CN115844430A - CT detector module temperature control structure and CT scanning equipment - Google Patents
CT detector module temperature control structure and CT scanning equipment Download PDFInfo
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- CN115844430A CN115844430A CN202211703795.3A CN202211703795A CN115844430A CN 115844430 A CN115844430 A CN 115844430A CN 202211703795 A CN202211703795 A CN 202211703795A CN 115844430 A CN115844430 A CN 115844430A
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Abstract
The application discloses CT detector module temperature control structure and CT scanning equipment includes: the device comprises a collimator, a scintillation crystal, a photodiode, a semiconductor refrigerator, a supporting block, a circuit board and a circuit board radiating block; the circuit board heat dissipation block is attached to the circuit board; two ends of the collimator are respectively and fixedly connected with the two supporting blocks, and a temperature control chamber is formed between the collimator and the circuit board radiating block; the semiconductor refrigerator is positioned at two ends of the temperature control chamber, the two ends of the semiconductor refrigerator are respectively connected with the collimator and the circuit board radiating block, one end of the semiconductor refrigerator, which is connected with the circuit board radiating block, is a heat absorption end, and the other end of the semiconductor refrigerator, which is connected with the collimator, is a heat release end; the scintillation crystal is stacked on the photodiode, and the scintillation crystal and the photodiode are positioned between the two semiconductor refrigerators. According to the method and the device, the heating efficiency is improved, accurate temperature control can be performed on a single module, and the technical effects of detector noise performance and CT image noise quality are improved.
Description
Technical Field
The application relates to the technical field of CT (computed tomography) equipment, in particular to a CT detector module temperature control structure and CT scanning equipment.
Background
In modern medical CT systems, the detector module is used as a device for acquiring image data by CT, and the role of the detector module in the whole system is very important. To maximize the detector module capability, very strict requirements are imposed on the operating environment temperature of the scintillation crystal and PD (a functional crystal material that converts X-rays to visible light). To ensure that the temperature difference between each crystal and the operating environment temperature of the PD (photodiode) is within a certain range, an additional mechanism is added to control the temperature.
In the prior art, temperature control of the scintillation crystal and the PD working environment usually requires a separate temperature chamber for the crystal and the PD, and the methods for controlling the temperature in the temperature chamber usually include the following two methods:
1) Air is heated through the outside, hot air is blown into the cavity, and the temperature of the blown hot air is detected through the temperature sensor to adjust the temperature in the whole cavity.
2) The temperature of air in the cavity is heated by heating the metal guide rails of the detectors on the two sides of the cavity through the heating belt, and then the temperature of the air or the metal guide rails in the cavity is detected through the temperature sensor to realize temperature control.
Because the traditional temperature control method adopts a method of integrally controlling the temperature of the air in the cavity, the heating efficiency of the method is low, and because the cavity space is large, the heat conduction efficiency is low, and because the heat conduction distance is long, the temperature of each detector module can not be kept consistent.
Because the detector crystal and the PD are temperature sensitive devices, the conversion efficiency can be changed when the working environment temperature is different, so that the inconsistency of the environment temperature can cause the inconsistency of the noise performance of the detector, and the quality of the CT image is affected.
Disclosure of Invention
The main aim at of this application provides a CT detector module temperature control structure and CT scanning equipment to it is low to solve the heating efficiency in the control by temperature change of correlation technique at the detector module, and because the cavity space is big, the heat conduction efficiency of air is low, and because heat-conduction distance is longer, can't guarantee that every detector module temperature keeps unanimous problem.
In order to achieve the above object, the present application provides a temperature control structure of a CT detector module, including: the device comprises a collimator, a scintillation crystal, a photodiode, a semiconductor refrigerator, a supporting block, a circuit board and a circuit board radiating block; wherein the content of the first and second substances,
the circuit board radiating block is attached to the circuit board, and the supporting blocks are arranged on the circuit board radiating block and distributed on two sides of the circuit board radiating block; two ends of the collimator are respectively and fixedly connected with the two supporting blocks, and a temperature control chamber is formed between the collimator and the circuit board radiating block;
the semiconductor refrigerator, the scintillation crystal and the photodiode are all arranged in the temperature control cavity; the semiconductor refrigerator is positioned at two ends of the temperature control chamber, two ends of the semiconductor refrigerator are respectively connected with the collimator and the circuit board radiating block, one end of the semiconductor refrigerator, which is connected with the circuit board radiating block, is a heat absorption end, and the other end of the semiconductor refrigerator, which is connected with the collimator, is a heat release end;
the scintillation crystal is stacked on the photodiode, and the scintillation crystal and the photodiode are located between the two semiconductor refrigerators.
Furthermore, the temperature control device also comprises a temperature sensor, wherein the temperature sensor is arranged in the temperature control cavity and positioned at two ends of the photodiode.
Further, the photodiode is connected with the circuit board through a connector;
and solid heat dissipation grease is pressed between the circuit board and the circuit board heat dissipation block.
Furthermore, the collimator is an integrated tungsten sheet collimator, one end of the semiconductor refrigerator is in contact with the collimator through solid heat conducting grease, and the other end of the semiconductor refrigerator is in contact with a circuit board radiating block through the solid heat conducting grease.
Furthermore, a threading hole is formed in the heat dissipation block of the circuit board, the semiconductor refrigerator is connected with a power supply cable, and the power supply cable penetrates through the threading hole and then is connected with the circuit board.
Furthermore, the upper end of the circuit board radiating block is provided with a supporting plane, and the supporting block, the semiconductor refrigerator and the photodiode are arranged on the supporting plane.
Further, the supporting block is made of a material with low thermal conductivity.
Furthermore, connecting blocks are arranged at two ends of the collimator and are L-shaped, one end of each connecting block is fixedly connected with the end face of the collimator through a screw, and the other end of each connecting block is fixedly connected with the supporting block through a connecting bolt;
the connecting bolt sequentially penetrates through the supporting plane, the supporting block and the other end of the connecting block.
Further, a sensor mounting block is arranged on the connector, the sensor mounting block is arranged in the temperature control chamber and positioned at two ends of the photodiode, and the temperature sensor is arranged on one side, facing the photodiode, of the sensor mounting block;
the temperature sensor is connected with the circuit board through a cable.
According to another aspect of the present application, a CT scanning apparatus is provided, which includes the above CT detector module temperature control structure.
In the embodiment of the application, the collimator, the scintillation crystal, the photodiode, the semiconductor refrigerator, the supporting block, the circuit board and the circuit board radiating block are arranged; the circuit board radiating block is attached to the circuit board, and the supporting blocks are arranged on the circuit board radiating block and distributed on two sides of the circuit board radiating block; two ends of the collimator are respectively and fixedly connected with the two supporting blocks, and a temperature control chamber is formed between the collimator and the circuit board radiating block; the semiconductor refrigerator, the scintillation crystal and the photodiode are all arranged in the temperature control cavity; the semiconductor refrigerator is positioned at two ends of the temperature control chamber, the two ends of the semiconductor refrigerator are respectively connected with the collimator and the circuit board radiating block, one end of the semiconductor refrigerator, which is connected with the circuit board radiating block, is a heat absorption end, and the other end of the semiconductor refrigerator, which is connected with the collimator, is a heat release end; scintillation crystal is piled up on photodiode, scintillation crystal and photodiode are located between two semiconductor cooler, semiconductor cooler by both ends has been reached and has been heated the collimator, make the collimator heated evenly and the programming rate is fast, the collimator after the heating has great heat generation area, usable large tracts of land heat radiation heats the control by temperature change cavity, realize the purpose to scintillation crystal and photodiode's ambient temperature control, thereby realized improving heating efficiency, can carry out accurate accuse temperature to single module, improve the technical effect of detector noise performance and CT image noise quality, and then solved the correlation technique and heated the thermal efficiency in the control by temperature change of detector module and hang down, and because the cavity space is big, the heat conduction efficiency of air is low, and because heat conduction distance is longer, can't guarantee every detector module temperature and keep the unanimous problem.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
FIG. 1 is a schematic structural diagram according to an embodiment of the present application;
the circuit board comprises a circuit board 1, a circuit board radiating block 2, a solid radiating grease 3, a supporting block 4, a connecting bolt 5, a connecting block 6, a sensor mounting block 7, a temperature sensor 8, a temperature control chamber 9, a photodiode 10, a scintillation crystal 11, a collimator 12, a semiconductor refrigerator 13 and a supporting plane 14.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used.
In this application, the terms "upper", "lower", "inside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "disposed," "provided," "connected," "secured," and the like are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, the term "plurality" shall mean two as well as more than two.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In the prior art, temperature control of the scintillation crystal and the PD working environment usually requires a separate temperature chamber for the crystal and the PD, and the methods for controlling the temperature in the temperature chamber usually include the following two methods:
3) The air is heated through the outside, hot air is blown into the cavity, and the temperature in the whole cavity is adjusted by detecting the temperature of the blown hot air through the temperature sensor.
4) The temperature of air in the cavity is heated by heating the metal guide rails of the detectors on the two sides of the cavity through the heating belt, and then the temperature of the air or the metal guide rails in the cavity is detected through the temperature sensor to realize temperature control.
Because the traditional temperature control method adopts a method of integrally controlling the temperature of the air in the cavity, the heating efficiency of the method is low, and because the cavity space is large, the heat conduction efficiency is low, and because the heat conduction distance is long, the temperature of each detector module can not be kept consistent.
Because the detector crystal and the PD are temperature sensitive devices, the conversion efficiency can be changed when the working environment temperature is different, so that the inconsistency of the environment temperature can cause the inconsistent noise performance of the detector, and the quality of the CT image is influenced.
In order to solve the above technical problem, as shown in fig. 1, an embodiment of the present application provides a temperature control structure of a CT detector module, where the temperature control structure of the CT detector module includes: the device comprises a collimator 12, a scintillation crystal 11, a photodiode 10, a semiconductor refrigerator 13, a supporting block 4, a circuit board 1 and a circuit board heat dissipation block 2; wherein, the first and the second end of the pipe are connected with each other,
the circuit board radiating block 2 is attached to the circuit board 1, and the supporting blocks 4 are arranged on the circuit board radiating block 2 and distributed on two sides of the circuit board radiating block 2; two ends of the collimator 12 are respectively fixedly connected with the two supporting blocks 4, and a temperature control chamber 9 is formed between the collimator 12 and the circuit board radiating block 2;
the semiconductor refrigerator 13, the scintillation crystal 11 and the photodiode 10 are all arranged in the temperature control chamber 9; the semiconductor refrigerator 13 is positioned at two ends of the temperature control chamber 9, two ends of the semiconductor refrigerator 13 are respectively connected with the collimator 12 and the circuit board radiating block 2, one end of the semiconductor refrigerator 13 connected with the circuit board radiating block 2 is a heat absorption end, and one end of the semiconductor refrigerator 13 connected with the collimator 12 is a heat release end;
the scintillation crystal 11 is stacked on the photodiode 10, and the scintillation crystal 11 and the photodiode 10 are located between two semiconductor refrigerators 13.
In the present embodiment, as shown in fig. 1, the temperature control structure is mainly composed of a collimator 12, a scintillation crystal 11, a photodiode 10, a semiconductor refrigerator 13, a support block 4, a circuit board 1, and a circuit board heat dissipation block 2. The structure forms a detector module, and a detector is formed by a plurality of detector modules together. In this temperature control structure, circuit board radiating block 2 is as the installation basis, and circuit board 1 is installed in the side of circuit board radiating block 2, and the two have great binding face for the heat that circuit board 1 produced in the operation can be better transmit to circuit board radiating block 2 on. In order to further improve the heat transfer efficiency between the circuit board 1 and the circuit board heat sink 2, a solid heat sink grease is pressed between the circuit board 1 and the circuit board heat sink 2. The circuit board 1 is an acquisition circuit board 1, and is used as a control end in the temperature control structure, and can receive signals, process the signals and send the signals.
The collimator 12 is installed above the circuit board radiating block 2, the collimator 12 is connected with the circuit board radiating block 2 through the supporting block 4, a temperature control chamber 9 is formed between the circuit board radiating block 2 and the collimator 12 through the supporting block 4, so that the scintillation crystal 11 and the photodiode 10 can be installed in the temperature control chamber 9, and the environmental temperature of the scintillation crystal 11 and the photodiode 10 is controlled by controlling the temperature in the temperature control chamber 9. In this embodiment the support blocks 4 are mounted at both ends of the circuit board heat sink 2 to support both ends of the collimator 12, forming a temperature controlled chamber 9 between the two support blocks 4. The collimator 12 serves as a stray radiation filtering mechanism in the detector, and is usually made of tungsten alloy or other metal material capable of absorbing X-rays, and has a good heat conductivity.
In order to increase the temperature of the temperature-controlled chamber 9 during use and improve the heating efficiency and heating uniformity, the semiconductor refrigerator 13 is used as a heating element in the temperature-controlled chamber 9 in the present embodiment. The semiconductor refrigerator 13 is made using the Peltier (Peltier) effect of a semiconductor material. When direct current passes through a couple formed by connecting two different semiconductor materials in series, heat is absorbed and released at two ends of the couple respectively. It is a refrigeration technology producing negative thermal resistance, and is characterized by that it has no moving component and high reliability.
In this embodiment, the semiconductor refrigerators 13 are disposed at two ends of the temperature controlled chamber 9, one end of the semiconductor refrigerator 13 connected to the circuit board heat sink 2 is a heat absorption end, and one end of the semiconductor refrigerator 13 connected to the collimator 12 is a heat release end. In the operation process, the semiconductor refrigerator 13 heats the collimator 12, and the collimator 12 can reach a set temperature value at a higher heating speed due to the better heat conduction performance of the collimator 12, and the whole temperature distribution is uniform. The heated collimator 12 has a large heating area, and can heat the temperature control chamber 9 by using large-area heat radiation, so as to control the ambient temperature of the scintillation crystal 11 and the photodiode 10.
The heating intensity can be changed by adjusting the output power of the semiconductor refrigerator 13, so that the ambient temperature in the temperature-controlled chamber 9 can be precisely adjusted. Because the detector comprises a plurality of detector modules in this application jointly, can realize efficient scintillation crystal 11 and 10 operational environment accuse temperature of photodiode when single detector module, consequently only need set for same target temperature to all detector modules and can realize the holistic accuse temperature of detector, realized the uniformity of control by temperature change, reach the purpose that improves the detector noise performance, improve CT image noise quality then. And for each detector module, the temperature control is independent, and the temperature cavity in the whole detector does not need to be heated according to actual conditions, so that the waste of heat energy is avoided, and the energy conservation is realized.
Through the structure, the problems that heating efficiency is low in temperature control of the detector modules in the related art, the space of the cavity is large, heat conduction efficiency of air is low, and temperature of each detector module can not be kept consistent due to long heat conduction distance are solved.
In order to obtain the temperature value in the temperature control chamber 9 in real time and accurately control the temperature value in the temperature control chamber 9, as shown in fig. 1, the temperature control structure in this embodiment further includes a temperature sensor 8, and the temperature sensor 8 is disposed in the temperature control chamber 9 and located at two ends of the photodiode 10. Temperature sensor 8 is connected with circuit board 1 through the cable, has seted up the through wires hole on the circuit board radiating block 2, and semiconductor cooler 13 is connected with the power supply cable, and the power supply cable passes to be connected with circuit board 1 behind the through wires hole. The output power of the semiconductor refrigerator 13 can be used as input, the temperature monitored by the temperature sensor 8 can be used as feedback, and the accurate temperature control of the temperature of the detector can be realized through a PI algorithm.
Further, the photodiode 10 is connected to the circuit board 1 through a connector, so as to realize transmission of electrical signals. The functions of the circuit board 1 in the present embodiment include acquisition of photoelectric signal data and temperature control of the semiconductor cooler 13.
In order to make the collimator 12 be better heated by the semiconductor cooler 13, the collimator 12 in this embodiment is an integrated tungsten plate collimator, one end of the semiconductor cooler 13 is in contact with the collimator through the solid heat conducting grease, the other end is in contact with the circuit board heat dissipation block 2 through the solid heat conducting grease, and the heat transfer efficiency can be improved by fixing the heat conducting grease.
The circuit board heat sink 2 serves as a mounting base, and in order to facilitate the mounting of various components on the circuit board heat sink 2, as shown in fig. 1, a support plane 14 is formed at the upper end of the circuit board heat sink 2, the support block 4, the semiconductor cooler 13 and the photodiode 10 are disposed on the support plane 14, and the support plane 14 may have a certain width to facilitate the mounting of various components.
Since the support block 4 needs to be in contact with the collimator 12, in order to prevent heat of the collimator 12 from being transferred through the support block 4, the support block 4 is made of a material with low thermal conductivity, such as glass fiber reinforced plastic.
In order to facilitate stable connection of the collimator 12 and the supporting block 4, in the embodiment, the two ends of the collimator 12 are provided with the connecting blocks 6, the connecting blocks 6 are arranged in an L shape, one end of each connecting block 6 is fixedly connected with the end face of the collimator 12 through a screw, and the other end of each connecting block 6 is fixedly connected with the supporting block 4 through a connecting bolt 5; the connecting bolt 5 passes through the supporting plane 14, the supporting block 4 and the other end of the connecting block 6 in sequence.
In order to facilitate the connection of the temperature sensor 8, the connector in this embodiment is provided with a sensor mounting block 7, the sensor mounting block 7 is disposed in the temperature control chamber 9 and located at two ends of the photodiode 10, and the temperature sensor 8 is disposed on a side of the sensor mounting block 7 facing the photodiode 10. The sensor mounting block 7 is also made of a material with low thermal conductivity, such as glass reinforced plastic. The sensor mounting block 7 and the support plane 14 can be connected by bolts.
According to another aspect of the present application, a CT scanning apparatus is provided, which includes the above CT detector module temperature control structure.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A temperature control structure of a CT detector module, comprising: the device comprises a collimator, a scintillation crystal, a photodiode, a semiconductor refrigerator, a supporting block, a circuit board and a circuit board radiating block; wherein the content of the first and second substances,
the circuit board radiating block is attached to the circuit board, and the supporting blocks are arranged on the circuit board radiating block and distributed on two sides of the circuit board radiating block; two ends of the collimator are respectively and fixedly connected with the two supporting blocks, and a temperature control chamber is formed between the collimator and the circuit board radiating block;
the semiconductor refrigerator, the scintillation crystal and the photodiode are all arranged in the temperature control cavity; the semiconductor refrigerator is positioned at two ends of the temperature control chamber, two ends of the semiconductor refrigerator are respectively connected with the collimator and the circuit board radiating block, one end of the semiconductor refrigerator, which is connected with the circuit board radiating block, is a heat absorption end, and the other end of the semiconductor refrigerator, which is connected with the collimator, is a heat release end;
the scintillation crystal is stacked on the photodiode, and the scintillation crystal and the photodiode are positioned between the two semiconductor refrigerators.
2. The CT detector module temperature control structure of claim 1, wherein: the temperature control device is characterized by further comprising temperature sensors, wherein the temperature sensors are arranged in the temperature control cavity and positioned at two ends of the photodiodes.
3. The CT detector module temperature control structure of claim 2, wherein: the photodiode is connected with the circuit board through a connector;
and solid heat dissipation grease is pressed between the circuit board and the circuit board heat dissipation block.
4. The CT detector module temperature control structure of claim 3, wherein: the collimator is an integrated tungsten sheet collimator, one end of the semiconductor refrigerator is in contact with the collimator through solid heat conducting grease, and the other end of the semiconductor refrigerator is in contact with a circuit board radiating block through the solid heat conducting grease.
5. The CT detector module temperature control structure of claim 1, wherein: the circuit board radiating block is provided with a threading hole, the semiconductor refrigerator is connected with a power supply cable, and the power supply cable penetrates through the threading hole and then is connected with the circuit board.
6. The CT detector module temperature control structure of claim 5, wherein: the upper end of the circuit board radiating block is provided with a supporting plane, and the supporting block, the semiconductor refrigerator and the photodiode are arranged on the supporting plane.
7. The CT detector module temperature control structure of claim 6, wherein: the supporting block is made of a material with low thermal conductivity.
8. The CT detector module temperature control structure of claim 1, wherein: connecting blocks are arranged at two ends of the collimator and are L-shaped, one end of each connecting block is fixedly connected with the end face of the collimator through a screw, and the other end of each connecting block is fixedly connected with the supporting block through a connecting bolt;
the connecting bolt sequentially penetrates through the supporting plane, the supporting block and the other end of the connecting block.
9. The CT detector module temperature control structure of claim 8, wherein: the connector is provided with a sensor mounting block, the sensor mounting block is arranged in the temperature control cavity and positioned at two ends of the photodiode, and the temperature sensor is arranged on one side of the sensor mounting block facing the photodiode;
the temperature sensor is connected with the circuit board through a cable.
10. A CT scanning apparatus comprising a CT detector module temperature control structure according to any of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211703795.3A CN115844430A (en) | 2022-12-28 | 2022-12-28 | CT detector module temperature control structure and CT scanning equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211703795.3A CN115844430A (en) | 2022-12-28 | 2022-12-28 | CT detector module temperature control structure and CT scanning equipment |
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