CN207729864U - A kind of thermoelectric cooling module - Google Patents
A kind of thermoelectric cooling module Download PDFInfo
- Publication number
- CN207729864U CN207729864U CN201721833866.6U CN201721833866U CN207729864U CN 207729864 U CN207729864 U CN 207729864U CN 201721833866 U CN201721833866 U CN 201721833866U CN 207729864 U CN207729864 U CN 207729864U
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- CN
- China
- Prior art keywords
- thermally conductive
- conductive sheet
- cold end
- hot junction
- semiconductor chilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of thermoelectric cooling modules, including semiconductor chilling plate, cold end thermally conductive sheet and hot junction thermally conductive sheet, the semiconductor chilling plate includes several pairs of p-types and N-type galvanic couple arm and conductive tabs, the semiconductor chilling plate is fixed between the cold end thermally conductive sheet and the hot junction thermally conductive sheet, the semiconductor chilling plate is filled with insulating heat-conductive colloid with the cold end thermally conductive sheet and the hot junction thermally conductive sheet contact jaw, the cold end thermally conductive sheet and the hot junction thermally conductive sheet are made of metal material, the cold end thermally conductive sheet includes thermal conductive contact end and the connecting pin for being connect with product to be cooled, shape matches with product to be cooled.The utility model can improve refrigerating efficiency, reduce temperature control feedback time, improves assembly performance and reduce product cost.
Description
Technical field
The utility model is related to a kind of thermoelectric cooling modules, belong to thermoelectric-cooled technical field.
Background technology
Traditional thermoelectric refrigerating modular structure composition such as Fig. 1, shown in Fig. 2：The semiconductor galvanic arm material of thermoelectric module
For a kind of telluride bismuth alloy, it is suitably doped with the block of " N " type and " P " type semiconductor feature, large number of semi-conductor electricity
Even arm realizes electric interconnection by the conductive excellent conductive tabs welding such as copper；It is coated with heat-conducting glue in the both sides of conductive tabs, most
Outer layer is packaged fixation with insulating ceramic film, and entire cooling piece accesses direct current by conducting wire and plays refrigeration.
In general, traditional thermoelectric module is being integrated into system since both sides are equipped with insulating ceramic film（There is cooling need
The product or equipment asked）In be bound to heat-conducting interface material to be increased, constitute great heat transfer resistance, seriously affect cooling piece
Refrigerating efficiency；The time constant that temperature regulation and control are increased in some high-precision temperature control systems, extends the response time；Meanwhile
Also higher Material Cost is constituted.
Invention content
Technical problem to be solved by the utility model is to provide one kind can improving refrigerating efficiency, reduces temperature control feedback
The thermoelectric cooling module of time further provides the thermoelectric cooling module that a kind of assembly performance is high and level of integrated system is high,
A kind of low-cost thermoelectric cooling module is further provided.
In order to solve the above technical problems, the technical solution adopted in the utility model is：
A kind of thermoelectric cooling module, including semiconductor chilling plate, cold end thermally conductive sheet and hot junction thermally conductive sheet, the semiconductor
Cooling piece includes several pairs of p-types and N-type galvanic couple arm and conductive tabs, and the semiconductor chilling plate is fixed on the cold end and leads
Between backing and the hot junction thermally conductive sheet, the semiconductor chilling plate and the cold end thermally conductive sheet and the hot junction thermally conductive sheet
Contact jaw is filled with insulating heat-conductive colloid, and cold end thermally conductive sheet and the hot junction thermally conductive sheet are made of metal material, described cold
End thermally conductive sheet includes thermal conductive contact end and the connecting pin for being connect with product to be cooled, shape and product phase to be cooled
Match.
The cold end thermally conductive sheet is made of aluminum alloy material.
The hot junction thermally conductive sheet is made of die casting aluminium material.
Several radiating fins are equipped on the outside of the hot junction thermally conductive sheet.
The semiconductor chilling plate is fixed by screws on the hot junction thermally conductive sheet.
The cold end thermally conductive sheet is channel-shaped, and slot both sides are outward extended with connecting plate, and the connecting plate is used for and production to be cooled
Product connect.
The advantageous effect that the utility model is reached：Using the structure setting of cold end thermally conductive sheet, can be realized in conjunction with system
Concurrent development improves the assembling capacity of refrigeration module and system so that this thermoelectric refrigerating module and product can be highly integrated, expand
The big application range of thermoelectric cooling module；Remove the setting of potsherd from, heat transfer resistance can be made to reduce an order of magnitude, on the one hand
Refrigerating efficiency is greatly improved, electric current when refrigeration module work and power consumption are reduced；On the other hand reduce temperature control system
The time constant for feedback adjustment of uniting, response is rapider, and temperature control is more accurate；Also, use metal（Such as aluminium, copper）Thermally conductive sheet generation
Material Cost is optimized for ceramics.
Description of the drawings
Fig. 1 is Conventional thermoelectric cooling piece structural schematic diagram；
Fig. 2 is Conventional thermoelectric cooling piece principle schematic；
Fig. 3 is novel thermoelectric refrigerating piece principle schematic；
Fig. 4 is embodiment assembling schematic diagram；
Fig. 5 is embodiment assembling front view；
Reference sign：Insulating ceramic film（11）Heat conduction colloid（12）Conductive tabs（13）Semiconductor galvanic arm（14）
Conducting wire（15）Heat-conducting interface material（16）Cold end thermally conductive sheet（17）Hot junction thermally conductive sheet（18）Top shell（21）Semiconductor chilling plate（22）
Freeze plate rack（23）Heat-conducting silicone grease（24）LD arrays（31）Camera lens（32）Optical fiber（33）Laser stent（34）Bottom case（35）Spiral shell
Nail is fixed（36）Screw is fixed（37）.
Specific implementation mode
The utility model is further described below in conjunction with the accompanying drawings.Following embodiment is only used for clearly illustrating this
The technical solution of utility model, and the scope of protection of the utility model cannot be limited with this.
By taking the assembly of certain LD array laser as an example, such as Fig. 4, shown in Fig. 5, LD array lasers include LD arrays 31, camera lens
32, optical fiber 33, laser stent 34 and bottom case 35, laser stent 34 are fixed by screws on bottom case 35, LD arrays 31
In bottom case 35, power unit omission, which is not done, to be illustrated, and wherein 31 calorific value of LD arrays is big needs to cool down, according to the shape of bottom case 35
Shape, refrigeration plate rack 23 are used as cold end cooling fin, are designed as such as Fig. 4, flute profile shown in fig. 5, and two sides, which extend, to be used for and bottom case
35 are connected and fixed use, are fixed on 35 top of laser bottom case using screw, and refrigeration plate rack 23 uses aluminum alloy material,
Bottom surface is contacted with pyrotoxin LD arrays 31 by heat-conducting interface material as thermal conductive contact face, and top shell 21 is used as hot junction thermally conductive sheet,
It is made of die casting aluminium material, is designed to that top shell structure, top carry short fin, increase heat dissipation area, can effectively improve
Radiating efficiency, cold end cooling piece 22, which is fixed by screws in top shell 21, plays fixed supporting role, and inside can be protected partly to lead
Body galvanic couple arm improves the structural strength of the present apparatus from pressure damage, and 22 heat absorbing end of semiconductor chilling plate is distinguished with release end of heat
Filled with heat-conducting silicone grease, with refrigeration plate rack 23 and top shell 21 is benign contacts, top shell 21 connects with 23 two sides of refrigeration plate rack
It connects, to ensure the depth of parallelism, connector may be used and be fixed, contact surface is equipped with heat-barrier material, avoids hot-fluid short-circuit.Using
Above-mentioned design not only increases the refrigerating efficiency of thermoelectric cooling module, realizes the high integration of refrigeration module and system, also saves
It has saved structure space and has saved Material Cost.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and deformations can also be made, these change
The scope of protection of the utility model is also should be regarded as into deformation.
Claims (6)
1. a kind of thermoelectric cooling module, characterized in that including semiconductor chilling plate, cold end thermally conductive sheet and hot junction thermally conductive sheet, institute
It includes several pairs of p-types and N-type galvanic couple arm and conductive tabs to state semiconductor chilling plate, and the semiconductor chilling plate is fixed on institute
It states between cold end thermally conductive sheet and the hot junction thermally conductive sheet, the semiconductor chilling plate and the cold end thermally conductive sheet and the heat
Thermally conductive sheet contact jaw is held to be filled with insulating heat-conductive colloid, the cold end thermally conductive sheet and the hot junction thermally conductive sheet use metal material
Be made, the cold end thermally conductive sheet includes thermal conductive contact end and the connecting pin for being connect with product to be cooled, shape with wait for it is cold
But product matches.
2. a kind of thermoelectric cooling module according to claim 1, characterized in that the cold end thermally conductive sheet uses aluminium alloy material
Matter is made.
3. a kind of thermoelectric cooling module according to claim 1, characterized in that the hot junction thermally conductive sheet uses die casting aluminium
Matter is made.
4. a kind of thermoelectric cooling module according to claim 1, characterized in that be equipped on the outside of the hot junction thermally conductive sheet several
Radiating fin.
5. a kind of thermoelectric cooling module according to claim 1, characterized in that the semiconductor chilling plate is solid by screw
It is scheduled on the hot junction thermally conductive sheet.
6. according to a kind of thermoelectric cooling module of claim 1-5 any one of them, characterized in that the cold end thermally conductive sheet is slot
Shape, slot both sides are outward extended with connecting plate, and the connecting plate with product to be cooled for connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721833866.6U CN207729864U (en) | 2017-12-25 | 2017-12-25 | A kind of thermoelectric cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721833866.6U CN207729864U (en) | 2017-12-25 | 2017-12-25 | A kind of thermoelectric cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207729864U true CN207729864U (en) | 2018-08-14 |
Family
ID=63085955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721833866.6U Expired - Fee Related CN207729864U (en) | 2017-12-25 | 2017-12-25 | A kind of thermoelectric cooling module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207729864U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109182082A (en) * | 2018-08-29 | 2019-01-11 | 南京新生医疗科技有限公司 | hair follicles adipose tissue separating plate |
| CN110849027A (en) * | 2019-11-08 | 2020-02-28 | 江苏科技大学 | Thermoelectric cooling device combining flexible flat heat pipe and flowing working medium in pipe |
| CN112524839A (en) * | 2020-11-16 | 2021-03-19 | 杭州大和热磁电子有限公司 | High-performance refrigeration module with simple structure |
| CN112713496A (en) * | 2020-12-29 | 2021-04-27 | 深圳市利拓光电有限公司 | High-speed laser |
-
2017
- 2017-12-25 CN CN201721833866.6U patent/CN207729864U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109182082A (en) * | 2018-08-29 | 2019-01-11 | 南京新生医疗科技有限公司 | hair follicles adipose tissue separating plate |
| CN110849027A (en) * | 2019-11-08 | 2020-02-28 | 江苏科技大学 | Thermoelectric cooling device combining flexible flat heat pipe and flowing working medium in pipe |
| CN112524839A (en) * | 2020-11-16 | 2021-03-19 | 杭州大和热磁电子有限公司 | High-performance refrigeration module with simple structure |
| CN112713496A (en) * | 2020-12-29 | 2021-04-27 | 深圳市利拓光电有限公司 | High-speed laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200624 Address after: 215324, No. 2, No. 448 KUNKAI Road, Jinxi Town, Patentee after: KUNSHAN SHEMAO ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: Jinxi town Kunshan city Suzhou City Kunming 215300 Jiangsu province open No. 150 No. 3 Building Patentee before: HONGLICHENG PHOTOELECTRIC SCI&TECH CO.LTDD |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180814 Termination date: 20211225 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |