CN102958285B - Installation method and structure of photoelectric device packaged by metal - Google Patents
Installation method and structure of photoelectric device packaged by metal Download PDFInfo
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- CN102958285B CN102958285B CN201110255258.2A CN201110255258A CN102958285B CN 102958285 B CN102958285 B CN 102958285B CN 201110255258 A CN201110255258 A CN 201110255258A CN 102958285 B CN102958285 B CN 102958285B
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Abstract
The invention provides an installation method and structure of a photoelectric device packaged by metal. The photoelectric device is inserted into bonding pads of a printed wiring board, wherein the bonding pads include a first bonding pad and a second bonding pad; a first pin and at least one second pin are led out from the bottom surface of the photoelectric device, wherein the lead-out end of the first pin is provided with a step, and the lead-out end of each second pin is provided with an insulating area; a bonding pad hole of the first bonding pad is enlarged to be matched with the outer diameter of the step of the first pin; and a bonding pad hole of the second bonding pad is reduced into the insulating area of the second pin, and the outer diameter of the bonding pad hole of the second bonding pad is smaller than that of the insulating area. The installation method and structure solve the problem that a light-emitting direction cannot be perpendicular to the surface of the printed wiring board caused by the factor that the bottom surface of the conventional photoelectric device is difficult to be parallel to the surface of the printed wiring board after welding because one pin of the conventional photoelectric device is provided with a step, or the conventional photoelectric device cannot be flatly welded with adoption of a movable spacer when the photoelectric device packaged by the metal is welded to the printed wiring board.
Description
[technical field]
The invention belongs to electronic applications, be specifically related to printed wiring board manufacture field.
[background technology]
In printed wiring board industry, often to use the operating state that photoelectric device detects machine.Photoelectric device is carried by printed circuit board, jointly completes measuring ability with the circuit on printed substrate and other electronic devices and components.Because the detected object of part is quite little, there is requirement to the installation perpendicularity of photoelectric device, so photoelectric device is welded on printed wiring board require that the bottom surface of photoelectric device is parallel to printed wiring board surface.
A lot of photoelectric device adopts metallic packaging.And in general, several the pins of drawing from photoelectric device bottom surface only have an equipotential surperficial with metallic packaging, and other pins need and metallic packaging surface insulation.As shown in Figure 1, lens 1 are arranged on the top on metallic packaging surface 2, and first and second pin 4,5 is drawn from metallic packaging bottom surface, wherein the first pin 4 and metallic packaging surface equipotential, the second pin 5 and metallic packaging surface insulation.In order to prevent pasting board from welding the short circuit caused, there is a step 3 with the equipotential pin in metallic packaging surface, by padded for photoelectric device bottom metal face, prevent photoelectric device bottom-side metal face from connecting the pad of photoelectric device other several pin, causing short circuit.From figure bis-, the second pin 5 has insulating regions 6 from photoelectric device bottom surface exit.
When welding, the metal bottom surface of the padded photoelectric device of step prevents short circuit.But, have no idea owing to only having one first pin, 4, fulcrum support face, to cause plug-in unit out-of-flatness, finally weld out-of-flatness.Common way as shown in Figure 3, photoelectric device is inserted on the 3rd pad 21 and the 4th pad 22, because the 3rd pad 21 and the 4th pad 22 mate with the first pin 4 and the second pin 5 respectively at the position pad one of the second pin 5 pad 7 auxiliary welding contour with step 3.When actual welding, because pad 7 is movable, so welding effect is undesirable, device or often appearance welding out-of-flatness phenomenon.
[summary of the invention]
Being welded in the irregular problem of printed wiring board to solve above-mentioned photoelectric device, the invention provides a kind of installation method of photoelectric device of metallic packaging.This installation method is that photoelectric device is inserted on the pad of printed wiring board, this pad comprises the first pad and the second pad, described photoelectric device bottom surface leads to one first pin and at least one second pin, wherein, the exit of the first pin has a step, and the exit of the second pin has insulating regions; This installation method is:
The pad hole of the first pad is extended to and mates with the outer diameter of step of the first pin;
Be contracted in the insulating regions of the second pin by the pad hole of the second pad, the external diameter in its pad hole is less than the external diameter of insulating regions.
Corresponding above-mentioned installation method provides a kind of mounting structure of photoelectric device of metallic packaging, photoelectric device is inserted on the pad of printed wiring board, this pad comprises the first pad and the photoelectric device bottom surface described in the second pad leads to one first pin and at least one second pin, wherein, the exit of the first pin has a step, and the exit of the second pin has insulating regions; The structure of this installation is: the first pad mates with the outer diameter of step of the first pin; Second pad is in the insulating regions of the second pin, and the external diameter in its pad hole is less than the external diameter of insulating regions.
Wherein, the pin that described photoelectric device bottom surface is drawn comprises one first pin and one second pin.
The invention has the beneficial effects as follows to solve uses the photoelectric device of metallic packaging being welded on printed wiring board, because photoelectric device only has a pin to have a step, be difficult to accomplish that photoelectric device bottom surface is parallel with printed wiring board surface after causing welding, such that light emission direction can not vertically printed wiring board be surperficial or because still not welding smooth problem after use removable insole pieces.
[accompanying drawing explanation]
In conjunction with execution mode, the present invention is further described with reference to the accompanying drawings.
Fig. 1 is the texture edge schematic diagram of photoelectric device;
Fig. 2 is the schematic bottom view of photoelectric device shown in Fig. 1;
Fig. 3 is the existing installation method of the photoelectric device of metallic packaging and the side schematic view of structure;
Fig. 4 is the installation method of the photoelectric device of metallic packaging of the present invention and the side schematic view of mounting structure;
Fig. 5 is the schematic bottom view of the installation method of the photoelectric device of metallic packaging of the present invention and the pad of mounting structure and photoelectric device relative position.
[embodiment]
For object of the present invention, technical scheme and advantage are clearly expressed, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only for explaining the present invention, being not intended to limit the present invention.
An embodiment provided by the invention is a kind of installation method of photoelectric device of metallic packaging, as shown in Figure 4 and Figure 5, the two pins of photoelectric device is inserted on two pads, the pore size of two pads is changed, it is respectively the first pad 11 and the second pad 12, and to avoid, photoelectric device is capable with printed wiring board 10 air spots or to use removable insole pieces still can not weld smooth.
Increased in the pad hole of the first pad 11 and mate with the external diameter of the step 3 of the first pin 4, whole first pin 4 and step 3 thereof insert in the first pad 11.Be contracted in the pad hole of the second pad 12 in the insulating regions 6 of the second pin 5, the external diameter in its pad hole is less than the external diameter of insulating regions 6, preventing the metal bottom surface of photoelectric device because contacting with the second pad 12, causing short circuit.
Simultaneously, the corresponding above-mentioned installation method of the present invention, provides an embodiment to be a kind of mounting structure of photoelectric device, as shown in Figure 4 and Figure 5, first pad 11 mates with the external diameter of the step 3 of the first pin 4, and whole first pin 4 and step 3 thereof insert in the first pad 21.The external diameter of the second pad 12 is less than the external diameter of insulating regions 6, is in the insulating regions of the second pin 5, to prevent the metal bottom surface of photoelectric device because contacting with the second pad 12, and causes short circuit.
In the above-described embodiments, photoelectric device comprises two pins, and the pin that its bottom surface is drawn comprises one first pin 4 and one second pin 5.Installation method provided by the invention and mounting structure are equally applicable to the photoelectric device more than two pins.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all belong to the scope that the present invention protects.
Claims (3)
1. the installation method of the photoelectric device of a metallic packaging, photoelectric device is inserted on the pad of printed wiring board, this pad comprises the first pad and the second pad, described photoelectric device bottom surface leads to one first pin and at least one second pin, wherein, the exit of the first pin has a step, and the exit of the second pin has insulating regions; The feature of this installation method is:
The pad hole of the first pad is extended to and mates with the outer diameter of step of the first pin;
Be contracted in the insulating regions of the second pin by the pad hole of the second pad, the external diameter in its pad hole is less than the external diameter of insulating regions.
2. the mounting structure of the photoelectric device of a metallic packaging, photoelectric device is inserted on the pad of printed wiring board, this pad comprises the first pad and the second pad, described photoelectric device bottom surface leads to one first pin and at least one second pin, wherein, the exit of the first pin has a step, and the exit of the second pin has insulating regions; The feature of this mounting structure is: the first pad mates with the outer diameter of step of the first pin; Second pad is in the insulating regions of the second pin, and the external diameter in its pad hole is less than the external diameter of insulating regions.
3. the mounting structure of the photoelectric device of metallic packaging according to claim 2, is characterized in that: the pin that described photoelectric device bottom surface is drawn comprises one first pin and one second pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255258.2A CN102958285B (en) | 2011-08-31 | 2011-08-31 | Installation method and structure of photoelectric device packaged by metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255258.2A CN102958285B (en) | 2011-08-31 | 2011-08-31 | Installation method and structure of photoelectric device packaged by metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102958285A CN102958285A (en) | 2013-03-06 |
| CN102958285B true CN102958285B (en) | 2014-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110255258.2A Active CN102958285B (en) | 2011-08-31 | 2011-08-31 | Installation method and structure of photoelectric device packaged by metal |
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| CN (1) | CN102958285B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2898575Y (en) * | 2006-04-28 | 2007-05-09 | 吴毅超 | High-density and directed-connected LED illuminating module |
| CN102017817A (en) * | 2008-04-30 | 2011-04-13 | 大金工业株式会社 | Electric circuit connection member |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080206516A1 (en) * | 2007-02-22 | 2008-08-28 | Yoshihiko Matsushima | Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
-
2011
- 2011-08-31 CN CN201110255258.2A patent/CN102958285B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2898575Y (en) * | 2006-04-28 | 2007-05-09 | 吴毅超 | High-density and directed-connected LED illuminating module |
| CN102017817A (en) * | 2008-04-30 | 2011-04-13 | 大金工业株式会社 | Electric circuit connection member |
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| Publication number | Publication date |
|---|---|
| CN102958285A (en) | 2013-03-06 |
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Address after: 518000 No. 9988 Shennan Avenue, Shenzhen, Guangdong, Nanshan District Co-patentee after: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Address before: 518055, the Han Dynasty laser building, No. 9 West West Road, Nanshan District hi tech park, Guangdong, Shenzhen Co-patentee before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: Han's Laser Technology Co.,Ltd. |
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Effective date of registration: 20200618 Address after: 518000 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000 No. 9988 Shennan Avenue, Shenzhen, Guangdong, Nanshan District Co-patentee before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |
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