CN218450326U

CN218450326U - Camera with a camera module

Info

Publication number: CN218450326U
Application number: CN202222061709.5U
Authority: CN
Inventors: 葛龙; 高飞
Original assignee: Insta360 Innovation Technology Co Ltd
Current assignee: Insta360 Innovation Technology Co Ltd
Priority date: 2022-08-03
Filing date: 2022-08-03
Publication date: 2023-02-03
Anticipated expiration: 2032-08-03

Abstract

The utility model relates to a camera, include: the main control panel, the sensor PCB board and the heat conductor are located in the supporting structure, the sensor PCB board is used for conversion of photoelectric signals, the main control panel is used for receiving and processing the sensor PCB board output information, the heat conductor comprises a main board radiating fin and a sensor radiating fin which are arranged in the same direction and are separated by a set gap, the main board radiating fin is connected with the main control panel to conduct heat of the main control panel, and the sensor radiating fin is connected with the sensor PCB board to conduct heat of the sensor PCB board.

Description

Camera with a camera module

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a camera.

Background

When a camera works, internal components can generate a large amount of heat, such as a chip, an image sensor and the like, because the power consumption and the over-temperature of each component are different, the heat generated by different components is different at the same working moment, and if the effective heat dissipation can not be carried out, the temperature among different components can be influenced mutually, so that the service performance of the camera is influenced.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for a camera that is capable of reducing the influence of heat dissipation in time on the performance of the camera.

A camera, comprising: the sensor PCB is used for converting photoelectric signals, the main control panel is used for receiving and processing the output information of the sensor PCB, the heat conductor comprises a main board radiating fin and a sensor radiating fin, the main board radiating fin and the sensor radiating fin are located in the same direction and separated by a set gap, the main board radiating fin is connected with the main control panel to conduct the heat of the main control panel, and the sensor radiating fin and the sensor PCB are connected to conduct the heat of the sensor PCB.

In one embodiment, the main board heat sink is disposed in an overlapping manner with the main control board, and the sensor heat sink is disposed on a side of the main board heat sink facing away from the main control board.

In one embodiment, the heat storage device further comprises a heat storage film, and the heat storage film is attached to one side, away from the main control board, of the main board heat dissipation sheet.

In one embodiment, the solar heat collector further comprises a heat insulation film, wherein the heat insulation film is attached to one side, facing away from the heat storage film, of the heat storage film.

In one embodiment, the heat-insulating film is attached to the side of the main board heat sink facing away from the main control board.

In one embodiment, the sensor heat sink includes a heat dissipation connecting portion connected to the sensor PCB board and a heat dissipation portion connected to the heat dissipation connecting portion and the support structure, respectively.

In one embodiment, the heat dissipation connecting portion is overlapped with the sensor PCB, and an overlapping direction of the heat dissipation connecting portion and the sensor PCB is perpendicular to an overlapping direction of the main board heat sink and the main control board.

In one embodiment, the heat dissipation portion is located in an overlapping direction of the main board heat dissipation fin and the main control board.

In one embodiment, a protruding structure is formed on one side of the heat dissipation part, which is close to the upper end of the main control plate, and air holes matched with the protruding structure are formed in the supporting structure.

In one embodiment, the bottom end of the support structure is provided with a connecting hole, and the heat of the main control board conducted by the main board radiating fin is radiated out of the support structure through the connecting hole.

According to the camera, the main board radiating fins and the sensor radiating fins are arranged on the main control board and the sensor PCB respectively, and the main board radiating fins and the sensor radiating fins are arranged separately and are arranged independently, so that a heat insulation effect is achieved between the main board radiating fins and the sensor radiating fins, the influence of the main board radiating fins on the ambient temperature is reduced, and the influence on the temperature of the sensor radiating fins and the temperature of the sensor PCB is further reduced.

Drawings

Fig. 1 is a schematic view of an overall structure of a camera according to an embodiment of the present invention.

Fig. 2 is a schematic view of a disassembly structure of a camera according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view of fig. 1.

Fig. 4 is an assembly diagram of part of components in a camera according to an embodiment of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 and fig. 2, fig. 1 shows an overall structural schematic diagram of a camera in an embodiment of the present invention, and fig. 2 shows a disassembly structural schematic diagram of the camera. An embodiment of the utility model provides a camera, including bearing structure 10, sensor PCB board 20 and main control panel 30, bearing structure 10 has well plenum chamber 101, and under the camera assembled state, sensor PCB board 20 and main control panel 30 all are located the well plenum chamber 101 of bearing structure 10. The sensor PCB 20 is used for mounting a sensor and converting an optical signal into an electrical signal; the main control board 30 is communicatively connected to the sensor PCB board 20 for mounting a chip and receiving and processing output information of the sensor PCB board 20. The camera further includes a lens assembly 40 disposed through the support structure 10, and the lens assembly 40 is connected to the sensor PCB board 20 for imaging an imaging target on the sensor PCB board 20. The lens assembly 40 is disposed on the support structure 10 near the ends so that the lens assembly 40 is unobstructed when the user is holding the camera. In the present embodiment, the lens assembly 40 is disposed at a position near the upper end of the support structure 10.

Referring to fig. 2, the supporting structure 10 is a substantially rectangular parallelepiped structure, and includes a frame 110 and a cover 120 covering the frame 110, wherein the cover 120 and the frame 110 are assembled to form the hollow chamber 101. The cover 120 has an opening 121, and the cover 120 is disposed on the lens assembly 40 through the opening 121. In the present embodiment, the sensor PCB board 20 is positioned in the left-right direction of the support structure 10, and the lens assembly 40 connected to the sensor PCB board 20 is positioned substantially in the front-rear direction of the support structure 10. The sensor PCB board 20 is located near the upper end of the support structure 10, and is disposed adjacent to the lens assembly 40. The main control board 30 and the cover 120 are located in the front-rear direction of the support structure 10.

Referring to fig. 3, in the assembled state, the main control board 30 is biased to a position close to the cover 120 and below the lens assembly 40. Referring to fig. 4, for the convenience of viewing, fig. 4 shows only an assembly diagram of the main control board 30, the cover 120, the lens assembly 40 mounted on the cover 120, and the sensor PCB board 20 connected to the lens assembly 40. The lens assembly 40 and the sensor PCB board 20 are located at the upper end of the support structure 10 and are at substantially the same height. The main control board 30 is located below the sensor PCB board 20, that is, below the lens assembly 40.

In the operating state of the camera, the chip mounted on the main control board 30 and the sensor mounted on the sensor PCB 20 are the main heat sources in the supporting structure 10, and since the heat generated by the operation of the chip is directly conducted to the main control board 30 and the heat generated by the operation of the sensor is directly conducted to the sensor PCB, the main heat sources can also be directly regarded as the main control board 30 and the sensor PCB 20. The hollow chamber 101 in the support structure 10 is relatively closed to heat dissipation. Referring to fig. 2, in order to avoid the influence on the working performance caused by the over-high temperature of the main control board 30 and the sensor PCB 20, a heat conductor 50 with good heat conductivity is disposed in the supporting structure 10, and the heat conductor 50 is respectively connected to the main control board 30 and the sensor PCB 20, and is used for conducting the heat generated by the main control board 30 and the heat generated by the sensor PCB 20 to the outside of the supporting structure 10.

As can be seen from fig. 3 and 4, the main control board 30 and the sensor PCB 20 are adjacent to each other, and the heat generated by the main control board 30 and the heat generated by the sensor PCB 20 can be transferred to the same heat conductor 50 and dissipated by the heat conductor 50, so that the temperatures of the two main heat sources do not rise too fast, and the temperatures around the heat sources are stable and do not significantly affect the operating temperatures of other components in the supporting structure 10. Specifically, the heat conductor 50 may be attached to the main control board 30 to have a large contact surface and thus improve heat conduction efficiency, and similarly, the heat conductor 50 may also be attached to the sensor PCB 20 to accelerate heat dissipation.

Since the power loss of the chip on the main control board 30 is much larger than that of the sensor on the sensor PCB 20, the heat of the main control board 30 is much larger than that of the sensor PCB 20 during the same operation period. The over-temperature of the sensor on the sensor PCB board 20 is typically 60-65 deg.c and the over-temperature of the chip on the main control board 30 is typically 85 deg.. Therefore, a situation may occur in which heat generated by the main control board 30 is transferred to the sensor PCB 20 through the heat conductor 50, so that the sensor on the sensor PCB 20 quickly reaches an over-temperature, and the sensor PCB 20 stops working too early due to the over-temperature, and at this time, the temperature of the chip itself on the main control board 30 does not reach the over-temperature yet. That is to say, the two main heat sources of the chip on the main control board 30 and the sensor on the sensor PCB board 20 reach different times of over-temperature, which affects the use experience.

In order to avoid the problem that different components reach different over-temperature temperatures due to the fact that the same heat conductor 50 is used for dissipating heat of the main heat source, referring to fig. 2, the heat conductor 50 includes two adjacent motherboard fins 510 and sensor fins 520. The main plate heat sink 510 and the sensor heat sink 520 are independent of each other with a predetermined gap therebetween. The main board heat sink 510 is connected to the main control board 30 for conducting away heat generated by the main control board 30. The sensor heat sink 520 is connected to the sensor PCB board 20 for conducting away heat generated from the sensor PCB board 20.

When the power loss of the chip on the main control board 30 is not large, that is, the heat generated by the main control board 30 does not significantly affect the temperature of the sensor on the sensor PCB 20, the temperature of the main board heat sink 510 and the temperature of the sensor heat sink 520 may be isolated by an air medium, so that the temperature of the main board heat sink 510 does not affect the sensor heat sink 520.

Referring to fig. 3, the size of the motherboard heat sink 510 is adapted to the size of the main control board 30, and the motherboard heat sink 510 is stacked on the side of the main control board 30 facing the cover 120. The sensor heat sink 520 is located on the side of the motherboard heat sink 510 facing away from the main control board 30. The heat conduction between the motherboard heat sink 510 and the main control board 30 may be performed by a heat conductive pad, a heat conductive gel, or the like. In order to facilitate the heat dissipation of the main board heat sink 510 from the main control board 30, the supporting structure 10 is provided with a connection hole 102, and the connection hole 102 is communicated with the hollow chamber 101 inside the supporting structure 10. The motherboard heat sink 510 may dissipate heat to the external environment through the connection hole 102. Further, the connection hole 102 is opened at the bottom end of the support structure 10, and the main board heat sink 510 radiates the heat of the main control board 30 out from the bottom end of the support structure 10, so as to prevent the temperature of the support structure 10 from rising at a position where the user holds the support structure.

The main plate heat sink 510 may be a plate structure or a bent structure, such as an L-shaped structure, so that the end of the main plate heat sink 510 away from the sensor PCB 20 is closer to the connection hole 102, which is beneficial to heat dissipation.

Referring to fig. 3, if the power loss of the chip on the main control board 30 is large, in order to prevent the main control board 30 from heating up too fast and the temperature of the main board heat sink 510 increases rapidly, which may cause the surrounding temperature to heat up faster and affect the time that other components reach the over-temperature, a heat storage film 530 is further disposed in the support structure 10. The heat storage film 530 is attached to a side of the main board heat sink 510 away from the main control board 30. The heat storage film 530 may adopt a phase-change heat storage film. The phase-change heat storage film at least comprises a mixture of nano graphene, paraffin and the like, has the characteristic of high specific heat capacity, can absorb the heat of the main control board 30 conducted through the main board radiating fins 510, and prolongs the temperature rise time of the main control board 30.

Referring to fig. 3, in order to reduce the influence of the motherboard heat sink 510 on the ambient temperature, a heat insulation film 540 is further disposed in the supporting structure 10. The heat insulation film 540 is attached to a side of the heat storage film 530 away from the motherboard heat sink 510, that is, the heat storage film 530 is sandwiched between the motherboard heat sink 510 and the heat insulation film 540. By adding the heat insulation film 540 on one side of the heat storage film 530, the heat of the main control board 30 conducted by the heat storage film 530 and the main board heat sink 510 can be isolated from the ambient temperature, and dissipated from the connection hole 102 on the support structure 10, thereby reducing the influence on the temperature of other components. The heat insulating film 540 may use silica aerosol or the like.

In other embodiments, the heat storage film 530 may not be provided, and the heat insulation film 540 may be directly attached to the side of the motherboard heat sink 510 away from the main control board 30.

Referring to fig. 4, the sensor PCB board 20 disposed in the left-right direction of the supporting structure 10 is located beside the lens assembly 40 and near the edge of the cover 120, which is not conducive to heat dissipation in the assembled state of the camera. As shown in fig. 2, the sensor heat sink 520 includes a heat dissipating connection portion 521 and a heat dissipating portion 522 connected to each other. The heat-dissipating connecting portion 521 is overlapped with the sensor PCB, and further, the heat-dissipating connecting portion 521 is attached to the side surface of the sensor PCB 20 away from the lens assembly 40. The overlapping direction of the heat-dissipating connecting portion 521 and the sensor PCB 20 is perpendicular to the overlapping direction of the main board heat sink 510 and the main control board 30. The heat sink 522 is connected to the cover 120. The heat of the heat dissipation portion 522 connected to the sensor PCB 20 is dissipated through the heat dissipation connection portion 521 connected to the cover 120, so that the heat conduction area of the sensor PCB 20 is greatly increased, and heat dissipation is facilitated. The heat between the heat-dissipating connection 521 and the sensor PCB board 20 may be conducted through a heat-conducting pad or a heat-conducting gel.

Referring to fig. 4, a plurality of ventilation holes 122 are formed in the cover 120 at positions opposite to the heat dissipation portion 522, and are used for dissipating heat of the sensor PCB 20 conducted through the heat dissipation portion 522 to an external environment with a low temperature. The heat dissipation portion 522 extends toward one side of the cover 120 to form a plurality of protrusion structures 523 engaged with the air holes 122. When the camera is in an assembled state, the protruding structure 523 penetrates through the air hole 122, so that the heat dissipation effect is further improved.

Referring to fig. 2, the size of the heat sink 522 is adapted to the size of the cover 120, so as to increase the heat conducting volume. The heat dissipation portion 522 is stacked on the cover 120. The heat dissipation portion 522 has a relief hole 524 at a position corresponding to the opening 121 of the cover 120 so as not to interfere with the lens assembly 40 extending out of the support structure 10 through the opening 121. As shown in fig. 3, in the assembled state of the camera, the heat dissipation portion 522 is located in the stacking direction of the motherboard heat sink 510 and the main control board 30, and one side of the heat dissipation portion faces the cover plate 120, and the other side of the heat dissipation portion faces the motherboard heat sink 510 and does not form a heat conduction path with the motherboard heat sink 510. In order to prevent the sensor heat sink 520 from transferring heat to the cover 120 to cause a burning sensation when the user holds the cover, a heat insulation measure may be provided between the sensor heat sink 520 and the cover 120, for example, a heat insulation film may be attached to a side of the cover 120 facing the sensor heat sink 520.

The utility model provides a camera sets up respectively in bearing structure 10 and is used for supplying the main board fin 510 that main control panel 30 conducts heat and is used for supplying sensor PCB board 20 to conduct the sensor fin 520 of heat, and main board fin 510 and sensor fin 520 are located the equidirectional and are separated by and set for the clearance, can reduce the temperature influence of main board fin 510 ambient temperature to sensor fin 520 and sensor PCB board 20. By attaching the heat storage film 530 to the side of the motherboard heat sink 510 away from the main control board 30, the heat transfer volume of the motherboard heat sink 510 can be increased. By attaching the heat insulating film 540 to the main board heat sink 510 on the side away from the main control board 30, the influence of the heat on the main board heat sink 510 on the ambient temperature can be reduced.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A camera, comprising: the main control panel, the sensor PCB board and the heat conductor are located in the supporting structure, the sensor PCB board is used for conversion of photoelectric signals, the main control panel is used for receiving and processing the output information of the sensor PCB board, the heat conductor comprises a main board radiating fin and a sensor radiating fin which are located in the same direction and are separated by a set gap, the main board radiating fin is connected with the main control panel to conduct the heat of the main control panel, and the sensor radiating fin is connected with the sensor PCB board to conduct the heat of the sensor PCB board.

2. The camera of claim 1, wherein the main board heat sink is disposed in superimposition with the main control board, and the sensor heat sink is located on a side of the main board heat sink facing away from the main control board.

3. The camera of claim 2, further comprising a heat storage film attached to a side of the motherboard heat sink facing away from the main control board.

4. The camera of claim 3, further comprising a thermal insulating film attached to a side of the heat storage film facing away from the heat storage film.

5. The camera of claim 2, further comprising a thermal insulating film attached to a side of the motherboard heat sink facing away from the main control board.

6. The camera of claim 2, wherein the sensor heat sink comprises a heat dissipating connection portion and a heat dissipating portion, the heat dissipating connection portion being connected to the sensor PCB board, the heat dissipating portion being connected to the heat dissipating connection portion and the support structure, respectively.

7. The camera according to claim 6, wherein the heat dissipating connecting portion is disposed to overlap the sensor PCB, and an overlapping direction of the heat dissipating connecting portion and the sensor PCB is perpendicular to an overlapping direction of the main board heat sink and the main control board.

8. The camera of claim 7, wherein the heat dissipation portion is located in a direction of superposition of the main board heat sink and the main control board.

9. The camera as claimed in claim 6, wherein a protrusion structure is formed on the heat dissipating part at a side close to the upper end of the main control board, and the support structure is formed with an air hole engaged with the protrusion structure.

10. The camera according to claim 2, wherein the bottom end of the support structure is provided with a connection hole through which the heat of the main control board conducted by the main board heat sink is radiated to the outside of the support structure.