CN217902325U - Constant temperature device and temperature control system - Google Patents
Constant temperature device and temperature control system Download PDFInfo
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- CN217902325U CN217902325U CN202222326050.1U CN202222326050U CN217902325U CN 217902325 U CN217902325 U CN 217902325U CN 202222326050 U CN202222326050 U CN 202222326050U CN 217902325 U CN217902325 U CN 217902325U
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Abstract
The application provides a constant temperature device and a temperature control system, wherein the constant temperature device comprises a shell, and an accommodating space is formed in the shell; the radiator is positioned in the accommodating space, and the first side of the radiator is arranged on the first side surface of the shell; the heat dissipation surface of the semiconductor refrigerator is arranged on the second side of the radiator, the refrigeration surface of the semiconductor refrigerator is led out from the second side surface of the shell, the first side and the second side of the radiator are two opposite sides, and the first side surface and the second side surface of the shell are two opposite sides, so that the adaptability of the device to the working environment is improved.
Description
Technical Field
The application relates to the field of semiconductors, in particular to a constant temperature device and a temperature control system.
Background
In the prior art, high-end electronic equipment has high requirements on the environment, and particularly various military equipment is often applied to a plurality of severe working environments. In order to ensure that the electronic equipment can operate at a constant temperature, some heat dissipation means are often required to dissipate heat, for example, a semiconductor refrigeration sheet is matched with a heat dissipation fin to realize refrigeration, but if the structure is exposed in a severe working environment, the structure is easily corroded by air water or other environmental factors, and further the heat dissipation efficiency is influenced. Therefore, a scheme is needed to ensure that the heat dissipation key components are not damaged, and further improve the adaptability of the device to the working environment.
SUMMERY OF THE UTILITY MODEL
In view of the problem that the existing heat dissipation device is poor in adaptability to the working environment, the application provides a constant temperature device and a temperature control system.
In a first aspect, a thermostat is provided, which includes a housing having an accommodating space formed therein; the radiator is positioned in the accommodating space, and the first side of the radiator is arranged on the first side surface of the shell; the cooling surface of the semiconductor refrigerator is led out from the second side surface of the shell, the first side and the second side of the radiator are two sides opposite to each other, and the first side surface and the second side surface of the shell are two sides opposite to each other.
Preferably, the casing includes bottom plate, panel and four curb plates, and the first side of casing is the bottom plate, and the second side of casing is the panel, and wherein, constant temperature equipment still includes: and the heat radiation fan is arranged on a first target side plate of the shell, and the first target side plate is one of the four side plates.
Preferably, the semiconductor cooler comprises a plurality of cooling elements, each cooling element being arranged side by side on the second side of the heat sink.
Preferably, the panel of casing is formed by the heat preservation cotton, is formed with a plurality of holes of placing on the heat preservation cotton, and every hole of placing is used for placing a corresponding refrigeration piece.
Preferably, the cooling surface of each cooling element is coated with a heat-conducting grease.
Preferably, the thermostatic device further comprises a cover body, the cover body is arranged between the heat preservation cotton and the heat dissipation fan, one side of the cover body is arranged on a second target side plate of the casing, and the second target side plate is any one of two side plates perpendicular to the first target side plate.
Preferably, a first vent hole is formed in the first target side plate of the housing, and a position of the vent hole on the first target side plate is aligned with a position of the heat dissipation fan on the first target side plate.
Preferably, a second vent hole is formed in a third target side plate of the housing, a position of the vent hole on the third target side plate is aligned with a position of the heat dissipation fan on the first target side plate, and the third target side plate and the first target side plate are two side plates opposite to each other.
Preferably, the thermostatic device further comprises a temperature sensor for detecting a temperature value at the refrigerating surface of the semiconductor refrigerator; and the controller is connected with the temperature sensor so as to receive the detected temperature value from the temperature sensor, is also connected with the semiconductor refrigerator, and increases the working current transmitted to the semiconductor refrigerator when the temperature value received by the controller is greater than a preset temperature value.
In a second aspect, a temperature control system is provided, where the temperature control system includes a radar shelter and the thermostat device as described above, and a cooling surface of a semiconductor refrigerator in the thermostat device is attached to a smooth surface of a heat generating device in the radar shelter.
The utility model provides a pair of constant temperature equipment and temperature control system, constant temperature equipment includes the casing, radiator and semiconductor cooler, wherein, be formed with accommodation space in the casing, the radiator is located accommodation space, the first side at the casing is arranged to the first side of radiator, the second side at the radiator is arranged to the cooling surface of semiconductor cooler, the refrigeration face of semiconductor cooler is drawn forth from the second side of casing, the first side and the second side of radiator are the both sides relative to each other, the first side and the second side of casing are two sides relative to each other, wherein, because the temperature control precision of semiconductor cooler is high, the cooling surface of semiconductor cooler can release the heat through the radiator, and the casing can play fine isolated effect, can not influenced by external environment, can ensure that heat dissipation key components and parts are not damaged, and then the adaptability of device to operational environment has been improved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 shows a schematic structural view of a thermostat device;
FIG. 2 shows a schematic diagram of the electrical connections of a thermostat;
fig. 3 shows a schematic half-section of a temperature control system.
Reference numerals:
a thermostat 10, a radar shelter 20;
the heat dissipation device comprises a shell 101, a radiator 102, a semiconductor refrigerator 103, a heat dissipation fan 104, heat insulation cotton 105, a cover body 106, a second vent hole 107, a temperature sensor 108, a controller 109 and a heating device 201.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. Every other embodiment that can be obtained by a person skilled in the art without making creative efforts based on the embodiments of the present application falls within the protection scope of the present application.
It should be noted that in the embodiments of the present application, the term "comprising" is used to indicate the presence of the features stated hereinafter, but does not exclude the addition of further features.
The application relates to a constant temperature equipment and temperature control system, this constant temperature equipment can ensure that the key components and parts of heat dissipation are not damaged, and then improve the adaptability of device to operational environment.
Fig. 1 is a schematic structural diagram of a thermostat device provided in an embodiment of the present application. As shown in fig. 1, a thermostat device 10 provided for an embodiment of the present application includes a housing 101, a heat sink 102, and a semiconductor cooler 103, where an accommodating space is formed in the housing 101, the heat sink 102 is located in the accommodating space, a first side of the heat sink 102 is disposed on a first side surface of the housing 101, a heat radiating surface of the semiconductor cooler 103 is disposed on a second side of the heat sink 102, a cooling surface of the semiconductor cooler 103 is led out from the second side surface of the housing 101, the first side and the second side of the heat sink 102 are two sides opposite to each other, and the first side and the second side surface of the housing 101 are two sides opposite to each other.
In one embodiment, the cooling surface of the semiconductor cooler 103 (TEC) is used to attach to the heat generating device 201, two ends of the semiconductor cooler 103 are respectively connected to the positive electrode and the negative electrode of the power supply, and by controlling the working current supplied to the semiconductor cooler 103, the cooling surface of the semiconductor cooler 103 absorbs heat and the heat dissipating surface releases heat due to peltier effect, so as to generate a temperature difference, thereby forming a cooling effect. The heat of the heat dissipation surface is dissipated through the heat sink 102, and the cold of the cooling surface is conducted to the heating device 201, so that the heating device 201 is maintained in a constant temperature environment. The housing 101 can protect the semiconductor cooler 103 and the heat sink 102 well, for example, to isolate air water, so as to prevent a large amount of air water from condensing on the surface of the device due to heat exchange, thereby affecting the working accuracy of the semiconductor cooler and improving the stability of thermostatic control of the device in different working environments.
Because the temperature control accuracy of the semiconductor refrigerator 103 is high, the temperature can reach 0.5 ℃, and for some power devices which have higher requirements on the temperature of the working environment, the temperature of the power devices can be more accurately regulated, so that the power devices can work in a constant temperature range.
Specifically, the cooling surface of the semiconductor cooler 103 is an aluminum metal plate. The heat sink 102 is a profile heat sink 102, and may be embodied as heat dissipation fins. The radiating fins are made of aluminum. The base plate of the heat dissipation fin is fixedly connected in the housing 101 through screws.
Specifically, the housing 101 includes a bottom plate, a panel, and four side plates, where a first side surface of the housing 101 is the bottom plate, and a second side surface of the housing 101 is the panel, where the thermostat device further includes a heat dissipation fan 104, the heat dissipation fan 104 is disposed on a first target side plate of the housing 101, and the first target side plate is one of the four side plates.
The case 101 here is an aluminum metal case.
The heat dissipation fan 104 is connected to the housing 101 by screws, and the screws are respectively disposed at four corners of the heat dissipation fan 104. The heat radiation fan 104 blows toward the heat sink 102, which accelerates the heat radiation from the heat radiation surface of the semiconductor cooler 103.
Specifically, the semiconductor cooler 103 includes a plurality of cooling members, each of which is disposed side by side on the second side of the heat sink 102.
The number of the cooling members herein may be determined according to the area of the heat generating device 201 or the amount of heat generated. A plurality of refrigeration devices are arranged to refrigerate simultaneously, so that the temperature of the heat generating device 201 can be reduced more quickly. In fig. 1, four refrigeration elements are arranged side by side.
Specifically, the panel of the casing 101 is formed by heat insulation cotton 105, and a plurality of placing holes are formed in the heat insulation cotton 105, and each placing hole is used for placing a corresponding refrigerating element.
The heat preservation cotton 105 can keep the cold quantity of refrigeration face, has improved the stability of constant temperature equipment to temperature control.
Specifically, the refrigerating surface of each refrigerating piece is coated with heat conducting grease.
The coating of the heat-conducting grease can enable the refrigerating surface and the heating device 201 to form better heat-conducting contact, and the refrigerating surface and the smooth metal surface of the heating device 201 are tightly attached.
Specifically, the thermostat device further includes a cover 106, the cover 106 is disposed between the heat insulation cotton 105 and the heat dissipation fan 104, and one side of the cover 106 is disposed on a second target side plate of the housing 101, where the second target side plate is any one of two side plates perpendicular to the first target side plate.
The cover 106 can prevent the heat dissipation fan 104 from depositing dust, and ensure the operating environment of the heat dissipation fan 104.
Specifically, a first vent hole is formed in a first target side plate of the housing 101, and a position of the vent hole on the first target side plate is aligned with a position of the heat dissipation fan 104 on the first target side plate. And a second vent hole 107 is formed in a third target side plate of the housing 101, a position where the vent hole is provided in the third target side plate is aligned with a position where the heat dissipation fan 104 is provided in the first target side plate, and the third target side plate and the first target side plate are two side plates opposite to each other.
Here, the first vent hole (not shown) may be circular, and the second vent hole 107 may be square. A passage is formed between the first vent hole and the second vent hole 107, and when the heat dissipation fan 104 operates, air can flow in from the first vent hole, pass through the fins of the heat sink 102 and take heat away, and then flow out from the second vent hole 107. The heat radiation effect of the radiator 102 is ensured to refrigerate the refrigerating surface.
As shown in fig. 2, fig. 2 is a schematic circuit connection diagram of a thermostat device according to an embodiment of the present disclosure.
In particular, the thermostatic device further comprises a temperature sensor 108 and a controller 109. The temperature sensor 108 is used to detect a temperature value at the cooling surface of the semiconductor cooler 103. The controller 109 is connected to the temperature sensor 108 to receive the detected temperature value from the temperature sensor 108, and the controller 109 is further connected to the semiconductor cooler 103, and when the temperature value received by the controller 109 is greater than a preset temperature value, the operating current supplied to the semiconductor cooler 103 is increased.
Here, the input terminal of the temperature sensor 108 may be disposed on the cooling surface, or may be disposed on the smooth metal bottom surface of the heat generating device 201. The controller 109 performs closed-loop regulation through temperature feedback to achieve the purpose of refrigeration and constant temperature. Here, a preset temperature value and a cooling temperature value of the cooling surface may be set in the controller 109 in advance.
It should be noted that, in an application scheme, the temperature of the heating device may be lowered through the cooling surface of the semiconductor cooler 103, or the temperature of the heating device 201 may be raised through the semiconductor cooler 103, at this time, only the working current input by the semiconductor cooler 103 needs to be reversed, the cooling surface becomes the heating end, and the cooling surface becomes the cooling end.
Fig. 3 is a schematic half-sectional view of a temperature control system according to the present application. In one embodiment of the present application, a temperature control system is provided, which comprises a radar shelter 20 and a thermostat device 10 as described above, wherein a cooling surface of a semiconductor refrigerator 103 in the thermostat device is attached to a smooth surface of a heat generating device 201 in the radar shelter 20.
Here, the radar shelter 20 may be a radar radio frequency shelter, and the heat generating device 201 may be a microwave component in the radar shelter 20. The housing 101 in the temperature control device is made as a kind of hatch. In one case, the microwave components in the radar shelter 20 are typically disposed within an equipment room, and a mounting window may be opened in a wall of the equipment room to insert a thermostat into the mounting window.
The controller 109 here may be provided integrally with the control system within the radar shelter 20.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all changes that can be made in the details of the description and drawings, or directly/indirectly implemented in other related technical fields, are intended to be embraced therein without departing from the spirit of the present application.
Claims (10)
1. A thermostatic device, characterized in that it comprises:
a housing having an accommodating space formed therein;
a heat sink located within the receiving space, a first side of the heat sink being disposed at a first side of the housing;
the cooling surface of the semiconductor refrigerator is led out from the second side surface of the shell, the first side and the second side of the radiator are two opposite sides, and the first side surface and the second side surface of the shell are two opposite sides.
2. The thermostat of claim 1, wherein the housing includes a bottom plate, a face plate, and four side plates, the first side of the housing is the bottom plate, the second side of the housing is the face plate,
wherein, constant temperature equipment still includes:
the heat dissipation fan is arranged on a first target side plate of the shell, and the first target side plate is one of the four side plates.
3. A thermostat arrangement according to claim 2, characterized in that the semiconductor refrigerator comprises a plurality of refrigeration members, each refrigeration member being arranged side by side on the second side of the heat sink.
4. The thermostat device as claimed in claim 3, wherein the panel of the housing is formed of thermal insulation cotton, and a plurality of placing holes are formed in the thermal insulation cotton, and each placing hole is used for placing a corresponding refrigerating element.
5. A thermostatic device according to claim 4, wherein the cooling surface of each cooling member is coated with a thermally conductive grease.
6. A thermostat according to claim 5, characterized in that the thermostat further comprises:
the cover body is arranged between the heat preservation cotton and the heat dissipation fan, one side of the cover body is arranged on a second target side plate of the shell, and the second target side plate is any one of two side plates perpendicular to the first target side plate.
7. The thermostat device according to claim 6, wherein a first vent hole is formed in the first target side plate of the housing, and an arrangement position of the vent hole on the first target side plate is aligned with an arrangement position of the heat dissipation fan on the first target side plate.
8. The thermostat device according to claim 7, wherein a second vent hole is formed in a third target side plate of the housing, an arrangement position of the vent hole in the third target side plate is aligned with an arrangement position of the heat dissipation fan in the first target side plate, and the third target side plate and the first target side plate are two side plates opposed to each other.
9. The thermostat device of claim 8, further comprising:
the temperature sensor is used for detecting the temperature value at the refrigerating surface of the semiconductor refrigerator;
and the controller is connected with the temperature sensor so as to receive the detected temperature value from the temperature sensor, is also connected with the semiconductor refrigerator, and increases the working current transmitted to the semiconductor refrigerator when the temperature value received by the controller is greater than a preset temperature value.
10. A temperature control system, characterized in that the temperature control system comprises a radar shelter and a thermostat device according to any of claims 1-9, wherein a refrigerated face of a semiconductor refrigerator in the thermostat device abuts a smooth surface of a heat generating device in the radar shelter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222326050.1U CN217902325U (en) | 2022-08-31 | 2022-08-31 | Constant temperature device and temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222326050.1U CN217902325U (en) | 2022-08-31 | 2022-08-31 | Constant temperature device and temperature control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217902325U true CN217902325U (en) | 2022-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222326050.1U Active CN217902325U (en) | 2022-08-31 | 2022-08-31 | Constant temperature device and temperature control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217902325U (en) |
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2022
- 2022-08-31 CN CN202222326050.1U patent/CN217902325U/en active Active
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