CN218920854U - Monitoring equipment with radiating effect - Google Patents

Monitoring equipment with radiating effect Download PDF

Info

Publication number
CN218920854U
CN218920854U CN202223211084.2U CN202223211084U CN218920854U CN 218920854 U CN218920854 U CN 218920854U CN 202223211084 U CN202223211084 U CN 202223211084U CN 218920854 U CN218920854 U CN 218920854U
Authority
CN
China
Prior art keywords
circuit board
integrated circuit
installation shell
heat dissipation
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202223211084.2U
Other languages
Chinese (zh)
Inventor
王安春
董海军
王静
孙官华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weifang Langtai Electronic Technology Co ltd
Original Assignee
Weifang Langtai Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weifang Langtai Electronic Technology Co ltd filed Critical Weifang Langtai Electronic Technology Co ltd
Priority to CN202223211084.2U priority Critical patent/CN218920854U/en
Application granted granted Critical
Publication of CN218920854U publication Critical patent/CN218920854U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses monitoring equipment with a heat dissipation effect, which comprises a mounting shell, wherein a top cover is detachably connected to the top of the mounting shell, a protective sheet is arranged at the front end of the interior of the mounting shell, a camera lens is arranged in the mounting shell, an integrated circuit board is arranged on the right side of the camera lens in the mounting shell, a support frame is arranged on the outer side of the integrated circuit board, the support frame is arranged in the mounting shell, a plurality of air inlets and air outlets are arranged on the lower side of the integrated circuit board, the air inlets and the air outlets are arranged at the bottom of the mounting shell, the outer surfaces of the air inlets and the air outlets are in a horn shape, the diameter of the lower ends of the air inlets is larger than the diameter of the upper ends of the air outlets, the diameter of the upper ends of the air outlets is larger than the diameter of the lower ends of the air outlets, a plurality of heat conducting blocks are arranged at the bottom of the mounting shell, the top ends of the heat conducting blocks are attached to the integrated circuit board, two semiconductor refrigerating sheets are arranged below the top cover, and a plurality of heat dissipation rods connected with the top covers are arranged on each semiconductor refrigerating sheet. The utility model has simple structure and good heat dissipation effect.

Description

Monitoring equipment with radiating effect
Technical Field
The utility model relates to the field of monitoring equipment, in particular to monitoring equipment with a heat dissipation effect.
Background
The monitoring camera is a semiconductor imaging device and has the advantages of high sensitivity, strong light resistance, small deformation, small volume, long service life, vibration resistance and the like. A security system for a surveillance camera.
Along with the rapid development of microelectronic technology, the size of chip is smaller and smaller, the operation speed is faster and the calorific value is larger and larger, the chip in the advanced camera is smaller, the chip in the monitoring camera needs to run all the time and continuously emits heat, when the temperature in summer is higher, the internal heat dissipation effect of the existing camera is insufficient, so that the temperature of the chip can be too high to cause clamping and even damage electronic elements, therefore, aiming at the current situation, the development of the monitoring equipment with the heat dissipation effect, which has the advantages of simple structure and good heat dissipation effect, is urgently needed to overcome the defects in the current practical application, and meets the current demands.
Disclosure of Invention
The utility model aims to provide a monitoring device with a heat dissipation effect so as to solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a supervisory equipment with radiating effect, includes the installation shell, the top of installation shell is dismantled and is connected with the top cap, the protection piece is installed to the inside front end of installation shell, install the camera lens in the installation shell, install the integrated circuit board in the installation shell on the right side of camera lens, the support frame is installed in the installation shell to the outside of integrated circuit board, the camera lens passes through wire and integrated circuit board electric connection, a plurality of air inlets and gas outlet are installed to the downside of integrated circuit board, air inlet and gas outlet are all installed in the bottom of installation shell, the outward appearance of air inlet and gas outlet is loudspeaker shape, the lower extreme diameter of air inlet is greater than the upper end diameter, the upper end diameter of gas outlet is greater than the lower extreme diameter, a plurality of heat conduction blocks are installed to the bottom of installation shell, the top and the integrated circuit board laminating mutually of heat conduction block, two semiconductor cooling pieces are installed to the below of top cap, every all install the radiating rod that a plurality of top caps link to each other on the semiconductor cooling piece.
As a further scheme of the utility model: the protection sheet is made of transparent materials, an installation clamping groove is formed in the front end of the installation shell, and the bottom of the protection sheet is clamped in the installation clamping groove.
As still further aspects of the utility model: the plurality of air inlets and the plurality of air outlets are alternately arranged.
As still further aspects of the utility model: the heat conducting block and the heat radiating rod are both made of copper.
As still further aspects of the utility model: the heat absorption end of the semiconductor refrigerating sheet is attached to the integrated circuit board, and the heat emission end of the semiconductor refrigerating sheet is attached to the heat dissipation rod.
The beneficial effects are that: this supervisory equipment with radiating effect, during the use, the integrated circuit board sends heat, the lower extreme diameter of air inlet is greater than the upper end diameter, be convenient for outside air from the air inlet entering, and because the upper end of air inlet is less can prevent that the rainwater from getting into, the upper end diameter of gas outlet is greater than the lower extreme diameter, the inside air outflow of installation shell of being convenient for, and then realize the circulation of air inside and outside the installation shell, improve the radiating effect, simultaneously, can absorb the heat of integrated circuit board through the heat conduction piece, then with the outside of heat transfer to the installation shell, directly refrigerate the integrated circuit board through the semiconductor refrigeration piece, heat transfer to the outside of installation shell with the heat release of semiconductor refrigeration piece through the radiating rod, and then improve radiating efficiency. In conclusion, the utility model has simple structure and good heat dissipation effect.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic perspective view of a second embodiment of the present utility model.
Fig. 3 is an internal cross-sectional view of the present utility model.
Fig. 4 is an exploded view of the present utility model.
In the figure: 1. a mounting shell; 101. installing a clamping groove; 2. a top cover; 201. a screw; 3. a protective sheet; 4. an air inlet; 5. an air outlet; 6. a heat conduction block; 7. an integrated circuit board; 701. a support frame; 8. an imaging lens; 9. a semiconductor refrigeration sheet; 10. a heat dissipation rod.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
Examples
Referring to fig. 1 to 4, in an embodiment of the present utility model, a monitoring device with a heat dissipation effect includes a mounting case 1, a top cover 2 is detachably connected to the top of the mounting case 1, the top cover 2 is connected to the mounting case 1 through a plurality of screws 201, the top cover 2 and the mounting case 1 can be separated by removing the screws 201, so as to facilitate maintenance of the inside of the mounting case 1, a protection sheet 3 is mounted at the front end of the inside of the mounting case 1, the protection sheet 3 is made of a transparent material, a mounting clamping groove 101 is provided at the front end of the mounting case 1, the bottom of the protection sheet 3 is clamped in the mounting clamping groove 101, a camera lens 8 is mounted in the mounting case 1, an integrated circuit board 7 is mounted on the right side of the camera lens 8 in the mounting case 1, a support 701 is mounted on the outside of the integrated circuit board 7, the support 701 is mounted in the mounting case 1, the camera lens 8 is electrically connected to the integrated circuit board 7 through a wire, the image is acquired through the camera lens 8, the acquired image is sent to the integrated circuit board 7 by the camera lens 8, the image information is sent to the control terminal by the integrated circuit board 7, a person can see a monitoring picture at the control terminal, a plurality of air inlets 4 and air outlets 5 are arranged at the lower side of the integrated circuit board 7, the air inlets 4 and the air outlets 5 are alternately arranged, the air inlets 4 and the air outlets 5 are all arranged at the bottom of the installation shell 1, rainwater can be prevented from entering, the outer surfaces of the air inlets 4 and the air outlets 5 are in a horn shape, the diameter of the lower end of the air inlet 4 is larger than the diameter of the upper end, the outside air can be conveniently entered from the air inlet 4, the diameter of the upper end of the air outlet 5 is larger than the diameter of the lower end, the inside of the installation shell 1 can be conveniently discharged, the air circulation inside and outside the installation shell 1 can be further realized, the heat dissipation effect is improved, a plurality of heat conducting blocks 6 are installed at the bottom of the installation shell 1, the top ends of the heat conducting blocks 6 are attached to the integrated circuit board 7, heat of the integrated circuit board 7 can be absorbed through the heat conducting blocks 6, then the heat is transferred to the outer side of the installation shell 1, two semiconductor refrigerating sheets 9 are installed below the top cover 2, when direct current passes through a couple formed by connecting two different semiconductor materials in series, the semiconductor refrigerating sheets 9 (prior art) can absorb the heat and emit the heat respectively at the two ends of the couple, the purpose of refrigeration can be achieved, a plurality of heat dissipation rods 10 connected with the top cover 2 are installed on each semiconductor refrigerating sheet 9, the heat absorption ends of the semiconductor refrigerating sheets 9 are attached to the integrated circuit board 7, the heat dissipation ends of the semiconductor refrigerating sheets 9 are attached to the heat dissipation rods 10, the heat dissipation ends of the semiconductor refrigerating sheets 9 are directly refrigerated to the integrated circuit board 7, the heat dissipation ends of the semiconductor refrigerating sheets 9 are transferred to the outer side of the installation shell 1 through the heat dissipation rods 10, further the heat dissipation efficiency is improved, the heat conducting blocks 6 and the rods 10 are made of copper, and the copper has good heat dissipation performance, and heat dissipation performance is convenient to conduct heat dissipation.
The working principle of the utility model is as follows: this supervisory equipment with radiating effect, during the use, integrated circuit board 7 gives off heat, the lower extreme diameter of air inlet 4 is greater than the upper end diameter, be convenient for outside air from air inlet 4 get into, and because the upper end of air inlet 4 is less can prevent that the rainwater from getting into, the upper end diameter of gas outlet 5 is greater than the lower extreme diameter, the inside air outflow of installation shell 1 of being convenient for, and then realize the circulation of air inside and outside installation shell 1, improve the radiating effect, simultaneously, can absorb the heat of integrated circuit board 7 through heat conduction piece 6, then with the outside of heat transfer to installation shell 1, directly refrigerate integrated circuit board 7 through semiconductor refrigeration piece 9, the outside of the heat transfer to installation shell 1 of the radiating end of semiconductor refrigeration piece 9 through radiating rod 10, and then improve radiating efficiency.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. Monitoring equipment with radiating effect, its characterized in that: including the installation shell, the top of installation shell is dismantled and is connected with the top cap, the protection piece is installed to the inside front end of installation shell, install the camera lens in the installation shell, install the integrated circuit board in the installation shell on the right side of camera lens, the support frame is installed in the outside of integrated circuit board, the support frame is installed in the installation shell, camera lens passes through wire and integrated circuit board electric connection, a plurality of air inlets and gas outlet are installed to the downside of integrated circuit board, air inlet and gas outlet are all installed in the bottom of installation shell, the outward appearance of air inlet and gas outlet all is loudspeaker shape, the lower extreme diameter of air inlet is greater than the upper end diameter, the upper end diameter of gas outlet is greater than the lower extreme diameter, a plurality of heat conduction blocks are installed to the bottom of installation shell, the top and the integrated circuit board laminating mutually of heat conduction block, two semiconductor refrigeration pieces are installed to the below of top cap, every all install a plurality of radiator bars that link to each other on the semiconductor refrigeration piece.
2. The monitoring device with heat dissipation effect according to claim 1, wherein: the protection sheet is made of transparent materials, an installation clamping groove is formed in the front end of the installation shell, and the bottom of the protection sheet is clamped in the installation clamping groove.
3. The monitoring device with heat dissipation effect according to claim 1, wherein: the plurality of air inlets and the plurality of air outlets are alternately arranged.
4. The monitoring device with heat dissipation effect according to claim 1, wherein: the heat conducting block and the heat radiating rod are both made of copper.
5. The monitoring device with heat dissipation effect according to any one of claims 1 to 4, wherein: the heat absorption end of the semiconductor refrigerating sheet is attached to the integrated circuit board, and the heat emission end of the semiconductor refrigerating sheet is attached to the heat dissipation rod.
CN202223211084.2U 2022-12-01 2022-12-01 Monitoring equipment with radiating effect Active CN218920854U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223211084.2U CN218920854U (en) 2022-12-01 2022-12-01 Monitoring equipment with radiating effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223211084.2U CN218920854U (en) 2022-12-01 2022-12-01 Monitoring equipment with radiating effect

Publications (1)

Publication Number Publication Date
CN218920854U true CN218920854U (en) 2023-04-25

Family

ID=86049471

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223211084.2U Active CN218920854U (en) 2022-12-01 2022-12-01 Monitoring equipment with radiating effect

Country Status (1)

Country Link
CN (1) CN218920854U (en)

Similar Documents

Publication Publication Date Title
CN110425435B (en) Novel LED lamp with high-efficiency heat dissipation
CN211061064U (en) Built-in air-cooled heat abstractor and infrared detector of infrared core
CN112702480B (en) Camera and communication equipment
CN110505796A (en) It is a kind of for improving the exchange cabinet of interchanger radiating efficiency
CN218920854U (en) Monitoring equipment with radiating effect
CN211908932U (en) Monitoring camera heat abstractor
CN210624740U (en) Electrical box assembly, outdoor unit and air conditioner
CN204807895U (en) Vidicon
CN214204542U (en) Laboratory power supply management device based on thing networking
CN216357881U (en) Electrical control equipment of filtering system
CN210986182U (en) Security protection camera monitoring infrared lamp panel module
CN214315281U (en) Heat dissipation type wireless signal shielding ware
CN212781636U (en) Camera with water cooling and semiconductor refrigeration combined refrigeration
CN211184323U (en) Internal isolation heat dissipation device for ballast
CN214745048U (en) LED lamp board that radiating efficiency is high
CN221225222U (en) SMT liquid crystal display module
CN219228279U (en) High-efficient heat dissipation type ultrathin LED die-casting aluminum sleeve
CN216414320U (en) Network data safety isolation equipment
CN220693256U (en) Security protection camera heat abstractor
CN218001306U (en) Aluminum profile radiator of multifunctional LED lamp
CN211378093U (en) Heat dissipation device of monitoring camera
CN215991670U (en) Transistor inversion layout structure of motor controller and unmanned aerial vehicle
CN216670446U (en) Liquid crystal module with overheat protection function
CN220629906U (en) Power module for vehicle
CN218446318U (en) Intelligent panoramic camera bulb

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant