CN113188657A - Single photon detection device and quantum communication equipment comprising same - Google Patents

Single photon detection device and quantum communication equipment comprising same Download PDF

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Publication number
CN113188657A
CN113188657A CN202110498659.4A CN202110498659A CN113188657A CN 113188657 A CN113188657 A CN 113188657A CN 202110498659 A CN202110498659 A CN 202110498659A CN 113188657 A CN113188657 A CN 113188657A
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CN
China
Prior art keywords
single photon
detection device
photon detection
circuit pattern
avalanche photodiode
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Granted
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CN202110498659.4A
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Chinese (zh)
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CN113188657B (en
Inventor
陈柳平
张建
张国锋
范永胜
万相奎
付仁清
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Guangdong Qike Quantum Information Technology Research Institute Co ltd
Guokaike Quantum Technology Beijing Co Ltd
Original Assignee
Guangdong Qike Quantum Information Technology Research Institute Co ltd
Guokaike Quantum Technology Beijing Co Ltd
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Priority to CN202110498659.4A priority Critical patent/CN113188657B/en
Publication of CN113188657A publication Critical patent/CN113188657A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0271—Housings; Attachments or accessories for photometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0403—Mechanical elements; Supports for optical elements; Scanning arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/70—Photonic quantum communication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/4413—Type
    • G01J2001/442—Single-photon detection or photon counting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/4446—Type of detector
    • G01J2001/446—Photodiode
    • G01J2001/4466—Avalanche

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Light Receiving Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

The invention provides a single photon detection device and quantum communication equipment comprising the same, wherein the single photon detection device comprises: a housing; the refrigeration assembly is arranged at the bottom of the cavity of the shell; the single-photon avalanche photodiode is arranged on the refrigeration component; an input optical fiber which is introduced from the outside of the housing into and connected to the single photon avalanche photodiode via a through hole on a side wall of the housing; and the packaging cover is combined with the top opening of the shell to package the refrigeration component and the single photon avalanche photodiode into the shell, wherein a first circuit pattern and a second circuit pattern are formed on the packaging cover, the first circuit pattern is electrically connected to the single photon avalanche photodiode and transmits the detected optical signal to the data interaction interface, and the second circuit pattern is electrically connected to the refrigeration component and transmits the electric power obtained by the power supply interface to the refrigeration component. The single photon detection device provided by the invention can avoid the problem that the air tightness of the device is reduced because the slotted hole is formed by exposing the interface outwards.

Description

Single photon detection device and quantum communication equipment comprising same
Technical Field
The invention relates to the technical field of quantum communication, in particular to a single photon detection device and quantum communication equipment comprising the same.
Background
In the field of quantum secure communication and quantum computing, a single photon detection device is generally used to detect quantum light to obtain information transmitted by quantum states. Since the single photon avalanche photodiode in the single photon detection device must be placed in a low temperature environment (e.g., -40 ℃ or-50 ℃) with very stable sealing performance to operate normally, the single photon detection device is required to have very reliable and stable sealing performance.
In the related art, since the power supply interface and the data interaction interface disposed on the driving control circuit board of the single photon detection device must be exposed to the outside to access an external power supply and transmit the detected optical signal to other devices or apparatuses, a lateral slot hole needs to be formed in a sidewall of a housing of the single photon detection device, so that the driving control circuit board can be inserted into and disposed inside the housing from a side surface of the housing, and simultaneously, a portion of the driving control circuit board is exposed to the outside to dispose the power supply interface and the data interaction interface. However, such a transverse slot has a large area, and although the slot can be sealed by using silicone rubber, the silicone rubber may fall off or separate from the seal with the change of temperature or environment, and thus the airtightness of the single photon detection device cannot be ensured.
Disclosure of Invention
The invention aims to provide a single photon detection device and quantum communication equipment comprising the same.
According to an aspect of the present invention, there is provided a single photon detection apparatus comprising: a housing; the refrigeration assembly is arranged at the bottom of the cavity of the shell; the single-photon avalanche photodiode is arranged on the refrigerating assembly; an input optical fiber that is introduced from outside the case to inside via a through-hole provided on a side wall of the case and is connected to the single photon avalanche photodiode; and an encapsulation cover coupled to the top opening of the housing to encapsulate the refrigeration component and the single photon avalanche photodiode inside the cavity of the housing, wherein the encapsulation cover is formed with a first circuit pattern and a second circuit pattern, the first circuit pattern being electrically connected to the single photon avalanche photodiode and transmitting an optical signal detected by the single photon avalanche photodiode from the input optical fiber to a data exchange interface provided on the encapsulation cover, and the second circuit pattern being electrically connected to the refrigeration component and transmitting electric power obtained from an external power source via a power supply interface provided on the encapsulation cover to the refrigeration component.
According to an embodiment of the present invention, the package cover is made of one of an aluminum substrate and a ceramic board.
According to an embodiment of the present invention, the first circuit pattern and the second circuit pattern are formed on an upper surface of the encapsulation cover.
According to an embodiment of the present invention, a first wire through hole penetrating the encapsulation cover is further provided in the encapsulation cover, and a cable electrically connected to the single photon avalanche photodiode passes through the first wire through hole to be led out from the inside of the case and electrically connected to the first circuit pattern.
According to an embodiment of the present invention, the wires are soldered on the package cover via pads disposed at the respective apertures on the upper surface of the package cover, so that the wires are electrically connected to the first circuit pattern and seal the first wire passing holes.
According to an embodiment of the present invention, a second wire through hole penetrating the package cover is further provided in the package cover, and a cable electrically connected to the cooling module passes through the second wire through hole to be led out from the inside of the case and electrically connected to the second circuit pattern.
According to an embodiment of the present invention, the wires are soldered on the package cover via pads disposed at the respective apertures on the upper surface of the package cover, so that the wires are electrically connected to the second circuit pattern and seal the second wire passing holes.
According to one embodiment of the invention, the surface of the hole wall of the through hole is coated with a dielectric layer.
According to one embodiment of the invention, one end of the packaging cover extends beyond the edge of the shell to mount the data interaction interface and the power supply interface.
According to an embodiment of the invention, the single photon detection apparatus further comprises: and the heat sink is arranged between the single photon avalanche photodiode and the refrigeration component and surrounds the single photon avalanche photodiode.
According to one embodiment of the present invention, the heat sink is made of one of copper, aluminum, graphite, gold, silver, and thermally conductive ceramic.
According to an embodiment of the invention, the single photon detection apparatus further comprises: and the sealing ring is arranged between the packaging cover and the top opening of the shell so as to seal a gap between the packaging cover and the top opening of the shell.
According to another aspect of the present invention, there is provided a quantum communication device comprising a single photon detection apparatus as described above.
The single-photon detection device according to the exemplary embodiment of the invention not only can effectively avoid the problem that the air tightness of the single-photon detection device is reduced by forming the transverse slot on the side wall of the shell of the single-photon detection device due to the fact that the data interaction interface and the power supply interface of the single-photon detection device are exposed outwards, but also can enable the single-photon detection device to be more miniaturized.
Drawings
The above objects and features of the present invention will become more apparent from the following description when taken in conjunction with the accompanying drawings.
Fig. 1 shows a schematic view of the overall structure of a single-photon detection apparatus according to an exemplary embodiment of the present invention.
Figure 2 shows an exploded view of the overall structure of a single photon detection device according to an exemplary embodiment of the present invention.
Figure 3 shows a cross-sectional view of the overall structure of a single photon detection device according to an exemplary embodiment of the present invention taken along the direction a shown in figure 1.
Figure 4 shows another cross-sectional view of the overall structure of a single photon detection device according to an exemplary embodiment of the present invention taken along the direction a shown in figure 1.
Figure 5 shows a top view of a single photon detection device according to an exemplary embodiment of the present invention.
Detailed Description
The conception of the invention is as follows: the drive control circuit for the single photon detection device is formed on the packaging cover, so that the data interaction interface and the power supply interface which are arranged on the packaging cover are exposed outwards and are provided for an external device and an external power supply which are connected with the single photon detection device, and the problem that the air tightness of the single photon detection device is reduced due to the fact that the data interaction interface and the power supply interface are exposed outwards and slotted holes are formed in the side wall of the shell of the single photon detection device is effectively solved. Therefore, a stable and reliable air-tight working environment can be provided for the single photon avalanche photodiode packaged in the single photon detection device, and the exchange leakage between the air inside and outside the single photon detection device can be effectively blocked, so that the single photon detection device is kept in a low-temperature environment with very stable and reliable sealing performance.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Figure 1 shows a schematic diagram 100 of the overall structure of a single photon detection apparatus according to an exemplary embodiment of the present invention. Figure 2 shows an exploded view 200 of the overall structure of a single photon detection device according to an exemplary embodiment of the present invention. Figure 3 shows a cross-sectional view 300 of the overall structure of a single photon detection device according to an exemplary embodiment of the present invention, taken along the direction a shown in figure 1. Figure 4 shows another cross-sectional view 400 of the overall structure of a single photon detection apparatus according to an exemplary embodiment of the present invention, taken along direction a shown in figure 1. Figure 5 shows a top view 500 of a single photon detection device according to an exemplary embodiment of the present invention.
Referring to fig. 1, 2, 3, 4 and 5, a single photon detection device according to an exemplary embodiment of the invention may include a housing 101, a refrigeration assembly 102, a single photon avalanche photodiode 103, an input optical fiber 104 and an encapsulation cover 105.
In the single photon detection apparatus shown in fig. 1, 2, 3, 4 and 5, the refrigeration assembly 102 may be disposed at the bottom of the cavity of the housing 101, the single photon avalanche photodiode 103 may be mounted on the refrigeration assembly 102, the input optical fiber 104 may be introduced from the outside of the housing 101 into and connected to the single photon avalanche photodiode 103 via a through hole disposed on a sidewall of the housing 101, and the encapsulation cover 105 may be coupled to the top opening of the housing 101 to encapsulate the refrigeration assembly 102 and the single photon avalanche photodiode 103 inside the cavity of the housing 101.
In the single photon detection apparatus shown in fig. 1, 2, 3, 4 and 5, the package cover 105 is further formed with a first circuit pattern 106 and a second circuit pattern 107, the first circuit pattern 106 may be electrically connected to the single photon avalanche photodiode 103 and transmit an optical signal detected by the single photon avalanche photodiode 103 from the input optical fiber 104 to a data interface 111 provided on the package cover 105, the data interface 111 may include a control interface configured to transmit a control signal to the single photon detection apparatus and a data interface configured to transmit an optical signal detected by the single photon detection apparatus to the outside, and the second circuit pattern 107 may be electrically connected to the cooling member 102 and transmit electric power obtained from an external power source to the cooling member 102 via a power supply interface 112 provided on the package cover 105.
It can be seen that the single photon detection device with the above structure can effectively avoid the problem that the air tightness of the single photon detection device is reduced by forming the slot holes on the side wall of the shell 101 of the single photon detection device due to the fact that the data interaction interface 111 and the power supply interface 112 are exposed outwards, so that the single photon detection device can provide a more stable and reliable air tightness working environment for the single photon avalanche photodiode 103 packaged in the single photon detection device, and can effectively block the exchange leakage between the inside and the outside air of the single photon detection device.
Next, electrical connection and further sealing measures for the first circuit pattern 106 and the second circuit pattern 107 in the above-described single photon detection device will be described in further detail with continued reference to the drawings.
In one example, as in the single photon detection apparatus shown in fig. 1, 2, 3, 4 and 5, the first circuit pattern 106 and the second circuit pattern 107 may be formed on the upper surface of the encapsulation cover 105 to facilitate line detection of the first circuit pattern 106 and the second circuit pattern 107.
In this example, a first line passing hole 109 penetrating the package cover 105 is further provided in the package cover 105, and a cable electrically connected to the single photon avalanche photodiode 103 passes through the first line passing hole 109 to be led out from inside the housing 101 and electrically connected to the first circuit pattern 106. Accordingly, the cable may be soldered on the package cover 105 via pads disposed at the respective apertures on the upper surface of the package cover 105, electrically connected to the first circuit pattern 106 and sealing the first wire passing hole 109.
In this example, a second wire passing hole 110 penetrating the encapsulation cover 105 is further provided in the encapsulation cover 105, and a cable electrically connected to the cooling component 102 passes through the second wire passing hole 110 to be drawn out from inside the housing 101 and electrically connected to the second circuit pattern 107. Accordingly, the cable may be soldered on the package cover 105 via pads disposed at the respective apertures on the upper surface of the package cover 105, so that the cable is electrically connected to the second circuit pattern 107 and seals the second wire passing hole 110.
In addition, in this example, the hole wall surfaces of the first and second wire through holes 109 and 110 may be coated with a dielectric layer (not shown) to maintain insulation between the cable and the wire through holes and to ensure reliability of the signal transmission process.
It should be understood that although fig. 1, 2, 3, 4 and 5 show an example in which the first circuit pattern 106 and the second circuit pattern 107 may be formed on the upper surface of the encapsulation cover 105, this example is merely illustrative and the present invention is not limited thereto, for example, the first circuit pattern 106 and the second circuit pattern 107 may also be formed on the lower surface of the encapsulation cover 105 as needed.
In addition, it should also be understood that, although fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5 show an example in which one end of the encapsulation cover 105 may extend beyond the edge of the housing 101 to mount the data interaction interface 111 and the power supply interface 112, this example is also only illustrative, and the present invention is not limited thereto, for example, the data interaction interface 111 and the power supply interface 112 may be directly mounted at other positions on the encapsulation cover 105 as needed, which may depend on the shape and mounting manner of the above-described interfaces.
In addition, in the single photon detection apparatus shown in fig. 1, 2, 3, 4 and 5, the single photon detection apparatus according to the exemplary embodiment of the present invention may further include a heat sink 108, and the heat sink 108 may be disposed between the single photon avalanche photodiode 103 and the cooling member 102 and surround the single photon avalanche photodiode 103. In an example, the heat sink 108 may be made using, such as, but not limited to, one of the following materials: copper, aluminum, graphite, gold, silver, and thermally conductive ceramics. Therefore, the temperature of the refrigeration component 102 can be transmitted to the periphery of the single photon avalanche photodiode 103 by utilizing the thermal conductivity of the heat sink, so that the uniform refrigeration of the single photon avalanche photodiode 103 is realized.
In addition, in the single photon detection apparatus shown in fig. 1, 2, 3, 4, and 5, the single photon detection apparatus according to the exemplary embodiment of the present invention may further include a sealing ring (not shown) that may be disposed between the encapsulation cover 105 and the top opening of the housing 101 to seal a gap between the encapsulation cover 105 and the top opening of the housing 101. However, the present invention is not limited thereto, and a sealing material such as, but not limited to, silicone may be used to seal the gap between the package cover 105 and the top opening of the case 101 as long as stable airtightness of the single photon detection device can be ensured, as required.
In addition, in the single photon detection devices shown in figures 1, 2, 3, 4 and 5, the encapsulation cover 105 may be made using a material such as, but not limited to, one of the following: aluminum substrate and ceramic plate.
The single photon detection device shown in fig. 1, 2, 3, 4 and 5 can effectively avoid the problem that the airtightness of the single photon detection device is reduced by forming slot holes on the side wall of the housing 101 of the single photon detection device due to the data interaction interface 111 and the power supply interface 112 being exposed to the outside, so that the single photon detection device can provide a more stable and reliable airtight working environment for the single photon avalanche photodiode 103. Therefore, a quantum communication device (such as, but not limited to, a transmitting end and/or a receiving end in a Quantum Key Distribution (QKD) system) applying the single-photon detection apparatus can further improve the measurement sensitivity and the communication speed of the quantum communication device. Correspondingly, the invention also provides quantum communication equipment comprising the single photon detection device.
While the present application has been shown and described with reference to preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made to these embodiments without departing from the spirit and scope of the present application as defined by the following claims.

Claims (13)

1. A single photon detection device comprising:
a housing;
the refrigeration assembly is arranged at the bottom of the cavity of the shell;
the single-photon avalanche photodiode is arranged on the refrigerating assembly;
an input optical fiber that is introduced from outside the case to inside via a through-hole provided on a side wall of the case and is connected to the single photon avalanche photodiode; and
an encapsulation cover coupled to a top opening of the housing to encapsulate the refrigeration component and the single photon avalanche photodiode inside a cavity of the housing,
wherein the package cover is formed with a first circuit pattern and a second circuit pattern, the first circuit pattern is electrically connected to the single photon avalanche photodiode and transmits an optical signal detected by the single photon avalanche photodiode from the input optical fiber to a data interaction interface provided on the package cover, and the second circuit pattern is electrically connected to the cooling module and transmits power obtained from an external power source via a power supply interface provided on the package cover to the cooling module.
2. The single photon detection device of claim 1 in which said encapsulating cover is made of one of aluminum substrate and ceramic plate.
3. The single photon detection device of claim 1 in which said first and second circuit patterns are formed on the upper surface of said encapsulation cover.
4. The single photon detection device according to claim 3, wherein said encapsulation cover is further provided therein with a first wire through hole penetrating therethrough, through which a cable electrically connected to said single photon avalanche photodiode passes to be led out from inside said housing and electrically connected to said first circuit pattern.
5. The single photon detection device of claim 4 in which said cables are soldered on said encapsulation cover via pads provided at respective apertures on an upper surface of said encapsulation cover to electrically connect said cables to said first circuit pattern and seal said first wiring holes.
6. The single photon detection device according to claim 3, wherein said encapsulation cover is further provided therein with a second wire through hole penetrating therethrough, through which a cable electrically connected to said refrigeration assembly passes to be led out from inside said housing and electrically connected to said second circuit pattern.
7. The single photon detection device of claim 6 in which said cables are soldered on said encapsulation cover via pads provided at respective apertures on an upper surface of said encapsulation cover to electrically connect said cables to said second circuit pattern and seal said second wiring holes.
8. The single photon detection device according to claim 4 or 6 in which said through-line holes have dielectric layers coated on the wall surfaces thereof.
9. The single photon detection device of claim 1 in which one end of said encapsulating cover extends beyond the edge of said housing for mounting said data interaction interface and said power supply interface.
10. The single photon detection apparatus of claim 1 further comprising:
and the heat sink is arranged between the single photon avalanche photodiode and the refrigeration component and surrounds the single photon avalanche photodiode.
11. The single photon detection device of claim 10 in which said heat sink is made of one of copper, aluminum, graphite, gold, silver and thermally conductive ceramics.
12. The single photon detection apparatus of claim 1 further comprising:
and the sealing ring is arranged between the packaging cover and the top opening of the shell so as to seal a gap between the packaging cover and the top opening of the shell.
13. A quantum communication device, comprising:
the single photon detection device of any one of claims 1 to 12.
CN202110498659.4A 2021-05-08 2021-05-08 Single photon detection device and quantum communication equipment comprising same Active CN113188657B (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1621791A (en) * 2003-11-27 2005-06-01 中国科学院半导体研究所 Structure of single photon detecting element
WO2012132919A1 (en) * 2011-03-30 2012-10-04 日本電気株式会社 Photon detection circuit and photon detection method
CN103336336A (en) * 2013-06-28 2013-10-02 安徽量子通信技术有限公司 Seal refrigerating box convenient to dismantle and mount and optical fiber via hole hermetically sealed connector
CN110609368A (en) * 2018-06-15 2019-12-24 科大国盾量子技术股份有限公司 Refrigeration box optical fiber via hole sealing device, refrigeration box and single photon detection device
CN210689812U (en) * 2019-09-18 2020-06-05 北京中创为南京量子通信技术有限公司 Single photon detection device
CN210719421U (en) * 2019-09-19 2020-06-09 北京中创为南京量子通信技术有限公司 Single photon detector and refrigeration and heat preservation device thereof
CN112097901A (en) * 2020-03-31 2020-12-18 科大国盾量子技术股份有限公司 Refrigeration structure and single photon detection device
CN213042158U (en) * 2020-09-30 2021-04-23 北京中创为南京量子通信技术有限公司 Photodiode detection integrated temperature control module

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1621791A (en) * 2003-11-27 2005-06-01 中国科学院半导体研究所 Structure of single photon detecting element
WO2012132919A1 (en) * 2011-03-30 2012-10-04 日本電気株式会社 Photon detection circuit and photon detection method
CN103336336A (en) * 2013-06-28 2013-10-02 安徽量子通信技术有限公司 Seal refrigerating box convenient to dismantle and mount and optical fiber via hole hermetically sealed connector
CN110609368A (en) * 2018-06-15 2019-12-24 科大国盾量子技术股份有限公司 Refrigeration box optical fiber via hole sealing device, refrigeration box and single photon detection device
CN210689812U (en) * 2019-09-18 2020-06-05 北京中创为南京量子通信技术有限公司 Single photon detection device
CN210719421U (en) * 2019-09-19 2020-06-09 北京中创为南京量子通信技术有限公司 Single photon detector and refrigeration and heat preservation device thereof
CN112097901A (en) * 2020-03-31 2020-12-18 科大国盾量子技术股份有限公司 Refrigeration structure and single photon detection device
CN213042158U (en) * 2020-09-30 2021-04-23 北京中创为南京量子通信技术有限公司 Photodiode detection integrated temperature control module

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