JP2010049951A - Led illumination fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED illumination fixture capable of improving a withstand voltage without upsizing of an LED unit. <P>SOLUTION: In an LED projector 1 in which on the surface of an LED circuit board 44 obtained by installing an insulating film 42 on the surface of a metal plate 40 and LED units 30 installed with LEDs 46 are equipped at an LED light source part 2, a lighting circuit 25 is equipped in which electric power of a commercial power supply connected to a primary side is converted and supplied to the LEDs 46 of the LED units 30 connected to a secondary side, and a wiring 33 is equipped by which the primary side or the secondary side of the lighting circuit 25 and the metal plates 40 of the LED units 30 are made to have nearly the same potential. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an LED lighting apparatus having an LED (light emitting diode) as a light source.

  Conventionally, since the amount of heat generated by the LED has increased with the increase in the output of the LED, it is necessary to take measures against heat of the LED in order to extend the life of the LED. Therefore, as shown in FIG. 7, by using a metal substrate 94 in which an insulating material 92 is bonded to the surface of a metal plate 90 such as aluminum and mounting the LED 96 on the metal substrate 94, the heat dissipation of the LED 96 is improved. The LED unit 98 is realized.

  In recent years, LED lighting fixtures with built-in lighting circuits (power sources) that turn on LEDs using power from a commercial power source are known as LED lighting fixtures using LEDs as light sources. In addition, there is also known one using the LED unit 98 as a light source. In general, a withstand voltage test for applying a high voltage of 1000 V (volts) or more is performed on these LED lighting fixtures with a built-in lighting circuit.

Here, in the LED unit 98, as shown in FIG. 7, since the insulating material 92 is interposed between the metal plate 90 and the LED 96, the floating distributed capacitance C1 is generated between them. Therefore, when this LED unit 98 is used as a light source of an LED lighting fixture, when a high voltage is applied to the LED lighting fixture during a withstand voltage test, the floating distribution capacitance C1 causes a gap between the metal plate 90 and the LED 96. There is also a risk that the LED 96 may be damaged by applying an excessive voltage exceeding the withstand voltage (for example, 500 V) of the LED 96.
Therefore, in the LED unit 98, an electronic component such as a capacitor (surge absorber), a Zener diode, a varistor, or a resistor is connected between the metal plate 90 and the LED 96, and the overvoltage or overcurrent to the LED 96 is caused by this electronic component. The structure which absorbs is proposed (for example, refer patent document 1).
JP 2008-53663 A (pages 14 to 15, FIGS. 17 to 18)

However, assuming the withstand voltage test as described above, a large-sized electronic component having a withstand voltage of 500 V or more is required to reliably protect the LED 96, so that the LED unit becomes large, and such When incorporating the LED unit into a lighting fixture, it is necessary to devise arrangement of the electronic component in a place that does not interfere with illumination, and further measures for insulation of the electronic component are required, resulting in an increase in cost.
This invention is made | formed in view of the situation mentioned above, and it aims at providing the LED lighting fixture which can aim at the improvement of a withstand voltage, without causing the enlargement of an LED unit.

  In order to achieve the above object, the present invention provides a power source for a commercial power supply in an LED lighting apparatus having an LED unit in which an LED is provided on the surface of an LED substrate provided with an insulating layer on the surface of a metal plate. A lighting circuit that converts and supplies the LED to the LED of the LED unit, a primary side or a secondary side of the lighting circuit, and a wiring member that brings the metal plate of the LED unit to substantially the same potential. To do.

  According to the present invention, in the LED lighting device, the LED unit is provided with an insulating material sandwiched between mounting bases provided in the lamp body.

  In the LED lighting apparatus, the light source portion is configured by arranging the LED units in which the metal plate is exposed on a part of the surface and the screw holes are provided in the exposed portions in a line, A metal plate for equipotential is provided to make each metal plate have the same potential so as to extend over the screw holes of the LED unit, and the metal plate for equipotential is connected to the screw hole of each LED unit with a conductive screw. It is characterized by being screwed with.

  According to the present invention, since the primary or secondary side of the lighting circuit and the wiring member that makes the metal plate of the LED unit substantially the same potential are provided, the LED and the metal plate of the LED unit even when a high voltage is inputted. Since the potential difference hardly occurs between the LED and the LED, breakage of the LED can be prevented and the withstand voltage can be improved. Moreover, since it is not necessary to use electronic components such as a capacitor (surge absorber), a Zener diode, a varistor, and a resistor, the LED unit is not increased in size.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a front view of an LED projector 1 as an aspect of an LED lighting apparatus according to the present embodiment, and FIG. 2 is a main cross-sectional view of the LED projector 1 as viewed from the side.
As shown in these drawings, the LED projector 1 includes a lamp main body 4 in which an LED light source unit 2 is housed, a power supply case 6 provided integrally with the lamp main body 4, and the power supply case 6 rotatably supported. And an arm 8 to be operated.

As shown in FIG. 2, the lamp body 4 is formed by molding, for example, aluminum die casting into a bottomed box shape that gradually expands from the back side toward the front side, and a substantially rectangular opening on the front side is formed. Formed as a light projection opening 10, an aluminum die-cast front frame 12 is attached to the light projection opening 10.
The front frame 12 is configured to be openable and closable with the lower surface 4A side of the lamp main body 4 as a support shaft, and is configured to be latchable on the upper surface 4B of the lamp main body 4 with a latch. A front glass 14 that closes the light projection opening 10 of the lamp body 4 is fitted into the front frame 12.

  The power supply case 6 has a built-in lighting circuit (power supply) 25 that is supplied with commercial power via the power line 16 and converted into DC power having a voltage suitable for the LED light source unit 2. The power supply case 6 is formed by molding, for example, aluminum die casting into a substantially box shape having the same width as the lamp body 4, and is integrally connected to the lower surface 4 </ b> A of the lamp body 4. A large number of radiating fins 18 (FIG. 2) for radiating heat generated by the built-in lighting circuit 25 are provided on the outer surface of the power supply case 6. The arm 8 is a support member formed by bending a flat plate-like member into a substantially U-shape, and an arm fastening screw is provided so that the power supply case 6 can be rotated around the rotation support shaft P between two tip portions. 20 is pivotally supported.

As shown in FIG. 2, the LED light source unit 2 is connected to a plurality of LED units 30 (2 × 4 in the illustrated example) attached to a conductive heat transfer unit 32 and will be described later. The same potential metal plate 34 is provided.
The heat transfer unit 32 functions as a mounting base for the LED unit 30 and transfers heat generated by the LED unit 30 to the lamp body 4. The heat transfer unit 32 includes two substantially block-shaped heat transfer bodies 35 serving as the unit body. Heat pipes 36 and 37, and a dish-shaped mounting metal plate 38 fixed to the upper surface of the heat transfer body 35 and to which the LED unit 30 is fixed.
The heat transfer body 35 is formed by molding, for example, aluminum, which is a metal material having high thermal conductivity, such that its side peripheral surface and bottom surface are in contact with the lamp body 4. Thereby, the heat generated by the LED unit 30 is transferred to the entire lamp body 4. The heat pipes 36 and 37 are provided in the heat transfer body 35 so as to thermally connect the upper surface and the bottom surface of the heat transfer body 35, and the LED unit 30 attached to the upper surface of the heat transfer body 35. Is efficiently transferred to the bottom surface side opposite to the upper surface side. With this configuration, the heat of the LED unit 30 is efficiently radiated using the entire lamp body 4.

3A and 3B are diagrams schematically showing the configuration of the LED unit 30. FIG. 3A is a plan view and FIG. 3B is a side view.
The LED unit 30 includes an LED substrate 44 configured by providing an insulating film 42 that forms an insulating layer on the surface of a metal plate 40 in which a metal having high heat dissipation, such as aluminum, is formed in a substantially square plate shape. On the surface of the insulating film 42, an LED 46, an input terminal 48 to which DC power for LED lighting is supplied from the lighting circuit 25, and a conductive pattern 49 for guiding DC power from the input terminal 48 to the LED 46 are formed. ing. A resin lens 50 that covers the LED 46 is attached to the LED substrate 44. The LED board 44 has mounting screw holes 52 and 54 formed at two locations. The mounting screw holes 52 and 54 are electrically insulated from the heat transfer unit 32 through, for example, resin insulating screws. Fixed in state. Further, the LED substrate 44 is provided with a screw hole 81 for screwing the insulating film 42 to the LED substrate 44 and a metal for equipotential described later provided in a portion where the metal plate 40 is exposed without being covered by the insulating film 42. A screw hole 82 for screwing the plate 34 is provided. The screw hole 82 is formed to a depth that does not penetrate the LED substrate 44, and is tapped on the inside thereof. By screwing a metal screw having conductivity into the screw hole 82, the screw and the metal are screwed. The conduction of the plate 40 is achieved. Although not shown, the lens 50 is integrally formed with a portion that extends to the screw holes 81 and 82, and this portion is fixed by being screwed with a screw that passes through the screw holes 81 and 82.

As shown in FIG. 1, the plurality of LED units 30 having such a configuration are arranged in multiple rows and multiple columns (2 rows and 4 columns in the illustrated example) on the upper surface of the heat transfer unit 32. More specifically, as shown in FIG. 2, each LED unit 30 is disposed on an insulating paper 57 such as a Mylar film provided on the surface of the mounting metal plate 38 of the heat transfer unit 32. Insulation between each metal plate 40 of the unit 30 and the heat transfer unit 32 is achieved.
The power supply case 6 is provided with the lighting circuit 25 for each row of LED units 30. Commercial power from the power line 16 is input in parallel to each lighting circuit 25, and a power feeding cable 60 is drawn from each lighting circuit 25, and each power feeding cable 60 is input to the top LED unit 30 in each row. The terminal 48 is connected. The input terminals 48 of the LED units 30 in each row are electrically connected in series by a connection cable 58, whereby DC power for LED lighting is supplied from the lighting circuit 25 to each LED unit 30.

FIG. 4 is a diagram schematically illustrating the configuration of the LED unit 30 in the LED projector 1, and FIG. 5 is a diagram schematically illustrating the electrical configuration of the LED projector 1.
As shown in FIG. 4, in the LED unit 30, since the insulating film 42 is interposed between the metal plate 40 and the LED 46, a floating distributed capacitance C <b> 1 is generated between them. Similarly, since the insulating paper 57 is interposed between the heat transfer unit 32 to which the LED unit 30 is attached and the LED unit 30, a floating distributed capacitance C2 is generated therebetween. A voltage divided by the floating distribution capacitance C1 and the floating distribution capacitance C2 is applied between the metal plate 40 and the LED 46, and between the heat transfer unit 32 and the LED unit 30, respectively.

As shown in FIG. 5, during the withstand voltage test of the LED projector 1, a predetermined high voltage VI is input to the lighting circuit 25 by the withstand voltage tester. At this time, depending on the voltage division ratio between the stray distribution capacitance C1 and the stray distribution capacitance C2, a voltage exceeding the withstand voltage of the LED 46 may be applied between the metal plate 40 and the LED 46 and the LED 46 may be damaged or discharge may occur. .
Therefore, in this embodiment, as shown in FIG. 5, the metal plate 40 of each LED unit 30 is connected by the same potential metal plate 34, and at the same potential as the point P <b> 1 on the high potential side (plus side) of the LED 46. The metal plate 34 is connected by the same potential wiring 33. The point P1 on the high potential side of the LED 46 can be an arbitrary point on the current path from the lighting circuit 25 to the LED 46, that is, the current path on the secondary side of the lighting circuit 25. In this embodiment, As shown in FIG. 1, the same potential metal plate 34 is connected to the high potential line (plus-side line) of the power supply cable 60 via the same potential wiring 33.

  With this configuration, the metal plate 40 of each LED unit 30 is maintained at substantially the same potential as the voltage VC1 on the input side of the LED 46. Therefore, even when a high voltage VI is applied during a withstand voltage test, for example. There is no potential difference between the LED 40 and the LED 46, and the LED 46 is not damaged or discharged. At this time, the high voltage applied to each LED unit 30 by the high voltage VI during the withstand voltage test is applied between the heat transfer unit 32 and the LED unit 30 by the floating distribution capacitance C2, but the insulating paper 57 Since it has insulation performance, it has a structure that can withstand the high voltage.

As shown in FIG. 1, the equipotential metal plate 34 that connects each LED unit 30 is formed of a single rectangular aluminum plate, and extends so as to cover the screw hole 82 of each LED unit 30. It is provided and screwed to the LED unit 30 through a screw hole 82. Since the screw hole 82 is provided in a portion where the metal plate 40 is exposed without being covered with the insulating film 42, the screwed equipotential metal plate 34 and the metal plate 40 of the LED unit 30 are respectively Are conducted and maintained at the same potential.
As described above, since the metal plate 40 of the LED unit 30 is made to have the same potential by using the metal plate 34 for the same potential provided so as to cover the screw holes 82 of the LED units 30, the plurality of LED units 30. However, the same potential metal plate 34 can be easily attached at a time. Further, the metal plate 40 of the LED unit 30 is connected to the lighting circuit 25 by simply connecting the same potential metal plate 34 and the point P1 on the current path on the secondary side of the lighting circuit 25 with the same potential wiring 33, respectively. Therefore, it is not necessary to individually connect each LED unit 30 to the secondary side of the lighting circuit 25 with the same potential wiring 33, and wiring work is facilitated.

  As described above, according to the present embodiment, the point P1 on the high potential side of the LED unit 30 corresponding to the secondary side of the lighting circuit 25 and the metal plate 40 of each LED unit 30 are set to substantially the same potential. Therefore, even when a high voltage is input to the LED projector 1 by a withstand voltage test or the like, a potential difference is almost generated between the LED 46 and the metal plate 40 in each LED unit 30. There is no. Thereby, damage of LED46 is prevented and a withstand voltage can be improved. Moreover, since it is not necessary to use electronic components such as a capacitor (surge absorber), a Zener diode, a varistor, and a resistor, the LED unit is not increased in size.

  Moreover, according to this embodiment, it was set as the structure which accommodates the heat-transfer unit 32 as a mounting base in the lamp body 4, and arrange | positions each LED unit 30 on both sides of the insulating paper 57 in this heat-transfer unit 32. With this configuration, the high voltage applied to each LED unit 30 by the high voltage VI during the withstand voltage test is transferred to the heat transfer unit C2 by the floating distribution capacitance C2 between the metal plate 40 of the LED unit 30 and the heat transfer unit 32. Although applied between the unit 32 and the LED unit 30, the insulation performance of the insulating paper 57 makes it possible to sufficiently withstand a high voltage and improve the insulation level. In addition, the heat transfer performance is improved by the heat transfer unit 32.

  Further, according to the present embodiment, the LED units 30 provided with the screw holes 82 are arranged in a line at a portion where the metal plate 40 is exposed on a part of the surface, and extend over the screw holes 82 of the respective LED units 30. The same potential metal plate 34 is provided so as to exist, and the screw hole 82 of each LED unit 30 is screwed with a conductive screw. With this configuration, the same potential metal plate 34 can be easily attached to the plurality of LED units 30 at one time.

  The above-described embodiment is merely an aspect of the present invention, and can be arbitrarily modified and applied within the scope of the present invention.

For example, in the above-described embodiment, as the secondary side of the lighting circuit 25, as shown in FIG. 1, the same potential metal plate 34 as the high potential line of the power supply cable 60 that supplies power to the LED unit 30 from the lighting circuit 25. Are connected by the same potential wiring 33, but the present invention is not limited to this. For example, as the secondary side of the lighting circuit 25, the same potential metal plate 34 as the high potential line (plus side line) of the conductive pattern 49 of any LED unit 30 or the high potential line of the input terminal 48 is used for the same potential. It is good also as a structure connected by the wiring 33. FIG. Further, for example, as the secondary side of the lighting circuit 25, the low potential line (minus side line) of the conductive pattern 49 of any LED unit 30 or the low potential line of the input terminal 48 and the same potential metal plate 34 are set to the same potential. It is good also as a structure connected by the wiring 33 for work.
The secondary side of the lighting circuit 25 and the same potential metal plate 34 are not limited to the configuration in which the same potential wiring 33 is connected. For example, as shown in FIG. 6, the primary side of the lighting circuit 25 (commercial power supply is connected). The same potential metal plate 34 may be connected by the same potential wiring 33A.

  In addition, for example, in the above-described embodiment, the case where the LED lighting apparatus of the present invention is applied to a projector has been described. Can be applied.

It is a front view of the LED floodlight which is 1 aspect of the LED lighting fixture which concerns on embodiment of this invention. It is the principal sectional view which looked at the LED floodlight from the side. It is a figure which shows the structure of an LED unit typically, (A) is a top view, (B) is a side view. It is a figure which shows typically the structure of the LED unit in a LED projector. It is a figure which shows typically the electric constitution of a LED projector. It is a figure which shows typically the electric constitution of the LED projector which concerns on the other aspect of this invention. It is a figure which shows the structure of the conventional LED unit typically.

Explanation of symbols

1 LED floodlight (LED lighting equipment)
2 LED light source 4 Lamp body 6 Power supply case 16 Power line 25 Lighting circuit 30, 98 LED unit 32 Heat transfer unit 33, 33A Equipotential wiring (wiring member)
34 Metal plate for equipotential 40 Metal plate 42 Insulating film (insulating layer)
44 LED board 46, 96 LED
48 Input terminal 49 Conductive pattern 50 Lens 82 Screw hole 57 Insulating paper (insulating material)
60 Power supply cable 90 Metal plate 92 Insulation material 94 Metal substrate

Claims (3)

In the LED lighting device provided with the LED unit in which the LED is provided on the surface of the LED substrate provided with the insulating layer on the surface of the metal plate in the light source unit,
A lighting circuit for converting the power of the commercial power source and supplying the converted power to the LEDs of the LED unit;
A wiring member that makes the primary side or secondary side of the lighting circuit substantially the same potential as the metal plate of the LED unit;
An LED lighting apparatus comprising:   2. The LED lighting apparatus according to claim 1, wherein the LED unit is provided with an insulating material sandwiched between mounting bases provided in the lamp body. Exposing the metal plate on a part of the surface and arranging the LED units provided with screw holes in the exposed locations in a row to constitute the light source unit,
An equipotential metal plate is provided to make each metal plate have the same potential so as to extend over the screw hole of each LED unit, and the same potential metal plate is electrically connected to the screw hole of each LED unit. The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is screwed with a natural screw.

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