP5218747B2 (en) Lighting device
JP2004127782A (en) Vehicle lamp and lighting device
JP2008130397A (en) Lighting system
JP5940372B2 (en) Lighting device
JP5789164B2 (en) Lighting device
JP6708308B2 (en) Lighting device and connected lighting device
JP2008210593A (en) Illuminating device
JP6061220B2 (en) LED lighting device
JP2017199596A (en) Lighting device
JP5390781B2 (en) Light source cooling device
JP2009283406A (en) Vehicular headlamp device
JP6700978B2 (en) Power converter
CN110914592B (en) Lighting device
JP6282966B2 (en) Motor control unit
JP2008147299A (en) Cooling structure for heating body in electronic apparatus
JP6566347B2 (en) Lighting device
JP6275234B2 (en) LED lighting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090624

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101008

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101102

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101115

R151 Written notification of patent or utility model registration

Ref document number: 4640313

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131210

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees