CN103531550B - The encapsulating structure of the small-space plastic package improved and method for packing - Google Patents
The encapsulating structure of the small-space plastic package improved and method for packing Download PDFInfo
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- CN103531550B CN103531550B CN201310534603.5A CN201310534603A CN103531550B CN 103531550 B CN103531550 B CN 103531550B CN 201310534603 A CN201310534603 A CN 201310534603A CN 103531550 B CN103531550 B CN 103531550B
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- substrate
- base plate
- encapsulating structure
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- plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The present invention relates to a kind of encapsulating structure and method for packing, especially a kind of encapsulating structure of small-space plastic package of improvement and method for packing, belong to the technical field of semiconductor packages.According to technical scheme provided by the invention, the encapsulating structure of the small-space plastic package of described improvement, comprises base plate and is positioned at the stacked package body with plastic-sealed body plastic packaging on described base plate; The encapsulating structure that described stacked package body comprises some bearing substrates and is positioned on described bearing substrate, described bearing substrate is provided with substrate through-hole, gap between adjacent bearing substrate and the gap between bearing substrate with base plate are connected by the substrate through-hole on bearing substrate, and plastic-sealed body fills the gap between adjacent bearing substrate and the gap between bearing substrate and base plate by substrate through-hole.Structure of the present invention is simple, and technique is simple, easy to operate, reduces packaging cost, wide accommodation, safe and reliable.
Description
Technical field
The present invention relates to a kind of encapsulating structure and method for packing, especially a kind of encapsulating structure of small-space plastic package of improvement and method for packing, belong to the technical field of semiconductor packages.
Background technology
Along with chip functions is day by day concentrated, the chip of the required set of single package body also gets more and more, corresponding SIP(SystemInaPackage), PIP(ProductInPackage) and POP(PackageonPackage) encapsulation shared by the market share increase year by year.Can the encapsulating structure (described encapsulating structure is the packaging body that former of chip or plastic packaging are good) of stacked multilayer in a large packaging body.Meanwhile, due to the restriction of product space height, the distance between the upper and lower between these stacking encapsulating structures becomes very little.Normal plastic packaging material cannot flow through so little spacing, needs the extra process carrying out underfill.
Because the gap between each encapsulating structure is less, and injection molding material needs the distance that flows through comparatively far away, and these gap-fills can not directly be expired by traditional capsulation material.At present when stacking complete chip, fill with bottom between the layers, to make it discharge air, finally carry out overall plastic packaging again.While technological process increases, cost also greatly rises.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of encapsulating structure and method for packing of small-space plastic package of improvement, its structure is simple, and technique is simple, easy to operate, reduces packaging cost, wide accommodation, safe and reliable.
According to technical scheme provided by the invention, the encapsulating structure of the small-space plastic package of described improvement, comprises base plate and is positioned at the stacked package body with plastic-sealed body plastic packaging on described base plate; The encapsulating structure that described stacked package body comprises some bearing substrates and is positioned on described bearing substrate, described bearing substrate is provided with substrate through-hole, gap between adjacent bearing substrate and the gap between bearing substrate with base plate are connected by the substrate through-hole on bearing substrate, and plastic-sealed body fills the gap between adjacent bearing substrate and the gap between bearing substrate and base plate by substrate through-hole.
Be electrically connected by substrate connecting electrode between described adjacent bearing substrate, be interspersed between substrate through-hole and substrate connecting electrode.
Described base plate is provided with base plate connecting electrode, and described base plate connecting electrode lays respectively on the corresponding surface of base plate with plastic-sealed body.
Described encapsulating structure is provided with encapsulating structure through hole, and described encapsulating structure through hole is connected with substrate through-hole.
A method for packing for the small-space plastic package of improvement, described method for packing comprises the steps:
A, provide bearing substrate, and required substrate through-hole is set on described bearing substrate;
B, encapsulating structure is set on the bearing substrate with substrate through-hole, and some bearing substrates arranging encapsulating structure are connected to form stacked package body by substrate connecting electrode;
C, to be arranged on base plate by substrate connecting electrode by stacked package body, and to be encapsulated on base plate with plastic-sealed body by stacked package body, plastic-sealed body fills the gap between adjacent bearing substrate and the gap between bearing substrate and base plate by substrate through-hole.
Described base plate is provided with base plate connecting electrode, and described base plate connecting electrode lays respectively on the corresponding surface of base plate with plastic-sealed body.
Described encapsulating structure is provided with encapsulating structure through hole, described encapsulating structure through hole is connected with substrate through-hole.Described substrate connecting electrode is spherical.
Advantage of the present invention: substrate through-hole is set on bearing substrate, or encapsulating structure through hole is set on encapsulating structure simultaneously; The plastic packaging material of plastic-sealed body is by substrate through-hole, the gap of encapsulating structure filling through hole between adjacent bearing substrate and the gap between bearing substrate and base plate, then disposablely plastic packaging can be completed, plastic packaging material flow distance can be reduced, improve plastic sealing property and the encapsulation rigidity of whole encapsulating structure, structure is simple, and technique is simple, easy to operate, reduce packaging cost, wide accommodation, safe and reliable.
Accompanying drawing explanation
Fig. 1 ~ Fig. 3 is the concrete implementing process step cutaway view of existing encapsulation, wherein:
Fig. 1 is the structure cutaway view obtain stack package structure on base plate after.
Fig. 2 is to carrying out the structure cutaway view after underfill in stack package structure.
Fig. 3 is the structure cutaway view to carrying out plastic packaging after underfill.
Fig. 4 ~ Fig. 7 is the concrete implementing process step cutaway view of the embodiment of the present invention 1, wherein:
Fig. 4 is the cutaway view after the present invention arranges substrate through-hole on bearing substrate.
Fig. 5 is the cutaway view after the present invention arranges encapsulating structure on bearing substrate.
Fig. 6 is the cutaway view of the present invention after stack package structure is arranged on base plate.
Fig. 7 is that the present invention carries out the cutaway view after plastic packaging to stack package structure.
Fig. 8 ~ Figure 11 is the concrete implementing process step cutaway view of the embodiment of the present invention 2, wherein:
Fig. 8 is the cutaway view after the present invention arranges encapsulating structure on bearing substrate.
Fig. 9 is that the present invention carries out perforate to bearing substrate and encapsulating structure and obtains the cutaway view after encapsulating structure through hole and substrate through-hole.
Figure 10 is that stack package structure is arranged on the cutaway view after on base plate by the present invention.
Figure 11 is that the present invention carries out the cutaway view after plastic packaging to stack package structure.
Description of reference numerals: 1-base plate, 2-base plate connecting electrode, 3-bearing substrate, 4-substrate connecting electrode, 5-encapsulating structure, 6-obturator, 7-plastic-sealed body, 8-substrate through-hole and 9-encapsulating structure through hole.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Figure 1, Figure 2 and Figure 3: be the concrete technology block diagram of existing stacked package, base plate 1 is arranged stacked package body, described stacked package body comprises some bearing substrates 3, bearing substrate 3 is arranged encapsulating structure 5, described encapsulating structure 5 can be former of chip or packaging body, be electrically connected by substrate connecting electrode 4 between adjacent bearing substrate 3, simultaneously, whole stacked package body is arranged on base plate 1 by substrate connecting electrode 4, and base plate 1 is electrically connected by substrate connecting electrode 4 is corresponding with encapsulating structure 5.Be electrically connected between encapsulating structure 5 with bearing substrate 3, the encapsulating structure 5 in stacked package body carries out required Signal transmissions by the base plate connecting electrode 2 on base plate 1 and base plate 1.After above-mentioned encapsulation completes, all there is gap between adjacent bearing substrate 3 and between bearing substrate 3 and base plate 1, in order to improve the reliability of encapsulation, need to carry out underfill process in above-mentioned gap, obtain the obturator 6 being positioned at above-mentioned gap, and then utilizing plastic packaging material by stacked package body plastic packaging on base plate 1, the another side of base plate 1 arranges some base plate connecting electrodes 2, and base plate connector 2 and substrate connecting electrode 4 are all in spherical.Due to adjacent bearing substrate 3 and the gap between bottom bearing substrate 3 and base plate 1 less, just need complicated technique to obtain obturator 6, packaging cost rises, and packaging efficiency is low, poor reliability.
In order to improve efficiency and the reliability of encapsulation, reducing packaging cost, respectively encapsulating structure of the present invention and method for packing being described in detail below by embodiment 1 and embodiment 2.
Embodiment 1
As shown in Figure 7: the present invention includes base plate 1 and be positioned at the stacked package body with plastic-sealed body 7 plastic packaging on described base plate 1; The encapsulating structure 5 that described stacked package body comprises some bearing substrates 3 and is positioned on described bearing substrate 3, described bearing substrate 3 is provided with substrate through-hole 8, gap between adjacent bearing substrate 3 and the gap between bearing substrate 3 with base plate 1 are connected by the substrate through-hole 8 on bearing substrate 3, and plastic-sealed body 7 fills the gap between adjacent bearing substrate 3 and the gap between bearing substrate 3 and base plate by substrate through-hole 8.
Particularly, owing to the bearing substrate 3 of every layer all being arranged the substrate through-hole 8 of through bearing substrate 3, and the substrate through-hole 8 of bearing substrate 3 in stacked package body is corresponding, carrying out plastic packaging utilizing plastic packaging material is, plastic packaging material flows downward by the substrate through-hole 8 of every layer of bearing substrate 3, until all gaps are all filled full by plastic packaging material, then on base plate 1, forms plastic-sealed body 7, be filled with plastic packaging material in whole stacked package body, thus improve the rigidity of encapsulation.
Further, be electrically connected by substrate connecting electrode 4 between described adjacent bearing substrate 3, be interspersed between substrate through-hole 8 and substrate connecting electrode 4.Described base plate 1 is provided with base plate connecting electrode 2, and described base plate connecting electrode 2 lays respectively on the corresponding surface of base plate 1 with plastic-sealed body 7.
As shown in Fig. 4 ~ Fig. 7: above-mentioned encapsulating structure can be obtained by following method for packing, comprises particularly:
A, provide bearing substrate 3, and required substrate through-hole 8 is set on described bearing substrate 3; Described substrate through-hole 8 can by hole or the mode such as fluting forms substrate through-hole 8 in bearing substrate 3, and bearing substrate 3 can adopt pcb board.
B, encapsulating structure 5 is set on the bearing substrate 3 with substrate through-hole 8, and some bearing substrates 3 arranging encapsulating structure 5 are connected to form stacked package body by substrate connecting electrode 4; In the present embodiment, the size of encapsulating structure 5 is less, and substrate through-hole 8 is positioned at the outer ring of encapsulating structure 5, and encapsulating structure 5 can be arranged by modes such as welding and be fixed on bearing substrate 3.Connected by spherical substrate connecting electrode 4 between adjacent bearing substrate 3, can make to form gap between adjacent bearing substrate 3 simultaneously.
C, to be arranged on base plate 1 by substrate connecting electrode 4 by stacked package body, and to be encapsulated on base plate 1 with plastic-sealed body 7 by stacked package body, plastic-sealed body 7 fills the gap between adjacent bearing substrate 3 and the gap between bearing substrate 3 and base plate by substrate through-hole 8.
Stacked package body is arranged on after on base plate 1 by substrate connecting electrode 4, needs to carry out plastic packaging with plastic-sealed body 7 to whole stacked package body.When plastic packaging, plastic packaging material flows into the gap between bearing substrate 3 and the gap between base plate 1 and stacked package body by substrate through-hole 8, the air in delivery space, to carry out overall plastic packaging, improves the intensity of plastic packaging and the reliability of encapsulation.After plastic packaging completes, base plate 1 also arranges base plate connecting electrode 2, so that base plate 1 carries out follow-up connection needs.
Embodiment 2
As shown in figure 11, the present invention includes base plate 1 and be positioned at the stacked package body with plastic-sealed body 7 plastic packaging on described base plate 1, the encapsulating structure 5 that described stacked package body comprises some bearing substrates 3 and is positioned on described bearing substrate 3, described bearing substrate 3 is provided with substrate through-hole 8, encapsulating structure 5 is arranged the encapsulating structure through hole 9 be connected with substrate through-hole 8, the axis of encapsulating structure through hole 9 and the axis of substrate through-hole 8 are located along the same line, gap between adjacent bearing substrate 3 and the gap between bearing substrate 3 and base plate 1 are by the substrate through-hole 8 on bearing substrate 3, encapsulating structure through hole 9 is connected, plastic-sealed body 7 is by substrate through-hole 8, encapsulating structure through hole 9 fills the gap between adjacent bearing substrate 3 and the gap between bearing substrate 3 and base plate.
As shown in Figure 8, Figure 9, Figure 10 and Figure 11: when the size of encapsulating structure 5 is larger, when only arranging substrate through-hole 8 on bearing substrate 3, encapsulating structure 5 may block described substrate through-hole 8.In order to carry out a plastic packaging by plastic-sealed body 7, need to arrange encapsulating structure through hole 9 on encapsulating structure 5, described encapsulating structure through hole 9 is connected with substrate through-hole 8.Adjacent bearing substrate 3 also carries out support and connection by substrate connecting electrode 4.When carrying out plastic packaging, plastic packaging material flows into the gap between bearing substrate 3 by encapsulating structure through hole 9 and substrate through-hole 8, and the gap between bottom bearing substrate 3 and base plate 1, after plastic packaging material fills above-mentioned gap, plastic packaging material can form plastic-sealed body 7 on base plate 1, stacked package body is positioned at plastic-sealed body 7, by stacked package body gland on base plate 1.When specific embodiment, can encapsulating structure 5 be first arranged on bearing substrate 3, then encapsulating structure 5 and bearing substrate 3 are holed simultaneously or slotted, form encapsulating structure through hole 9 and substrate through-hole 8, other follow-up stacking technique and plastic package process are all corresponding to the same with the description of prior art, embodiment 1, repeat no more herein.
The present invention arranges substrate through-hole 8 on bearing substrate 3, or on encapsulating structure 5, arranges encapsulating structure through hole 9 simultaneously; The plastic packaging material of plastic-sealed body 7 is filled in the gap between adjacent bearing substrate 3 and the gap between bearing substrate 3 and base plate 1 by substrate through-hole 8, encapsulating structure through hole 9, then disposablely plastic packaging can be completed, plastic packaging material flow distance can be reduced, improve plastic sealing property and the encapsulation rigidity of whole encapsulating structure, structure is simple, and technique is simple, easy to operate, reduce packaging cost, wide accommodation, safe and reliable.
Claims (2)
1. a method for packing for the small-space plastic package improved, it is characterized in that, described method for packing comprises the steps:
(a), bearing substrate (3) is provided, and required substrate through-hole (8) is set on described bearing substrate (3);
(b), on the bearing substrate (3) with substrate through-hole (8), encapsulating structure (5) is set, and some bearing substrates (3) arranging encapsulating structure (5) are connected to form stacked package body by substrate connecting electrode (4);
(c), stacked package body is arranged on base plate (1) by substrate connecting electrode (4), and with plastic-sealed body (7), stacked package body being encapsulated on base plate (1), plastic-sealed body (7) fills the gap between adjacent bearing substrate (3) and the gap between bearing substrate (3) and base plate by substrate through-hole (8);
Described base plate (1) is provided with base plate connecting electrode (2), and described base plate connecting electrode (2) and plastic-sealed body (7) lay respectively on the corresponding surface of base plate (1);
Described encapsulating structure (5) is provided with encapsulating structure through hole (9), described encapsulating structure through hole (9) is connected with substrate through-hole (8).
2. the method for packing of the small-space plastic package improved according to claim 1, is characterized in that: described substrate connecting electrode (4) is in spherical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534603.5A CN103531550B (en) | 2013-10-31 | 2013-10-31 | The encapsulating structure of the small-space plastic package improved and method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534603.5A CN103531550B (en) | 2013-10-31 | 2013-10-31 | The encapsulating structure of the small-space plastic package improved and method for packing |
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| Publication Number | Publication Date |
|---|---|
| CN103531550A CN103531550A (en) | 2014-01-22 |
| CN103531550B true CN103531550B (en) | 2016-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310534603.5A Active CN103531550B (en) | 2013-10-31 | 2013-10-31 | The encapsulating structure of the small-space plastic package improved and method for packing |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10784220B2 (en) * | 2017-03-30 | 2020-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer |
| CN110010589B (en) * | 2018-01-04 | 2022-03-08 | 长鑫存储技术有限公司 | Stacked semiconductor packaging method and packaging structure |
| US11239173B2 (en) | 2019-03-28 | 2022-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of chip package with fan-out feature |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101577259A (en) * | 2008-05-05 | 2009-11-11 | 南茂科技股份有限公司 | Chip encapsulating structure |
| CN102148166A (en) * | 2010-02-04 | 2011-08-10 | 力成科技股份有限公司 | Method and structure for filling clearances among stacked multi-layer wafers |
| CN103346131A (en) * | 2013-06-25 | 2013-10-09 | 华进半导体封装先导技术研发中心有限公司 | Fine-pitch POP type sealing structure and sealing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219213A (en) * | 2012-04-10 | 2013-10-24 | Shinko Electric Ind Co Ltd | Laminated type semiconductor device and process of manufacturing the same |
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- 2013-10-31 CN CN201310534603.5A patent/CN103531550B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101577259A (en) * | 2008-05-05 | 2009-11-11 | 南茂科技股份有限公司 | Chip encapsulating structure |
| CN102148166A (en) * | 2010-02-04 | 2011-08-10 | 力成科技股份有限公司 | Method and structure for filling clearances among stacked multi-layer wafers |
| CN103346131A (en) * | 2013-06-25 | 2013-10-09 | 华进半导体封装先导技术研发中心有限公司 | Fine-pitch POP type sealing structure and sealing method |
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| CN103531550A (en) | 2014-01-22 |
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