CN219609495U - Constant temperature device of refrigeration type infrared light conduction sensor - Google Patents
Constant temperature device of refrigeration type infrared light conduction sensor Download PDFInfo
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- CN219609495U CN219609495U CN202320338413.5U CN202320338413U CN219609495U CN 219609495 U CN219609495 U CN 219609495U CN 202320338413 U CN202320338413 U CN 202320338413U CN 219609495 U CN219609495 U CN 219609495U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model provides a constant temperature device of a refrigeration type infrared photoelectric sensor, which comprises a heat radiation component, a TEC refrigeration piece, a cold end component and a circuit board, wherein the heat radiation component comprises a heat radiation fan and heat radiation fins, and the cold end component comprises a cold end fixing piece and a cold guide piece; the cooling fan is arranged on one side of the cooling fin, and the cold end fixing piece is arranged on the other side of the cooling fin; the circuit board is arranged above the radiating fins and is used for respectively connecting the radiating fan and the TEC refrigerating piece; the TEC refrigerating piece is arranged between the radiating fin and the cold end fixing piece; one end of the cold guide piece is connected with one side of the cold end assembly, and the other end of the cold guide piece is used for placing a sensor. Therefore, the utility model can timely radiate heat of the sensor shell, increase the distance between the sensor and the cold end fixing piece, provide installation space for assembling the constant temperature device and other parts such as a light source, and improve the replacement and maintenance efficiency of the sensor.
Description
Technical Field
The utility model relates to the technical field of infrared light conduction sensors, in particular to a constant temperature device of a refrigeration type infrared light conduction sensor.
Background
An infrared conductivity sensor is a typical semiconductor principle device that converts a received infrared radiation signal into an electrical signal that is convenient for measurement. However, in addition to receiving infrared radiation energy to generate signals, the infrared conductivity sensor also causes a certain signal to be generated by a sensitive chip through thermal excitation when the temperature of the working environment in the sensor is increased, so that the conventional photoconductive sensor is greatly influenced by the ambient temperature, and has poor precision and is easy to generate false alarm when the photoelectric conductivity sensor is used for measuring the gas concentration or the temperature of an object.
At present, the main solution is to package TEC refrigerating sheets inside the sensor to manufacture a refrigerating type infrared photoelectric sensor so as to reduce the working temperature of the sensitive chip and improve the detection rate and stability of the sensor. However, heat generated by the TEC cooling fins inside the sensor can be conducted to the sensor housing, resulting in overheating of the sensor housing and even affecting the inability to maintain a constant temperature inside the sensor.
In order to enable the TEC refrigerating sheet in the sensor to work normally, the cold face reaches an ideal working temperature, and heat generated by the hot face of the TEC refrigerating sheet in the sensor needs to be conducted to the external environment in time. At present, a passive heat dissipation structure is mainly added to increase the heat exchange area between the sensor shell and the external environment, so that the heat dissipation efficiency of the sensor shell is improved; however, the heat dissipation mode is easily affected by the external environment temperature, when the high-temperature environment is met, the heat exchange efficiency of the sensor shell is reduced, so that the temperature of the hot surface of the TEC refrigerating plate in the sensor is increased, even the temperature of the cold surface cannot be maintained at the ideal working temperature, and finally the detection rate and the stability of the sensor are reduced.
Document CN 216817258U discloses a thermostatic device of a photoelectric sensor based on a semiconductor refrigerating sheet, which comprises a photoelectric sensor, an APD mounting seat for placing the photoelectric sensor, an APD upper cover for closing the upper part of the photoelectric sensor, and the like, wherein the thermal insulation effect of the photoelectric sensor is improved by mounting the photoelectric sensor in a closed space enclosed by the APD mounting seat, the APD upper cover and the semiconductor refrigerating sheet; however, this structure is disadvantageous in that the photoelectric sensor is assembled with other components such as a light source, and the upper APD cover is required to be opened to perform a sensor replacement operation, resulting in low sensor replacement efficiency.
In order to solve the above problems, an ideal technical solution is always sought.
Disclosure of Invention
The utility model aims at overcoming the defects of the prior art, and provides a constant temperature device of a refrigeration type infrared light conductivity sensor.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the constant temperature device of the refrigeration type infrared photoconductive sensor comprises a heat dissipation assembly, a TEC refrigeration piece, a cold end assembly and a circuit board, wherein the heat dissipation assembly comprises a heat dissipation fan and heat dissipation fins, and the cold end assembly comprises a cold end fixing piece and a cold guide piece;
the radiating fan is arranged on one side of the radiating fin, and the air outlet direction of the radiating fan is opposite to the radiating fin;
the cold end fixing piece is arranged on the other side of the radiating fin;
the circuit board is arranged above the radiating fins and is used for respectively connecting the radiating fan and the TEC refrigerating piece;
the TEC refrigerating piece is arranged between the radiating fins and the cold end fixing piece, the hot surface of the TEC refrigerating piece is arranged opposite to the radiating fins, and the cold surface of the TEC refrigerating piece is arranged opposite to the cold end fixing piece;
one end of the cold guide piece is connected with one side of the cold end fixing piece, and the other end of the cold guide piece is used for placing a sensor.
The beneficial effects of the utility model are as follows:
1) The utility model provides a constant temperature device of a refrigeration type infrared photoelectric sensor, which comprises a heat dissipation component, a TEC refrigeration piece, a cold end component and a circuit board, wherein the sensor is arranged at the other end of the cold guide piece, so that heat conducted to a sensor shell by a hot surface of a TEC refrigeration piece in the sensor can be rapidly dissipated, the overheating of the sensor shell is avoided, and the TEC refrigeration piece in the sensor is ensured to be maintained at an ideal working temperature;
meanwhile, the distance between the sensor and the TEC refrigerating piece can be increased, and an installation space is provided for assembling the constant temperature device with other parts such as a light source and the like;
2) Because the sensor is arranged in the open space, the replacement operation of the sensor is convenient to realize, and the replacement and maintenance efficiency of the sensor is improved;
3) The heat radiating fins and the heat radiating fans are arranged on the hot surface of the TEC refrigerating piece, so that the heat radiating area can be effectively increased, and the heat exchange efficiency is improved; the problem that the performance of the refrigerating type photoconductive sensor is reduced due to the fact that the heat dissipation capacity of the shell is reduced in a high-temperature environment is solved, and the working stability of the refrigerating type photoconductive sensor in the high-temperature environment is improved;
4) The heat conducting layers are respectively arranged between the TEC refrigerating piece and the radiating fins and between the TEC refrigerating piece and the cold end fixing piece, so that the heat of a hot face of the TEC refrigerating piece is conducted to the radiating fins in time, the temperature of a cold face of the TEC refrigerating piece is conducted to the cold end fixing piece in time, and the constant temperature control effect is improved;
5) The cold junction mounting with the surface winding of cold guide has the insulating layer, thereby avoids cold junction mounting with the cold guide carries out heat exchange with the air, in order to strengthen refrigeration effect.
6) The refrigerating component of the utility model has smaller volume and is convenient for realizing the miniaturization and integration of the back-end equipment.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic diagram of an explosive structure of the present utility model;
FIG. 3 is a schematic diagram of an exploded structure of the present utility model;
FIG. 4 is a schematic view of the structure of the cold guide of the present utility model;
in the figure: 1. a heat radiation fan; 2. a circuit board; 3. a heat radiation fin; 4. a cold guide; 401. a cold conducting section; 402. a sensor mounting section; 403. a sensor accommodation hole; 404. bending the connecting section; 5. a sensor; 6. a cold end fixing piece; 601. a groove; tec refrigeration.
Detailed Description
The technical scheme of the utility model is further described in detail through the following specific embodiments.
Example 1
As shown in fig. 1 to 3, a thermostat of a refrigeration type infrared photoelectric sensor comprises a heat dissipation component, a TEC refrigeration piece 7, a cold end component and a circuit board 2, wherein the heat dissipation component comprises a heat dissipation fan 1 and a heat dissipation fin 3, and the cold end component comprises a cold end fixing piece 6 and a cold guide piece 4;
the cooling fan 1 is arranged on one side of the cooling fin 3, and the air outlet direction of the cooling fan 1 is opposite to the cooling fin 3; the cold end fixing piece 6 is arranged on the other side of the radiating fin 3;
the circuit board 2 is arranged above the radiating fins 3 and is used for respectively connecting the radiating fan 1, the TEC refrigerating piece 7, a power supply and the like;
the TEC refrigerating piece 7 is arranged between the radiating fin 3 and the cold end fixing piece 6, the hot surface of the TEC refrigerating piece 7 is arranged opposite to the radiating fin 3, and the cold surface of the TEC refrigerating piece 7 is arranged opposite to the cold end fixing piece 6; one end of the cold guide 4 is connected with one side of the cold end fixing piece 6, and the other end of the cold guide 4 is used for placing the sensor 5.
The cold surface of the TEC refrigeration piece 7 is attached to the cold end fixing piece 6, the cold end fixing piece 6 is connected with the cold guide piece 4, the cold guide piece 4 is tightly attached to the outer shell of the sensor 5, so that the cold surface temperature of the TEC refrigeration piece 7 is conducted to the sensor 5 on the cold guide piece 4, and the shell of the sensor 5 is refrigerated;
the hot surface of the TEC refrigeration piece 7 is attached to the substrate plane of the radiating fin 3, and the radiating fan 1 is fixed on the radiating fin 3 through screws, so that heat generated by the hot surface of the TEC refrigeration piece 7 is quickly conducted to the outside, and stable operation of the TEC refrigeration piece 7 is ensured.
As shown in fig. 1, the sensor 5 is disposed at the other end of the cold guide 4, so that the distance between the sensor 5 and the cold end fixing member 6 can be increased, so that the sensor 5 and other components such as a light source can be assembled conveniently, and the functional test and replacement operation of the sensor 5 can be facilitated.
As shown in fig. 4, the cold guide member 4 includes a cold guide section 401, a bent connection section 404 and a sensor mounting section 402, one end of the cold guide section 401 is connected with the cold end fixing member 6, the other end of the cold guide section 401 is connected with the sensor mounting section 402 through the bent connection section 404, the sensor mounting section 402 is provided with a sensor accommodating hole 403, and the size of the sensor accommodating hole 403 is matched with that of the sensor 5.
In a specific embodiment, the side of the heat dissipation fin 3 close to the heat dissipation fin 3 is provided with four screw holes for fixing the heat dissipation fan 1, and the air outlet direction of the heat dissipation fan 1 blows to the heat dissipation fin 3; eight screw holes are formed in one side of the base plate of the radiating fin 3, the center four screw holes are used for fixing the cold end fixing piece 6, so that the TEC refrigerating piece 7 is clamped tightly, and the periphery four screw holes are used for fixing the whole constant temperature device;
during installation, the cooling fan 1 is fixed on one side of the cooling fin 3 through a screw, the TEC refrigerating piece 7 is fixed on the other side of the cooling fin 3 through the cold end fixing piece 6 through the screw, and the TEC refrigerating piece 7 is positioned at the symmetrical center of the substrate plane of the cooling fin 3; the circuit board 2 is fixed on the upper side wall of the radiating fin 3 through screws.
Specifically, the TEC refrigeration unit 7 is in a sheet structure, and in other embodiments, may be other structures except for a sheet structure, which is not described herein again;
the cold end fixing member 6 has a block structure, and in other embodiments, the cold end fixing member 6 may have other structures except for the block structure, which will not be described herein;
the cold guide 4 is in a strip structure, and in other embodiments, the cold guide 4 may be other structures that can increase the distance between the sensor and the cold end fixing member, which will not be described herein.
Specifically, the cold guide member 4 is made of copper alloy or aluminum alloy, so that the conduction of the cold surface temperature of the TEC refrigerating member is facilitated; the radiating fins 3 are made of copper alloy or aluminum alloy, so that the conduction of the temperature of the hot surface of the TEC refrigerating piece is facilitated.
Example 2
On the basis of the embodiment 1, the embodiment shows a specific implementation mode of a constant temperature device of another refrigeration type infrared light conduction sensor.
Further, a thermistor is further disposed on the sensor mounting section 402, and the thermistor is connected to the circuit board 2.
Specifically, the circuit board 2 includes a controller, a power management circuit, a fan driving circuit, a TEC driving circuit, etc., where the controller may be a single chip or a control chip, and the power management circuit, the fan driving circuit, the TEC driving circuit, etc. are existing circuits, and are not described herein.
The thermistor is adhered near the joint of the cold guide 4 and the sensor 5, so as to collect the ambient temperature around the sensor 5, and transmit the ambient temperature to the circuit board 2, so that the circuit board 2 can perform constant temperature control according to the ambient temperature.
Example 3
Based on the above embodiment, the present embodiment provides a specific implementation manner of a thermostat of another refrigeration type infrared light conduction sensor.
Further, a heat conducting layer I is further arranged between the hot surface of the TEC refrigeration piece 7 and the substrate plane of the radiating fin 3, so that the heat of the hot surface of the TEC refrigeration piece 7 can be conducted to the radiating fin 3 in time, and stable operation of the TEC refrigeration piece 7 is ensured.
In other embodiments, a heat conducting layer ii is further disposed between the cold surface of the TEC refrigeration element 7 and the cold end fixing element 6, so that the temperature of the cold surface of the TEC refrigeration element 7 is timely conducted to the cold end fixing element 6, and the refrigeration effect is improved.
Specifically, the heat conducting layer I and the heat conducting layer II are heat conducting silicone grease or heat conducting silver paste.
Example 4
Based on the above embodiment, the present embodiment provides a specific implementation manner of a thermostat of another refrigeration type infrared light conduction sensor.
Further, a heat insulation foam is further arranged between the heat dissipation fins 3 and the cold end fixing piece 6, and the heat insulation foam is arranged around the TEC refrigerating piece 7 in a surrounding mode, so that the contact area between the TEC refrigerating piece and the outside is reduced, and the TEC refrigerating piece 7 is insulated and protected.
In other embodiments, the surfaces of the cold end fixing piece 6 and the cold guide piece 4 are provided with heat insulation layers; specifically, the heat insulation layer is made of heat insulation materials, such as heat insulation foam. It will be appreciated that by performing the heat insulation treatment on the portions of the cold end fixing member 6 and the cold guide member 4 in contact with the air, the cold end assembly and the air can be effectively prevented from performing heat exchange, thereby improving the refrigerating effect.
Example 5
Based on the above embodiment, the present embodiment provides a specific implementation manner of a thermostat of another refrigeration type infrared light conduction sensor.
Further, a groove 601 is formed in the side wall of the cold end fixing member 6, and one end of the cold guide member 4 is fixed in the groove 601 through reflow soldering.
It will be appreciated that the present embodiment utilizes a reflow soldering technique to fixedly connect the cold end fixing member 6 with the cold guide section 401 of the cold guide member 4, thereby improving the stability of the cold end assembly.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same; while the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art will appreciate that: modifications may be made to the specific embodiments of the present utility model or equivalents may be substituted for part of the technical features thereof; without departing from the spirit of the utility model, it is intended to cover the scope of the utility model as claimed.
Claims (10)
1. A constant temperature equipment of refrigeration type infrared light conduction sensor, its characterized in that: the cooling device comprises a heat dissipation assembly, a TEC refrigerating piece, a cold end assembly and a circuit board, wherein the heat dissipation assembly comprises a heat dissipation fan and heat dissipation fins, and the cold end assembly comprises a cold end fixing piece and a cold guide piece;
the radiating fan is arranged on one side of the radiating fin, and the air outlet direction of the radiating fan is opposite to the radiating fin;
the cold end fixing piece is arranged on the other side of the radiating fin;
the circuit board is arranged above the radiating fins and is used for respectively connecting the radiating fan and the TEC refrigerating piece;
the TEC refrigerating piece is arranged between the radiating fins and the cold end fixing piece, the hot surface of the TEC refrigerating piece is arranged opposite to the radiating fins, and the cold surface of the TEC refrigerating piece is arranged opposite to the cold end fixing piece;
one end of the cold guide piece is connected with one side of the cold end fixing piece, and the other end of the cold guide piece is used for placing a sensor.
2. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: the cold guide piece comprises a cold guide section, a bending connecting section and a sensor mounting section, one end of the cold guide section is connected with the cold end fixing piece, the other end of the cold guide section is connected with the sensor mounting section through the bending connecting section, and the sensor mounting section is provided with a sensor accommodating hole.
3. The refrigerated infrared light guide sensor thermostat of claim 2, wherein: and the sensor mounting section is also provided with a thermistor, and the thermistor is connected with the circuit board.
4. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: and a heat conducting layer I is further arranged between the TEC refrigerating piece and the radiating fins.
5. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: and a heat conducting layer II is further arranged between the TEC refrigerating piece and the cold end fixing piece.
6. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: and heat insulation foam is further arranged between the radiating fins and the cold end fixing piece, and the heat insulation foam is arranged around the TEC refrigerating piece in a surrounding mode.
7. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: the side wall of the cold end fixing piece is provided with a groove, and one end of the cold guide piece is fixed in the groove through reflow soldering.
8. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: the cold end fixing piece and the surface of the cold guide piece are provided with heat insulation layers.
9. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: the cold guide piece is made of copper alloy or aluminum alloy.
10. The refrigerated infrared light guide sensor thermostat of claim 1, wherein: the radiating fin is made of copper alloy or aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320338413.5U CN219609495U (en) | 2023-02-28 | 2023-02-28 | Constant temperature device of refrigeration type infrared light conduction sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320338413.5U CN219609495U (en) | 2023-02-28 | 2023-02-28 | Constant temperature device of refrigeration type infrared light conduction sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219609495U true CN219609495U (en) | 2023-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320338413.5U Active CN219609495U (en) | 2023-02-28 | 2023-02-28 | Constant temperature device of refrigeration type infrared light conduction sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219609495U (en) |
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2023
- 2023-02-28 CN CN202320338413.5U patent/CN219609495U/en active Active
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