CN209517602U - The straight-through two-sided copper base of heat dissipation of one kind - Google Patents
The straight-through two-sided copper base of heat dissipation of one kind Download PDFInfo
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- CN209517602U CN209517602U CN201820801487.7U CN201820801487U CN209517602U CN 209517602 U CN209517602 U CN 209517602U CN 201820801487 U CN201820801487 U CN 201820801487U CN 209517602 U CN209517602 U CN 209517602U
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- heat dissipation
- copper base
- dissipation plate
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Abstract
The utility model discloses a kind of straight-through two-sided copper base of heat dissipation, including Copper base material ontology, the top and bottom of the Copper base material ontology are equipped with radiator structure；The radiator structure includes being provided with the two-sided line slot of the Copper base material ontology, and the Copper base material ontology is divided into the first heat dissipation plate and the second heat dissipation plate by the line slot.Core radiator structure using fine copper substrate as circuit substrate has the characteristics that rapid heat dissipation, thermal coefficient 380W/m.k have the characteristics that thermal capacitance product is high, can effective divergent light source heat.
Description
Technical field
The utility model belongs to the technical field of copper base, more particularly, to the straight-through two-sided copper base of heat dissipation of one kind.
Background technique
LED light source in headlight for vehicles field using more and more, be based primarily upon LED light product-derived have it is following significant
The characteristics of
One: the service life is long, general up to tens of thousands of or even 100,000 hours.Even replacement lamp will not be had in entire automobile service life
Tool.Two: high efficiency, low energy consumption.The energy consumption of LED light is the 1/20 of halogen lamp.Three: light quality is high, and it is basic to belong to environment-friendly products
Upper radiationless, " green " light source.Four: the structure of LED light source is simple, internal carrier structure, and surrounding is close with transparent epoxy resin
Envelope, anti-seismic performance are good.Five: lighting non-delay, bright light fast response time (nanosecond).Six: being applicable in low voltage operating, LED is only needed
It wants DC voltage 12V that can light, no longer worries the voltage of xenon more than 20,000.Seven: LED occupancy is small in size, and designer can
Arbitrarily to convert lamps and lanterns mode, enable vehicle configuration diversified.
The universal difficulty of LED automobile headlamp at present, mainly since thermal diffusivity is bad, radiating treatment is not taken pains light decay.Shadow
Ring car light service life.When if necessary to higher light efficiency and more high integration vehicle lamp light source, heat dissipation problem is more prominent, this
Patent provides a kind of car light substrate scheme of the double-side of higher power, while using the composite construction of straight-through heat dissipation,
The effective solution high integration of LED car lamp light source and high heat dissipation characteristics demand.
Utility model content
The utility model is to solve technical problem present in above-mentioned background technique, and it is two-sided copper-based to provide a kind of straight-through heat dissipation
Plate.
The utility model uses following technical scheme: the straight-through two-sided copper base of heat dissipation of one kind, including Copper base material ontology, described
The top and bottom of Copper base material ontology are equipped with radiator structure；The radiator structure is two-sided including being provided with the Copper base material ontology
Line slot, the Copper base material ontology is divided into the first heat dissipation plate and the second heat dissipation plate by the line slot.
Further, conductive circuit layer is embedded in the line slot, the wire circuit can be complete with the line slot
Agree with.
Further, first heat dissipation plate is close close to the side of wire line layer, conductive circuit layer, the second heat dissipation plate
The side of wire line layer is coated with solder mask layer.
Further, the region of solder mask layer is not coated with as heat dissipation on first heat dissipation plate and second heat dissipation plate
Area.
Further, the top and bottom of the Copper base material ontology are equipped with two groups of heat dissipation bonding pads and positive and negative anodes pad.
Further, the solder mask layer and the first heat dissipation plate, conductive circuit layer, be coated with insulation between the second heat dissipation plate
Layer.
Further, two groups of heat dissipation bonding pads are located on the first heat dissipation plate and the second heat dissipation plate, and and conductor wire
The electrical connection of road floor；The positive and negative anodes pad is located in line slot, and is electrically connected with conductive circuit layer.
The utility model has the beneficial effects that using core radiator structure of the fine copper substrate as circuit substrate, have
The characteristics of rapid heat dissipation, thermal coefficient 380W/m.k have the characteristics that thermal capacitance product is high, can effective divergent light source heat；The substrate is adopted
With multilayered structure pressing, heat dissipation bonding pad of the Copper base material ontology as LED light source forms the through type heat dissipation knot of LED light source
Structure optimizes the heat dissipation channel of LED light source to greatest extent；The exposed heat dissipation area of substrate is increased, monolith substrate is effectively improved
Radiating efficiency.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the two-sided copper base of the utility model；
Each mark in Fig. 1 are as follows: 1 Copper base material ontology, 2 line slots, 3 first heat dissipation plates, 4 second heat dissipation plates, 5 conducting wires
Layer, 6 solder mask layers, 7 radiating areas, 8 heat dissipation bonding pads, 9 positive and negative anodes pads.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
Referring to Fig. 1, the utility model provides a kind of technical solution: the straight-through two-sided copper base of heat dissipation of one kind, including it is copper-based
The overall thickness of material ontology 1, Copper base material ontology 1 is 2.0mm, and the top and bottom of the Copper base material ontology 1 are equipped with radiator structure；
The radiator structure includes being provided with the two-sided line slot 2 of the Copper base material ontology 1, and the line slot 2 is with a thickness of 0.15mm, institute
It states line slot 2 and the Copper base material ontology 1 is divided into the first heat dissipation plate 3 and the second heat dissipation plate 4.It is embedded with and leads in the line slot 2
Electric line layer 5, the wire circuit layer 5 can agree with completely with the line slot 2.Conductive circuit layer 5 uses 0.15mm thickness
Single side FR-4 wiring board as light source circuit connection layer.
The integrated morphology of the two groups of light sources in substrate two sides is realized, its power of the light source module group of same structure volume and light efficiency are equal
It is doubled.
First heat dissipation plate 3 is close to the side of wire line layer, conductive circuit layer 5, the second heat dissipation plate 4 close to wire
The side of road floor 5 is coated with solder mask floor 6, is not coated with solder mask layer on first heat dissipation plate 3 and second heat dissipation plate 4
6 region is radiating area 7.The solder mask layer 6 and the first heat dissipation plate 3, conductive circuit layer 5 are coated between second heat dissipation plate 4
Insulating layer.Copper base material heat dissipation plate is devised, the exposed heat dissipation area of substrate is increased, effectively improves the radiating efficiency of monolith substrate.
The top and bottom of the Copper base material ontology 1 are equipped with two groups of heat dissipation bonding pads 8 and positive and negative anodes pad 9.Described two groups
Heat dissipation bonding pad 8 is located on the first heat dissipation plate 3 and the second heat dissipation plate 4, and is electrically connected with conductive circuit layer 5；The positive and negative anodes
Pad 9 is located in line slot 2, and is electrically connected with conductive circuit layer 5.
Claims (7)
1. the straight-through two-sided copper base of heat dissipation of one kind, which is characterized in that including Copper base material ontology, the top surface of the Copper base material ontology and
Bottom surface is equipped with radiator structure；The radiator structure includes being provided with the two-sided line slot of the Copper base material ontology, the route
The Copper base material ontology is divided into the first heat dissipation plate and the second heat dissipation plate by slot.
2. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that be embedded with and lead in the line slot
Electric line layer, the conductive circuit layer can agree with completely with the line slot.
3. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that first heat dissipation plate is close
The side of wire line layer, conductive circuit layer, the second heat dissipation plate are coated with solder mask layer close to the side of wire line layer.
4. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that first heat dissipation plate and institute
Stating and being not coated with the region of solder mask layer on the second heat dissipation plate is radiating area.
5. a kind of straight-through two-sided copper base of heat dissipation according to claim 1, which is characterized in that the top of the Copper base material ontology
Face and bottom surface are equipped with two groups of heat dissipation bonding pads and positive and negative anodes pad.
6. a kind of straight-through two-sided copper base of heat dissipation according to claim 3, which is characterized in that the solder mask layer and the
One heat dissipation plate, conductive circuit layer are coated with insulating layer between the second heat dissipation plate.
7. a kind of straight-through two-sided copper base of heat dissipation according to claim 5, which is characterized in that two groups of heat dissipation bonding pads point
Wei Yu not be on the first heat dissipation plate and the second heat dissipation plate, and be electrically connected with conductive circuit layer；The positive and negative anodes pad is located at line slot
In, and be electrically connected with conductive circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820801487.7U CN209517602U (en) | 2018-05-28 | 2018-05-28 | The straight-through two-sided copper base of heat dissipation of one kind |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820801487.7U CN209517602U (en) | 2018-05-28 | 2018-05-28 | The straight-through two-sided copper base of heat dissipation of one kind |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517602U true CN209517602U (en) | 2019-10-18 |
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ID=68186185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820801487.7U Active CN209517602U (en) | 2018-05-28 | 2018-05-28 | The straight-through two-sided copper base of heat dissipation of one kind |
Country Status (1)
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| CN (1) | CN209517602U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864040A (en) * | 2020-09-23 | 2020-10-30 | 歌尔股份有限公司 | Metal substrate and heating element |
-
2018
- 2018-05-28 CN CN201820801487.7U patent/CN209517602U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864040A (en) * | 2020-09-23 | 2020-10-30 | 歌尔股份有限公司 | Metal substrate and heating element |
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