1:ύ〇年.0》月07日核正替換頁 M421454 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係與散熱結構有關，特別有關於一種可加速自然 對流速率的散熱結構。 【先前技術】 [0002] 近年來因發光二極體（LED)技術的蓬勃發展及曰趨成熟， 又具有低耗能、使用壽命長、體積小、反應快等特點， 故已逐漸取代傳統鹵素燈泡而成為未來的主流市場。 [0003] 一般而言，LED的功率越高所伴隨產生的廢熱也越多，惟 ，高溫對LED的壽命及發光效能有相當大的負面影響，因 此，功率較高的LED燈具大多會設有散熱結構，以適時地 將高溫逸散；習知的LED燈具的散熱結構通常利用自然對 流的方式將廢熱自LED燈具内部導引至外部逸散，其實施 方式係將一散熱體貼接在LED的背光面上，該散熱體可由 複數散熱鰭片所組成，藉由具有大範圍散熱面積的散熱 鰭片來加速排除LED發光時所產生的廢熱。 [0004] 上述結構中，該散熱體的散熱面積雖然可加速LED廢熱的 排除，然而，由於自然對流的氣體流動速度較為緩慢， 故其散熱過程仍容易造成熱聚集的現象，令該LED燈具的 整體溫度偏高，甚至影響到該LED的使用壽命及發光效率 [0005] 有鑑於此，本創作人為改善並解決上述之缺失，乃特潛 心研究並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本創作。 表單编號A0101 第3頁/共16頁 M421454 100年.09月07日梭正替換頁 【新型内容】 [0006] 本創作之一目的，在於提供一種可加速熱對流效應之散 熱結構，以加速燈具内部氣流的自然對流速度，避免產 生熱聚集的現象。 [0007] 為了達成上述之目的，本創作係為一種可加速熱對流效 應之散熱結構，用以導引一外部氣流而對一發熱元件進 行散熱，該散熱結構包括： [0008] —座體，具有可容置所述發熱元件的一容置空間，該座 體的一側為一開口，另一側開設有複數散熱孔； 隹 [0009] 一散熱體，設置在該容置空間中，並熱導接所述發熱元 件，該散熱體包含一中空筒柱及間隔排列在該中空筒柱 之外緣面的多數個散熱片，該中空筒柱的一側設有至少 一第一對流孔，另一側則設有至少一第二對流孔；以及 [0010] 一罩蓋，係蓋合在該座體的開口上，並開設有複數通孔1:ύ〇年.0》月07日核正换页 M421454 V. New description: [New technology field] [0001] This creation is related to the heat dissipation structure, especially regarding a heat dissipation that accelerates the natural convection rate. structure. [Prior Art] [0002] In recent years, due to the vigorous development and mature of LED technology, it has the characteristics of low energy consumption, long service life, small size, fast response, etc., so it has gradually replaced traditional halogen. Light bulbs have become the mainstream market in the future. [0003] In general, the higher the power of the LED, the more waste heat is generated. However, the high temperature has a considerable negative impact on the life and luminous efficacy of the LED. Therefore, most of the LED lamps with higher power are provided. The heat dissipation structure dissipates the high temperature in a timely manner; the heat dissipation structure of the conventional LED lamp usually uses natural convection to guide the waste heat from the inside of the LED lamp to the external escape. The embodiment is to attach a heat sink to the LED. On the backlight surface, the heat dissipating body may be composed of a plurality of heat dissipating fins, and the heat dissipating heat generated by the LED illumination is accelerated by the heat dissipating fin having a wide heat dissipating area. [0004] In the above structure, although the heat dissipating area of the heat dissipating body can accelerate the elimination of the waste heat of the LED, however, since the natural convection gas flows at a relatively slow speed, the heat dissipating process is still prone to cause heat accumulation, so that the LED lamp is The overall temperature is too high, even affecting the service life and luminous efficiency of the LED [0005] In view of this, the creator has tried to improve and solve the above-mentioned shortcomings, and has devoted himself to research and cooperation with the theory, finally proposed a reasonable and effective design. Improve the above-mentioned lack of creation. Form No. A0101 Page 3 of 16 M421454 100. September 07 Shuttle Replacement Page [New Content] [0006] One of the purposes of this creation is to provide a heat dissipation structure that accelerates the heat convection effect to accelerate The natural convection velocity of the airflow inside the luminaire avoids the phenomenon of heat accumulation. [0007] In order to achieve the above object, the present invention is a heat dissipation structure capable of accelerating the heat convection effect for guiding an external airflow to dissipate heat from a heat generating component, the heat dissipation structure comprising: [0008] An accommodating space for accommodating the heating element, the one side of the body is an opening, and the other side is provided with a plurality of heat dissipation holes; 隹 [0009] a heat sink disposed in the accommodating space, and Thermally guiding the heating element, the heat dissipating body comprises a hollow cylinder and a plurality of fins spaced apart from the outer peripheral surface of the hollow cylinder, and one side of the hollow cylinder is provided with at least one first convection hole. The other side is provided with at least one second convection hole; and [0010] a cover is attached to the opening of the base body and is provided with a plurality of through holes
[0011] 其中，所述外部氣流係自該等通孔流入該容置空間中， 並從該第一對流孔進入該中空筒柱内部，再沿著該中空 筒柱而從該第二對流孔導出，最後往該等散熱孔逸散。 [0012] 本創作之另一目的，在於提供一種可加速熱對流效應之 散熱結構，係於中空筒柱的相對侧分別開設有對流孔， 以加速中空筒柱内部氣流的流動速率，提高散熱體的散 熱效率。 [0013] 相較於習知技術，本創作係在中空筒柱的相對侧分別開 設有第一對流孔及第二對流孔，以利於一部份的外部氣 表單編號A0101 第4頁/共16頁 M421454 100年.09月办日修正_頁 流從第一對流孔進入中空筒柱内部，同時帶走發熱元件 的部分熱氣，由於熱氣係沿著中空筒柱上昇，最後從該 第二對流孔導出，因中空筒柱的内部氣流會因熱空氣的 逸散而造成流動，進而抽入外部空氣填補，進而令該中 空筒柱内部的對流加速，從而帶走該散熱體大量的熱， 據此降低發熱元件的溫度，以避免產生熱聚集的現象， 防止降低電子元件的使用壽命，增加本創作之實用性。 【實施方式】[0011] wherein the external airflow flows into the accommodating space from the through holes, and enters the inside of the hollow cylinder from the first convection hole, and from the second convection hole along the hollow cylinder Export and finally escape to the vents. [0012] Another object of the present invention is to provide a heat dissipation structure capable of accelerating the heat convection effect, wherein convection holes are respectively formed on opposite sides of the hollow cylinder column to accelerate the flow rate of the airflow inside the hollow cylinder column, and improve the heat dissipation body. Cooling efficiency. [0013] Compared with the prior art, the present invention has a first convection hole and a second convection hole respectively on opposite sides of the hollow cylinder to facilitate a part of the external gas form number A0101. Page M421454 100 years. September, the day of the correction _ page flow from the first convection hole into the hollow cylinder column, while taking away part of the hot gas of the heating element, because the hot gas rises along the hollow cylinder column, and finally from the second convection hole Derived, because the internal airflow of the hollow cylinder will flow due to the escape of hot air, and then the external air is drawn to fill, thereby accelerating the convection inside the hollow cylinder, thereby taking away a large amount of heat of the radiator. Reduce the temperature of the heating element to avoid the phenomenon of heat accumulation, prevent the life of the electronic component from being lowered, and increase the practicality of the creation. [Embodiment]
[0014] 有關本創作之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 [0015] 請參照第一圖至第三圖，係分別為本創作可加速熱對流 效應之散熱結構的立體外觀示意圖、立體分解圖及組合 剖視圖；本創作之可加速熱對流效應之散熱結構係用以 導引一外部氣流而對一發熱元件80進行散熱，該散熱結 構包括一座體10、一散熱體20及一罩蓋30。[0014] The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and description, and are not intended to limit the present invention. [0015] Please refer to the first to third figures, which are respectively a three-dimensional appearance diagram, a three-dimensional exploded view and a combined sectional view of the heat dissipation structure capable of accelerating the heat convection effect; the heat dissipation structure system capable of accelerating the heat convection effect of the present invention The heat dissipation structure includes a body 10, a heat sink 20 and a cover 30 for guiding an external airflow to dissipate heat.
[0016] 該座體10具有可容置該發熱元件80的一容置空間100，該 座體10的一侧為一開口 11，另一側開設有複數散熱孔12 。本實施例中，該發熱元件80為一LED燈組，該發熱元件 80包含一電路板81及電性連接該電路板81的複數LED 82 。又，該座體10為呈碗形的一燈罩，該燈罩更包含有一 導電接頭13，該導電接頭13係結合在該座體10的外側端 ，且其端面成型有複數定位柱131，該電路板81則對應該 些定位柱131而設有複數穿孔810。此外，該LED燈組的 外側更包括有一透光鏡83，以利於發散該等LED所發出的 表單編號A0101 第5頁/共16頁 M421454 100年.09月07日核正替换頁 光0 [0017] 該散熱體20設置在該容置空間100中，並熱導接該發熱元 件80。該散熱體20包含一中空筒柱21及間隔排列在該中 空筒柱21之外緣面的多數個散熱片22，任二散熱片22間 形成有一散熱通道220，該等散熱通道220係對應該等散 熱孔12配設。 [0018] 該中空筒柱21的一側設有至少一第一對流孔211，另一側 則設有至少一第二對流孔212，該第一對流孔211及該第 二對流孔212係分別開設在該中空筒柱21的端面，並朝彼 此接近的方向延伸有一段距離。另外，該第一對流孔211 及該第二對流孔212可呈錯位設置，但不以此為限。 [0019] 該罩蓋30係蓋合在該座體10的開口 11上，且開設有複數 通孔31。該罩蓋30對應該LED燈組而設有一容置孔300， 該等通孔31係環設在該容置孔300的外側，且該透光鏡83 係結合在容置孔300中。 [0020] 該散熱結構更包括有一散熱板40，其為一導熱性佳的金 屬片所構成，本實施例中，該散熱板40呈圓狀，並在外 侧環設有複數開孔400。該散熱板40的一側貼接在該散熱 .體20上，另一側則承接有該發熱元件80 ;此外，該散熱 板40對應該導電接頭13的定位柱131而設有複數結合孔 401 ° [0021] 組設時，首先將該座體10(燈罩）放置在該導電接頭13上 ，並依序將該散熱體20、該散熱板40及該發熱元件80容 置在該座體10的容置空間100中。該散熱結構更包括有複 表單編號A0101The housing 10 has an accommodating space 100 for accommodating the heating element 80. One side of the housing 10 is an opening 11, and the other side is provided with a plurality of heat dissipation holes 12. In this embodiment, the heating element 80 is an LED lamp group. The heating element 80 includes a circuit board 81 and a plurality of LEDs 82 electrically connected to the circuit board 81. Moreover, the base 10 is a lampshade having a bowl shape, and the lamp cover further includes a conductive joint 13 coupled to the outer end of the base 10 and having a plurality of positioning posts 131 formed on the end surface thereof. The plate 81 is provided with a plurality of perforations 810 corresponding to the positioning posts 131. In addition, the outer side of the LED lamp group further includes a light transmissive mirror 83 to facilitate the divergence of the form number A0101 issued by the LEDs. Page 5 of 16 M421454 100 years. September 07 nuclear replacement page light 0 [ The heat dissipating body 20 is disposed in the accommodating space 100 and thermally connects the heat generating component 80. The heat dissipating body 20 includes a hollow cylinder 21 and a plurality of fins 22 spaced apart from each other on the outer peripheral surface of the hollow cylinder 21. A heat dissipating channel 220 is formed between the two fins 22, and the heat dissipating passages 220 are corresponding to each other. The heat dissipation holes 12 are arranged. [0018] The hollow tubular column 21 is provided with at least one first convection hole 211, and the other side is provided with at least one second convection hole 212. The first convection hole 211 and the second convection hole 212 are respectively The end faces of the hollow cylinders 21 are opened and extend a distance toward each other. In addition, the first convection hole 211 and the second convection hole 212 may be arranged in a dislocation manner, but not limited thereto. [0019] The cover 30 is attached to the opening 11 of the base 10, and a plurality of through holes 31 are opened. The cover 30 is provided with a receiving hole 300 corresponding to the LED lamp set. The through hole 31 is annularly disposed outside the receiving hole 300, and the transparent mirror 83 is coupled in the receiving hole 300. The heat dissipation structure further includes a heat dissipation plate 40 which is formed of a metal sheet having good thermal conductivity. In the embodiment, the heat dissipation plate 40 has a circular shape, and a plurality of openings 400 are provided in the outer ring. One side of the heat dissipation plate 40 is attached to the heat dissipation body 20, and the other side receives the heat generating component 80. Further, the heat dissipation plate 40 is provided with a plurality of coupling holes 401 corresponding to the positioning post 131 of the conductive joint 13. [0021] When the assembly is set, the base 10 (light cover) is first placed on the conductive joint 13 , and the heat sink 20 , the heat dissipation plate 40 and the heat generating component 80 are sequentially accommodated in the base 10 . The accommodation space is 100. The heat dissipation structure further includes a complex form number A0101
第6頁/共16頁 M421454 100年.091.07白梭正替Θ頁 數鎖合元件50，該等鎖合元件50分別穿設該散熱板40的 結合孔401及該電路板81的穿孔810後，再鎖固在該導電 接頭13的定位柱131上，藉以將該散熱板40及該發熱元件 80(LED燈組）固定在該座體10(燈座）上，最後再將結合 有透光鏡83的罩蓋30罩蓋在該座體10的開口 11上，以構 成一 LED燈具。 [0022] 請續參照第四圖，係為本創作可加速熱對流效應之散熱 結構的使用示意圖；該LED燈具使用時，該等LED82發光 時所產生的熱係經由該散熱板40而傳導至該散熱體20 ; 另一方面，外部氣流自該罩蓋30的通孔31處流入該座體 10的容置空間中，其中，一部份的氣流會從該第一對流 孔211進入該中空筒柱21内部，同時帶走該發熱元件80的 部分熱氣，再沿著該中空筒枉21上昇，最後從該第二對 流孔212導出，最後往該等散熱孔12逸散；此時，該中空 筒柱21内部的氣流會因熱空氣的逸散而造成流動，進而 抽入外部空氣填補，進而令該中空筒柱21内部的對流加 速，從而帶走該散熱體20大量的熱，據此降低該發熱元 件80的溫度。 [0023] 請再參照第五圖，係為本創作可加速熱對流效應之散熱 結構的第二實施例；本實施例與第一實施例大致相同， 與第一實施例不同之處在於中空筒柱21 a所開設的第一對 流孔211a及第二對流孔212a的態樣，本實施例中，該第 一對流孔211 a及該第二對流孔212 a係分別開設在該中空 筒柱21a的外緣面，並距離該中空筒柱21a的端面有一段 距離》 表單編號A0101 第7頁/共16頁 M421454 [0024] [0025] [0026] [0027] [0028] [0029] [0030] [0031] [0032] [0033] [0034] [0035] [0036] 100年.09月07日修正替換頁 以上所述僅為本創作之較佳實施例，非用以限定本創作 之專利範圍，其他運用本創作之專利精神之等效變化， 均應倶屬本創作之專利範圍。 【圖式簡單說明】 第一圖係為本創作可加速熱對流效應之散熱結構的立體 外觀示意圖； 第二圖係為本創作可加速熱對流效應之散熱結構的立體 分解圖； 第三圖係本創作可加速熱對流效應之散熱結構的組合剖 視圖； 第四圖係本創作可加速熱對流效應之散熱結構的使用示 意圖； 第五圖係本創作可加速熱對流效應之散熱結構的第二實 施例。 【主要元件符號說明】 10座體 100容置空間 11開口 12散熱孔 13導電接頭 1 31定位柱 20散熱體 表單編號A0101 第8頁/共16頁Page 6 of 16 M421454 100.091.07 White Shuttle is the replacement of the number of the locking elements 50. The locking elements 50 are respectively inserted through the coupling holes 401 of the heat dissipation plate 40 and the through holes 810 of the circuit board 81. And then locked on the positioning post 131 of the conductive joint 13, thereby fixing the heat dissipation plate 40 and the heating element 80 (LED lamp group) on the base 10 (lamp holder), and finally combining the light transmission A cover 30 of the mirror 83 is placed over the opening 11 of the base 10 to form an LED luminaire. [0022] Please continue to refer to the fourth figure, which is a schematic diagram of the use of the heat dissipation structure capable of accelerating the heat convection effect; when the LED lamp is used, the heat generated when the LEDs 82 emit light is transmitted to the heat dissipation plate 40 through the heat dissipation plate 40. The heat sink 20; on the other hand, the external airflow flows into the accommodating space of the base 10 from the through hole 31 of the cover 30, wherein a part of the airflow enters the hollow from the first convection hole 211. Inside the column 21, a part of the hot gas of the heating element 80 is taken away, then rises along the hollow tube 21, finally is led out from the second convection hole 212, and finally escapes to the heat dissipation holes 12; The airflow inside the hollow cylinder 21 is caused to flow due to the escape of the hot air, and is then drawn into the external air to be filled, thereby accelerating the convection inside the hollow cylinder 21, thereby taking away a large amount of heat of the radiator 20, according to which The temperature of the heat generating component 80 is lowered. [0023] Please refer to the fifth figure again, which is a second embodiment of the heat dissipation structure capable of accelerating the heat convection effect; the embodiment is substantially the same as the first embodiment, and the difference from the first embodiment is the hollow cylinder. In the embodiment, the first convection hole 211 a and the second convection hole 212 a are respectively opened in the hollow cylinder 21a. The first convection hole 211 a and the second convection hole 212 a are respectively opened in the column 21 a. The outer peripheral surface is at a distance from the end surface of the hollow cylinder 21a. Form No. A0101 Page 7 of 16 M421454 [0024] [0028] [0028] [0030] [0036] [0036] [0036] [0036] 100 years. September 07, revised replacement page, described above, is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention. Other equivalent changes in the patent spirit of this creation shall belong to the scope of the patent of this creation. [Simple diagram of the diagram] The first diagram is a three-dimensional view of the heat dissipation structure that can accelerate the heat convection effect; the second diagram is a three-dimensional exploded view of the heat dissipation structure that can accelerate the heat convection effect; This creation can accelerate the combined heat dissipation structure of the heat convection effect; the fourth picture is a schematic diagram of the use of the heat dissipation structure that can accelerate the heat convection effect; the fifth picture is the second implementation of the heat dissipation structure that can accelerate the heat convection effect example. [Main component symbol description] 10 seat body 100 accommodation space 11 opening 12 heat dissipation hole 13 conductive joint 1 31 positioning post 20 heat sink Form No. A0101 Page 8 of 16
M4214.54 .100年.09月07日修正替#頁 [0037] 21中空筒柱 [0038] 211第一對流孔 [0039] 212第二對流孔 [0040] 22散熱片 [0041] 220散熱通道 [0042] 30罩蓋 [0043] 1 [0044] 300容置孔 31通孔 [0045] 40散熱板 [0046] 400開孔 [0047] 401結合孔 [0048] 50鎖合元件 [0049] 血 80發熱元件 W [0050] 81電路板 [0051] 81 0穿孔 [0052] 82LED [0053] 8 3透光鏡 [0054] 21a中空筒柱 [0055] 21 la第一對流孔 [0056] 212a第二對流孔 表單编號A0101 第9頁/共16頁M4214.54 .100年.09月07日修正替#页[0037] 21 hollow cylinder [0038] 211 first convection hole [0039] 212 second convection hole [0040] 22 heat sink [0041] 220 heat dissipation channel [0042] 30 cover [0043] 1 [0044] 300 accommodating hole 31 through hole [0045] 40 heat sink [0046] 400 opening [0047] 401 bonding hole [0048] 50 locking element [0049] blood 80 Heating element W [0050] 81 circuit board [0051] 81 0 perforation [0052] 82 LED [0053] 8 3 light transmission mirror [0054] 21a hollow cylinder column [0055] 21 la first convection hole [0056] 212a second convection Hole Form No. A0101 Page 9 of 16