CN218602443U

CN218602443U - Gamma detection device based on semiconductor cooler

Info

Publication number: CN218602443U
Application number: CN202222576647.1U
Authority: CN
Inventors: 许承聪; 邓晓
Original assignee: Ruishi Xinhe Hebei Medical Technology Co ltd
Current assignee: Ruishi Xinhe Hebei Medical Technology Co ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-03-10
Anticipated expiration: 2032-09-28

Abstract

The utility model relates to a gamma detector field, especially a gamma detection device based on semiconductor cooler. The gamma detecting device includes: the device comprises a scintillation crystal, a photosensitive array component and a semiconductor refrigeration component; the photosensitive array component comprises a plurality of photoelectric detectors which are arranged in an array in a plane; the scintillation crystal is closely arranged on the top surface of the photosensitive array component; the semiconductor refrigeration assembly is used for refrigerating the bottom surface of the photosensitive array assembly. The gamma detection device can be used as an independent functional module based on a semiconductor refrigerator, is convenient to install and produce, avoids the requirements of conventional integral water cooling or oil cooling for additional high-power refrigerators, pumps and other parts, simplifies the internal structure of the gamma detection device, ensures the refrigeration and heat dissipation effects, and enables the disassembly and assembly process and the maintenance operation of the gamma detection device to be more convenient and faster.

Description

Gamma detection device based on semiconductor cooler

Technical Field

The utility model relates to a gamma detector field, especially a gamma detection device based on semiconductor cooler.

Background

The semiconductor photoelectric sensor array is applied to occasions adopting semiconductor photoelectric sensor arrays such as SiPM, CZT and the like, generally, a heat conduction material is coupled on one side of the photoelectric sensor, a heat conduction pipeline is fixed on the other side of the heat conduction material, heat conduction liquid such as pure water or oil circulates inside the pipeline, and heat inside the detector is brought into an external space.

SUMMERY OF THE UTILITY MODEL

To the above defect, an object of the utility model is to provide a gamma detection device based on semiconductor cooler can dispel the heat to the photoelectric detector array high efficiency, and its simple structure maintains the convenience.

To achieve the purpose, the utility model adopts the following technical proposal:

a semiconductor refrigerator based gamma detection apparatus, comprising: the device comprises a scintillation crystal, a photosensitive array component and a semiconductor refrigeration component; the photosensitive array component comprises a plurality of photoelectric detectors which are arranged in an array in a plane; the scintillation crystal is closely arranged on the top surface of the photosensitive array component; the semiconductor refrigeration assembly is used for refrigerating the bottom surface of the photosensitive array assembly.

More preferably, the semiconductor refrigeration assembly comprises: the semiconductor refrigeration device comprises a semiconductor refrigeration device, a radiator and a radiating fan; the radiator is installed in contact with the heating end of the semiconductor refrigerating device; the refrigerating end of the semiconductor refrigerating device is in contact with the bottom surface of the photosensitive array component; the heat radiation fan is used for blowing and radiating heat to the heat radiator.

Preferably, the radiator comprises a radiating plate and a plurality of fins which are vertically parallel to each other and are arranged at the bottom of the radiating plate at intervals; a heat dissipation gap is arranged between the adjacent fins; two ends of the heat dissipation plate are respectively and vertically provided with a heat dissipation fan, and the two heat dissipation fans are respectively positioned at two ends of the heat dissipation gap; and the rotation direction is opposite when driving.

Preferably, the gamma detection device is also provided with a control circuit; a temperature sensor is arranged between the bottom surface of the scintillation crystal and the top surface of the photosensitive array component and is used for detecting the temperature of the photosensitive array component; and the control circuit is electrically connected with the temperature sensor and the semiconductor refrigeration assembly.

Preferably, the bottom surface of the scintillation crystal and the top surface of the photosensitive array component are mounted in a fitting mode through a light guide material.

Preferably, the bottom surface of the photosensitive array component and the refrigeration end of the semiconductor refrigeration device are attached and installed through a heat conduction material.

Preferably, the gamma detection device further comprises a heat shield, wherein the heat shield covers the scintillation crystal, the photosensitive array assembly and the refrigerating end of the semiconductor refrigerating device.

More preferably, the heat shield is made of asbestos fibres and has a thickness of 1-2mm.

The utility model discloses a beneficial effect of embodiment:

the gamma detection device can detect the gamma detection device as an independent functional module based on the semiconductor refrigerator, is convenient to install and produce, avoids the requirements of conventional integral water cooling or oil cooling for additional high-power refrigerators, pumps and other parts, simplifies the internal structure of the gamma detection device, ensures the refrigeration and heat dissipation effects, and enables the disassembly and assembly process and the maintenance operation of the gamma detection device to be more convenient and faster.

Drawings

Fig. 1 is a schematic cross-sectional structure diagram of the gamma detection device according to an embodiment of the present invention;

fig. 2 is a schematic perspective view of the gamma detection device according to an embodiment of the present invention;

fig. 3 is an exploded schematic view of the gamma detecting device according to an embodiment of the present invention.

Wherein: scintillation crystal 110, photosensitive array component 120, photoconductive material 130, heat conducting material 140, semiconductor cooling component 130, semiconductor cooling device 131, heat sink 132, heat dissipation plate 133, fins 134, heat dissipation fan 135, control circuit 150, temperature sensor 160, and heat shield 170.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In one embodiment of the present application, as shown in fig. 1 to 3, a gamma detection device based on a semiconductor refrigerator includes: a scintillation crystal 110, a photosensitive array assembly 120, and a semiconductor refrigeration assembly 130; the photosensitive array assembly 120 includes a plurality of photodetectors arranged in an array in a plane; the scintillation crystal 110 is closely arranged on the top surface of the photosensitive array component 120; the semiconductor cooling assembly 130 is used to cool the bottom surface of the photosensitive array assembly 120.

Specifically, the semiconductor cooling module 130 includes: a semiconductor cooling device 131, a radiator 132, and a radiator fan 135; the radiator 132 is installed in contact with the heating end of the semiconductor cooling device 131; the refrigerating end of the semiconductor refrigerating device 131 is installed in contact with the bottom surface of the photosensitive array assembly 120; the heat dissipation fan 135 is used for blowing air to dissipate heat of the heat sink 132. The semiconductor refrigeration assembly 130 has the advantages of compact structure and environmental friendliness, and is suitable for meeting the internal refrigeration requirement of the photosensitive array assembly 120.

The heat sink 132 comprises a heat dissipation plate 133 and a plurality of fins 134 which are vertically parallel and arranged at the bottom of the heat dissipation plate 133 at intervals; a heat dissipation gap is formed between the adjacent fins 134; two ends of the heat dissipation plate are respectively and vertically provided with a heat dissipation fan 135, and the two heat dissipation fans 135 are respectively positioned at two ends of the heat dissipation gap; and the rotation direction is opposite when the motor is driven. By means of the heat dissipation fan 135 and the design of the heat dissipation gap, the heat generated by the semiconductor refrigeration device 131 can be rapidly discharged, and the higher refrigeration efficiency can be maintained.

The gamma detection device is also provided with a control circuit 150; a temperature sensor 160 is arranged between the bottom surface of the scintillation crystal 110 and the top surface of the photosensitive array component 120, and the temperature sensor 160 is used for detecting the temperature of the photosensitive array component 120; the control circuit 150 is electrically coupled to the temperature sensor 160 and the semiconductor refrigeration assembly 130. The temperature sensor 160 can transmit the temperature parameter of the photosensitive array assembly 120 to the control circuit 150 in real time, and the control circuit 150 controls the working current of the semiconductor refrigeration device 131 according to a preset temperature range, so as to adjust the refrigeration effect of the semiconductor refrigeration device 131 on the photosensitive array assembly 120. The SiPM gamma detection device has an automatic real-time temperature feedback control system, so that the temperature of the photosensitive array assembly 120 is always stabilized within a set range.

The bottom surface of the scintillation crystal 110 and the top surface of the photosensitive array component 120 are attached by a light guide material 130. The light guide material 130 may specifically be optically transparent silicone grease; so that the radiation received by the scintillation crystal 110 can be transmitted to the photosensitive array assembly 120 more accurately and rapidly.

The bottom surface of the photosensitive array component 120 and the refrigeration end of the semiconductor refrigeration device 131 are attached and installed through a heat conduction material 140. The heat conducting material 140 can be heat conducting silicone grease, so that the cooling capacity of the semiconductor cooling device 131 can be transferred to the photosensitive array assembly 120 more quickly and efficiently.

The gamma detection device further comprises a heat shield 170, wherein the heat shield 170 covers the scintillation crystal 110, the photosensitive array assembly 120 and the cooling end of the semiconductor cooling device. The heat shield 170 is made of asbestos fibers and has a thickness of 1-2mm. The thermal shield 170 can ensure that rays smoothly enter the scintillation crystal 110, prevent external heat from entering, and prevent dew condensation inside the SiPM gamma detection device in an external environment with high humidity.

The photoelectric detector is a semiconductor photoelectric sensor such as a CZT photoelectric sensor array or an SiPM photoelectric sensor.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of parts and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

For ease of description, spatially relative terms such as "over … …", "over … …", "over … …", "over", etc. may be used herein to describe the spatial positional relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms do not have special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in other sequences than those illustrated or described herein.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. A gamma detection device based on a semiconductor refrigerator, comprising: the device comprises a scintillation crystal, a photosensitive array component and a semiconductor refrigeration component;

the photosensitive array component comprises a plurality of photoelectric detectors which are arranged in an array in a plane;

the scintillation crystal is closely arranged on the top surface of the photosensitive array component;

the semiconductor refrigeration assembly is used for refrigerating the bottom surface of the photosensitive array assembly.

2. The semiconductor refrigerator-based gamma detection device of claim 1, wherein the semiconductor refrigeration assembly comprises: the semiconductor refrigeration device comprises a semiconductor refrigeration device, a radiator and a radiating fan;

the radiator is installed in contact with the heating end of the semiconductor refrigerating device;

the refrigerating end of the semiconductor refrigerating device is installed in contact with the bottom surface of the photosensitive array component;

the heat radiation fan is used for blowing and radiating heat to the heat radiator.

3. The gamma detection device based on the semiconductor refrigerator as claimed in claim 2, wherein the heat sink comprises a heat dissipation plate and a plurality of fins vertically arranged in parallel and at intervals at the bottom of the heat dissipation plate; a heat dissipation gap is arranged between the adjacent fins;

two ends of the heat dissipation plate are respectively and vertically provided with a heat dissipation fan, and the two heat dissipation fans are respectively positioned at two ends of the heat dissipation gap; and the rotation direction is opposite when the motor is driven.

4. The gamma detection device based on semiconductor refrigerator as claimed in claim 1, wherein there is further provided a control circuit; a temperature sensor is arranged between the bottom surface of the scintillation crystal and the top surface of the photosensitive array component and is used for detecting the temperature of the photosensitive array component; and the control circuit is electrically connected with the temperature sensor and the semiconductor refrigeration assembly.

5. The semiconductor cooler-based gamma detection device according to claim 4, wherein the bottom surface of the scintillation crystal and the top surface of the photosensitive array assembly are attached by a light guide material.

6. The gamma detection device based on the semiconductor refrigerator as claimed in claim 2, wherein the bottom surface of the photosensitive array assembly and the refrigeration end of the semiconductor refrigeration device are attached by a heat conductive material.

7. The semiconductor refrigerator-based gamma detection device of claim 2, further comprising a thermal shield covering the scintillation crystal, the photosensitive array assembly and the refrigeration end of the semiconductor refrigeration assembly.

8. A gamma detection device based on semiconductor refrigerator as claimed in claim 7, wherein the heat shield is made of asbestos fiber and has a thickness of 1-2mm.