CN213042158U - Photodiode detection integrated temperature control module - Google Patents
Photodiode detection integrated temperature control module Download PDFInfo
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- CN213042158U CN213042158U CN202022221648.5U CN202022221648U CN213042158U CN 213042158 U CN213042158 U CN 213042158U CN 202022221648 U CN202022221648 U CN 202022221648U CN 213042158 U CN213042158 U CN 213042158U
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Abstract
The utility model discloses a photodiode detection integrated temperature control module, which relates to the field of optical communication, and comprises a shell, a circuit board connector, a semiconductor refrigerator, a heat conduction platform, a temperature sensor, a PIN photodiode and a PIN tube stopper; the circuit board is fixed on the shell, the circuit board and the shell form a box body, and the semiconductor refrigerator, the heat conduction platform, the temperature sensor, the PIN photodiode and the PIN tube limiting block are arranged in the box body; the semiconductor refrigerator comprises two opposite surfaces, the heat conduction platform is fixed on one surface of the semiconductor refrigerator, and the other surface of the semiconductor refrigerator is tightly attached to the shell; the heat conducting platform is provided with a heat conducting groove, and the PIN photodiode is arranged in the heat conducting groove; the PIN tube limiting block fixes the PIN photodiode and the heat conducting platform on the semiconductor refrigerator; and the PIN of the PIN photodiode, the temperature sensor and the semiconductor refrigerator are electrically connected with the circuit board. The module is small in size and convenient to detach, replace and maintain.
Description
Technical Field
The application relates to the field of optical communication, in particular to a photodiode detection integrated temperature control module.
Background
A photodiode is a photoelectric sensing device that converts an optical signal into an electrical signal, which is commonly used in optical communications. In the development and design of optical communication products, a PIN (Positive internal-Negative) photodiode is generally used as a photodetector. The PIN type photodiode is also called a PIN junction diode or a PIN diode, is a photodetector which generates an I-type layer between a P region and an N region in a PN junction between two semiconductors or in a region adjacent to a junction between a semiconductor and a metal, absorbs light radiation, and generates a photocurrent, and has the advantages of small junction capacitance, short transit time, high sensitivity, and the like.
In the development and design of actual optical communication products, a plurality of PIN photodiodes are often used for signal detection, the PIN photodiodes are sensitive to the ambient temperature, and the ambient temperature can influence the detection efficiency, so that temperature control is required; in addition, if a plurality of PIN photodiodes are scattered in actual detection, the detection module is bulky and inconvenient to replace, move and maintain.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a technical problem that will solve provides a photodiode detects integrated temperature control module, integrated temperature control module wherein is small, convenient to detach, removes, changes and maintains.
The embodiment of the utility model provides a concrete technical scheme is:
a photodiode detection integrated temperature control module comprises a shell, a circuit board connector, a semiconductor refrigerator, a heat conduction platform, a temperature sensor, a PIN photodiode and a PIN tube limiting block; the circuit board connector is fixed on the circuit board, the circuit board is fixed on the shell, the circuit board and the shell form a box body, and the semiconductor refrigerator, the heat conduction platform, the temperature sensor, the PIN photodiode and the PIN tube limiting block are arranged in the box body; the semiconductor refrigerator comprises two opposite surfaces, the heat conducting platform is fixed on one surface of the semiconductor refrigerator, and the other surface of the semiconductor refrigerator is tightly attached to the shell; the heat conduction platform is provided with a heat conduction groove, and the PIN photodiode is arranged in the heat conduction groove; the PIN tube limiting block fixes the PIN photodiode and the heat conduction platform on the semiconductor refrigerator; one end of the temperature sensor is connected to the heat conduction platform, and the other end of the temperature sensor is electrically connected with the circuit board; the semiconductor refrigerator is electrically connected with the circuit board; and the PIN of the PIN photodiode is electrically connected with the circuit board.
Preferably, the material of the housing is aluminum.
Preferably, the material of the heat conducting platform is red copper.
Preferably, the number of the PIN photodiodes is at least 1, and the number of the PIN photodiodes is equal to that of the heat conducting grooves.
Preferably, the housing includes an optical fiber guide groove and a heat dissipation groove, the semiconductor refrigerator is placed in the heat dissipation groove, and the optical fiber of the PIN photodiode is placed in the optical fiber guide groove.
Preferably, the PIN pipe stopper is provided with a limiting groove, the PIN pipe stopper fixes the PIN photodiode and the heat conduction platform to the semiconductor refrigerator, and the PIN pipe stopper is fixedly connected with the shell through a screw.
Preferably, the two sides of the PIN tube limiting block are provided with extending edges, the extending edges are provided with first screw holes, the shell is provided with second screw holes corresponding to the first screw holes, the second screw holes are formed in the two sides of the heat dissipation groove, and the PIN tube limiting block is fixed to the shell through screws.
Preferably, the circuit board is fixedly connected with the shell through screws, the circuit board occupies one surface of the box body, and the circuit board connector is arranged on the outer side of the box body.
Preferably, the circuit board is connected to an external motherboard through the circuit board connector, and the external motherboard includes an FPGA or an ARM processing chip.
According to the scheme, the integrated temperature control module for detecting the photodiodes can integrate a semiconductor refrigerator, a temperature sensor and a plurality of PIN photodiodes into a small shell, so that real-time working temperature adjustment of the PIN photodiodes is realized in a centralized manner, and the size of the detection module is greatly reduced. In addition, through directly setting up the circuit board and the circuit board connector that are used for the circuit wiring in integrated temperature control module, can realize integrated temperature control module's independence, when using, removing, changing or maintaining above-mentioned photodiode detection integrated temperature control module promptly, only need externally on the mainboard plug can, very convenient.
Specific embodiments of the present invention are disclosed in detail with reference to the following description and the accompanying drawings, which specify the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the present invention are not so limited in scope. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims. Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for helping the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. The skilled person in the art can, under the teaching of the present invention, choose various possible shapes and proportional dimensions to implement the invention according to the specific situation.
Fig. 1 is a schematic cross-sectional structure diagram of a photodiode detection integrated temperature control module according to the present application;
fig. 2 is a schematic front view of a photodiode detection integrated temperature control module according to the present application;
fig. 3 is a schematic rear view of a photodiode detection integrated temperature control module according to the present application;
FIG. 4 is a schematic front view structure diagram of the PIN tube stopper without the circuit board;
fig. 5 is a schematic front view of the present application without a circuit board.
Detailed Description
The details of the present invention can be more clearly understood with reference to the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of explanation only, and should not be construed as limiting the invention in any way. Given the teachings of the present invention, the skilled person can conceive of any possible variants based on the invention, which should all be considered as belonging to the scope of the invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application provides a photodiode detects integrated temperature control module, fig. 1 is a section structure schematic diagram of the photodiode that this application detected integrated temperature control module, fig. 2 is a front view structure schematic diagram of the photodiode that this application detected integrated temperature control module, fig. 3 is a rear view structure schematic diagram of the photodiode that this application detected integrated temperature control module, fig. 4 is a front view structure schematic diagram that this application does not contain circuit board and PIN pipe stopper, fig. 5 is a front view structure schematic diagram that this application does not contain the circuit board. Referring to fig. 1 to 3, a photodiode detection integrated temperature control module may include: casing 1, circuit board 2, circuit board connector 3, semiconductor cooler 4, heat conduction platform 5, temperature sensor 6, PIN photodiode 7, PIN pipe stopper 8. The shell 1 is made of aluminum, the aluminum has good thermal conductivity, can be used for heat dissipation of the semiconductor refrigerator 4, and is low in density, light in weight and convenient to move. The circuit board 2 is a PCB printed circuit board, and wiring is convenient. The circuit board connector 3 is used for the electric connection of circuit board 2 and outside mainboard, makes circuit board 2 connect in outside mainboard through circuit board connector 3, and outside mainboard includes processing chips such as FPGA, ARM, singlechip for closed loop feedback control of 7 ambient temperature of PIN photodiode. The semiconductor refrigerator 4 is a device for producing cold by utilizing the thermo-electric effect of a semiconductor, and is also called as a thermoelectric refrigerator, wherein the semiconductor refrigerator comprises two opposite surfaces, and one surface is heated while the other surface is refrigerated; when the current flow direction changes, the heating surface becomes a refrigerating surface, and the refrigerating surface becomes a heating surface; the required side can be controlled to heat or cool according to the current flowing direction. The heat conduction platform 5 is made of red copper, the red copper is copper simple substance, the heat conductivity is excellent, heat can be well transferred between the semiconductor refrigerator 4 and the PIN photodiode 7, and the heat conduction platform can be used as a support of the PIN photodiode 7 to fix the PIN photodiode 7 well. The temperature sensor 6 is a sensor capable of sensing temperature and converting into a usable output signal, and preferably, a platinum resistance temperature sensor is used. The preferred operating temperature of the PIN photodiode 7 at signal detection is room temperature, and therefore, temperature closed loop feedback control is required to be maintained around room temperature. The PIN pipe limiting block 8 is used for fixing and limiting the positions of the PIN photodiode 7 and the heat conducting platform 5.
Specifically, reference is made to FIGS. 1-5. The circuit board connector 3 is fixed on the circuit board 2, the circuit board 2 is fixed on the shell 1, the circuit board 2 and the shell 1 form a box body, and the semiconductor refrigerator 4, the heat conduction platform 5, the temperature sensor 6, the PIN photodiode 7 and the PIN tube limiting block 8 are arranged in the box body. The circuit board 2 and the shell 1 are fixedly connected through screws, the circuit board 2 occupies one surface of the box body, and the circuit board connector 3 is arranged on the outer side of the box body and is conveniently connected with an external mainboard in an inserting mode.
As shown with reference to fig. 4 and 5. Semiconductor cooler 4 includes two opposing faces, a thermally conductive platform 5 secured to one face of semiconductor cooler 4, and the other face of semiconductor cooler 4 abutting housing 1. The shell 1 comprises an optical fiber guide groove 10 and a heat dissipation groove 9, the semiconductor refrigerator 4 is placed in the heat dissipation groove 9, namely the other surface of the semiconductor refrigerator 4 is tightly attached to the heat dissipation groove 9; the optical fiber of the PIN photodiode 7 is placed in the optical fiber guide groove 10, and the optical fiber of the PIN photodiode 7 can extend out of the box body formed by the circuit board 2 and the shell 1 through the optical fiber guide groove 10, so that the PIN photodiode 7 is connected with an external optical device to receive an optical signal. Case 1 is made of an aluminum material, and the heat dissipation effect is good, so heat dissipation groove 9 can realize the heat dissipation of semiconductor cooler 4, and in addition, the size of the slot of heat dissipation groove 9 is determined according to the size of semiconductor cooler 4, so that heat dissipation groove 9 limits semiconductor cooler 4, i.e. limits the movement of semiconductor cooler 4. The heat conducting platform 5 is provided with a heat conducting groove, and the PIN photodiode 7 is arranged in the heat conducting groove. The PIN tube limiting block 8 fixes the PIN photodiode 7 and the heat conducting platform 5 on the semiconductor refrigerator 4; specifically, PIN pipe stopper 8 has seted up spacing recess, is fixed in PIN photodiode 7 and heat conduction platform 5 in semiconductor cooler 4 through spacing recess PIN pipe stopper 8, and PIN pipe stopper 8 passes through screw fixed connection with casing 1. Heat conduction platform 5 is between semiconductor cooler 4 and PIN photodiode 7, has placed heat conduction platform 5 in the one side of semiconductor cooler 4, has placed PIN photodiode 7 in heat conduction platform 5's the heat conduction recess, and PIN pipe stopper 8 covers PIN photodiode 7, and the left and right sides of PIN pipe stopper 8 is provided with prolongs the limit, every is prolonged and has all seted up first screw hole, sets up the second screw hole that corresponds with first screw hole on the casing 1, and the both sides of heat dissipation recess 9 are seted up to the second screw hole, are fixed in on casing 1 with PIN pipe stopper 8 through the screw to PIN pipe stopper 8's dismantlement, and then make things convenient for PIN photodiode 7's change and maintenance.
Referring to fig. 1 to 4, one end of a temperature sensor 6 is connected to the heat conducting platform 5 for monitoring the temperature of the heat conducting platform 5 in real time, and the other end of the temperature sensor 6 is electrically connected to the circuit board 2 for feeding back an electrical signal after signal conversion in real time; the semiconductor refrigerator 4 is electrically connected with the circuit board 2; the circuit board 2 is connected to an external mainboard through a circuit board connector 3, the external mainboard comprises processing chips such as an FPGA, an ARM, a single chip microcomputer and the like, and closed-loop feedback adjustment of temperature can be achieved. Specifically, the PIN photodiode 7 is arranged in a heat conducting groove of the heat conducting platform 5, due to the good heat conducting performance of the heat conducting platform 5, the temperature sensor 6 monitors the temperature of the heat conducting platform 5 in real time, namely the current working environment temperature of the PIN photodiode 7 can be sensed, the temperature sensor 6 transmits the current working environment temperature to a processing chip on an external mainboard, and the processing chip judges whether the current working environment temperature is higher or lower than the optimal working temperature of the PIN photodiode 7; if the temperature is higher than the preset temperature, the surface of the semiconductor refrigerator 4, which is in contact with the heat conducting platform 5, is controlled to refrigerate through an external mainboard, so that the working environment temperature of the PIN photodiode 7 is reduced; if the temperature is low, the surface of the semiconductor refrigerator 4, which is in contact with the heat conducting platform 5, is controlled to be heated through an external mainboard, so that the temperature of the working environment of the PIN photodiode 7 is increased, the process is a real-time monitoring and adjusting process, and therefore real-time closed-loop feedback adjustment of the temperature can be realized. In addition, the PIN of the PIN photodiode 7 is also electrically connected to the circuit board 2, and is used for transmitting the electrical signal photoelectrically converted by the PIN photodiode to the circuit board 2, and then transmitting the electrical signal to an external motherboard through the circuit board 2, and implementing post-processing of the detection signal through the external motherboard.
Through above-mentioned embodiment, not only can realize the real-time closed loop feedback of temperature and adjust, the integrated temperature control module that provides moreover is small, convenient to detach, remove, change and maintenance, when dismantling, maintenance or change, only need with this integrated temperature control module from outside mainboard pull out can, very convenient.
The number of the PIN photodiodes 7 is not limited, and is at least 1. The number of the heat conducting grooves on the heat conducting platform 5 can be equal to the number of the PIN photodiodes 7, and the number of the heat conducting grooves can be more than the number of the PIN photodiodes 7. Referring to fig. 3 and 4, when the number of the PIN photodiodes 7 is two or more, the two or more PIN photodiodes 7 may be concentrated on one heat conducting platform 5, and all the PIN photodiodes 7 may be fixed by one PIN tube stopper 8.
The present application has been described in detail with reference to specific embodiments and illustrative examples, but the description is not intended to limit the application. Those skilled in the art will appreciate that various equivalent substitutions, modifications or improvements may be made to the presently disclosed embodiments and implementations thereof without departing from the spirit and scope of the present disclosure, and these fall within the scope of the present disclosure. The protection scope of this application is subject to the appended claims.
Claims (9)
1. A photodiode detection integrated temperature control module is characterized by comprising a shell, a circuit board connector, a semiconductor refrigerator, a heat conduction platform, a temperature sensor, a PIN photodiode and a PIN tube limiting block;
the circuit board connector is fixed on the circuit board, the circuit board is fixed on the shell, the circuit board and the shell form a box body, and the semiconductor refrigerator, the heat conduction platform, the temperature sensor, the PIN photodiode and the PIN tube limiting block are arranged in the box body;
the semiconductor refrigerator comprises two opposite surfaces, the heat conducting platform is fixed on one surface of the semiconductor refrigerator, and the other surface of the semiconductor refrigerator is tightly attached to the shell;
the heat conduction platform is provided with a heat conduction groove, and the PIN photodiode is arranged in the heat conduction groove;
the PIN tube limiting block fixes the PIN photodiode and the heat conduction platform on the semiconductor refrigerator;
one end of the temperature sensor is connected to the heat conduction platform, and the other end of the temperature sensor is electrically connected with the circuit board;
the semiconductor refrigerator is electrically connected with the circuit board;
and the PIN of the PIN photodiode is electrically connected with the circuit board.
2. The integrated temperature control module for photodiode detection of claim 1, wherein the material of the housing is aluminum.
3. The integrated temperature control module for photodiode detection of claim 1, wherein the material of the thermally conductive platform is copper.
4. The integrated temperature control module for photodiode detection according to claim 1, wherein the number of the PIN photodiodes is at least 1, and the number of the PIN photodiodes is equal to the number of the heat conducting grooves.
5. The integrated temperature control module for photodiode detection of claim 1, wherein the housing comprises a fiber guide groove and a heat dissipation groove, the semiconductor refrigerator is disposed in the heat dissipation groove, and the fiber of the PIN photodiode is disposed in the fiber guide groove.
6. The photodiode detection integrated temperature control module according to claim 5, wherein the PIN tube limiting block is provided with a limiting groove, the PIN tube limiting block fixes the PIN photodiode and the heat conducting platform on the semiconductor refrigerator through the limiting groove, and the PIN tube limiting block is fixedly connected with the housing through a screw.
7. The photodiode detection integrated temperature control module according to claim 6, wherein extending edges are arranged on two sides of the PIN tube limiting block, a first screw hole is formed in each extending edge, a second screw hole corresponding to the first screw hole is formed in the shell, the second screw holes are formed in two sides of the heat dissipation groove, and the PIN tube limiting block is fixed to the shell through screws.
8. The integrated temperature control module for photodiode detection of claim 1, wherein the circuit board is fixedly connected to the housing by screws, the circuit board occupies one side of the box body, and the circuit board connector is disposed at an outer side of the box body.
9. The photodiode detection integrated temperature control module of claim 8, wherein the circuit board is connected to an external motherboard by the circuit board connector, the external motherboard comprising an FPGA or an ARM processing chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022221648.5U CN213042158U (en) | 2020-09-30 | 2020-09-30 | Photodiode detection integrated temperature control module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022221648.5U CN213042158U (en) | 2020-09-30 | 2020-09-30 | Photodiode detection integrated temperature control module |
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| CN213042158U true CN213042158U (en) | 2021-04-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113188657A (en) * | 2021-05-08 | 2021-07-30 | 国开启科量子技术(北京)有限公司 | Single photon detection device and quantum communication equipment comprising same |
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- 2020-09-30 CN CN202022221648.5U patent/CN213042158U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113188657A (en) * | 2021-05-08 | 2021-07-30 | 国开启科量子技术(北京)有限公司 | Single photon detection device and quantum communication equipment comprising same |
| CN113188657B (en) * | 2021-05-08 | 2022-05-17 | 国开启科量子技术(北京)有限公司 | Single photon detection device and quantum communication equipment comprising same |
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