CN209861445U - Heat dissipation device for solving narrow space - Google Patents

Abstract

The utility model discloses a solve heat abstractor in narrow and small space, including heat pipe, paster and two at least fin that set up side by side, two at least fin are connected to the heat pipe, and the paster is the heat conduction mounting, and the junction of fin and heat pipe has all laminated the paster. The heat dissipation device for solving the narrow space provided by the utility model can connect different cooling fins (different temperatures on different cooling fins, higher temperature of some cooling fins and lower temperature of some cooling fins) by using the heat pipe in the limited space, and after the cooling fins are connected by the heat pipe, the cooling fins with high temperature transfer the heat to the cooling fins with low temperature, thereby playing the role of reducing the overall temperature; meanwhile, a patch is attached to the joint of the heat radiating fin and the heat pipe, and the patch has a heat conduction fixing function, namely the patch plays a role in further radiating on one hand and plays a role in fixing the heat pipe and the heat radiating fin on the other hand.

Description

Heat dissipation device for solving narrow space

Technical Field

The utility model belongs to the technical field of the semiconductor heat dissipation, especially, relate to a solve heat abstractor in narrow and small space.

Background

In the modern society, with the development of information and semiconductor industry, semiconductor chips are increasingly being developed to higher frequencies, and electronic devices such as central processing units (hereinafter, referred to as CPUs) are being processed at a speed of one day, and LEDs are also being developed to high power lighting. However, high temperatures are also generated during the development process, and high temperatures are generated in a CPU, an LED, an IC, a rectifier, a resistor, a capacitor, an inductor, and the like.

In order to solve the high temperature problem generated in semiconductor products, manufacturers mostly adopt metal heat sinks for heat dissipation, or the metal heat sinks are combined with refrigeration chips, soaking plates, heat dissipation fans and the like. However, the above-mentioned heat dissipation method has the disadvantages of not fast enough heat dissipation speed and complex heat dissipation module structure, and especially the most common method of heat dissipation by using metal heat dissipation fins alone still cannot achieve the heat dissipation effect desired by the user in the limited space under the condition that the size of the metal heat dissipation fins has been maximized.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a solve heat abstractor in narrow and small space aims at solving the poor and complicated problem of structure of current radiator radiating effect.

In order to solve the technical problem, the utility model discloses a realize like this, a solve heat abstractor in narrow and small space, including heat pipe, paster and two at least fin that set up side by side, two at least fin are connected to the heat pipe, and the paster is the heat conduction mounting, and the junction of fin and heat pipe all has laminated the paster.

Further, the quantity of paster and fin is two, and two pasters are laminated respectively on the relative surface of two fins.

Furthermore, the number of the radiating fins is two, a patch is arranged between the two radiating fins, and two ends of the patch are respectively connected with the opposite surfaces of the two radiating fins.

Furthermore, the patch is a copper piece, an aluminum piece, a graphite aluminum foil piece or a graphite copper foil piece.

Furthermore, the number of the heat pipes is two, and the two heat pipes are respectively arranged at two ends of the radiating fin.

Furthermore, the heat dissipation device for solving the problem of the narrow space further comprises a connecting pipe, and the upper ends or the lower ends of the two heat pipes are connected through the connecting pipe to form a U-shaped pipe structure.

Furthermore, an accommodating space is formed between the two heat pipes, the connecting pipe and the radiating fin close to the connecting pipe, and the accommodating space is filled with heat conducting materials.

Further, the heat pipe is a hollow pipe filled with a condensed liquid.

Further, the radiating fins are aluminum parts, aluminum alloy parts, copper parts or graphite parts.

Compared with the prior art, the utility model, beneficial effect lies in: the heat dissipation device for solving the narrow space provided by the utility model can connect different cooling fins (different temperatures on different cooling fins, higher temperature of some cooling fins and lower temperature of some cooling fins) by using the heat pipe in the limited space, and after the cooling fins are connected by the heat pipe, the cooling fins with high temperature transfer the heat to the cooling fins with low temperature, thereby playing the role of reducing the overall temperature; meanwhile, a patch is attached to the joint of the heat radiating fin and the heat pipe, and the patch has a heat conduction fixing function, namely the patch plays a role in further radiating on one hand and plays a role in fixing the heat pipe and the heat radiating fin on the other hand.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of embodiment 2 of the present invention;

fig. 3 is a schematic structural diagram of embodiment 3 of the present invention;

fig. 4 is a schematic structural diagram of embodiment 4 of the present invention;

fig. 5 is a schematic structural diagram of embodiment 5 of the present invention;

fig. 6 is a schematic structural diagram of embodiment 6 of the present invention.

In the drawings, each reference numeral denotes:

10. a heat pipe; 11. pasting a piece; 12. a heat sink; 13. a connecting pipe; 14. a thermally conductive material.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Example 1:

as shown in fig. 1, the present embodiment provides a heat dissipation device for solving a narrow space, which includes a heat pipe 10, a patch 11 and a heat sink 12. In this embodiment, the number of the heat pipe 10 is one, the number of the heat dissipation fins 12 is two and the heat dissipation fins are arranged side by side, the heat pipe 10 is connected with the two heat dissipation fins 12, the patch 11 is a heat conduction fixing member, and the connection positions of the heat dissipation fins 12 and the heat pipe 10 are both attached with the patch 11.

The heat dissipation device for solving the problem of narrow space provided by the embodiment can connect different heat dissipation fins by using the heat pipe in a limited space, and after the heat dissipation fins are connected by the heat pipe, the heat dissipation fins with high temperature transfer heat to the heat dissipation fins with low temperature, so that the effect of reducing the overall temperature is achieved; meanwhile, a patch is attached to the joint of the heat radiating fin and the heat pipe, and the patch has a heat conduction fixing function, namely the patch plays a role in further radiating on one hand and plays a role in fixing the heat pipe and the heat radiating fin on the other hand.

In this embodiment, the patch 11 is preferably made of a high thermal conductivity material, which may be, but is not limited to, a single metal material such as copper or aluminum, or graphite, a composite material of aluminum foil and graphite (i.e., graphite aluminum foil), a composite material of copper foil and graphite (i.e., graphite copper foil), or the like.

In this embodiment, the heat pipe 10 is a hollow pipe filled with condensed liquid. The heat pipe 10 is a hollow tube evacuated and has a condensable working fluid (e.g., water) enclosed therein. That is, the heat pipe 10 is a heat transfer device that transfers heat in the form of latent heat of the working fluid.

In the present embodiment, the heat sink 12 is made of a material having good thermal conductivity (such as aluminum, copper, aluminum alloy, or graphite, but not limited to the above materials), and is integrally soldered to the upper surface of the IC in parallel with each other at regular intervals. That is, the heat sink 12 stands upright on the upper surface of the IC. Further, the heat radiating fins 12 may be integrally fitted together by bending predetermined portions thereof at right angles, such as the lower end portion or the front end portion, and connecting the adjacent heat radiating fins.

Example 2:

as shown in fig. 2, the present embodiment is different from embodiment 1 in that: the number of the patches 11 and the number of the heat sinks 12 are two, and the two patches 11 are respectively attached to the opposite surfaces of the two heat sinks 12. But not limited to this, in other embodiments, the number of the patches 11 may also be three or more, the number of the heat sinks 12 may also be three or more, and the specific arrangement of the patches 11 and the heat sinks 12 is determined according to actual requirements, and will not be described in detail herein.

Example 3:

as shown in fig. 3, the present embodiment is different from embodiment 1 in that the number of the heat dissipation fins 12 is two, one patch 11 is disposed between the two heat dissipation fins 12, and both ends of the patch 11 are respectively connected to the opposite surfaces of the two heat dissipation fins 12, which can further enhance the heat conduction and the effect of fixing the heat dissipation fins 12 and the heat pipe 10.

Example 4:

as shown in fig. 4, the present embodiment is different from embodiment 3 in that the number of the heat pipes 10 is two, and the two heat pipes 10 are respectively disposed at both ends of the heat sink 12. But not limited thereto, in other embodiments, the number of the heat sinks 12 and the heat pipes 10 may also be three or four, and the arrangement is preferably as follows: all the heat sinks 12 are arranged side by side and all the heat pipes 10 are arranged side by side.

Example 5:

as shown in fig. 5, the present embodiment is different from embodiment 1 in that: the heat dissipation device for solving the problem of narrow space further comprises a connecting pipe 13, and the upper ends or the lower ends of the two heat pipes 10 are connected through the connecting pipe 13 to form a U-shaped pipe structure. The heat pipe 10 is formed in a U shape, so that the heat dissipation speed can be greatly increased, and the purpose of rapidly balancing the temperatures of different heat dissipation fins is achieved.

Example 6:

as shown in fig. 6, the present embodiment is different from embodiment 5 in that: an accommodating space is formed between the two heat pipes 10, the connecting pipe 13 and the radiating fins 12 close to the connecting pipe, and the accommodating space is filled with a heat conducting material 14. The heat conducting material 14 may be a conventional material with a heat conducting function, such as a copper material or an aluminum material, and of course, the heat conducting material 14 may also be a heat sink directly, that is, a heat sink is directly filled in the accommodating space. The provision of the thermally conductive material 14 may further enhance the thermal conduction and the effect of securing the heat sink 12 and heat pipe 10.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (9)

1. The utility model provides a solve heat abstractor in narrow and small space, its characterized in that includes heat pipe (10), paster (11) and two at least fin (12) that set up side by side, at least two are connected in heat pipe (10) fin (12), paster (11) are the heat conduction mounting, fin (12) with the junction of heat pipe (10) all has been laminated paster (11).

2. The narrow space heat dissipation device according to claim 1, wherein the number of the patches (11) and the heat dissipation fins (12) is two, and the two patches (11) are respectively attached to the opposite surfaces of the two heat dissipation fins (12).

3. The narrow space heat dissipation device according to claim 1, wherein the number of the heat dissipation fins (12) is two, one of the patches (11) is disposed between the two heat dissipation fins (12), and both ends of the patch (11) are respectively connected to the opposite surfaces of the two heat dissipation fins (12).

4. The narrow space heat dissipation device as recited in any one of claims 1 to 3, wherein the patch (11) is a copper member, an aluminum member, a graphite aluminum foil member or a graphite copper foil member.

5. The narrow space heat dissipation device as recited in claim 1, wherein the number of the heat pipes (10) is two, and the two heat pipes (10) are respectively disposed at both ends of the heat dissipation plate (12).

6. The narrow space heat dissipation device according to claim 5, further comprising a connection pipe (13), wherein the upper end or the lower end of the two heat pipes (10) are connected by the connection pipe (13) to form a U-shaped pipe structure.

7. The narrow space heat dissipation device according to claim 6, wherein a receiving space is formed between the two heat pipes (10), the connecting pipe (13) and the heat dissipation fins (12) adjacent to the connecting pipe, and the receiving space is filled with a heat conductive material (14).

8. The narrow space-resolving heat dissipating device as claimed in any one of claims 1 to 3 or 5 to 7, wherein the heat pipe (10) is a hollow tube filled with a condensed liquid.

9. The narrow space heat dissipating device according to claim 1, wherein the heat dissipating fins (12) are made of aluminum, aluminum alloy, copper or graphite.