JP5887533B2 - Recessed lighting fixture - Google Patents

Description

  The present invention relates to an embedded lighting fixture that is embedded in an embedded hole of a ceiling material.

  2. Description of the Related Art Conventionally, an embedded luminaire such as a downlight in which a luminaire body is embedded in an embedded hole in a ceiling material has been used. For example, when an embedded lighting fixture is embedded in a ceiling, it may be difficult to replace a light source such as a fluorescent lamp or an incandescent lamp from below the ceiling. Therefore, it is conceivable to use a light emitting diode (LED), which is a semiconductor light emitting element having characteristics such as low power consumption and long life, instead of a fluorescent lamp or an incandescent lamp as a light source for an embedded lighting fixture.

  Here, the LED has a characteristic that the temperature rises due to self-heating due to lighting, and the lifetime is shortened due to thermal deterioration when the semiconductor pn junction exceeds the maximum operating temperature rating (for example, about 120 ° C.). ing. Further, the LED has a characteristic that the light emission efficiency decreases as the temperature rises. Therefore, it is more important to ensure the heat dissipation of the light source in the embedded lighting fixture using the LED as the light source, as compared with the one using a fluorescent lamp or an incandescent lamp as the light source.

  As an embedded luminaire using an LED as a light source, for example, it is conceivable to have a structure including a luminaire main body that houses an LED therein and a heat radiation fin that radiates heat from the LED to the outside. The embedded luminaire can radiate heat from the radiating fins of the luminaire main body to the back side of the ceiling.

  The lighting fixture is embedded in the ceiling of the system. The light fixture is thermally coupled to the lighting fixture body, and the side plate of the lighting fixture main body is brought into close contact with the abutting portion of the ceiling bar. A device in which the main body and the ceiling bar are thermally coupled is also known (for example, Patent Document 1).

  In the lighting fixture of patent document 1, it is supposed that the heat emitted from a light emitting diode can be conducted from the lighting fixture body to the ceiling bar to improve heat dissipation. In addition, since the luminaire radiates heat from the ceiling bar for embedding and arranging the luminaire main body in the ceiling, a large radiating fin is provided on the luminaire main body, or a small radiating fin is provided on the luminaire main body. There is no need to provide many.

  However, the luminaire of Patent Document 1 uses a system ceiling including a ceiling bar, and is not an embedded luminaire that is embedded and installed in an embedding hole of a ceiling material in a building such as a general house. .

JP 2010-118189 A

  By the way, in recent buildings, in order to achieve high airtightness and high heat insulation, and to suppress the release of warm air and cold air inside the building to the outside, those with a heat insulating structure with a heat insulating material on the back side of the ceiling are increasing. . When the embedded luminaire is embedded in a ceiling material embedding hole in a building having a heat insulating structure, the heat insulating material provided on the back side of the ceiling covers the luminaire main body. The embedded luminaire has a problem that heat radiated from the luminaire main body is shielded by a heat insulating material and it is difficult to ensure heat dissipation.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide an embedded lighting apparatus capable of ensuring higher heat dissipation even when installed in a building having a heat insulating structure. .

An embedded luminaire of the present invention includes a luminaire main body embedded in an embedding hole of a ceiling material, a light source unit provided in the luminaire main body and provided with a semiconductor light emitting element, and a separate body from the luminaire main body. A heat dissipating member that can be disposed between a ceiling back surface side of the ceiling material and a heat insulating material provided on the ceiling back surface side, and connecting the luminaire main body side and the heat dissipating member to heat the light source unit. A heat transfer material that transfers heat to the heat radiating member, and the heat radiating member includes a heat radiating sheet that is in contact with the ceiling material and can radiate the heat of the heat radiating member .

  In the embedded lighting fixture, the heat transfer material preferably has flexibility.

  The embedded luminaire of the present invention has an effect that it is possible to ensure higher heat dissipation even when installed in a building having a heat insulating structure.

FIG. 3 is a partial cross-sectional explanatory view illustrating the embedded lighting fixture of the first embodiment. FIG. 3 is a schematic plan view showing a usage state of the embedded lighting fixture of the first embodiment. 6 is a graph showing the temperature of the light source unit with respect to the surface area of the heat dissipation member in the embedded lighting fixture of Embodiment 1. It is a fragmentary sectional explanatory view explaining the embedded lighting fixture of a comparative example. It is a partial cross-sectional explanatory drawing explaining the embedded type lighting fixture of Embodiment 2. FIG. It is a partial cross-sectional explanatory drawing explaining the embedded type lighting fixture of Embodiment 3. FIG.

(Embodiment 1)
The embedded lighting fixture 10 of this embodiment is demonstrated using FIG. 1 thru | or FIG. The embedded lighting fixture 10 of this embodiment will be described with reference to FIG. 1, and the configuration of the embedded lighting fixture 10 will be described. With reference to FIG. 2, the embedded lighting fixture 10 viewed from the ceiling back surface c <b> 2 side. explain. Moreover, the characteristic of the principal part of the embedded lighting fixture 10 of this embodiment is demonstrated using FIG. In addition, in the figure, the same code | symbol is attached | subjected to the same component. Moreover, in FIG. 2, the heat insulating material I of FIG. 1 is omitted.

  As shown in FIGS. 1 and 2, the embedded lighting fixture 10 of the present embodiment includes a lighting fixture main body 2 that is embedded in an embedding hole c <b> 1 of the ceiling material C, and a semiconductor light emitting device provided in the lighting fixture main body 2. And a light source unit 1 including an element. In particular, the embedded lighting device 10 of the present embodiment can be disposed between the ceiling back surface c2 side of the ceiling material C and the heat insulating material I provided on the ceiling back surface c2 side separately from the lighting device body 2. The heat radiating member 3, the luminaire main body 2 side, and the heat radiating member 3 are connected to each other, and the heat transfer material 4 that transfers heat of the light source unit 1 to the heat radiating member 3 is provided.

  Thereby, the embedded lighting fixture 10 of this embodiment can ensure higher heat dissipation even when it is installed in a building having a heat insulating structure.

  More specifically, the embedded lighting fixture 10 of the present embodiment includes a lighting fixture body 2 whose outer shape is a bottomed cylindrical shape. The luminaire body 2 includes a bottomed cylindrical portion 2a and a flange portion 2b that protrudes outward from the opening end of the cylindrical portion 2a. The luminaire main body 2 has a cylindrical portion 2a embedded in an embedded hole c1 penetrating the ceiling material C, and the flange 2b and the ceiling material C are brought into contact with each other. The luminaire main body 2 may be embedded and arranged on the ceiling material C side with the ceiling material C sandwiched between a mounting leaf spring (not shown) provided on the luminaire main body 2 and the flange portion 2b. However, it may be embedded in the ceiling material C using a fixing screw or the like.

  Moreover, the lighting fixture main body 2 arrange | positions the light source part 1 whose outer shape is a disk shape on the inner bottom face of the cylindrical part 2a. The light source unit 1 includes a bottomed cylindrical outer shell portion 1b formed of a material having excellent thermal conductivity (for example, aluminum, copper, stainless steel, etc.) and a translucent light provided at the center of the outer shell portion 1b. The cover part 1a is provided. The light source unit 1 includes a plurality of LEDs (not shown) that are semiconductor light emitting elements inside the outer shell 1b and the cover 1a. The cover part 1a is attached to the outer shell part 1b so as to cover the LED. The cover unit 1a is provided in the light source unit 1 and can emit light emitted from the LEDs to the outside. The light source unit 1 fixes the outer shell 1b of the light source unit 1 to the luminaire main body 2 side by an assembly screw (not shown).

  In addition, the light source part 1 has led out a pair of electric wire (not shown) electrically connected with LED from the surrounding part of the outer shell part 1b. The electric wire is configured to be electrically connectable to the outside through a through hole (not shown) formed through the lighting fixture body 2.

  The embedded luminaire 10 suitably includes a lighting control unit (not shown) in order to control the power supplied from the outside and supply it to the light source unit 1. What is necessary is just to comprise a lighting control part suitably using an AC-DC converter, a current limiting resistor, etc., for example so that the alternating current supplied from an external commercial alternating current power supply may become a thing suitable for lighting of LED.

  The embedded luminaire 10 of the present embodiment is generated at the light source unit 1 outside the luminaire main body 2 corresponding to the light source unit 1 on the upper side (on the paper surface of FIG. 1) of the luminaire main body 2. A heat transfer plate 6 for transferring heat is suitably provided. The heat transfer plate 6 is formed in a flat plate having a rectangular shape in plan view (see FIG. 2). The heat transfer plate 6 is made of a material having excellent thermal conductivity (for example, aluminum, copper, stainless steel, etc.). Moreover, the embedded lighting fixture 10 of this embodiment is provided with the heat radiating member 3 having a rectangular shape in plan view separately from the lighting fixture body 2. The heat radiating member 3 is made of a material having excellent thermal conductivity (for example, aluminum, copper, stainless steel, etc.). The heat radiating member 3 is formed in a flat plate shape so as to be easily inserted between the ceiling back surface c2 side of the ceiling material C and the heat insulating material I provided on the ceiling back surface c2 side. Further, the flat plate-like heat radiating member 3 is long and has a width smaller than the diameter of the ceiling material C so as to be easily inserted into the embedding hole c1 of the ceiling material C while ensuring higher heat dissipation. It is said. In the embedded lighting fixture 10 of the present embodiment, the heat dissipating member 3 is disposed in contact with the ceiling back surface c2 that is separated from the embedding hole c1 in the vicinity of the embedding hole c1 of the ceiling material C in which the lighting fixture body 2 is embedded. ing.

  The embedded luminaire 10 of the present embodiment thermally connects the heat transfer plate 6 to which heat from the light source unit 1 is transferred and the heat radiating member 3 with a heat pipe as a heat transfer material 4. The heat transfer material 4 is composed of, for example, a round heat pipe having an outer diameter of 6 mm. The heat transfer plate 6 and the heat radiating member 3 are thermally connected to cause the heat generated in the light source unit 1 to the heat radiating member 3 side. Conducts heat. Thereby, the embedded lighting fixture 10 can radiate the heat of the light source unit 1 through the lighting fixture body 2, the heat transfer plate 6, the heat transfer material 4, the heat radiating member 3, and the ceiling material C in order. (See the dashed line arrow in FIG. 1).

  Here, the embedded lighting fixture 10 of this embodiment and the embedded lighting fixture 11 of the comparative example shown in FIG. 4 will be compared and described.

  The embedded lighting device 11 of the comparative example has substantially the same configuration as the embedded lighting device 10 of the present embodiment, and instead of including the heat transfer plate 6, the heat transfer material 4, and the heat dissipation member 3, heat dissipation. The portion 2e is provided integrally with the lighting fixture body 2. The heat dissipating part 2e has a shape in which heat dissipating fins 2e1 made of a plurality of metal plates are radially arranged in a plan view (not shown). The embedded luminaire 11 is configured to be able to radiate heat generated in the light source unit 1 to the outside through the radiating fins 2e1 of the radiating unit 2e.

However, in the embedded luminaire 11 of the comparative example, when the heat insulating material I covers the luminaire main body 2, the air around the luminaire main body 2 is trapped between the ceiling material C and the heat insulating material I. Therefore, the embedded luminaire 11 of the comparative example only radiates the heat from the radiation fins 2e1 to the ceiling material C side. Implantable luminaire 11, because they are also limited size dimension of the embedding hole c1, by increasing the height of the luminaire body 2 heat dissipation of the illuminating tool body 2 in order to ensure the ceiling The space B between the material C and the heat insulating material I must be enlarged to secure the volume of the space for heat dissipation. Therefore, the embedded luminaire 11 tends to have a large height of the luminaire main body 2 and the entire embedded luminaire 11 becomes larger. In addition, the embedded illumination fixture 11 radiates heat from the light source part 1 from the radiation fins 2e1 of the radiation part 2e formed by aluminum die casting or the like. There is also an adverse effect that it becomes difficult to embed the instrument body 2. Furthermore, in the embedded lighting fixture 11 of the comparative example, when heat radiation from the heat radiation fins 2e1 is insufficient, it may be necessary to take measures such as cutting out the heat insulating material I.

  By the way, there are various types of heat insulating materials I applied to the ceiling material C, such as fiber heat insulating materials obtained by processing glass fibers, wood fibers and minerals into fibers, and foamed plastic heat insulating materials. In the embedded lighting device 11 of the comparative example, the overall height of the embedded lighting device 11 is high. Therefore, the embedded lighting fixture 11 damages the heat insulating material I provided in advance on the ceiling back surface c2 side when the lighting fixture body 2 including the heat radiating portion 2e is embedded in the embedding hole c1 of the ceiling material C. there is a possibility. When the heat insulating material I is torn or damaged, the heat insulating effect of the building may be lowered.

Comparative In contrast, implantable luminaire 10 of the present embodiment, since it has a luminaire body 2 a heat radiating member 3 which is disposed separately, implantable luminaire 11 shown in FIG. 4 Thus, the overall height of the lighting fixture body 2 can be reduced and made thinner.

  The embedded luminaire 10 of the present embodiment installs the embedded luminaire 11 of the comparative example even when the heat insulating material I is installed in a building having a heat insulating structure arranged on the ceiling back surface c2 side of the ceiling material C. Compared to the case, the gap A between the ceiling material C and the heat insulating material I can be made smaller than the gap B of the comparative example. Therefore, the embedded luminaire 10 can suppress damage to the heat insulating material I. In the embedded lighting fixture 10 of the present embodiment, it is not necessary to take measures such as cutting out the portion of the heat insulating material I covering the lighting fixture body 2 in order to ensure heat dissipation. Therefore, in the embedded lighting fixture 10 of the present embodiment, it is possible to ensure higher heat dissipation even when installed in a building with a heat insulating structure without hindering high airtightness and high heat insulation of the building. Become.

  Next, in the embedded lighting fixture 10 of the present embodiment, with respect to the surface area (S) of the heat radiating member 3 in which the heat radiating member 3 is in contact with the ceiling material C with the heat insulating material I covered on the upper surface of the luminaire main body 2. The temperature (Tc) of the light source unit 1 is shown in FIG. The embedded lighting fixture 10 uses a lighting fixture body 2 having a diameter of 150 mm, and the input power to the light source unit 1 is 7W.

The embedded lighting fixture 10 of this embodiment radiates the heat generated in the light source unit 1 from the heat radiating member 3 to the ceiling material C via the heat transfer plate 6 and the heat transfer material 4. FIG. 3 shows an embedded luminaire 10 in which the heat radiating member 3 to be brought into contact with the ceiling back surface c2 is not provided and an embedded luminaire 10 in which three types of heat radiating members 3 having different surface areas are brought into contact with the ceiling back surface c2. . In addition, the thermal radiation member 3 with the largest surface area which contacts the ceiling back surface c2 is 19,600 mm < ² > (for example, 140 mm long x 140 mm wide). As can be seen from FIG. 3, in the embedded lighting fixture, when the heat radiating member 3 is not provided, the temperature of the light source unit 1 is about 60 ° C. under the condition of room temperature (25 ° C.). In the embedded lighting fixture 10 of this embodiment, in the case of the heat radiating member 3 having the largest surface area, the temperature of the light source unit 1 is 52.6 ° C. That is, the embedded lighting fixture 10 of this embodiment can reduce the temperature of about 7.4 ° C. as compared with the embedded lighting fixture that does not have the heat radiating member 3 that is in contact with the ceiling back surface c2. It becomes.

  Hereinafter, each structure of the embedded lighting fixture 10 of this embodiment is demonstrated.

  The light source unit 1 can irradiate illumination light with electric power from an external commercial AC power source or the like. As the light source unit 1, for example, one having a plurality of LEDs, which are semiconductor light-emitting elements that are electrically connected and mounted on a wiring pattern (not shown) on a mounting board using a printed wiring board, is used. it can.

  The light source unit 1 can be configured by including an outer shell portion 1b formed of a material having excellent thermal conductivity and a translucent cover portion 1a provided at the center of the outer shell portion 1b.

  Even if the cover part 1a forms the site | part which radiate | emits the light from LED in appropriate shapes, such as a convex lens shape, a prism shape, and a plano-convex lens shape, it may have the lens effect which makes the light from LED predetermined light distribution. It may be a flat plate. As a material constituting the cover portion 1a, a translucent resin material such as acrylic resin or silicone resin or glass can be used as a translucent material capable of emitting light emitted from the LED to the outside.

  The outer shell portion 1b can be made of, for example, an aluminum die cast structure that accommodates a mounting substrate on which LEDs are mounted. The outer shell portion 1b is not limited to aluminum but may be formed of a metal such as copper or stainless steel as a material having higher thermal conductivity than the resin. In the embedded lighting fixture 10 of the present embodiment, the heat radiating member 3 that radiates heat generated by the LEDs and the light source unit 1 are configured separately. Therefore, the light source part 1 does not necessarily need to use the outer shell part 1b made of aluminum die cast, and a part of the outer shell part 1b may be formed by molding a resin. Further, the light source unit 1 may use only a plate-shaped mounting board itself that has excellent thermal conductivity and can form a wiring pattern or the like, on which LEDs are mounted.

  In the embedded lighting device 10 of the present embodiment, the shape of the light source unit 1 in plan view is circular, but is not limited thereto, and may be, for example, a polygonal shape or an elliptical shape. .

  The light source unit 1 may be electrically connected to a lighting control unit provided in the luminaire body 2 using an electric wire (not shown). Note that the lighting control unit can be appropriately mechanically fixed to the luminaire body 2 by a screw (not shown) or the like.

  Although not shown, the light source unit 1 includes a pair of electric wires that are electrically connected to the LEDs so that the LEDs can be externally fed to emit light. The plurality of LEDs are electrically connected in series by a wiring pattern (not shown) or the like on one surface side of the mounting substrate. The plurality of LEDs are not limited to those connected in series electrically, but may be connected in parallel or may be connected in series-parallel. The plurality of LEDs on the one surface side of the mounting substrate can be appropriately arranged in a matrix shape or a staggered shape in plan view.

  For example, when a ceramic substrate is used as the mounting substrate, it is possible to thermally diffuse the heat generated by the LED through the ceramic substrate. For example, an LED chip or an LD (Laser Diode) element may be used as the semiconductor light emitting element. The light source unit 1 can be configured not only with a plurality of semiconductor light emitting elements, but also with a single semiconductor light emitting element. Similarly, the light source unit 1 may be configured to include not only one type of semiconductor light emitting device but also different types of semiconductor light emitting devices.

  Further, as the light source unit 1, for example, an LED chip that emits blue light or ultraviolet light, and a particulate phosphor that emits light having a longer wavelength when excited by light energy emitted from the LED chip (for example, blue light) A phosphor that emits yellow light having a broad emission wavelength range excited by UV, and three types of phosphors that can emit blue, green, and red when excited by ultraviolet light). The provided LED can be used. Thereby, the light source part 1 can irradiate mixed color light, such as white light.

  Although the structure of the LED is not shown, for example, an LED chip mounted on the surface side of the package substrate, and a dome-shaped translucent material (for example, silicone resin, epoxy resin, glass, etc.) surrounding the LED chip on the surface side ), A translucent sealing portion that seals the LED chip inside the shell portion, and a shell that covers the shell portion from the front surface side of the package substrate and is emitted from the LED chip to the shell. It is possible to use one provided with a dome-shaped color conversion member containing a phosphor that is excited by light transmitted through the portion and emits light of a color different from that of the LED chip. The LED can also be formed with an air layer between the color conversion member and the shell.

Here, the LED uses, for example, an LED chip that emits blue light and a color conversion member in which a fluorescent material that absorbs blue light and emits yellow light that is complementary color is contained in a translucent material. Thus, white light can be obtained. As the LED chip, for example, a light emitting layer using a gallium nitride compound semiconductor such as InGaN that has a pn junction and can emit desired light such as blue light can be used. The phosphor is, for example, a silicate-based phosphor doped with rare earth such as (Sr, Ba) ₂ SiO ₄ activated with Eu, Y ₃ Al ₅ O ₁₂ activated with Ce, or Ce. Examples thereof include aluminate-based phosphors doped with rare earth such as activated Tb ₃ Al ₅ O ₁₂ . The LED is a translucent member that does not contain a phosphor instead of using a color conversion member, and covers a red LED chip that emits red light, a green LED chip that emits green light, and a blue LED chip that emits blue light. As a structure, it can also be set as the structure which light-emits white light.

  The luminaire main body 2 accommodates the light source unit 1 therein and can be embedded in the embedded hole c1 of the ceiling material C. In order to ensure heat dissipation, the luminaire main body 2 used in the embedded luminaire 10 of the present embodiment is a large-sized radiant part 2e, as in the embedded luminaire 11 of the comparative example shown in FIG. There is no need to form by aluminum die casting. Moreover, since the embedded lighting fixture 10 of this embodiment dissipates the heat which generate | occur | produced in the light source part 1 from the heat radiating member 3 to the ceiling material C side via the heat-transfer plate 6 and the heat-transfer material 4, it is not necessarily a lighting fixture. It is not necessary to form the entire main body 2 with a material excellent in heat dissipation. Accordingly, the embedded lighting fixture 10 of the present embodiment uses a molded product formed of a resin material as a part of the lighting fixture body 2, for example, so that the lighting fixture body 2 can be easily formed and the manufacturing cost can be reduced. Reduction can also be achieved. The lighting fixture body 2 is formed in a bottomed cylindrical shape so that the outer shape of the light source unit 1 having a disk shape can be stored and held, but is not limited to the shape of a bottomed cylindrical shape, and can be used as desired. An appropriate shape may be used.

  Next, the heat dissipating member 3 is provided separately from the luminaire main body 2 and can dissipate heat from the light source unit 1 that is heat-transmitted through the heat transfer material 4 or the like. In other words, the embedded lighting fixture 10 of the present embodiment separates the function of the lighting fixture body 2 from housing the light source unit 1 and the function of dissipating the heat generated by the light source unit 1, and the lighting fixture body 2. The heat dissipating member 3 that is spatially separated from each other mainly has a function of dissipating heat from the light source unit 1. Thereby, the embedded lighting fixture 10 of the present embodiment can efficiently transfer heat from the light source unit 1 to the ceiling material C side via the heat transfer material 4 and the like. Moreover, the embedded lighting fixture 10 of this embodiment can also make it easy to insert the heat radiating member 3 provided separately from the lighting fixture main body 2 between the ceiling material C and the heat insulating material I. . The embedded lighting fixture 10 of the present embodiment radiates heat between the heat insulating material I and the ceiling material C, which are preliminarily constructed on the ceiling back surface c2 side of the ceiling material C, from the embedded hole c1 provided in the ceiling material C. The member 3 is disposed. Although not shown in the figure, the heat dissipating member 3 may have a pointed tip so that the heat dissipating member 3 can be easily inserted between the heat insulating material I and the ceiling material C that are preliminarily constructed on the ceiling back surface c2 side of the ceiling material C. .

  The heat radiating member 3 can be formed using, for example, aluminum, copper, or stainless steel as the material of the heat radiating member 3. The heat radiating member 3 is formed in a long rectangular shape along the longitudinal direction of the heat pipe which is the heat transfer material 4 in a plan view, and is easily fixed to the heat pipe. Note that the heat dissipation member 3 is not limited to a long rectangular shape in plan view, and may be various shapes such as a triangle, a square, a circle, and an ellipse as desired.

  The heat transfer material 4 thermally transfers the heat from the light source unit 1 to the heat radiating member 3 by thermally connecting the luminaire main body 2 side and the heat radiating member 3 provided separately from the luminaire main body 2. Is. As the heat transfer material 4, aluminum, copper, brass, stainless steel, or the like can be used as the material of the heat transfer material 4 having excellent thermal conductivity. The heat transfer material 4 can be formed of, for example, a long metal material, but a heat pipe is used to efficiently transfer the heat of the light source unit 1 from the lighting fixture body 2 side to the heat radiating member 3. It is preferable. The heat pipe is a heat transport element that uses latent heat of evaporation and condensation of a working fluid (for example, pure water) accommodated therein, and can transport larger heat even with a relatively small temperature difference.

  The heat pipe has a structure in which a small amount of hydraulic fluid is vacuum sealed inside a sealed pipe and a capillary structure is provided on the inner wall of the pipe. In the heat pipe, when the lighting fixture main body 2 side is heated by the heat from the light source unit 1, the working fluid absorbs the latent heat of evaporation and evaporates. In the heat pipe, the evaporated working fluid moves to the heat radiating member 3 side, which is lower in temperature than the luminaire main body 2 side, and condenses by releasing the latent heat of evaporation on the heat radiating member 3 side. In the heat pipe, the condensed working fluid flows back from the heat radiating member 3 side to the lighting fixture main body 2 side by a capillary phenomenon. The heat pipe allows heat from the light source unit 1 to be transferred to the heat radiating member 3 side by continuously evaporating, moving, condensing and refluxing the working fluid. The heat pipe can be configured using, for example, aluminum or copper. In addition, as the hydraulic fluid, for example, water, alcohol, or alternative chlorofluorocarbon can be used.

  The heat pipe which is the heat transfer material 4 can be connected to the heat transfer plate 6 and the heat radiating member 3 provided in the luminaire main body 2 by welding or soldering. As the heat pipe, not only a round pipe but also a flat pipe may be used. In addition, as shown in FIG. 2, the embedded lighting fixture 10 of this embodiment is along the longitudinal direction of the elongate heat-transfer plate 6 provided in the lighting fixture main body 2, or the elongate heat-radiating member 3. As shown in FIG. Although the heat pipe is arranged, it is sufficient if the heat from the light source unit 1 can be efficiently transferred, and the heat pipe can be arranged in various shapes such as a zigzag folded shape.

The heat transfer plate 6 is preferably provided to efficiently transfer heat from the light source unit 1 to the heat transfer material 4 via the lighting fixture body 2. The heat transfer plate 6 can be connected to a heat pipe as the heat transfer material 4 by welding or soldering. As the heat transfer plate 6, for example, a plate material such as aluminum, copper or stainless steel excellent in thermal conductivity can be suitably used. Heat transfer plate 6, if efficient heat transfer heat to the heat transfer material 4 from the light source unit 1, is not necessarily required.

(Embodiment 2)
The embedded lighting fixture 10 of the present embodiment shown in FIG. 5 is a heat radiating sheet provided on the heat radiating member 3 instead of directly contacting the heat radiating member 3 to the ceiling back surface c2 as in the first embodiment shown in FIG. The difference is that 5 is brought into contact with the ceiling back surface c2. In the figure, the same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The embedded lighting fixture 10 of this embodiment has a lighting fixture main body 2 that is embedded in an embedding hole c1 of a ceiling material C, and a light source unit 1 that is housed in the lighting fixture main body 2 and includes an LED. doing. The embedded lighting fixture 10 is provided separately from the lighting fixture main body 2 and can be disposed between the ceiling back C2 side of the ceiling material C and the heat insulating material I provided on the ceiling back c2 side. The lighting device main body 2 side and the heat radiating member 3 are connected to each other, and a heat transfer material 4 that transfers heat of the light source unit 1 to the heat radiating member 3 is provided. Furthermore, the heat radiating member 3 of the embedded lighting fixture 10 of this embodiment includes a heat radiating sheet 5 that contacts the ceiling material C and radiates the heat of the heat radiating member 3.

  The embedded lighting fixture 10 of this embodiment is provided with a heat dissipation sheet 5 having a thickness of about 0.5 mm on the ceiling back surface c2 side of the heat dissipation member 3. The heat radiating sheet 5 is disposed between the heat radiating member 3 and the ceiling material C, and can contact the heat radiating member 3 and the ceiling material C, respectively. The heat dissipation sheet 5 can improve the adhesion between the heat dissipation member 3 and the ceiling material C. Therefore, the heat radiating sheet 5 has an effect of reducing the thermal resistance between the heat radiating member 3 and the ceiling material C, and the temperature of the light source unit 1 is measured under the same conditions as the embedded lighting fixture 10 of the first embodiment. For example, it is possible to obtain a cooling effect that lowers the temperature of the light source unit 1 by about 1 ° C. to about 2 ° C.

  As the heat-dissipating sheet 5, for example, a silicone gel sheet using a silicone resin made of a gel-like elastomer material that is gel-like, has a low crosslinking density, is soft, and has elasticity can be suitably used. The heat radiating sheet 5 is not limited to the silicone gel as a material of the heat radiating sheet 5, and a soft elastomer material (for example, an acrylic resin material) having electrical insulation and thermal conductivity can also be used. Thereby, compared with the heat radiating member 3 formed with the metal material, the heat radiating sheet 5 increases the adhesiveness with the ceiling material C, and radiates the heat of the heat radiating member 3 to the ceiling material C side more efficiently. Is possible.

  In addition, the heat radiating member 3 may improve heat dissipation further by making the surface side in which the heat radiating sheet 5 is provided uneven | corrugated shape and making a contact area with the heat radiating sheet 5 large. Moreover, the heat radiating member 3 is good also considering the surface side opposite to the surface in which the heat radiating sheet 5 is provided as a smooth shape, providing the groove | channel along the external shape of the heat-transfer material 4, and arrange | positioning the heat-transfer material 4 in a groove | channel. It may be possible to facilitate the fixing with the heat transfer material 4.

(Embodiment 3)
The embedded lighting fixture 10 of the present embodiment in FIG. 6 uses the bottomed cylindrical portion 2a to which the inner bottom surface side of the lighting fixture main body 2 is fixed as in the first embodiment of FIG. 2 is different from the cylindrical frame portion 2a1 in that a bottom plate portion 2a2 on which the light source portion 1 is arranged is connected to be openable and closable. In the figure, the same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The lighting fixture main body 2 of the embedded lighting fixture 10 of the present embodiment includes a bottomed cylindrical portion 2a and a cylindrical frame portion 2a1 and a disc-shaped bottom plate portion 2a2 constituting the bottom surface side. In the luminaire main body 2, the frame 2a1 holds the end of the bottom plate 2a2 with a hinge 2d, and the bottom plate 2a2 is connected to the frame 2a1 so as to be openable and closable.

The embedded lighting fixture 10 of the present embodiment is arranged on the ceiling material C side by embedding the lighting fixture body 2 in the embedded hole c1 provided in the ceiling material C when the embedded lighting device 10 is installed. Prior to the embedded arrangement of the luminaire main body 2, the embedded luminaire 10 is disposed at a predetermined position by inserting the heat transfer material 4 and the heat radiating member 3 into the embedded hole c <b> 1. Here, in the embedded lighting device 10 of the present embodiment, the bottom plate portion 2a2 can be opened and closed with respect to the frame portion 2a1 by a hinge 2d. Further, the embedded lighting fixture 10 uses a flexible heat transfer material 4. Therefore, implantable luminaire, as compared to implantable luminaire 10 of the first embodiment, when no embed the illuminating tool body 2 in the embedding hole c1, the ceiling rear surface c2 side of the ceiling material C easily done by placing the heat radiating member 3 to between the heat insulating material I provided above the ceiling face c2 side.

  The heat transfer material 4 can have flexibility by appropriately setting the material and the thickness thereof. Moreover, since the embedded lighting fixture 10 of this embodiment has provided the hinge 2d in the bottom plate part 2a2 on which the heat transfer plate 6 is disposed, the ceiling of the heat radiation member 3 is reduced while reducing the stress applied to the heat transfer material 4. It is possible to perform attachment to the material C side. In the embedded lighting device 10 of the present embodiment, the heat radiating sheet 5 may be provided on the heat radiating member 3 as in the second embodiment.

C ceiling material c1 embedding hole c2 ceiling back surface I heat insulating material 1 light source part 2 lighting fixture body 3 heat dissipation member 4 heat transfer material 5 heat dissipation sheet 10 embedded type lighting fixture

Claims (2)

A lighting fixture body that is embedded in an embedding hole of a ceiling material, a light source unit that is provided in the lighting fixture body and includes a semiconductor light emitting element, and a ceiling back surface side of the ceiling material that is provided separately from the lighting fixture body And a heat dissipating member that can be disposed between the heat insulating material provided on the back side of the ceiling, a heat transfer material that connects the luminaire main body side and the heat dissipating member, and transfers heat of the light source unit to the heat dissipating member It has a door,
The embedded luminaire characterized in that the heat dissipating member includes a heat dissipating sheet in contact with the ceiling material and capable of dissipating heat of the heat dissipating member . The embedded light fixture according to claim 1, wherein the heat transfer material has flexibility .

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