CN112739158A

CN112739158A - Terminal equipment and heat dissipation device thereof

Info

Publication number: CN112739158A
Application number: CN202011513698.9A
Authority: CN
Inventors: 吴迪; 戈云飞; 曾科
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-12-17
Filing date: 2020-12-17
Publication date: 2021-04-30

Abstract

The application provides a terminal equipment, include the shell, be equipped with main control board in the shell to and heat abstractor, heat abstractor include the heat conduction base and connect in the radiator unit of heat conduction base, heat abstractor's heat conduction base set up in the shell, the heat conduction face of heat conduction base exposes the shell outward, heat abstractor's radiator unit accept in the inner chamber of shell, radiator unit contact terminal equipment's electron device, the heat warp that electron device produced radiator unit conducts extremely the heat conduction base. Not only effectively promoted terminal equipment's heat-sinking capability, and reduced and transmitted to heat on the shell to reduce the surface temperature of the shell of art, improve user experience. The application also provides a heat dissipation device.

Description

Terminal equipment and heat dissipation device thereof

Technical Field

The application relates to the field of heat dissipation of terminal equipment, in particular to a heat dissipation device and terminal equipment with the same.

Background

With the popularization of the 5G technology, terminal devices such as routers are continuously upgraded in the directions of high performance, integration, and lightness, so that the heat productivity of the terminal devices is greatly increased. The existing terminal equipment generally comprises two heat dissipation modes, namely natural heat dissipation and air cooling heat dissipation, wherein the natural heat dissipation means that a plurality of air inlet holes and a plurality of heat dissipation holes are respectively arranged at the bottom and the top of the terminal equipment, and by utilizing a chimney effect, external cold air enters an inner cavity of the terminal equipment from the air inlet holes of the terminal equipment to discharge heat generated by an electronic device through the heat dissipation holes at the top, namely the heat inside the terminal equipment is taken out to the external environment through heat conduction, heat radiation and heat convection. The air cooling heat dissipation means that a fan is arranged in an inner cavity of the terminal equipment, and the rotation of the fan drives the airflow in the inner cavity of the terminal equipment to flow, so that the air flow inside and outside the terminal equipment is accelerated to dissipate heat. However, the natural heat dissipation mode can make the heat inside the terminal device easily gather at the top, resulting in higher temperature at the top of the terminal device, and the probability that the top of the terminal device is contacted by the user is higher, thereby causing the user to feel hot and affecting the user experience.

Disclosure of Invention

An object of this application is to provide a heat abstractor and is equipped with heat abstractor's terminal equipment, heat abstractor can reduce terminal equipment's shell surface's temperature, promotes user experience.

In order to solve the technical problem, the present application provides a heat dissipation apparatus for radiating heat for a terminal device, the heat dissipation apparatus includes a heat conduction base and a heat dissipation assembly connected to the heat conduction base, the heat conduction base includes a heat conduction substrate, the heat conduction substrate has a heat conduction surface deviating from the heat dissipation assembly, the heat dissipation assembly contacts an electronic device of the terminal device, the heat conduction surface of the heat conduction substrate is used for being attached to a supporting table or a supporting surface, and heat generated by the electronic device is conducted to the supporting table or the supporting surface through the heat dissipation assembly and the heat conduction substrate.

The application also provides a terminal device, including the shell, be equipped with main control board in the shell to and heat abstractor, heat abstractor include the heat conduction base and connect in the radiator unit of heat conduction base, heat abstractor's heat conduction base set up in the shell, the heat conduction face of heat conduction base exposes the shell, radiator unit's radiator unit accept in the inner chamber of shell, radiator unit contacts terminal device's electron device, the heat warp that electron device produced radiator unit conducts extremely the heat conduction base.

This application terminal equipment's heat abstractor includes heat conduction base and radiator unit, terminal equipment's main control board and electron device contact radiator unit, radiator unit connect in the heat conduction base, the heat conduction base is including the heat conduction base plate that has the heat conduction face, just radiator unit accept in the inner chamber of shell, the heat conduction face exposes outward the shell. When the terminal equipment works, most of heat generated by the main control board and the electronic devices on the main control board is conducted to the heat conducting base through the heat radiating assembly and then conducted to the supporting table or the supporting surface through the heat conducting surface. The heat dissipation capacity of the terminal equipment is effectively improved, and the heat transferred to the shell is reduced, so that the surface temperature of the shell is reduced, namely the temperature of the contact surface of the shell is reduced, and the user experience is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a terminal device in a first embodiment of the present application;

fig. 2 is an exploded perspective view of the housing and the heat sink of the terminal device in fig. 1;

fig. 3 is a schematic perspective view of another perspective view of the terminal device in fig. 1;

FIG. 4 is a further exploded perspective view of the terminal device of FIG. 2;

FIG. 5 is a further exploded perspective view of the terminal device of FIG. 3;

fig. 6 is a perspective sectional view of the terminal device in fig. 1;

FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. 1;

fig. 8 is a reference diagram of one of the use states of the terminal device in fig. 1;

FIG. 9 is a cross-sectional view taken along line VII-VII of FIG. 8;

fig. 10 is another use state reference diagram of the terminal device in fig. 1;

fig. 11 is a schematic structural diagram of a terminal device in a second embodiment of the present application;

fig. 12 is a schematic structural diagram of a terminal device in the third embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

In addition, the following description of the various embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. Directional phrases used in this application, such as, for example, "upper," "inner," "outer," "side," etc., refer only to the orientation of the appended drawings and, therefore, are used in a better and clearer sense to describe and understand the present application and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and, therefore, should not be considered limiting of the present application.

In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed at … …" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1 to 3, a terminal device 100 in a first embodiment of the present application includes a housing 20, a main control board 30 disposed in the housing 20, and a heat dissipation device 50 for dissipating heat from the terminal device 100, wherein the housing 20 has an accommodating space 201, and the main control board 30 and the heat dissipation device 50 are accommodated in the inner cavity 201. Specifically, the heat dissipation device 50 includes a heat conductive base 52 and a heat dissipation assembly 55 connected to the heat conductive base 52, wherein the heat conductive base 52 includes a heat conductive substrate 523, and the heat conductive substrate 523 has a heat conductive surface 5233 facing away from the heat dissipation assembly 55. The main control board 30 contacts the heat dissipation assembly 55, the electronic device on the main control board 30 contacts the heat dissipation assembly 55, the heat conductive base 52 is disposed on the housing 20, and the heat conductive surface 5233 of the heat conductive substrate 523 is exposed out of the housing 20. The heat dissipation assembly 55 is accommodated in the inner cavity 201 of the housing 20, when the terminal device 100 is placed on a supporting platform or a supporting surface, the heat conduction surface 5233 of the heat conduction substrate 523 is attached to the supporting platform or the supporting surface, and most of heat generated by the main control board 30 and the electronic devices thereon is conducted to the supporting platform or the supporting surface through the heat dissipation assembly 55 and the heat conduction substrate 523.

When the terminal device 100 is used, the terminal device 100 is placed on a support stand or mounted on a support surface such as a wall surface, and the heat-conducting surface 5233 of the heat-conducting base 52 is attached to the support stand or the support surface. Most of the heat generated by the terminal device 100 during operation is conducted to the heat conducting base 52 through the heat dissipating assembly 55, and then conducted to the supporting platform or the supporting surface through the heat conducting surface 5233 by the heat conducting base 52.

The terminal device 100 in the present application may be, but is not limited to, a router, a stereo, a camera, or the like. The terminal device 100 in this embodiment is a Customer Premises Equipment (CPE).

The main control board 30 and the electronic device of the terminal device 100 of the present application contact the heat radiation assembly 55, the heat radiation assembly 55 connect in the heat conduction base 52, the heat conduction base 52 includes the heat conduction substrate 523 with the heat conduction surface 5233, just the heat radiation assembly 55 accept in the inner cavity 201 of the shell 20, the heat conduction surface 5233 is exposed out of the shell 20. When the terminal device 100 is in operation, most of the heat generated by the main control board 30 and the electronic devices thereon is conducted to the heat conducting base 52 through the heat dissipating assembly 55, and then conducted to the supporting platform or the supporting surface through the heat conducting surface 5233. The heat dissipation capacity of the terminal device 100 is effectively improved, and the heat transferred to the housing 20 is reduced, so that the surface temperature of the housing 20 is reduced, that is, the temperature of the contact surface of the housing 20 is reduced, and the user experience is improved.

The term "connected" in the description of the embodiments of the present application includes both direct connection and indirect connection, for example, a connection between a and B includes a direct connection between a and B or a connection between a third element C or more and other elements. The connection also includes both the case of integral connection and the case of non-integral connection, the integral connection means that A and B are integrally formed and connected, and the non-integral connection means that A and B are non-integrally formed and connected. It is to be understood that unless defined by means of modifiers, prefixes, suffixes, or the like, reference to "coupled" in the embodiments of the present application is to be interpreted to include, but not limited to, fixed couplings, rotational couplings, sliding couplings, pivotal couplings, threaded couplings, movable couplings, interference couplings, frictional couplings, elastic couplings, rigid couplings, adhesive couplings, and the like. It will be understood that the embodiments of the present application are not limited to two elements being directly secured, but may be secured by a third party element or more.

Referring to fig. 4 and 5, the housing 20 includes a casing 22 and a cover plate 24 disposed on the top of the casing 22, and the heat conducting base 52 is disposed on the bottom end of the casing 22, specifically, the heat conducting surface 5233 is exposed out of the bottom end of the casing 22. The top of the housing 20 is provided with a plurality of heat dissipation holes 220, and the heat dissipation holes 220 are communicated with the inner cavity 201 of the housing 20. The heat conducting base 52 is provided with a plurality of air inlet holes 520, and the air inlet holes 520 are communicated with the inner cavity 201 of the shell 20. Specifically, the housing 22 includes a top plate 222 and an outer peripheral wall 224 surrounding the top plate 222, the top plate 222 and the outer peripheral wall 224 surround the inner cavity 201, and a plurality of heat dissipation holes 220 are formed in the top plate 222. Preferably, the plurality of heat dissipation holes 220 are arranged near the edge of the top plate 222 and along the circumference of the top plate 222. An accommodating space 223 is formed at one end of the top plate 222, which is away from the inner cavity 201, the cover plate 24 is accommodated in the accommodating space 223, and the plurality of heat dissipation holes 220 are communicated with the accommodating space. When the cover plate 24 is accommodated in the accommodating space 223, a gap is formed between the cover plate 24 and the inner circumferential surface of the accommodating space 223, and a gap is formed between the cover plate 24 and the top plate 222, so as to prevent the cover plate 24 from sealing the heat dissipation hole 220. Heat in the inner cavity 201 is dissipated through the heat dissipation holes 202, the space between the cover plate 24 and the top plate 222, and the gap between the cover plate 24 and the inner circumferential surface of the accommodating space 223, and the cover plate 24 can reduce impurities such as external dust from entering the inner cavity 201 through the heat dissipation holes 220; meanwhile, the cover plate 24 can prevent the appearance and the ID design of the terminal device 100 from being influenced by the fact that the heat dissipation holes 220 are shielded by the heat dissipation holes 220, and the comprehensive competitiveness of the product can be improved.

A support strip 225 is disposed between the cover plate 24 and the top plate 222, and the support strip 225 forms a space between the cover plate 24 and the top plate 222. In this embodiment, the supporting strip 225 surrounds a circle along the circumferential direction of the top plate 222, so that the supporting strip 225 and the outer circumferential wall 224 surround to form an air outlet groove 226, the plurality of heat dissipation holes 220 are arranged along the air outlet groove 226, and each heat dissipation hole 220 is communicated with the air outlet groove 226 and the inner cavity 201.

The cover plate 24 and the top plate 222 can be connected by clamping, gluing or screwing, in this embodiment, the cover plate 24 and the top plate 222 are clamped. Specifically, the top plate 222 is provided with a plurality of fastening holes 227, the cover plate 24 is provided with a plurality of hooks 242, and the hooks 242 are detachably fastened in the fastening holes 227 respectively.

In other embodiments, the fastening holes may be formed on the cover plate 24, and the hooks may be disposed on the top plate 222.

In this embodiment, the housing 22 is a rectangular frame, that is, the top plate 222 is a rectangular plate, the outer peripheral wall 224 is a rectangular cylinder surrounding the rectangular plate, the receiving space 223 is a rectangular groove, and the cover plate 24 is a rectangular cover. In other embodiments, the case 22 may be a cylindrical case, a kidney-shaped case, a polygonal case, or the like, the housing space 223 may be a circular frame, an elliptical frame, a polygonal frame, or the like, and the cover plate 24 may be a circular frame, an elliptical frame, a polygonal frame, or the like. That is, the housing 22, the housing space 223, and the cover plate 24 may be designed to have corresponding shapes as needed.

Referring to fig. 1 to 6, the heat conductive base 52 further includes a heat conductive bottom plate 521, the heat conductive bottom plate 521 includes a top surface 5211 and a bottom surface 5213, and the heat conductive substrate 523 further includes a top surface 5231 facing away from the heat conductive surface 5233. The heat dissipation assembly 55 is connected to the top surface 5211 of the heat conductive base plate 521, the top surface 5231 of the heat conductive substrate 523 is attached to the bottom surface 5213 of the heat conductive base plate 521, and heat on the heat dissipation assembly 55 is conducted to the heat conductive substrate 523 through the heat conductive base plate 521. The air inlet holes 520 are formed in the top surface 5211 of the heat conductive bottom plate 521 and penetrate through the bottom surface 5213 of the heat conductive bottom plate 521. The area of the top surface 5231 of the heat conducting substrate 523 is smaller than the area of the bottom surface 5213 of the heat conducting bottom plate 521, and when the top surface 5231 of the heat conducting substrate 523 is attached to the bottom surface 5213 of the heat conducting bottom plate 521, a plurality of the air inlet holes 520 are exposed, that is, a plurality of the air inlet holes 520 are located around the heat conducting substrate 523. In this embodiment, in the rectangular plate of the heat conducting bottom plate 521, the air inlet holes 520 are close to the edge of the heat conducting bottom plate 521 and are arranged along the circumference of the heat conducting bottom plate 521, that is, the air inlet holes 520 are respectively located at four sides of the heat conducting bottom plate 521. The heat conducting substrate 523 is a rectangular plate, and the area of the top surface 5231 of the heat conducting substrate 523 is slightly smaller than or equal to the area of the area surrounded by the air inlet holes 520. Preferably, the area of the top surface 5231 of the heat conducting substrate 523 is equal to the area of the area surrounded by the air inlet holes 520, so that the contact area between the heat conducting substrate 523 and the heat conducting base plate 521 is maximized, that is, the heat conducting area between the heat conducting base plate 521 and the heat conducting substrate 523 is increased, and the heat conducting efficiency is improved.

In other embodiments, the heat conductive base plate 521 may be designed as a circular plate, a waist plate, a polygonal plate, etc. according to the shape of the inner cavity 201 of the housing 22; the heat conductive substrate 523 may be designed as a circular plate, a waist-shaped plate, a polygonal plate, or the like. The heat conductive substrate 523 may be designed to have a corresponding shape as needed.

In other embodiments, the area of the heat-conducting surface 5233 of the heat-conducting substrate 523 is larger than that of the top surface 5231, so as to increase the contact area of the heat-conducting substrate 523 and the supporting platform or the supporting surface, i.e., increase the heat-conducting area between the heat-conducting substrate 523 and the supporting platform or the supporting surface, and improve the heat-conducting efficiency.

In other embodiments, the heat conductive substrate 523 and the heat conductive bottom plate 521 may be integrally formed. Optionally, the heat conducting base 52 is made of a heat conducting material with compressibility, so that a slight gap between the heat conducting base 52 and the supporting surface can be filled to reduce the heat transfer resistance between the heat conducting base 52 and the supporting surface. Specifically, the heat conducting substrate 523 is made of a heat conducting material with a compression rate of less than or equal to 10% at 100 Pounds force Per Square Inch (PSI), so that a minute gap between the heat conducting surface 5233 of the heat conducting substrate 523 and the supporting surface is filled with the heat conducting substrate 523, and heat transfer resistance from the heat conducting substrate 523 to the supporting surface is reduced, thereby improving heat dissipation efficiency. The 100PSI is approximately equal to 6.8 standard atmospheres.

Optionally, the heat conducting base 52 has a high tensile strength, that is, the tensile strength of the heat conducting base 52 is greater than or equal to 1.5Mpa (that is, δ is greater than or equal to 1.5Mpa), which can meet frequent disassembly and abrasion, so that the heat conducting substrate 523 is suitable for frequent disassembly and abrasion. The tensile strength refers to the stress at which the material undergoes maximum uniform plastic deformation.

Optionally, the thermal conductivity of the thermal conductive base 52 is greater than or equal to 0.3W/Mk, so that the thermal conductivity between the thermal conductive base 52 and the supporting table or the supporting surface can be improved, and the heat dissipation capability of the terminal device 100 can be enhanced. Specifically, the thermal conductivity of the thermal conductive substrate 523 and the thermal conductive bottom plate 521 is greater than or equal to 0.3W/Mk. The heat conductivity coefficient refers to the heat transferred by a 1-square-meter area within a certain time by a material with the thickness of 1m and the temperature difference of the two side surfaces of 1 degree under the condition of stable heat transfer.

Optionally, the heat conducting base 52 has good high temperature resistance, and specifically, the heat conducting base 52 has a temperature resistance range of-40 ℃ to 250 ℃. Specifically, the temperature resistance ranges of the heat conducting substrate 523 and the heat conducting bottom plate 521 are-40 ℃ to 250 ℃.

Optionally, the heat conducting base 52 may be, but is not limited to, a hard silicone gasket, a rubber gasket, leather, or the like. The heat conducting base 52 has a certain sweat resistance, and the heat conducting base 52 serves as a bottom case of the terminal device 100, so that the touch feeling of the product can be increased, and the appearance of the product can be improved.

In other embodiments, the heat conducting base 52 may also be made of a high strength material with heat conducting and energy storing functions, so that the heat conducting base 52 has heat conducting and energy storing effects simultaneously.

Optionally, the heat conducting substrate 523 may be, but not limited to, a composite material made of a temperature-equalizing material such as copper foil, aluminum foil, graphite, and the like, so that the heat conducting substrate 523 not only can rapidly conduct heat to the supporting stage, but also can simultaneously equalize the temperature of the whole heat conducting substrate 523.

The main control board 30 includes a circuit board 32 and an electronic device 34 disposed on the circuit board 32.

The heat dissipation assembly 55 includes at least a first heat sink 551, the first heat sink 551 is connected between the electronic device 34 and the circuit board 32 and the heat conductive base 52. Heat generated by the electronic device 34 and the circuit board 32 is conducted to the thermally conductive base 52 through the first heat sink 551. The first heat sink 551 may be directly connected between the circuit board 32 and/or the electronic device 34 and the thermally conductive base 52; the first heat sink 551 may also be indirectly connected between the circuit board 32 and/or the electronic device 34 and the thermally conductive base 52. In this embodiment, the heat dissipation assembly 55 includes two first heat sinks 551, the circuit board 32 is sandwiched between the two first heat sinks 551, and the first heat sinks 551 are connected to the heat conductive base 52 through heat pipes.

Specifically, each first heat sink 551 includes a bottom plate 5511 and a plurality of fins 5513 disposed on the bottom plate 5511, the bottom plate 5511 includes a first contact surface 5514, and the plurality of fins 5513 are disposed on a side of the bottom plate 5511 facing away from the first contact surface 5514. The first heat sink 551 is provided with an accommodating groove 5515, specifically, the accommodating groove 5515 is provided on the first contact surface 5514, and one end of the accommodating groove 5515 penetrates through an end surface of the bottom plate 5511. The first contact surface 5514 is provided with a plurality of connecting columns 5516, and each connecting column 5516 is axially provided with a connecting hole 5517. In this embodiment, the main control board 30 is rectangular, the bottom board 5511 is a rectangular board, and connection posts 5516 are respectively disposed at four corners of the first contact surface 5514.

In other embodiments, the shape of the bottom plate 5511 may be designed according to the shape of the main control board 30, that is, if the main control board 30 is oval, polygonal, or circular, the shape of the bottom plate 5511 is oval, polygonal, or circular.

The heat dissipation assembly 55 further includes at least one heat pipe 553, the heat pipe 553 is connected between the electronic device 34, the first heat sink 551 and the heat conductive base 52, and one end of the heat pipe 553 is received in the receiving slot 5515 of the heat conductive base 52. In this embodiment, the heat dissipation assembly 55 includes two heat pipes 553, and one end of each of the two heat pipes 553 is respectively accommodated in the accommodating grooves 5515 of the two heat conduction bases 52; each heat pipe 553 is connected between the first heat sink 551 and the heat conductive base 52. The end of the heat pipe 553 away from the first heat sink 551 can be directly connected to the heat conducting base 52, or the end of the heat pipe 553 away from the first heat sink 551 can be connected to the heat conducting base 52 by another heat conducting member or heat sink.

The heat pipe 553 includes a first heat conductive section 5531 and a second heat conductive section 5533 connected to the first heat conductive section 5531, and the first heat conductive section 5531 is sandwiched between the first heat sink 551 and the main control board 30. In this embodiment, the heat conducting pipe 553 has an L shape, that is, the first heat conducting section 5531 is perpendicular to the second heat conducting section 5533.

The heat sink assembly 55 further comprises a second heat sink 555 attached to the heat conductive base 52, the second heat sink 555 coupled to the heat pipe 553. In this embodiment, the second heat sink 555 is a heat sink connected to the heat conducting base 52, and the second heat conducting section 5533 is attached to a side of the heat sink facing away from the heat conducting base 52.

In other embodiments, the heat conducting pipes 553 may be replaced by metal heat conducting bars.

In other embodiments, the heat pipe 553 may be omitted and the second heat sink 555 may directly contact the first heat sink 551. Alternatively, the second heat sink 55 and the heat transfer pipe 553 may be omitted, and the first heat sink 551 may contact the heat transfer base 52.

In other embodiments, the first heat sink 551 and the second heat sink 555 are integrally formed. Or the first heat sink 551, the heat pipe 553, and the second heat sink 555 are integrally formed.

Referring to fig. 1 to 7, when the terminal apparatus 100 is assembled, the first heat conducting sections 5531 of the two heat conducting pipes 553 are respectively accommodated in the accommodating grooves 5515 of the two first radiators 551; the main control board 30 is disposed between the two first heat sinks 551, the electronic devices 34 with large heat generation on the main control board 30 are attached to the corresponding first heat conducting section 5531, and preferably, a heat conducting gasket 36 is disposed between the heat conducting pipe 553 and the corresponding electronic devices 34. Four locking members, such as screws, are inserted into the four connecting holes 5517 of one of the first heat sinks 551, and connected to the corresponding connecting holes 5517 of the other first heat sink 551, so that the two first heat sinks 551 are fixed relatively and clamp the main control board 30 and the heat pipe 553. Attaching the second heat conducting segments 5533 of the two heat conducting pipes 553 to the second radiator 555; the side of the second heat sink 555 facing away from the heat pipe 553 is attached to the front surface 5211 of the heat conductive base plate 521, and the top surface 5231 of the heat conductive substrate 523 is attached to the bottom surface 5213 of the heat conductive base plate 521. The heat dissipation assembly 55 is inserted into the inner cavity 201 of the housing 20, such that the outer circumferential surface of the heat conductive bottom plate 521 is hermetically attached to the inner circumference of the casing 22, and the bottom surface of the conductive substrate 523 extends out of the bottom surface of the casing 22. The hooks 242 of the cover plate 24 are respectively fastened to the fastening holes 227 of the top plate 222, so that the cover plate 24 is fastened to the housing 22.

Referring to fig. 8 and 9, when the terminal device 100 is used, the terminal device 100 is placed on the supporting platform 300, that is, the heat-conducting base 52 is placed on the top of the supporting platform 300. The heat generated by the electronic device 34 on the circuit board 32 during operation is conducted to the first heat sink 551 and the second heat sink 555 through the heat pipe 553, and the heat on the second heat sink 555 is conducted to the supporting platform 300 through the heat conducting bottom plate 521 and the heat conducting substrate 523, so that most of the heat generated by the electronic device 34 during operation is conducted to the supporting platform 300, thereby increasing the heat dissipation capability of the terminal device 100, effectively reducing the internal temperature of the inner cavity 201 of the housing 22, maximally utilizing the external environment where the terminal device 100 is located to dissipate heat, and reducing the heat dissipation cost of the terminal device 100 itself. In addition, a small amount of heat forms natural convection in the cavity 201 of the housing 22 through a chimney effect, that is, cold air enters the inner cavity 201 of the housing 22 through the air inlet holes 520 of the heat conducting bottom plate 521, and the cold air carries a small amount of heat to be discharged from the heat dissipation holes 220 after exchanging heat with the first heat sink 551. Most of the heat generated by the main control board 30 and the electronic devices 34 is transferred to the supporting platform 300, so that the heat transferred to the housing 22 and the cover plate 24 is small, the temperature of the outer surface of the housing 22 and the outer surface of the cover plate 24 is kept low, the risk of high temperature of the contact surface of the terminal device 100 is reduced, that is, the temperature of the contact surface of the housing 20 and the cover body 24 is reduced, the use experience of the product is improved, and the safety risk caused by high temperature is reduced; in addition, the terminal device 100 is also beneficial to miniaturization design, and the competitiveness of products is improved.

As shown in fig. 10, the terminal device 100 may also be mounted on a supporting surface 500 such as a wall surface, and most of the heat generated by the terminal device 100 during operation is transferred to the wall through the heat sink assembly 55, so that the temperature of the outer surface of the housing 22 and the outer surface of the cover plate 24 is kept low.

The heat-conducting base 52 of the terminal device 100 can be mounted on different supporting surfaces according to different use scenarios.

Referring to fig. 11, a terminal device 100a in the second embodiment of the present application is similar to the first embodiment, except that: the heat dissipation apparatus in the second embodiment further includes a fan 556 disposed on the heat dissipation assembly 55, wherein the fan 556 is electrically connected to the main control board 30. Specifically, the fan 556 is fixed to the first heat sink 551. The fan 556 can accelerate the flow speed of the air flow inside the housing 20, and can further lower the temperature of the inner cavity 201 of the housing 20, so that the temperature of the outer surface of the casing 22 and the outer surface of the cover plate 24 can be further lowered.

Referring to fig. 12, the structure of a terminal device 100b in the third embodiment of the present application is similar to that of the second embodiment, except that: the heat dissipation apparatus in the third embodiment further includes a temperature sensor 557 disposed on the housing 20, where the temperature sensor 557 is configured to detect a temperature of the housing 20 and send a signal to the main control board 30, and the main control board 30 receives the signal and controls the fan 556. Specifically, the temperature sensor 557 may be disposed on the housing 22 and/or the cover plate 24, and the temperature sensor 557 is configured to detect a temperature of the housing 22 and/or the cover plate 24. The temperature sensor 557 is electrically connected to the main control board 30, and a preset temperature value T is preset in the main control board 30. The preset temperature value T can be set as required, and in this embodiment, the preset temperature value T is set to 25 degrees. In other embodiments, the preset temperature value T is set to any value between 20 and 25 degrees. In this embodiment, the temperature sensor 557 is disposed on an inner surface of the cover plate 24. In other embodiments, the temperature sensor 557 may be disposed on an inner surface of the casing 22, and the temperature sensor 557 is electrically connected to the main control board 30 through a wire.

When the terminal device 100b is just started, because the heat generated by the main control board 30 and the electronic devices 34 during operation is low, that is, most of the heat generated by the main control board 30 and the electronic devices 34 during operation is transferred to the supporting platform 300 through the first heat sink 551, the heat pipe 553, the second heat sink 555 and the heat conducting base 52, so as to meet the heat dissipation requirement, the surface temperatures of the cover plate 24 and the housing 22 are low. With the increase of heat generated by the electronic devices such as the main control board 30, when the temperature detected by the temperature sensor 557 is higher than the preset temperature value T, the temperature sensor 557 sends a signal to the main control board 30, the main control board 30 receives the signal and controls the fan 556 to rotate, so that a large amount of cold air enters the inner cavity 201 of the housing 22 through the air inlet hole 520 at the bottom of the terminal device 100b, and the cold air dissipates the heat inside the housing 22 through the heat dissipating hole 220, so that the temperature inside the housing 22 is reduced. When the temperature detected by the temperature sensor 557 is lower than the preset temperature value T, the temperature sensor 557 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the fan 556 to stop rotating, so as to save electric energy, reduce the loss of the fan 556, and prolong the service life of the fan 556.

In the working process of the terminal device 100b, when the temperature detected by the temperature sensor 557 is higher than or equal to the preset temperature value T, the temperature sensor 557 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the fan 556 to work, so that the temperatures of the housing 22 and the cover plate 24 are reduced. In the working process of the fan 556, when the temperature detected by the temperature sensor 557 is lower than the preset temperature value T, the temperature sensor 557 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the fan 556 to stop working. Therefore, the heat dissipation device of the present application can not only effectively dissipate heat for the motherboard 30 and the electronic device 34, but also keep the surface temperature of the housing 22 and the cover plate 24 below 25 degrees, thereby improving user experience; but also can save electric energy, reduce the loss of the fan 556 and prolong the service life of the fan 556.

The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims

1. A heat dissipation device is used for dissipating heat of terminal equipment and is characterized by comprising a heat conduction base and a heat dissipation assembly connected to the heat conduction base, wherein the heat conduction base comprises a heat conduction substrate, the heat conduction substrate is provided with a heat conduction surface deviating from the heat dissipation assembly, the heat dissipation assembly is in contact with an electronic device of the terminal equipment, the heat conduction surface of the heat conduction substrate is used for being attached to a supporting table or a supporting surface, and heat generated by the electronic device is conducted to the supporting table or the supporting surface through the heat dissipation assembly and the heat conduction substrate.

2. The heat dissipating device of claim 1, wherein the heat conducting base further comprises a heat conducting bottom plate, the heat conducting bottom plate is attached to a bottom surface of the heat conducting bottom plate, the heat dissipating assembly is connected to a top surface of the heat conducting bottom plate, and heat on the heat dissipating assembly is conducted to the heat conducting bottom plate through the heat conducting bottom plate.

3. The heat dissipating device of claim 1, wherein the heat dissipating assembly comprises at least a first heat sink connected between the electronic component and the thermally conductive base, wherein heat generated by the electronic component is conducted through the first heat sink to the thermally conductive base.

4. The heat dissipating device of claim 3, wherein said heat dissipating assembly further comprises at least one heat pipe connected between said electronic component, said first heat sink and said heat conductive base.

5. The heat dissipating device of claim 4, wherein the number of the first heat sinks is two, two of the first heat sinks clamp the main control board of the terminal device, a side of each first heat sink facing the main control board is provided with a receiving groove, the receiving groove receives a heat conducting pipe, and an end of the heat conducting pipe away from the first heat sink is connected to the heat conducting base.

6. The heat dissipating device of claim 4, wherein the heat dissipating assembly further comprises a second heat sink attached to the thermally conductive base, the second heat sink being connected to the thermally conductive tube and/or the first heat sink.

7. The heat dissipating device of claim 1, wherein the thermally conductive base is made of a thermally conductive material having compressibility, the thermally conductive base having a thermal conductivity greater than or equal to 0.3W/Mk; the tensile strength of the heat conduction base is greater than or equal to 1.5 Mpa.

8. A terminal device, comprising a housing, a main control board disposed in the housing, and the heat dissipation apparatus of any one of claims 1 to 7, wherein the heat conductive base of the heat dissipation apparatus is disposed on the housing, the heat conductive surface of the heat conductive substrate is exposed out of the housing, the heat dissipation assembly of the heat dissipation apparatus is accommodated in the inner cavity of the housing, and the main control board contacts the heat dissipation assembly.

9. The terminal device according to claim 8, wherein a plurality of heat dissipation holes are formed in the top of the housing, the heat dissipation holes are communicated with the inner cavity of the housing, and a plurality of air inlet holes are formed in the periphery of the heat conducting substrate of the heat conducting base and are communicated with the inner cavity of the housing.

10. The terminal device of claim 9, wherein the heat sink further comprises a fan disposed on the heat sink assembly, the fan being electrically connected to the main control board.

11. The terminal device according to claim 10, wherein the heat sink further comprises a temperature sensor disposed on the housing, the temperature sensor is configured to detect a temperature of the housing and send a signal to the main control board, and the main control board receives the signal and controls the fan.