JP2013110198A - Light emitting diode lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting diode lamp which achieves high heat radiation efficiency.SOLUTION: A light emitting diode lamp according to this invention includes: a lamp holder; a radiator which includes a substrate having an upper surface and a bottom surface which are installed facing each other in the lamp holder, a cylindrical body extending from the bottom surface of the substrate in the direction of the lamp holder and connected and fixed to the lamp holder; and multiple heat radiation fins protruding from an outer peripheral surface of the cylindrical body and extending along the outer peripheral surface; and a light emitting diode adhered to the bottom surface of the substrate. A heat radiation hole, penetrating through the upper surface and the bottom surface of the substrate, is provided on the substrate.

Description

  The present invention relates to a lighting device, and more particularly to a light emitting diode lamp.

  Light emitting diodes (LEDs) have a small volume, high efficiency, long life, do not use harmful substances such as mercury, and can reduce emissions of carbon dioxide, which is good for the environment. Currently, it is widely used as a light source for a lamp replacing a cold cathode fluorescent tube. However, a large amount of heat is generated when using light emitting diodes. In particular, when used in a compact indoor lamp, if the heat dissipation is insufficient, the light emission efficiency of the light emitting diode is affected, and further, the light emitting diode itself is damaged.

  The objective of this invention is providing the light emitting diode lamp which solves the said subject and has high heat dissipation efficiency.

  The light-emitting diode lamp according to the present invention includes a lamp holder, a substrate having an upper surface and a bottom surface that are installed opposite to each other in the lamp holder, and extending from the bottom surface of the substrate to the lamp holder and connected to the lamp holder. A radiator including a fixed cylinder, a plurality of heat radiation fins protruding from the outer peripheral surface of the cylinder and extending along the outer peripheral surface, and a light emitting diode attached to the bottom surface of the substrate; , Provided. The substrate is provided with heat dissipation holes that penetrate the top and bottom surfaces of the substrate.

  In the light-emitting diode lamp of the present invention, since the heat radiating hole is provided in the substrate of the radiator, the air convection around the radiator can be accelerated. Thereby, the heat dissipation efficiency of the radiator can be increased, and the stability of the light emitting diode lamp can be ensured.

It is a three-dimensional exploded view of the light emitting diode lamp according to the first embodiment of the present invention. It is the three-dimensional exploded view seen from the other angle of the light emitting diode lamp shown in FIG. FIG. 3 is a three-dimensional assembly diagram after the light-emitting diode lamps shown in FIG. 1 are assembled together; It is sectional drawing of the heat radiator of the light emitting diode lamp shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 3, the light emitting diode lamp according to the first embodiment of the present invention includes a lamp holder 10, a radiator 20, a plurality of light emitting diodes 30, and a lamp cover 40.

  The lamp holder 10 is electrically connected to an external power source and is used to supply power to the light emitting diode 30.

  The radiator 20 is installed in the lamp holder 10 and is integrally formed using a highly heat conductive insulating material (for example, ceramic). The ceramic material is selected from aluminum oxide, silicate, oxide, carbide, nitride, sulfide, and boride. The radiator 20 includes a substrate 22, a vertically long cylindrical body 24 extending from the bottom surface of the substrate 22, and a plurality of radiating fins 26 protruding from the outer peripheral surface of the cylindrical body 24 and extending along the outer peripheral surface. .

  In the center of the upper surface of the substrate 22, a cylindrical connection part 220 is formed that extends perpendicularly to the substrate 22 and to which the light emitting diode 30 is attached. A circuit electrically connected to the light emitting diode 30 is formed on the connection part 220. The circuit is formed on the upper surface of the connection part 220 by means of electricity. In the present embodiment, by directly forming a circuit on the upper surface of the connection part 220 of the substrate 22 and mounting the light emitting diode 30, the thermal resistance between the light emitting diode 30 and the radiator 20 is greatly reduced, and light emission is performed. The heat dissipation efficiency and heat dissipation stability of the diode 30 can be effectively increased. The heat radiating fins 26 are installed at equal intervals along the outer peripheral surface of the cylindrical body 24 and are connected to the bottom surface of the substrate 22. One end of the cylindrical body 24 away from the substrate 22 is connected and fixed to the lamp holder 10.

  The light emitting diode lamp further includes a driving module 100, and the volume of the entire light emitting diode lamp can be reduced by housing the driving module 100 in the cylindrical body 24. The driving module 100 is electrically connected to the lamp holder 10 and the light emitting diode 30 and is used to supply a driving voltage to the light emitting diode 30. The fixing method of the said cylinder 24 and the said lamp holder 10, and the installation position of the said drive module 100 are not limited to this embodiment. The drive module 100 and the light emitting diode 30 can be electrically connected by providing at least one through-hole 221 that penetrates the substrate 22 in the connection part 220 of the substrate 22. A mounting recess 222 that surrounds the connection portion 220 and has a groove shape is formed on the upper surface of the substrate 22. The mounting recess 222 is used for mounting the lamp cover 40.

  Referring to FIG. 4, at least one heat radiating hole 224 is provided near the periphery of the substrate 22. The heat dissipation hole 224 penetrates the substrate 22 along the vertical direction. That is, it penetrates the top and bottom surfaces of the substrate 22. In the present embodiment, the number of the heat radiation holes 224 is plural. The heat radiating holes 224 form circular rows along the outer peripheral edge of the substrate 22 and are installed at equal intervals. When there are a plurality of the heat dissipation holes 224, the inside of the substrate 22 between the adjacent heat dissipation holes 224 can communicate with each other by providing a through hole. Each heat radiating hole 224 is located in the opening on the bottom surface of the substrate 22 along the outer periphery of the cylindrical body 24, and is installed correspondingly between the two adjacent radiating fins 26. Each heat radiation hole 224 has a conical shape that gradually decreases from the top surface to the bottom surface of the substrate 22.

  In the present embodiment, the number of the light emitting diodes 30 is five, but the number of the light emitting diodes 30 is not limited to the present embodiment.

  The lamp cover 40 is manufactured using a light transmitting material such as glass or plastic. The lamp cover 40 is a hollow bowl-shaped body. The lamp cover 40 is installed corresponding to the radiator 20 and accommodates the light emitting diode 30 therein.

  When the light emitting diode lamp of the present invention is used, the heat generated from the light emitting diode 30 is absorbed by the substrate 22 of the radiator 20 and conducted to the radiation fins 26 before being radiated to the surroundings. Compared with the conventional technology, since at least one heat radiating hole 224 is provided on the substrate 22 of the radiator 20 of the light-emitting diode lamp of the present invention, the air around the radiator 20 is reduced. Convection can be accelerated. Thereby, the heat dissipation efficiency of the radiator 20 can be increased, and the stability of the light emitting diode lamp can be ensured.

  The present invention has been specifically described based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. Thus, the protection scope of the present invention is determined from the following claims.

DESCRIPTION OF SYMBOLS 10 Lamp holder 20 Radiator 22 Board | substrate 24 Cylinder 26 Radiation fin 30 Light emitting diode 40 Lamp cover 100 Drive module 220 Connection part 221 Through-hole 222 Mounting recessed part 224 Radiation hole

Claims (7)

A lamp holder,
In the lamp holder, a substrate having an upper surface and a bottom surface, a cylinder extending from the bottom surface of the substrate toward the lamp holder and connected and fixed to the lamp holder, and an outer periphery protruding from the outer peripheral surface of the cylinder A heat sink comprising a plurality of heat dissipating fins extending along the surface;
A light emitting diode affixed to the bottom of the substrate;
A light-emitting diode lamp comprising:
The light emitting diode lamp, wherein the substrate is provided with a heat radiating hole penetrating the top and bottom surfaces of the substrate.   2. The light emitting diode lamp according to claim 1, wherein each of the heat radiation holes has a conical shape extending from an upper surface to a bottom surface of the substrate and gradually decreasing in diameter.   3. The light emitting diode lamp according to claim 1, wherein the number of the heat radiating holes is plural, and the circular rows are arranged along the outer peripheral edge of the substrate, and are arranged at equal intervals.   The light emitting diode lamp according to any one of claims 1 to 3, wherein the adjacent heat radiation holes communicate with each other inside the substrate.   Each said heat radiating hole is located in opening of the bottom face of the said board | substrate, and is installed correspondingly between the said adjacent two heat radiating fins, The any one of Claims 1-4 characterized by the above-mentioned. The light-emitting diode lamp described in 1.   The light-emitting diode lamp according to claim 1, wherein the radiating fins are installed at equal intervals along an outer periphery of the cylindrical body.   The mounting recess surrounding the connecting portion and forming a groove is provided on the upper surface of the substrate, and the mounting recess is used for mounting a lamp cover. The light-emitting diode lamp described in 1.

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