CN201741692U - Lead type bridging rectifying device - Google Patents
Lead type bridging rectifying device Download PDFInfo
- Publication number
- CN201741692U CN201741692U CN2010202074863U CN201020207486U CN201741692U CN 201741692 U CN201741692 U CN 201741692U CN 2010202074863 U CN2010202074863 U CN 2010202074863U CN 201020207486 U CN201020207486 U CN 201020207486U CN 201741692 U CN201741692 U CN 201741692U
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- China
- Prior art keywords
- doping region
- chip
- pad parts
- rectifying device
- pin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The utility model discloses a lead type bridging rectifying device comprising a plurality of metal feet stands and a plurality of LED (light emitting diode) chips, wherein each metal foot stand is provided with a welding part, all the welding parts are arranged on the same plane; according to the distribution structure of the circuit, one polarity of the plurality of LED chips can be welded on the plurality of welding parts, and another polarity thereof is connected to the corresponding metal feet stands by a plurality of leads so as to form electric connection by the leads. The lead type bridging rectifying device is not limited when adopting the small-size LED chip, thus achieving the purpose of reducing volume.
Description
Technical field
The utility model relates to a kind of bridge joint rectifying device, is meant especially a kind ofly to be electrically connected at bridge joint rectifying device between diode chip for backlight unit and the metal foot rest by lead.
Background technology
Please refer to Fig. 5 and Fig. 6, be an existing bridge joint rectifying device perspective exploded view and a combination stereogram, existing bridge joint rectifying device is to be piled up with a plurality of chips 51～54 by a plurality of metal foot rests 41～44 to be connected to form, wherein each chip 51～54 includes one first doping region and one second doping region, and existing bridge joint rectifying device includes:
One first metal foot rest 41 comprises one first pin 411 and first pad parts, and the end face of first pad parts is electrically to weld for first doping region of one first chip 51 and one second chip 52;
One second metal foot rest 42, it is the top of being located at the first metal foot rest 41, it comprises one second pin 421 and one second pad parts, the bottom surface of described second pad parts is to form a protuberance and the corresponding welding of second doping region of described first chip 51, and the end face of second pad parts is to weld with first doping region of one the 3rd chip 53;
One the 3rd metal foot rest 43, it is the top of being located at the first metal foot rest 41, it comprises one the 3rd pin 431 and one the 3rd pad parts, the bottom surface of described the 3rd pad parts is to form a protuberance and the corresponding welding of second doping region of described second chip 52, and the end face of the 3rd pad parts is to weld with first doping region of a four-core sheet 54;
One the 4th metal foot rest 44, it is the top of being located at the second metal foot rest 42 and the 3rd metal foot rest 43, it comprises one the 4th pin 441 and the 4th pad parts, and wherein the bottom surface of the 4th pad parts is to form two protuberances electrically to weld second doping region of described the 3rd chip 53 and described four-core sheet 54 respectively.
Please refer to Fig. 7, be the side-looking floor map after the encapsulation of described existing bridge joint rectifying device, first, second, third and four-core sheet 51～54 be diode chip for backlight unit, wherein said first doping region can be N type polarity, second doping region is P type polarity relatively, and utilizing described assembling mode is to make a plurality of metal foot rests and a plurality of diode chip for backlight unit form the structure of alternately piling up.
Except the structure of described chip-stacked formula, the structure that other has a kind of existing bridge joint rectifying device is non-chip-stacked formula, as shown in Figure 8, be include a plurality of metal foot rests 61～64 and a plurality of chips 71～74 wherein each chip 71～74 include one first doping region and one second doping region, please cooperate Fig. 8 and Fig. 9 is non-chip-stacked formula bridge joint rectifying device perspective exploded view and combination stereogram, and described bridge joint rectifying device comprises:
One first metal foot rest 61 comprises one first pin 611 and first pad parts, and the end face of first pad parts is electrically to weld for first doping region of first chip 71 and second chip 72;
One second metal foot rest 62, comprise one second pin 621 and second pad parts, second pad parts is that first pad parts with the first metal foot rest 61 is same plane, and the end face of second pad parts is electrically to weld for second doping region of the 3rd chip 73 and four-core sheet 74;
One the 3rd metal foot rest 63 comprises one the 3rd pin 631 and the 3rd pad parts, and the bottom surface of the 3rd pad parts is to form two protuberances also electrically to weld with second doping region of first chip 71 and first doping region of the 3rd chip 73 respectively;
One the 4th metal foot rest 64 comprises one the 4th pin 641 and the 4th pad parts, and the bottom surface of the 4th pad parts is to form two protuberances also electrically to weld with second doping region of second chip 72 and first doping region of four-core sheet 74 respectively;
Please refer to Figure 10, be the side-looking floor map after the encapsulation of described existing non-stack bridge joint rectifying device, first, second, third and four-core sheet 71～74 be diode chip for backlight unit, wherein said first doping region can be N type polarity, second doping region is P type polarity relatively, all the position is on same plane to utilize described assembling mode to make diode chip for backlight unit, but described a plurality of metal foot rest is still and presents stacked state.
Above-mentioned two kinds of existing bridge joint rectifying devices all utilize on the metal foot rest formed protuberance directly electrically to weld with diode chip for backlight unit, and described protuberance is with impact style formation mostly, the protuberance size certain limit is arranged and can't make very small.But progress along with semiconductor technology, the size of diode chip for backlight unit is dwindled gradually, can will be more and more littler for bonding area, but the protuberance on the metal foot rest can't be complementary with undersized diode chip for backlight unit, so that existing bridge joint rectifying device still must adopt the diode chip for backlight unit of large-size, finished product is difficult to that significant reduction is arranged dimensionally after encapsulating.
Heal for its volume of electronics spare part and more can save material cost and to increase utilization of space for a short time, comprehensive the above, existing two kinds of bridge joint rectifying devices will limit the degree of dwindling of an electronics spare part volume with the practice that the metal foot rest directly electrically welds diode chip for backlight unit.
Summary of the invention
Can't be suitable for undersized diode chip for backlight unit and shortcoming such as take up room because existing metal foot rest is the practice of directly welding, the utility model lead formula bridge joint rectifying device is to utilize a plurality of leads and diode chip for backlight unit to electrically connect, and can reach the purpose of dwindling its volume of bridge joint rectifying device.
In order to achieve the above object, the utility model provides a kind of lead formula bridge joint rectifying device, and it includes:
One first metal foot rest comprises first pin and first pad parts, and described first pad parts is to weld with first doping region of one first chip and one second chip;
One second metal foot rest comprises second pin and second pad parts, and described second pad parts is to weld with first doping region of one the 3rd chip;
One the 3rd metal foot rest comprises the 3rd pin and the 3rd pad parts, and described the 3rd pad parts is to weld with first doping region of a four-core sheet;
One the 4th metal foot rest comprises the 4th pin and the 4th pad parts;
Be to electrically connect between second doping region of described first chip and described second pad parts with first lead;
Be to electrically connect between second doping region of described second chip and described the 3rd pad parts with second lead;
Between second doping region of described the 3rd chip and described the 4th pad parts is to electrically connect with privates;
Between second doping region of described four-core sheet and described the 4th pad parts is to electrically connect with privates;
One encapsulated layer is to coat above-mentioned a plurality of metal foot rests, a plurality of chip and a plurality of lead, and wherein said first penetrates out described encapsulated layer to described the 4th pin.
In the preferred implementation, the described first, second, third and the 4th pad parts is to be arranged in same plane.
In the preferred implementation, described first, second, third and the four-core sheet be diode chip for backlight unit, wherein first doping region is a N type polarity, second doping region is a P type polarity.
In the preferred implementation, described first, second, third and the four-core sheet be diode chip for backlight unit, wherein first doping region is a P type polarity, second doping region is a N type polarity.
Thus, a plurality of leads are except being easy to weld the diode chip for backlight unit of small size, and it is little that the utility model lead formula bridge joint rectifying device volume also can have the bridge joint rectifying device now.
Description of drawings
Fig. 1 is the utility model lead formula bridge joint rectifying device first preferred embodiment perspective exploded view;
Fig. 2 is the utility model bridge joint rectifying device first preferred embodiment schematic perspective view;
Fig. 3 is the bridge rectifier schematic diagram;
Fig. 4 is the utility model lead formula bridge joint rectifying device first preferred embodiment side plan view;
Fig. 5 is existing bridge joint rectifying device perspective exploded view;
Fig. 6 is the combination stereogram of existing bridge joint rectifying device;
The side-looking floor map of Fig. 7 after for the encapsulation of existing bridge joint rectifying device;
Fig. 8 is existing bridge joint rectifying device perspective exploded view;
Fig. 9 is the schematic perspective view of existing bridge joint rectifying device;
Figure 10 is existing bridge joint rectifying device side plan view.
11,41, the 61-first metal foot rest description of reference numerals:; 111,411,611-first pin; 12,42, the 62-second metal foot rest; 121,421,621-second pin; 13,43,63-the 3rd metal foot rest; 131,431,631-the 3rd pin; 14,44,64-the 4th metal foot rest; 141,441,641-the 4th pin; 21,51,71-first chip; 22,52,72-second chip; 23,53,73-the 3rd chip; 24,54,74-four-core sheet; 31-first lead; 32-second lead; The 33-privates; The 34-privates; The 40-encapsulated layer.
Embodiment
Below in conjunction with accompanying drawing, be described in more detail with other technical characterictic and advantage the utility model is above-mentioned.
Please refer to Fig. 1 and Fig. 2, the utility model lead formula bridge joint rectifying device first preferred embodiment perspective exploded view and schematic perspective view includes:
One first metal foot rest 11 comprises first pin 111 and first pad parts, and the end face of first pad parts is electrically to weld for first doping region of first chip 21 and second chip 22;
One second metal foot rest 12 comprises second pin 121 and second pad parts, and the end face of second pad parts is electrically to weld for first doping region of the 3rd chip 23;
One the 3rd metal foot rest 13 comprises the 3rd pin 131 and the 3rd pad parts, and the end face of the 3rd pad parts is electrically to weld for first doping region of four-core sheet 24;
One the 4th metal foot rest 14 comprises the 4th pin 141 and the 4th pad parts.
Be to electrically connect between second doping region of described first chip 21 and described second pad parts with first lead 31.
Be to electrically connect between second doping region of described second chip 22 and described the 3rd pad parts with second lead 32.
Be to electrically connect between second doping region of described the 3rd chip 23 and described the 4th pad parts with privates 33.
Be to electrically connect between second doping region of described four-core sheet 24 and described the 4th pad parts with privates 34.
Described a plurality of metal foot rest 11～14 is positioned at same plane and closely arranges each other, to reach the minimum space usable floor area; In described first preferred embodiment, first, second, the 3rd and four-core sheet 21～24 be diode chip for backlight unit, wherein said first doping region is a N type polarity, second doping region is a P type polarity, via above-mentioned a plurality of metal foot rests 11～14, the electric connection of a plurality of chips 21～24 and a plurality of leads 31～34, please contrast bridge rectifier schematic diagram shown in Figure 3, described second pin 121 can be as input terminal to electrically connect a string formula voltage with described the 3rd pin 131, and described first pin 111 can be exported the voltage of a full-wave rectification as lead-out terminal with described the 4th pin 141.
In addition, the utility model lead formula bridge joint rectifying device is to have one second preferred embodiment, described first to fourth chip, 21～24 polarity are inverted, be that described first doping region is a P type polarity, second doping region is a N type polarity, this second preferred embodiment can be by described second pin 121 and described the 3rd pin 131 inputs one string formula voltage, by the voltage of described first pin 111 with described the 4th pin 141 outputs one full-wave rectification.
Please refer to Fig. 4, side-looking floor map after the encapsulation of the utility model lead formula bridge joint rectifying device, form encapsulated layer 40 at above-mentioned lead formula bridge joint rectifying device, wherein in encapsulated layer 40 only by the metal foot rest, chip and a plurality of lead are formed, be existing bridge joint rectifying device side plan view according to Fig. 7 and Figure 10, the utility model is to adopt lead to electrically connect chip and metal foot rest, rather than adopt the metal foot rest of tool protuberance electrically to weld, utilize lead on small area, still can normally reach the advantage of electric connection, the utility model can be selected littler chip for use, to reach the purpose of reduction bridge joint rectifying device volume.
More than explanation is just illustrative for the utility model; and it is nonrestrictive; those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited; can make many modifications; change, or equivalence, but all will fall in the protection range of the present utility model.
Claims (4)
1. a lead formula bridge joint rectifying device is characterized in that, is to include:
One first metal foot rest comprises first pin and first pad parts, and described first pad parts is to weld with first doping region of one first chip and one second chip;
One second metal foot rest comprises second pin and second pad parts, and described second pad parts is to weld with first doping region of one the 3rd chip;
One the 3rd metal foot rest comprises the 3rd pin and the 3rd pad parts, and described the 3rd pad parts is to weld with first doping region of a four-core sheet;
One the 4th metal foot rest comprises the 4th pin and the 4th pad parts;
Be to electrically connect between second doping region of described first chip and described second pad parts with first lead;
Be to electrically connect between second doping region of described second chip and described the 3rd pad parts with second lead;
Between second doping region of described the 3rd chip and described the 4th pad parts is to electrically connect with privates;
Between second doping region of described four-core sheet and described the 4th pad parts is to electrically connect with privates;
One encapsulated layer is to coat above-mentioned a plurality of metal foot rests, a plurality of chip and a plurality of lead, and wherein said first penetrates out described encapsulated layer to described the 4th pin.
2. according to the described lead formula of claim 1 bridge joint rectifying device, it is characterized in that the described first, second, third and the 4th pad parts is to be arranged in same plane.
3. lead formula bridge joint rectifying device according to claim 1 and 2 is characterized in that, described first, second, third and the four-core sheet be diode chip for backlight unit, wherein first doping region is a N type polarity, second doping region is a P type polarity.
4. lead formula bridge joint rectifying device according to claim 1 and 2 is characterized in that, described first, second, third and the four-core sheet be diode chip for backlight unit, wherein first doping region is a P type polarity, second doping region is a N type polarity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202074863U CN201741692U (en) | 2010-05-27 | 2010-05-27 | Lead type bridging rectifying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202074863U CN201741692U (en) | 2010-05-27 | 2010-05-27 | Lead type bridging rectifying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201741692U true CN201741692U (en) | 2011-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202074863U Expired - Lifetime CN201741692U (en) | 2010-05-27 | 2010-05-27 | Lead type bridging rectifying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201741692U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263093A (en) * | 2011-07-15 | 2011-11-30 | 上海凯虹科技电子有限公司 | Packaging structure for bridging component |
| CN102263091A (en) * | 2010-05-27 | 2011-11-30 | 强茂股份有限公司 | Lead type bridging rectifying device |
-
2010
- 2010-05-27 CN CN2010202074863U patent/CN201741692U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263091A (en) * | 2010-05-27 | 2011-11-30 | 强茂股份有限公司 | Lead type bridging rectifying device |
| CN102263093A (en) * | 2011-07-15 | 2011-11-30 | 上海凯虹科技电子有限公司 | Packaging structure for bridging component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110209 |
|
| CX01 | Expiry of patent term |