RU166981U1 - DOUBLE ELECTRIC INSULATION LED MODULE FOR LIGHTING DEVICES - Google Patents

Abstract

1. An optical module comprising: a radiator in the form of a plate with a surface provided with a dielectric layer and a hole with a diameter d to accommodate a sealed current lead; a radiation source placed with the possibility of heat exchange with a radiator; an optical system made in the form of a lens equipped with fastening means to the surface of the radiator and silicone dielectric insulation along the contour. 2. The optical module according to claim 1, characterized in that the radiation source is made in the form of one or more LEDs mounted on a printed circuit board including an insulator layer and which is placed on the dielectric layer of a radiator plate equipped with a hole with a diameter D for installing a sealed input, while the dimensions holes for placing a sealed input are selected from the inequality D-d≥6 mm, where D is the diameter of the hole in the radiator plate, mm, d is the diameter of the hole in the printed circuit board, mm. 3. The optical module according to claim 1 or 2, characterized in that the sealed input is fixed in the radiator plate by means of a threaded connection. The optical module according to claim 2, characterized in that an elastic dielectric silicone ring is mounted on the radiator plate along the lens contour. The optical module according to claim 1, characterized in that the radiation source includes one or more COB LEDs mounted on a ceramic substrate mounted on a radiator plate. The optical module according to claim 2, characterized in that the radiation source board is provided with a contact element configured to connect a silicone dielectric insulation and a dielectric layer of a radiator to the breakdown indicator. The optical module according to claim 1, characterized in that in

Description

Technical field

The claimed solution relates to the field of lighting engineering and is intended for use in streetlights with uninsulated power supplies.

State of the art

As a rule, in LED light sources operating on the street, especially in conditions of temperature, humidity, etc. classic power supplies (KIP) with frequency conversion and isolated from the network with an electrically guaranteed electric strength of more than 1.5-3.7 kV are used.

With increasing power of the illuminators, the cost, weight and complexity of instrumentation increases. In LED illuminators, it is possible to use substantially simpler sequential power supplies (SIP), but one of the drawbacks of these SIPs is that they are powered directly from the AC network and each element of this SIP has a mains voltage (uninsulated IP).

At the same time, the simplicity of SIPs is attractive for use in LED light sources, the maintenance of which requires the safety of personnel.

Since the range of lighting equipment capacities is different, a single LED module with double electrical insulation can be used in the lighting device in an amount sufficient to achieve the required total power.

Known LED lamp with an uninsulated power source, containing an LED module comprising a radiator, a dielectric Bakelite board with LEDs, an optical system (WO 2014089930, MKI F21S 2/00, published 06/19/2014),

A non-insulated LED lamp is known, comprising an LED module including a heat-conducting plate, essentially a part of a radiator, radiation sources connected by conductors to a power source, and arranged to be heat exchanged with a radiator, an optical system in the form of an optically transparent hemisphere. To avoid breakdown, the conductors of the power source are located no closer than 4 mm from the edge of the board (KR 1020160007998, MKI F21V 25/00, published January 21, 2016).

A disadvantage of the known solution is the risky mechanical connection of the sequential power source with a part of the metal radiator and the introduction of a plastic insert between the power source board and the main radiator.

The technical result of the claimed solution is to simplify the design and increase the electrical safety of the LED module of lighting devices operating from a sequential power source.

Decision Disclosure

The claimed solution is characterized by the following set of features:

An optical module comprising a radiator in the form of a metal plate with a surface provided with a dielectric layer, for example, a dielectric heat-conducting prepreg, and with a hole of diameter d to accommodate a sealed current lead of the power source; a radiation source placed with the possibility of heat exchange with a radiator; an optical system made in the form of a lens equipped with fastening means to the surface of the radiator and silicone dielectric insulation along the contour.

By a radiation source, in one embodiment, one or more LEDs mounted on a printed circuit board (PCB) comprising a layer of an insulator and placed on a dielectric layer of a radiator plate should be understood. To install a sealed input and ensure electrical safety, the board has a hole with a diameter D, the value of which is selected from the inequality:

D-d≥6 mm, where:

D is the diameter of the hole in the radiator plate, mm,

d is the diameter of the hole in the printed circuit board, mm

In another embodiment, a radiation source should be understood as one or more SOC - LEDs (Chip-On-Board technology) having a dielectric ceramic substrate, which in the claimed solution is installed on the dielectric layer of the radiator.

For both options, it is preferable to fasten the sealed current lead in the radiator plate using a threaded connection.

A single spherical lens of the optical system is mounted around the perimeter on the dielectric surface of the radiator using a profiled dielectric silicone gasket and can be equipped with additional dielectric silicone insulation, for example, in the form of an elastic dielectric silicone ring.

In the case of using several regularly placed LEDs, the lenses can be made on a single optical panel.

To increase electrical safety, the radiation source board can be equipped with a contact element configured to connect to a breakdown indicator, which indicates a violation of the dielectric insulation of silicone or the dielectric layer of the radiator.

Brief Description of the Drawings

In FIG. 1 shows a section of an LED module,

FIG. 2 is an enlarged image of the mounting section of the lens on the radiator,

FIG. 3 - axonometric image of the LED module in the analysis.

In these drawings, the following positions indicate the elements of the claimed device:

1. Radiator plate

2. circuit board

3. Sources of radiation (LEDs)

4. The lens of the optical system

5. Dielectric silicone gasket

5.1 - the supporting section of the gasket on the surface of the radiator plate

5.2 - recess in the profile of the silicone gasket

5.3 - calibrated protrusion in the profile of the silicone gasket, guaranteeing a gap between the lens 4 and the board 2

6. Sealed current lead

7. The dielectric layer of the radiator (prepreg)

8. Cables connecting hermetic current lead

9. The clamping ring of the dielectric silicone gasket

Utility Model Implementation

On the aluminum plate of the radiator 1, which has a dielectric layer 7 in the form of a prepreg or other material withstanding breakdown voltage of more than 3750 V, a printed circuit board 2 with LEDs 3 and a lens 4 is mounted, which is pressed against the plate of the radiator 1 by means of a profiled dielectric silicone strip 5. V the radiator plate 1 has a thread through which a nylon insulating hermetic current lead is screwed in. 6. Before installing the lens 4, after soldering the current lead cable 6 to the LEDs 3, the gap 7 between the board 2 and okovvodom 6 pour electrically insulating silicone. The board 2 also has a prepreg, designed for a breakdown voltage of 3750 V. Thus, the LEDs 3 are isolated from the external environment by a pressure lead 6 and the dielectric material of the gasket 5, and between the LEDs 3 and the radiator plate 1 there are two layers of an electrical insulator in the form of a prepreg, each with breakdown voltage of 3750 V. If for some reason the insulation on board 2 becomes unusable, the mains voltage will be on the aluminum base of board 2, but the layer of prepreg 7 of the radiator plate 1 and the dielectric strip 5 will provide required security. It is necessary to observe the conditions under which the copper layer on the board 2 should be no closer than 3 mm from the edge of the hole in the board 2.

Industrial applicability

The utility model can be implemented on the basis of existing materials and assembly technologies of LED lamps.

Claims (8)

1. An optical module comprising: a radiator in the form of a plate with a surface provided with a dielectric layer and a hole with a diameter d to accommodate a sealed current lead; a radiation source placed with the possibility of heat exchange with a radiator; an optical system made in the form of a lens equipped with fastening means to the surface of the radiator and silicone dielectric insulation along the contour. 2. The optical module according to claim 1, characterized in that the radiation source is made in the form of one or more LEDs mounted on a printed circuit board including an insulator layer and which is placed on the dielectric layer of a radiator plate equipped with an opening with a diameter D for installing a sealed input, when this hole size to accommodate a sealed input selected from the inequality D-d≥6 mm, where D is the diameter of the hole in the radiator plate, mm, d is the diameter of the hole in the printed circuit board, mm 3. The optical module according to claim 1 or 2, characterized in that the sealed input is fixed in the radiator plate by means of a threaded connection. 4. The optical module according to claim 2, characterized in that an elastic dielectric silicone ring is mounted on the radiator plate along the lens contour. 5. The optical module according to claim 1, characterized in that the radiation source includes one or more COB LEDs mounted on a ceramic substrate mounted on a radiator plate. 6. The optical module according to claim 2, characterized in that the radiation source board is provided with a contact element configured to connect a silicone dielectric insulation and a dielectric layer of a radiator to the breakdown indicator. 7. The optical module according to claim 1, characterized in that a dielectric prepreg is used as an insulating layer. 8. The optical module according to claim 1 or 2, characterized in that the radiation source is made in the form of regularly arranged LEDs, the lenses of which are made on a single optical panel.

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