JP2013239490A - Electronic apparatus housing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus housing structure which meets demands for the downsizing and the weight reduction of an electronic apparatus housing.SOLUTION: A wall surface panel 4 of an electronic apparatus housing 1 is formed by a cooling unit 5 where a heat radiation heat sink 9 and an endothermic heat sink 10 are respectively disposed on the one surface side and the other surface side of a Peltier module 6. The endothermic heat sink 10 is disposed in the electronic apparatus housing 1 and the heat radiation heat sink 9 is disposed at the exterior of the electronic apparatus housing 1.

Description

  Embodiments described herein relate generally to an electronic device casing structure.

  The electronic equipment housing that houses the electronic equipment needs to have environmental resistance measures (temperature, humidity, vibration, impact, etc.) from the viewpoint of protecting the stored goods. In particular, COTS products often have a narrow operating temperature range, and devices that operate outdoors have a wide required temperature range. When storing such COTS products, temperature countermeasures are important.

  Therefore, a cooling unit such as a commercially available panel cooler is added to the enclosure to control the internal temperature of the enclosure within the operating temperature of the electronic equipment to be stored so that the electronic equipment can be operated without being affected by the outside air temperature. ing.

JP-A-3-192799

  Recently, there is an increasing demand for smaller and lighter electronic equipment housings. However, it is difficult to reduce the size and weight of a conventional cooling unit such as a commercially available panel cooler because the heat exchanger has a large shape. In the conventional cooling unit, since the heat exchange fan is designed and manufactured in the unit together with the heat exchanger, the overall shape and size of the cooling unit is large. For this reason, when equipment with various requirements is accommodated in the internal space such as the electronic device housing, the shape flexibility is small with respect to the limited internal space of the electronic device housing, and the internal space of the electronic device housing is limited. It is difficult to install a large cooling unit in the space.

  This embodiment pays attention to the above circumstances, and provides an electronic device housing structure that can meet the demand for a reduction in size and weight of an electronic device housing.

  According to the embodiment, the wall surface panel of the electronic device casing is formed by the cooling unit in which the heat sink for heat dissipation is arranged on one side of the Peltier module and the heat sink for heat absorption is arranged on the other side. The heat sink for heat absorption is disposed inside the electronic device housing, and the heat sink for heat dissipation is disposed outside the electronic device housing.

1 is a perspective view illustrating a schematic configuration of an entire electronic device housing according to a first embodiment. 1 is a longitudinal sectional view showing an internal configuration of an electronic device casing according to a first embodiment. The longitudinal cross-sectional view which shows the internal structure of the electronic device housing | casing of 2nd Embodiment. The longitudinal cross-sectional view which shows the internal structure of the electronic device housing | casing of 3rd Embodiment. The longitudinal cross-sectional view which shows the internal structure of the electronic device housing | casing of 4th Embodiment. VI-VI sectional view taken on the line of FIG. The perspective view of the principal part which shows the modification of the heat sink of the electronic device housing | casing of 4th Embodiment. The top view of the electronic device housing | casing of 5th Embodiment. IX-IX sectional view taken on the line of FIG. The front view of the electronic device housing | casing of 5th Embodiment.

[First Embodiment]
(Constitution)
1 and 2 show a first embodiment. FIG. 1 is a perspective view showing an overall schematic configuration of the electronic device casing 1 according to the first embodiment, and FIG. 2 is a longitudinal sectional view showing an internal configuration of the electronic device casing 1. As shown in FIG. 2, the electronic device casing 1 of the present embodiment has a thin wall surface panel 4 of the ceiling portion 3a of a box-shaped casing main body 3 that houses an electronic device 2 that is a heating element to be cooled. It is formed by the cooling unit 5.

  The cooling unit 5 of the present embodiment includes a heat sink 9 for heat dissipation on one side (upper side in FIG. 2) of the Peltier module group 7 in which a plurality of Peltier modules 6 are arranged side by side on the plane, and the other side (see FIG. The heat sink 10 for absorbing heat is disposed on the lower surface side in FIG. Here, the heat sink 10 for heat absorption is disposed inside the electronic device housing 1, and the heat sink 9 for heat dissipation is disposed outside the electronic device housing 1. The number of Peltier modules 6 arranged in the Peltier module group 7 can be adjusted in accordance with the amount of heat generated by the electronic device 2 to be cooled that is incorporated in the electronic device casing 1. And you may make it the structure which adjusts the area and arrangement | positioning location of the cooling unit 5 according to the number of the Peltier modules 6. FIG.

  Here, in the electronic device housing 1, for example, a heat sink 9 for heat dissipation is formed by a finned panel in which fins in which a plurality of fin structures are arranged in parallel are integrally formed on the wall surface panel 4. Instead of the configuration in which the heat sink 9 for heat dissipation is formed of a panel with fins, the heat sink for heat absorption 10 may be formed of a panel with fins.

  An external cover 11 is mounted outside the electronic device housing 1 so as to cover the heat sink 9 for heat dissipation. Between the external cover 11 and the electronic device housing 1, an external duct 12 for passing heat exchange air through the heat sink 9 for heat dissipation is formed. Further, a suction port 12a of the external duct 12 is formed on one side 3b of the housing body 3 of the electronic device housing 1, and an exhaust port 12b of the external duct 12 is formed on the other side 3c. A plurality of, in the present embodiment, three external fans 13 are attached to the exhaust port 12 b of the external duct 12. By driving these external fans 13, the outside air sucked from the suction port 12a flows along the heat sink 9 for heat dissipation inside the external duct 12 as shown by arrows in FIGS. 1 and 2, and is exhausted to the outside from the exhaust port 12b. A ventilation path is formed. At this time, air for radiating heat is passed between the plurality of fin constituent members constituting the heat radiating fins of the heat radiating heat sink 9.

  Inside the electronic device housing 1, an internal duct 14 is disposed on one end side of the heat sink for heat absorption 10. The internal duct 14 is disposed at a position corresponding to the suction port 12 a side of the external duct 12. The upper end portion of the internal duct 14 is connected to one end portion of the heat sink for heat absorption 10. An internal fan 15 is disposed at the lower end of the internal duct 14. Then, by driving the internal fan 15, the air inside the electronic device housing 1 sucked from the heat sink heat sink 10 side as shown by an arrow in FIG. 2 passes through the internal duct 14, and from the internal fan 15 to the electronic device housing 1. A ventilation path is formed in the lower part.

  A first wind direction guide plate 16 is disposed at the bottom of the electronic device housing 1 at a position below the internal fan 15, and a second wind direction guide is provided at an end opposite to the first wind direction guide plate 16. A plate 17 is provided. The flow of air blown downward from the internal fan 15 was guided by the first wind direction guide plate 16 in the direction of flowing toward the second wind direction guide plate 17 along the bottom surface of the electronic device housing 1. After that, the second wind direction guide plate 17 guides it in the upward flow direction. As a result, a ventilation path is formed inside the electronic device housing 1 for convection of the heat exchange air that passes the heat exchange air through the heat sink for heat absorption 10 as indicated by an arrow in FIG. In the present embodiment, the internal duct 14, the internal fan 15, the first wind direction guide plate 16 and the second wind direction guide plate 17 form convection generating means for generating air convection inside the electronic device housing 1. ing.

(Function)
Next, the operation of the above configuration will be described. When the electronic device casing 1 of the present embodiment is used, the external fan 13 outside the electronic device housing 1 and the internal fan 15 inside the electronic device housing 1 are driven. Then, by driving the internal fan 15, the air inside the electronic device housing 1 sucked from the heat sink heat sink 10 side as shown by an arrow in FIG. 2 passes through the internal duct 14, and from the internal fan 15 to the electronic device housing 1. The air is blown to the lower part, and then flows toward the second wind direction guide plate 17 along the bottom surface of the electronic device housing 1 by the first wind direction guide plate 16 and then flows upward by the second wind direction guide plate 17. . As a result, air convection is generated inside the electronic device housing 1, so that the heat of the electronic device 2 is transferred to the heat sink heat sink 10 by the convection of the internal air of the electronic device housing 1.

  At this time, by the driving of the external fan 13, the outside air sucked from the suction port 12a flows along the heat sink 9 in the external duct 12 as indicated by the arrows in FIGS. Exhausted. Thus, heat is radiated from the heat sink 9 for heat radiation to the outside by the flow of the external air in the external duct 12.

  Then, the heat absorbed from the heat sink 10 for heat absorption is transferred to the heat sink 9 for heat dissipation via the Peltier module group 7 and radiated, whereby the electronic device 2 inside the electronic device housing 1 is cooled. Thereby, the internal temperature of the housing 1 can be controlled within the operating temperature of the electronic device 2 to be stored, and the electronic device 2 can be operated without being affected by the outside air temperature.

(effect)
Therefore, the above configuration has the following effects. That is, in the electronic device housing 1 of the present embodiment, the thin cooling unit 5 can be used as the wall surface panel 4 of the housing 1 by disposing the thin cooling unit 5 on the wall surface panel 4. As a result, it is possible to obtain the electronic device housing 1 that has a thin temperature adjustment cooling unit 5, has a temperature adjustment function, does not take up an operation space, and has excellent mountability. Therefore, even an electronic device 2 having a narrow operating temperature range such as a COTS product can be operated in a wide range of environmental temperatures by being housed in the housing 1 and temperature controlled. Moreover, since the cooling unit 5 can be shared with the wall surface panel 4 of the electronic device housing 1, the cost can be reduced.

  Further, the number of Peltier modules 6 arranged in the Peltier module group 7 can be adjusted according to the amount of heat generated by the electronic device 2 to be cooled that is incorporated in the electronic device casing 1. And you may make it the structure which adjusts the area and arrangement | positioning location of the cooling unit 5 according to the number of the Peltier modules 6. FIG. As a result, the expandability of the cooling capacity is facilitated, and the corresponding range is expanded. For this reason, by arranging the cooling unit 5 at a position of the electronic device casing 1 that is not restricted as much as necessary, it is possible to provide the optimal electronic device housing 1 in consideration of the operation space. Even if the number of Peltier modules 6 increases, if it is used in a highly efficient area, it can be realized with power saving.

  In addition, the thin cooling unit 5 of the present embodiment can be easily expanded up to the surface integration of the wall surface panel 4, and the cooling capacity can be easily expanded.

  Furthermore, since the Peltier module 6 is used for the thin cooling unit 5, the electronic device housing 1 having both cooling and heating can be obtained by electrically controlling the Peltier module 6.

  Furthermore, since the thin cooling unit 5 of the present embodiment can be installed in the space of the heat insulation panel of the wall surface panel 4 of the current electronic device housing 1, there is an effect that is easy to apply.

[Second Embodiment]
(Constitution)
FIG. 3 shows a second embodiment. The present embodiment is a modification in which the configuration of the electronic device casing 1 of the first embodiment (see FIGS. 1 and 2) is changed as follows. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

  In other words, the electronic device casing 21 of the present embodiment is blown out from the built-in fan 22 that is incorporated in advance in the electronic device 2 that is a heating object to be cooled and is disposed inside the electronic device casing 21. The structure is such that air convection is generated inside the electronic device housing 21 using the blown air. Here, one end of an internal duct 24 is connected to the outlet 23 from the built-in fan 22 of the electronic device 2. The other end of the internal duct 24 is connected to one end of the heat absorbing heat sink 10.

(Function)
Next, the operation of the above configuration will be described. When the electronic device casing 21 of the present embodiment is used, the external fan 13 outside the electronic device housing 21 is driven. By driving the external fan 13, the outside air sucked from the suction port 12a as shown by an arrow in FIG. 3 flows along the heat radiating heat sink 9 in the external duct 12, and is exhausted to the outside from the exhaust port 12b. Thus, heat is radiated from the heat sink 9 for heat radiation to the outside by the flow of the external air in the external duct 12.

  Further, inside the electronic device casing 21, as shown by arrows in FIG. 3, blown air blown from the built-in fan 22 incorporated in advance in the electronic device 2 flows through the internal duct 24 to the heat sink for heat absorption 10. As a result, air convection is generated inside the electronic device housing 21, so that heat of the electronic device 2 is transferred to the heat sink heat sink 10 side by convection of the internal air of the electronic device housing 21.

  Then, the heat absorbed from the heat sink 10 for heat absorption is transferred to the heat sink 9 for heat dissipation via the Peltier module group 7 and radiated, whereby the electronic device 2 inside the electronic device housing 21 is cooled. Thereby, the internal temperature of the housing 21 is controlled within the operating temperature of the electronic device 2 to be stored, and the electronic device 2 can be operated without being affected by the outside air temperature.

(effect)
Therefore, in the present embodiment, the blown air blown from the built-in fan 22 incorporated in advance in the electronic device 2 can be used for the convection of the internal air of the electronic device housing 21, so that the inside of the electronic device housing 21 is The fan can be omitted. Therefore, in addition to the effects of the first embodiment, the internal configuration of the electronic device housing 21 can be further simplified.

[Third Embodiment]
(Constitution)
FIG. 4 shows a third embodiment. The present embodiment is a modification of the electronic device casing 1 of the first embodiment (see FIGS. 1 and 2). In FIG. 4, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

  The electronic device casing 31 of the present embodiment is obtained by changing the configuration of the heat sink 10 for absorbing heat of the cooling unit 5 as follows. That is, the heat sink 10 for heat absorption according to the present embodiment has a flat base plate in which fins 33 in which a plurality of fin structures 32 are arranged in parallel are arranged on one side (the lower side in FIG. 4) of the Peltier module group 7. 34 protrudes. The fin 33 is formed by inclining the height of each fin component 32 so that one end (right end in FIG. 4) side of the electronic device housing 1 is higher than the other end (left end in FIG. 4). is there. And by the shape of each fin structure 32 of this fin 33, the convection generation | occurrence | production which generate | occur | produces the natural convection of air inside the electronic device housing | casing 31 by the heat absorption of the fin 33 of the heat sink 10 for heat absorption as shown by the arrow in FIG. A means 35 is formed.

(Function)
Next, the operation of the above configuration will be described. When the electronic device casing 31 of the present embodiment is used, the external fan 13 outside the electronic device housing 31 is driven. By driving the external fan 13, the outside air sucked from the suction port 12a flows along the heat radiating heat sink 9 in the external duct 12 as shown by an arrow in FIG. 4, and is exhausted to the outside from the exhaust port 12b. Thus, heat is radiated from the heat sink 9 for heat radiation to the outside by the flow of the external air in the external duct 12.

  Further, inside the electronic device casing 21, as indicated by arrows in FIG. 4, high-temperature air heated by the heat of the electronic device 2 flows upward due to the convection effect, and heat with the fins 33 of the heat sink 10 for heat absorption. The air cooled by the exchange (heat absorption) moves downward. At this time, the height of each fin component 32 of the fin 33 is inclined such that one end (right end in FIG. 4) side of the electronic device housing 1 is higher than the other end (left end in FIG. 4) side. Due to the inclined shape, natural convection of air is generated inside the electronic device housing 31 as indicated by arrows in FIG.

  Then, the heat absorbed from the heat sink 10 for heat absorption is transferred to the heat sink 9 for heat dissipation via the Peltier module group 7 and radiated, whereby the electronic device 2 inside the electronic device housing 31 is cooled.

(effect)
Therefore, in the present embodiment, the electronic device 2 inside the electronic device casing 31 can be cooled by natural convection of air generated inside the electronic device casing 31. Therefore, since the internal fan of the electronic device housing 31 can be omitted, in addition to the effects of the first embodiment, the internal configuration of the electronic device housing 21 can be further simplified.

[Fourth Embodiment]
(Constitution)
5 and 6 show a fourth embodiment. The present embodiment is a modification of the electronic device casing 1 of the first embodiment (see FIGS. 1 and 2). 5 and 6, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

  That is, the electronic device casing 41 of the present embodiment is provided with a rectifying plate 43 in which a plurality of blades 42 are arranged in parallel on the lower surface side of the heat sink 10 for heat absorption. The blades 42 of the rectifying plate 43 are juxtaposed in parallel with each other inclined obliquely with respect to the vertical direction. The rectifying plate 43 forms convection generating means 44 for generating natural convection of air inside the electronic device housing 41 by the heat absorption of the heat sink 10 for heat absorption as indicated by arrows in FIG.

(Function)
Next, the operation of the above configuration will be described. When the electronic device casing 41 of the present embodiment is used, the external fan 13 outside the electronic device housing 41 is driven. By driving the external fan 13, the outside air sucked from the suction port 12a flows along the heat sink 9 for heat dissipation in the external duct 12 as indicated by an arrow in FIG. 5, and is exhausted to the outside from the exhaust port 12b. Thus, heat is radiated from the heat sink 9 for heat radiation to the outside by the flow of the external air in the external duct 12.

  Moreover, in the inside of the electronic device housing | casing 41, as shown by the arrow in FIG. 5, the high temperature air heated with the heat | fever of the electronic device 2 flows upwards by the convection effect. At this time, the air flowing upward flows between the blades 42 of the rectifying plate 43, thereby generating rectification that flows along the inclination direction of the blades 42 as indicated by arrows in FIG. Thereby, the air cooled by heat exchange (heat absorption) with the fins 33 of the heat sink 10 for heat absorption moves downward from one end (left end in FIG. 5) side of the electronic device housing 1. At this time, natural convection of air is generated inside the electronic device housing 41 as indicated by an arrow in FIG.

  Then, the heat absorbed from the heat sink for heat sink 10 is transferred to the heat sink 9 for heat dissipation via the Peltier module group 7 and radiated, whereby the electronic device 2 inside the electronic device housing 41 is cooled.

(effect)
Therefore, in the above configuration, the electronic device 2 inside the electronic device housing 41 can be cooled by natural convection of air generated inside the electronic device housing 41. Therefore, since the internal fan of the electronic device housing 41 can be omitted also in the present embodiment, the internal configuration of the electronic device housing 41 can be further simplified in addition to the effects of the first embodiment.

  Note that the heat sink for heat absorption 10 of the present embodiment may be configured by integrally forming a rectifying plate 43 in which a plurality of blades 42 are arranged in parallel on the lower surface side of the heat sink for heat absorption 10 as in the modification shown in FIG. .

[Fifth Embodiment]
(Constitution)
8 to 10 show a fifth embodiment. The present embodiment is a modification of the electronic device casing 1 of the first embodiment (see FIGS. 1 and 2). 8 to 10, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

  That is, the electronic device casing 51 of the present embodiment is provided with a common fan 52 that doubles as the external fan 13 and the internal fan 15 of the cooling unit 5 of the first embodiment. Here, the fan 52 is arrange | positioned at the one end part of the cooling unit 5, as shown in FIG. 8 and FIG. The lower side of the fan case 53 communicates with the internal space of the electronic device casing 51. Further, the upper side of the fan case 53 communicates with the external duct 12 between the external cover 11 and the electronic device housing 51.

  The fan case 53 on the exhaust port side of the fan 52 includes a partition wall formed between a communicating portion with the internal space of the electronic device housing 51 and a communicating portion with the external duct 12, as shown in FIG. A rectifying plate 54 having a higher inclined surface is formed. Here, the inclination direction of the rectifying plate 54 of the partition wall of the fan case 53 is determined by the rotation direction of the fan 52 and the flow direction of the exhaust gas. This prevents the air from flowing inside and outside of the electronic device housing 51 from being mixed with the air flow of the outside air flowing through the external duct 12 and the air flow of the air flowing through the internal space of the electronic device housing 51. Means 55 are formed.

(Function)
Next, the operation of the above configuration will be described. When the electronic device casing 51 of the present embodiment is used, the fan 52 of the electronic device casing 51 is driven. By driving the fan 52, as shown by an arrow in FIG. 9, the outside air sucked from the suction port 12a flows along the heat sink 9 for heat dissipation in the external duct 12 and is exhausted to the outside from the exhaust port 12b. Thus, heat is radiated from the heat sink 9 for heat radiation to the outside by the flow of the external air in the external duct 12.

  Also, in the electronic device casing 51, air convection is generated by the drive of the fan 52 as shown by arrows in FIG. At this time, high-temperature air heated by the heat of the electronic device 2 flows upward due to the convection effect, and is transferred to the heat sink 10 for heat absorption. Then, air cooled by heat exchange (heat absorption) with the fins 33 of the heat sink for heat absorption 10 is blown out from the fan 52 and blown to the electronic device 2, thereby cooling the electronic device 2.

  Then, the heat absorbed from the heat sink 10 for heat absorption is transferred to the heat sink 9 for heat dissipation via the Peltier module group 7 and radiated, whereby the electronic device 2 inside the electronic device casing 51 is cooled.

(effect)
Therefore, in the above configuration, the inside of the electronic device casing 51 and the inside of the external duct 12 can be blown by the common fan 52, respectively. Therefore, in addition to the effects of the first embodiment, the internal configuration of the electronic device casing 51 can be further simplified.

  According to these embodiments, it is possible to provide an electronic device housing structure that can meet the demand for a reduction in size and weight of the electronic device housing.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

    DESCRIPTION OF SYMBOLS 1 ... Electronic equipment housing, 4 ... Wall panel, 5 ... Cooling unit, 6 ... Peltier module, 9 ... Heat sink for heat dissipation, 10 ... Heat sink for heat absorption.

Claims (8)

A wall panel of the electronic device housing is formed by a cooling unit in which a heat sink for heat dissipation is arranged on one side of the Peltier module and a heat sink for heat absorption is arranged on the other side,
The heat sink for heat absorption is arrange | positioned inside the said electronic device housing, and the said heat sink for heat dissipation is arrange | positioned outside the said electronic device housing. The electronic device housing structure characterized by the above-mentioned. The electronic device housing includes a convection generating unit in which the heat sink for heat absorption is disposed on a ceiling surface and generates convection of air in the electronic device housing by heat absorption in the electronic device housing by the heat sink for heat absorption. The electronic device casing structure according to claim 1, wherein: In the electronic device housing, at least one of the heat sink for heat absorption and the heat sink for heat dissipation is formed by a finned panel in which fins in which a plurality of fin structures are arranged in parallel are integrally formed with the wall surface panel. The electronic device casing structure according to claim 1. In the electronic device housing, the heat sink for heat absorption is formed by a finned panel in which a fin in which a plurality of fin structures are arranged in parallel is integrally formed with the wall surface panel,
The convection generating means is formed by inclining the height of a plurality of fin structures constituting the fin for heat absorption so that one end side of the electronic device housing is higher than the other end side. The electronic device casing structure according to claim 2. In the electronic device housing, the heat sink for heat dissipation is formed by a finned panel in which a fin in which a plurality of fin structures are arranged in parallel is integrally formed with the wall surface panel,
The electronic device casing structure according to claim 1, further comprising: a fan that allows air to be radiated between the fin constituents on the side of the plurality of fin constituents constituting the fins for heat dissipation. The electronic device housing shares a convection generating means for generating convection of heat absorbing air inside the electronic device housing and a fan for ventilating heat radiation outside the electronic device housing. The electronic device casing structure according to claim 1, wherein: The electronic device housing structure according to claim 6, wherein the electronic device housing includes an air mixing preventing unit that prevents air inside and outside the electronic device housing from being mixed into an exhaust portion of the fan. The air mixing preventing means includes a rectifying plate having an inclination direction set according to a rotation direction of the fan and a flow direction of the exhaust of the fan at an exhaust portion of the fan. The electronic device casing structure described in 1.

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