JP2000004090A - Heat exchange device for electronic apparatus enclosure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a heat exchange device for an electronic apparatus enclosure which is small and thin, offers high heat exchange capability and is capable of controlling temperature with accuracy. SOLUTION: This heat exchange device for an electronic apparatus enclosure comprises a sealed enclosure 1 for housing electronic apparatus, and a heat exchanger 2 provided with a heat receiving portion 3 placed inside the enclosure, a heat radiating portion 4 placed outside the enclosure, and a metallic conductive plate 5, which separates the heat receiving portion and the heat radiating portion. The heat receiving portion and the heat radiating portion are positioned diagonally in the vertical direction. The conductive plate comprises a heat reception-side conductive plate 51 joined with a heat receiving fin board and a heat radiation-side conductive plate 52 which is joined with a heat radiating fin board, and a thermoelectric effect element 6 with its heat absorbing side in tight contact with the heat reception-side conductive plate and with its heat radiating side in tight contact with the heat radiation-side conductive plate is placed at the boundary between the two conductive plates.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat exchanger for releasing heat in a sealed electronic device housing to the outside air while maintaining hermeticity.

[0002]

2. Description of the Related Art Conventionally, a heat exchange device for a hermetically sealed electronic device housing.
As a device, one having a heat exchanger as shown in FIG.
Proposed. This heat exchanger is a controller for robot control.
This is an example used for rollers, and the width of the housing in the horizontal direction (hereinafter, referred to as
Thickness is 500 mm), the heat exchanger
The thickness is 85 mm and the length ratio is about 1/6.
In the figure, reference numeral 1 denotes an electronic device (not shown) that generates heat.
2 is a heat exchanger. 3 is a heat exchanger 2
The heat receiving portion receives the heat of the inside air that has become high temperature inside the housing 1.
Take away. Reference numeral 4 denotes a heat radiating portion of the heat exchanger 2, which introduces outside air.
To release the heat inside. 5 discharges the heat exchanger 2 with the heat receiving section 3
Partitions the heat section 4 into two passages and conducts internal heat
Conductive plate. Heat exchanger 2 was provided inside housing 1
Heat receiving part 3, heat radiating part 4 provided outside, heat receiving part and heat radiating part
And a metal conductive plate that separates the conductive plate. Receiving heat
The part 3 includes an inside air inlet 31 for introducing inside air and an inside air passage 35.
Inside air fan 32 provided near the inlet and inside air passage 35
From the heat receiving fins 33 provided in the center and the inside air outlet 36
Become. The heat radiating portion 4 is provided with an outside air inlet 41 and an outside air passage 45.
An external air fan 42 provided near the mouth and an external air
It comprises a radiation fin 43 and an outside air outlet 46. What
The heat receiving fins 33 and the heat radiating fins 43 are each shown in FIG.
It is fixed to a fin substrate not shown. A_HIs hot sky
Anxious shy, A_CIs open air. Next, about operation
explain. High temperature inside air A in the housing 1_HIs a heat exchanger
2 inside the heat exchanger 2 by the inside air fan 32 of the heat receiving section 3.
Will be introduced. Shy A_HIs at a right angle to the ventilation direction at the heat receiving part 3.
Bent inside the inside air passage 35 toward the heat receiving fin 33
It passes as a flow parallel to the fin substrate. At this time, air
Air A due to the convective heat transfer phenomenon between_HReceived from
Heat is transmitted to the heat fins 33. Shy A_HIs the heat receiving fin
33, the temperature is lowered by passing the heat to
From the housing 1. Heat receiving fins 33 and heat radiating fins
Since it is connected to the pin 43 by the conductive plate 5,
The heat transmitted to the heat fins 33 is transferred to the heat radiation fins 4 by conduction.
It is conveyed to 3. On the other hand, on the outside air side of the heat exchanger 2,
Outside air A into the radiator 4 by the fan 42 _cWas introduced,
After the ventilation direction is bent at a right angle, heat is radiated in the outside air passage 45
As a flow parallel to the fin substrate toward the fin 43,
Spend. At this time, the convection heat transfer between the air and the fin surface
Therefore, the outside air A_cHeat is transmitted to the outside
Ki A_cIs discharged from the heat radiating section 4. Therefore, heat exchange
The vessel 2 is heated by the conductive plate 5 to a high temperature inside air A._HSide and outside air A_c~ side
And the heat exchanger 2 is
By maintaining the airtightness of the housing 1
The heat inside the housing 1 can be efficiently discharged to the outside
You. As another conventional example, a filter in an inside air passage is provided.
Insert a thermoelectric element between the
In some cases, performance has been improved (for example, Japanese Utility Model Laid-Open No. 4-4).
No. 6594). This is inside the sealed electronics housing
There is a heat-absorbing side of the heat exchanger and a heat-dissipating side on the outside. Heat absorption
Thermoelectric module is inserted into the mounting surface of the cooling body on the side
I have. A fan is installed at the center on the heat absorption side. Release
Cooling body and fan also on the heat side at a position opposed to the heat absorption side
is set up. The fan operates in such a configuration
Then, the high-temperature air in the casing flows from the intake port to the cooling-side casing.
To contact the cooling body and transfer heat to the cooling body. That
The cooling body is being cooled by the action of the thermoelectric module.
The high-temperature air in the housing that
The temperature difference with the heat sink increases and the amount of heat transferred to the cooling
The temperature drop of the air also increases. As a result of the heat exchanger
Performance is improved. On the heat dissipation side, the amount of heat transferred from the air inside the housing
The amount of heat corresponding to the power input to the thermoelectric module
It is transmitted to the heat. When the fan on the heat radiation side operates,
The outside air that has flowed in through the air inlet contacts the radiator.
Heat transfer from the air in the housing that was transmitted to the heat radiator 3
Quantity and heat equivalent to e4bd power input to the thermoelectric module
The amount is released to the outside air.

[0003]

Generally, an index for evaluating the performance of a heat exchanger is represented by a heat conductance obtained by dividing the heat exchange amount of the heat exchanger by a temperature difference between a high temperature side and a low temperature side. For miniaturization, it is better that the thermal conductance per unit volume is large. However, in the former conventional technique, since the heat receiving fins 33 and the heat radiating fins 43 must be arranged close to each other, there are the following problems. (1) The height of the fins or the thickness of the two fans and the thickness of the ventilation space are added to increase the ventilation path volume on the high-temperature side and the outside air side. Can not be changed. (2) inside air after the outside air A _c discharged from the inside air A _H and the outside air fan 42 of the high-temperature discharged from the fan 32 collides vertically conductive plate 5, each of the fins to convert the discharge direction 33,4
Therefore, the convection heat transfer performance cannot be improved because the gas flows in parallel with the substrate 3 and is discharged from the discharge ports 36 and 46. With such a configuration, without changing the positions of the conductive plate 5 and the fins 33 and 43,
When the inside air fan 32 and the outside air fan 42 are arranged so that the air blown from the fans directly collides with the substrates of the fins 33 and 43, the convection heat transfer performance is improved, but on the contrary, the thickness of the heat exchanger is increased and the size is reduced Can not be changed. Further, in the latter conventional technique, there is a problem that when a thermoelectric module is attached to a cooling body in order to improve the cooling performance, the thickness of the heat exchanger is increased by the thickness of the thermoelectric module. Therefore, the present invention improves the convection heat transfer performance without increasing the thickness, or utilizes a thermoelectric effect element to provide a small, thin, high heat exchange performance and highly accurate temperature control housing for electronic equipment. It is an object of the present invention to provide a heat exchange device.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a sealed housing for housing electronic equipment, a heat receiving portion provided inside the housing, and a heat radiating portion provided outside the housing. A heat exchanger having a metal conductive plate for partitioning the heat receiving portion and the heat radiating portion, wherein the heat receiving portion introduces inside air that has become hot due to heat generated in the housing;
A heat receiving fin for taking in heat of the inside air passage, a heat receiving fin substrate connecting the heat receiving fin and the conductive plate, and an inside air fan for introducing inside air to the inside air passage, wherein the heat radiating unit introduces outside air An external air passage, an external air fan for introducing the external air into the external air passage, a radiating fin substrate coupled to the conductive plate, and a radiating fin coupled to the radiating fin substrate; In the heat exchange device of an electronic device housing for exchanging heat by flowing the outside air to the radiation fins, the heat receiving portion and the heat radiation portion are disposed at diagonal positions in a vertical direction, and the conduction is performed. The plate is composed of a heat-receiving side conductive plate that couples the heat-receiving fin substrate and a heat-radiating side conductive plate that couples the heat-radiating fin substrate. ~ side And a configuration in which a thermoelectric effect element is brought into close contact to each of the radiation side conductive plate. Further, a temperature sensor provided in the housing and measuring inside air temperature is compared with the temperature data from the temperature sensor and a previously stored index temperature, and the temperature is input to the thermoelectric effect element so as to approach the index temperature. A control unit for controlling electric power.
Further, it is more preferable that the heat receiving side conductive plate and the heat radiating side conductive plate have an L-shaped cross section. Since the thermal conductance per unit volume can be increased by the above means, a heat exchange device for an electronic device housing which is small and thin and has high heat exchange performance can be obtained.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing the overall configuration of a heat exchange device for an electronic device housing, and FIG. 2 is a side sectional view showing details of the heat exchanger of FIG. In the figure, 2 is a heat exchanger, 3 is a heat receiving portion of the heat exchanger 2, and 4 is a heat radiating portion. 51 is a heat receiving side conductive plate, 52 is a heat dissipation side conductive plate, 6 is a thermoelectric effect element, 7
Is a temperature sensor for measuring the internal air temperature of the housing 1,
A control unit 8 calculates the amount of power supplied to the thermoelectric effect element 6 and sends a signal to the power supply 9. The heat exchanger 2 has the heat receiving portion 3 and the heat radiating portion 4 arranged at diagonal positions in the vertical direction when viewed from the side cross section. The metal conductive plate 5 that separates the heat receiving section 3 and the heat radiating section 4 is separated at the boundary between the heat receiving side and the heat radiating side,
This is an L-shaped heat-receiving-side conductive plate 51 and a heat-dissipating-side conductive plate 52. The thermoelectric effect element 6 is provided at this boundary. The thermoelectric effect element 6 includes a heat-absorbing side conductive plate 51
The heat radiation surface side is in close contact with the outside air side conductive plate 52. The heat exchange characteristic data when the thermoelectric effect element 8 is added and the data of the index temperature which is the target temperature of the air in the housing 1 are input to the control unit 8. Temperature sensor 6
Is compared with a previously stored index temperature to calculate and control the amount of power supplied to the thermoelectric effect element 6 so as to approach the index temperature. The heat exchange characteristic data is shown in FIG. FIG. 3 shows the thermal conductance per unit volume with respect to the power supplied to the thermoelectric effect element 6, and the thermal conductance per unit volume has a non-linear relationship having a maximum point with respect to the power supplied to the thermoelectric effect element 6. . In addition, the position of the maximum point changes depending on the material of the heat conductor. By inputting such characteristics as data to the control unit 8 in advance in accordance with the specifications of the heat exchanger 2, it is possible to control the temperature of the air inside the housing 1 with higher accuracy. In this embodiment, aluminum is used as the material of the heat conductor.

Next, the operation will be described. Now, when the housing 1 of the electronic device is turned on and starts operating, the inside air fan 32 and the outside air fan 42 of the heat exchanger 2 operate. Shy A _H is passed through the inside air fin 33 is sucked receiving portion 3 from inside air suction port 31, it is discharged from inside air discharge port 36 in the housing 1. The outside air _Ac is sucked from the outside air suction port 41, passes through the radiating fins 43 of the heat radiating unit 4, and is discharged from the outside air discharging port 46 to the atmosphere. The heat of the inside air A _H contacts the heat receiving fins 33, is transmitted from the heat receiving fin substrate 34 to the heat receiving side conductive plate 51, passes through the thermoelectric effect element 6, and is transmitted to the heat radiating side conductive plate 52. Here, part of the heat comes into contact with the outside air _Ac and is radiated. Further, the remaining heat radiation fin substrate 44, transmitted to the radiation fin 43 is in contact with the heat dissipation with ambient air A _c. When the temperature in the housing 1 further rises due to an increase in load or the surrounding environment and exceeds a set value, the control unit 8 calculates the amount of power for operating the thermoelectric effect element 6 based on the data of the temperature sensor 7. And sends a command to the power supply 9. When DC power is supplied from the power supply 9, the thermoelectric effect element 6 operates, the surface of the thermoelectric effect element 6 on the heat receiving side conductive plate 51 side is cooled, and the heat radiating side conductive plate 52 side becomes a heat radiating surface, and the thermal conductance is large. Become. Therefore, the cooling efficiency is high, the temperature of the inside air A _H decreases. Conversely, when the temperature in the housing 1 decreases due to a decrease in the load or the surrounding environment and becomes equal to or less than the set value, the supply of power to the thermoelectric effect element 6 decreases. Temperature inside air A _H of the housing 1 by repeating such an operation is maintained near the index temperature. Thus, the heat receiving fins 33 and the radiation fins 43
Since the thermoelectric effect element 6 is inserted into the space between them, the heat exchange performance can be improved without increasing the size of the heat exchanger even if the thermoelectric effect element 6 is added. A highly accurate inside air temperature in the enclosure by systemizing a heat exchanger incorporating this thermoelectric element, a temperature sensor inside the enclosure, a controller that inputs the heat exchanger characteristic data, and a power supply to the thermoelectric element. Control becomes possible.

[0007]

As described above, according to the present invention, the heat exchanger is arranged so that the heat receiving portion and the heat radiating portion are at diagonal positions in the vertical direction when viewed from the side cross section. Since the conductive plate that separates the heat radiating section is separated at the boundary between the heat receiving side and the heat radiating side, and the thermoelectric effect element is arranged at this boundary, the heat exchange performance can be improved without increasing the size of the heat exchanger. There is an effect of obtaining a heat exchange device for an electronic device housing which is extremely high and can perform temperature control with high accuracy.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating an overall configuration of a heat exchange device according to an embodiment of the present invention.

FIG. 2 is a side sectional view of a heat exchanger showing an embodiment of the present invention.

FIG. 3 is a characteristic diagram showing heat exchange characteristics of a thermoelectric effect element used in the heat exchanger of the present invention.

FIG. 4 is a side sectional view showing a conventional heat exchanger.

[Explanation of symbols]

1: Housing 2: Heat exchanger 3: Heat receiving unit 31: Inside air inlet 32: Inside air fan 33: Heat receiving fin 34: Heat receiving fin substrate 35: Inside air passage 36: Inside air outlet 4: Heat radiating unit 41: Outside air inlet 42 : External air fan 43: Radiation fin 44: Radiation fin board 45: External air passage 46: External air discharge port 5: Conductive plate 51: Heat receiving side conductive plate 52: Radiation side conductive plate 6: Thermoelectric effect element 7: Temperature sensor 8: Control unit 9: power A _H: shy A _c: outside air

Claims (3)

[Claims] 1. A sealed housing for housing an electronic device, a heat receiving portion provided inside the housing, a heat radiating portion provided outside, and a metal conductive plate separating the heat receiving portion and the heat radiating portion. A heat exchanger having a heat exchanger, wherein the heat receiving portion is an internal air passage for introducing internal air heated to a high temperature by the heat generated in the housing, a heat receiving fin that takes in the heat of the internal air passage, the heat receiving fin, and the heat receiving fin. A heat receiving fin substrate that couples the conductive plate, and an inside air fan that introduces inside air into the inside air passage, wherein the heat radiating unit includes an outside air passage that introduces outside air, and an outside air fan that introduces the outside air into the outside air passage. An electronic device comprising: a radiating fin substrate coupled to the conductive plate; and a radiating fin coupled to the radiating fin substrate, wherein the inside air flows through the heat receiving fin and the outside air flows through the radiating fin to exchange heat. Equipment housing In the heat exchange device, the heat receiving portion and the heat radiating portion are disposed at diagonal positions in a vertical direction, and the conductive plate connects the heat receiving side conductive plate connecting the heat receiving fin substrate and the heat radiating fin substrate. And a thermoelectric effect element in which a heat-absorbing side is closely attached to the heat-receiving-side conductive plate and a heat-radiating side is closely attached to the heat-radiating-side conductive plate at a boundary between the two conductive plates. A heat exchange device for an electronic device housing. 2. A thermo sensor provided in the housing for measuring inside air temperature, and comparing the temperature data from the temperature sensor with a previously stored index temperature so as to approach the index temperature. The heat exchange device for an electronic device housing according to claim 1, further comprising a control unit configured to control power supplied to the electronic device housing. 3. The heat exchanger according to claim 1, wherein the heat-receiving-side conductive plate and the heat-radiating-side conductive plate have an L-shaped cross section.