CN209841195U - Thermal imaging display instrument structural assembly - Google Patents
Thermal imaging display instrument structural assembly Download PDFInfo
- Publication number
- CN209841195U CN209841195U CN201920262333.XU CN201920262333U CN209841195U CN 209841195 U CN209841195 U CN 209841195U CN 201920262333 U CN201920262333 U CN 201920262333U CN 209841195 U CN209841195 U CN 209841195U
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- heat dissipation
- thermal imaging
- imaging display
- fin
- installing support
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Abstract
The utility model belongs to the technical field of thermal imaging display instrument, specifically provide a thermal imaging display instrument structure subassembly, including plastic casing, the metal installing support, PCB board and a plurality of fin, the installing support outside is wrapped up by plastic casing, the PCB inboard is built-in the installing support, the one side of interior fin is hugged closely to the PCB board dorsal aspect, the another side and the outer fin of interior fin are hugged closely, outer fin communicates with each other with the external world, through bolted connection between each spare part, the below of installing support is equipped with the slotted hole that supplies outer fin to stretch out, the heat of PCB board distributes the external world after inside and outside fin like this, and plastic casing wraps up whole installing support, light in weight has, the outward appearance is good and not scald the advantage of hand, on the other hand, the installing support can guarantee holistic intensity for the metalwork piece.
Description
Technical Field
The utility model belongs to the technical field of thermal imaging display appearance, concretely relates to thermal imaging display appearance construction package.
Background
The thermal imaging display instrument is a detection device which detects infrared energy (i.e. heat) in a non-contact manner, converts the infrared energy into an electric signal, generates a thermal image and a temperature value on a display and can calculate the temperature value. As an efficient imaging apparatus, an infrared thermal imager is widely used in equipment maintenance, electric wire apparatus maintenance, and power station monitoring. The thermal imaging camera in the current market adopts a plastic shell or a metal shell, the plastic shell has the advantages of light weight and low cost, but the strength is weak and the heat dissipation is poor; the metal shell has good strength and heat dissipation, but the structure is heavy and the cost is high.
Disclosure of Invention
The utility model aims at overcoming the poor problem of heavy heat dissipation of thermal imaging system quality among the prior art.
Therefore, the utility model provides a thermal imaging display instrument structure subassembly, including shell, installing support, PCB board, interior fin and outer fin, the installing support with shell bolted connection, just the installing support is the metalwork, the shell is the working of plastics, the PCB board reaches interior fin is all installed in the support, just interior fin is hugged closely simultaneously the PCB board back, the another side of interior fin is hugged closely on the outer fin, outer fin with the connection can be dismantled to the installing support, just outer fin communicates with each other with the outside air.
Preferably, the PCB board is bolted to the bracket, and the inner heat sink is bolted to the PCB board.
Preferably, the mounting bracket is made of aluminum alloy.
Preferably, the surface of the inner radiating fin is coated with heat conducting mud or heat conducting silica gel.
Preferably, the structure component further comprises a heat dissipation grid, one end of the heat dissipation grid is abutted against the outer side of the outer heat dissipation sheet, at least one insertion block matched with the insertion hole of the mounting bracket is arranged on the heat dissipation grid, a plurality of heat dissipation gaps are formed in the heat dissipation grid, and the heat dissipation gaps are communicated with the outside.
Preferably, a plurality of U-shaped grooves are formed in the radiating grids, and the radiating gaps are respectively formed in the side edges of the U-shaped grooves.
Preferably, the mounting bracket flank is equipped with the pick up seat that is used for installing laser emitter, be equipped with the wedge groove on the pick up seat.
Preferably, the inner heat sink and the outer heat sink are made of 1060 aluminum plates.
The utility model has the advantages that: the utility model provides a this kind of thermal imaging display instrument structure subassembly, including plastic casing, the metal installing support, PCB board and a plurality of fin, the installing support outside is wrapped up by plastic casing, the PCB inboard is built-in the installing support, the one side of interior fin is hugged closely to PCB board dorsal surface, the another side of interior fin is hugged closely with outer fin, outer fin communicates with each other with the external world, pass through bolted connection between each spare part, the below of installing support is equipped with the slotted hole that supplies outer fin to stretch out, the heat of PCB board distributes the external world behind the inside and outside fin like this, and the whole installing support of plastic casing parcel, and has light in weight, the outward appearance is good and not scald the advantage of hand, on the other hand, the installing support can guarantee holistic intensity for the metalwork.
The present invention will be described in further detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of the assembly of the structural components of the thermal imaging display of the present invention;
FIG. 2 is a schematic view of a mounting bracket structure of the structural assembly of the thermal imaging display of the present invention;
FIG. 3 is a schematic cross-sectional view of a thermal imaging display structural assembly of the present invention;
FIG. 4 is a partial enlarged view of the structural components of the thermal imaging display of the present invention;
fig. 5 is a schematic view of a heat dissipation grid of the thermal imaging display structural assembly of the present invention.
Description of reference numerals: the heat dissipation structure comprises a shell 1, a mounting bracket 2, a pickup seat 3, a PCB 4, an inner cooling fin 5, an outer cooling fin 6, a cooling grid 7, a cooling gap 8, a threaded hole 9, an insertion block 10 and heat conduction silica gel 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The utility model provides a thermal imaging display instrument structure subassembly, including shell 1, installing support 2, PCB board 4, interior fin 5 and outer fin 6, installing support 2 with 1 bolted connection of shell, just installing support 2 is the metalwork, shell 1 is the working of plastics, PCB board 4 reaches interior fin 5 is all installed in support 2, just 5 one sides of interior fin are hugged closely the 4 backs of PCB board, the another side of interior fin 5 is hugged closely on the outer fin 6, outer fin 6 with installing support 2 can dismantle the connection, just outer fin 6 communicates with each other with the outside air. Therefore, as shown in fig. 1, the thermal imaging display is generally a portable handheld thermal imaging display, when in use, the housing 1 is held by a hand, the housing 1 is made of plastic and does not conduct heat, and heat dissipated by the PCB 4 inside the mounting bracket 2 is dissipated from the lower side after passing through the inner heat dissipation sheet 5 and the outer heat dissipation sheet 6, so as to avoid scalding the hand when holding the thermal imaging display by hand. Wherein, all pass through bolted connection between each spare part, in order to alleviate the quality and avoid the electric leakage, can adopt the plastics bolt. As shown in fig. 2, the mounting bracket 2 has a threaded hole 9 for mounting the image display device, and other mounting threaded holes, such as the threaded hole of the mounting leather holder 3.
As shown in fig. 3 and 4, when the heat dissipation device is installed, the PCB 4 is installed in the installation support 2, then the inner heat dissipation plate 5 is tightly attached to the back surface of the PCB 4, the size of the inner heat dissipation plate 5 is the same as or close to that of the PCB 4, heat of the PCB 4 can be absorbed to the maximum extent on the premise that the installation can be guaranteed, then the outer heat dissipation plate 6 is tightly attached to the other surface of the inner heat dissipation plate 5, the outer heat dissipation plate 6 is communicated with the outside, and heat can be dissipated. In other implementation scenarios, the inner heat sink 5 and the outer heat sink 6 may be integrally cast, but preferably made of two pieces in view of installation convenience.
Preferably, the PCB 4 is bolted to the bracket 2, and the inner heat sink 5 is bolted to the PCB 4. Bolted connection prevents the shake between the spare part, and convenient the dismantlement also can be the buckle connection, sets up the notch in installing support 2, insert from the tip can.
Preferably, the mounting bracket 2 is made of aluminum alloy. Thus, the aluminum alloy has a light weight and is easily subjected to secondary processing, and the threaded hole can be processed again as required.
Preferably, the surface of the inner heat sink 5 is coated with heat conducting mud or heat conducting silica gel 11. As shown in fig. 4, after the inner fin 5 is mounted, the outer surface of the inner fin 5 is coated with heat conductive paste or silica gel 11, so that the inner fin 5 can better conduct heat to the outer fin 6.
Preferably, the structural component further comprises a heat dissipation grid 7, one end of the heat dissipation grid 7 abuts against the outer side of the outer heat dissipation sheet 6, at least one insertion block 10 matched with the insertion hole of the mounting bracket 2 is arranged on the heat dissipation grid 7, a plurality of heat dissipation gaps 8 are arranged on the heat dissipation grid 7, and the heat dissipation gaps 8 are communicated with the outside. Therefore, as shown in fig. 4 and 5, the heat dissipation grid 7 is inserted into the mounting bracket 2 through the insertion block 10, after the insertion, the heat dissipation grid 7 is abutted against the outer side of the outer heat dissipation sheet 6, so as to facilitate heat transfer, a plurality of heat dissipation gaps 8 are formed below the heat dissipation grid 7, and heat is dissipated along the direction of the arrow in fig. 5. And the heat dissipation grating 7 is a plastic hollow part, so that the appearance is good, hands are not scalded, heat flows out from the heat dissipation gap 8 to the outside, and heat is more favorably led out.
In a preferable scheme, the heat dissipation grating 7 is provided with a plurality of U-shaped grooves, and the heat dissipation gaps 8 are respectively located on the sides of the U-shaped grooves. Therefore, as shown in fig. 4 and 5, the U-shaped groove can improve the air convection, accelerate heat exchange, improve the heat dissipation efficiency, and open the heat dissipation gap 8 at the lower side of the U-shaped groove, and the hollow part of the heat dissipation gap 8 is directly communicated with the outside, so that the heat in the U-shaped groove can be dissipated through the heat dissipation gap 8 and the tail end of the U-shaped groove, and the heat dissipation speed is further accelerated.
In the preferred scheme, the lateral wing of the mounting bracket 2 is provided with a leather clamping seat 3 for mounting the laser emitter, and the leather clamping seat is provided with a wedge-shaped groove. Therefore, as shown in fig. 1 to 3, the mounting bracket 2 is provided with a screw hole for mounting the leather clamping seat 3, and the leather clamping seat 3 is provided with a wedge-shaped groove for mounting the laser emitter.
Preferably, the inner heat sink 5 and the outer heat sink 6 are made of 1060 aluminum plates. Therefore, the 1060 aluminum plate has characteristics of light weight, good ductility, and easy processing, and has a certain strength.
The utility model has the advantages that: the utility model provides a this kind of thermal imaging display instrument structure subassembly, including plastic casing, the metal installing support, PCB board and a plurality of fin, the installing support outside is wrapped up by plastic casing, the PCB inboard is built-in the installing support, the one side of interior fin is hugged closely to PCB board dorsal surface, the another side of interior fin is hugged closely with outer fin, outer fin communicates with each other with the external world, pass through bolted connection between each spare part, the below of installing support is equipped with the slotted hole that supplies outer fin to stretch out, the heat of PCB board distributes the external world behind the inside and outside fin like this, and the whole installing support of plastic casing parcel, and has light in weight, the outward appearance is good and not scald the advantage of hand, on the other hand, the installing support can guarantee holistic intensity for the metalwork.
The above examples are merely illustrative of the present invention and do not limit the scope of the present invention, and all designs identical or similar to the present invention are within the scope of the present invention.
Claims (8)
1. A structural assembly for a thermal imaging display device, comprising: including shell (1), installing support (2), PCB board (4), interior fin (5) and outer heat dissipation piece (6), installing support (2) with shell (1) bolted connection, just installing support (2) are the metalwork, shell (1) is the working of plastics, PCB board (4) reach interior fin (5) are all installed in support (2), just interior fin (5) one side is hugged closely PCB board (4) the back, the another side of interior fin (5) is hugged closely on outer heat dissipation piece (6), outer heat dissipation piece (6) with installing support (2) can dismantle the connection, just outer heat dissipation piece (6) communicate with each other with the outside air.
2. A thermal imaging display construction assembly according to claim 1 wherein: the PCB (4) is connected with the bracket (2) through bolts, and the inner cooling fins (5) are connected with the PCB (4) through bolts.
3. A thermal imaging display construction assembly according to claim 1 wherein: the mounting bracket (2) is made of aluminum alloy.
4. A thermal imaging display construction assembly according to claim 1 wherein: the surface of the inner radiating fin (5) is coated with heat conducting mud or heat conducting silica gel (11).
5. A thermal imaging display construction assembly according to claim 1 wherein: the structure component further comprises a heat dissipation grid (7), one end of the heat dissipation grid (7) is abutted against the outer side of the outer heat dissipation sheet (6), at least one insertion block (10) matched with the insertion holes of the mounting support (2) is arranged on the heat dissipation grid (7), a plurality of heat dissipation gaps (8) are formed in the heat dissipation grid (7), and the heat dissipation gaps (8) are communicated with the outside.
6. A thermal imaging display construction assembly according to claim 5 wherein: a plurality of U-shaped grooves are formed in the radiating grids (7), and the radiating gaps (8) are located on the side edges of the U-shaped grooves respectively.
7. A thermal imaging display construction assembly according to claim 1 wherein: the lateral wing of the mounting bracket (2) is provided with a pickup seat for mounting the laser emitter, and the pickup seat is provided with a wedge-shaped groove.
8. A thermal imaging display construction assembly according to claim 1 wherein: the inner radiating fins (5) and the outer radiating fins (6) are both made of 1060 aluminum plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920262333.XU CN209841195U (en) | 2019-03-01 | 2019-03-01 | Thermal imaging display instrument structural assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920262333.XU CN209841195U (en) | 2019-03-01 | 2019-03-01 | Thermal imaging display instrument structural assembly |
Publications (1)
| Publication Number | Publication Date |
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| CN209841195U true CN209841195U (en) | 2019-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920262333.XU Active CN209841195U (en) | 2019-03-01 | 2019-03-01 | Thermal imaging display instrument structural assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111637973A (en) * | 2020-05-03 | 2020-09-08 | 浙江明阳红外技术股份有限公司 | Outdoor handheld thermal infrared imager |
-
2019
- 2019-03-01 CN CN201920262333.XU patent/CN209841195U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111637973A (en) * | 2020-05-03 | 2020-09-08 | 浙江明阳红外技术股份有限公司 | Outdoor handheld thermal infrared imager |
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