JP2012099375A - Bulb type led lamp - Google Patents

Bulb type led lamp Download PDF

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JP2012099375A
JP2012099375A JP2010247048A JP2010247048A JP2012099375A JP 2012099375 A JP2012099375 A JP 2012099375A JP 2010247048 A JP2010247048 A JP 2010247048A JP 2010247048 A JP2010247048 A JP 2010247048A JP 2012099375 A JP2012099375 A JP 2012099375A
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heat
led
lighting
heat sink
light
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Daisuke Uchida
大祐 内田
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a bulb type LED lamp capable of improving light-emitting efficiency by increasing heat radiation, raising amount of light, and enlarging light-emitting range etc.SOLUTION: The bulb type LED lamp 1 is provided with an LED unit 4 having LEDs 2 and LED substrates 3, a globe 5 with light transmission performance which covers the LED unit 4, a heat sink 6 of a bottomed cylindrical shape which radiates heat of the LED unit 4, a lighting device 7 which drive controls the LEDs 2, and a cylindrical heat radiation case 8 having a base part 8a. The heat radiation case 8 is incorporated inside by exposing a part of the heat sink 6 outside, the LED unit 4 is arranged at the bottom of the heat sink 6, the lighting device 7 is incorporated into the heat radiation case 8, a heat radiation resin (heat conduction member) 10 is arranged between the inner face of the heat radiation case 8 and the lighting device 7, thereby, heat from the lighting device 7 is transmitted to the heat radiation case 8 through the heat radiation resin 10, and the heat from the heat radiation case 8 and the heat from the LED unit 4 are radiated to the outside by the heat sink 6.

Description

本発明は、光源としてLEDを使用した電球型LEDランプに関するものである。   The present invention relates to a light bulb type LED lamp using an LED as a light source.

現在、蛍光灯光源と白熱電球用の口金を用いて商用AC電源によって点灯可能な照明用ランプが市販されている。このような蛍光灯を用いた電球は、従来の白熱電球に比べて寿命が長く、省電力であるという特長を有しており、CO削減等が可能な環境対応型ランプとして現在普及が見込まれている。 Currently, lighting lamps that can be turned on by a commercial AC power source using a fluorescent light source and a base for an incandescent bulb are commercially available. A light bulb using such a fluorescent lamp has a feature that it has a longer life than conventional incandescent light bulbs and is energy saving, and is expected to be widely used as an environmentally friendly lamp capable of reducing CO 2. It is.

一方、近年、光源として蛍光灯よりも更に寿命が長いLED(発光ダイオード)を用いた電球型LEDランプが出現している。ここで、斯かる電球型LEDランプの一例を図2に示す。   On the other hand, in recent years, a light bulb type LED lamp using an LED (light emitting diode) as a light source that has a longer life than a fluorescent lamp has appeared. Here, an example of such a bulb-type LED lamp is shown in FIG.

図2は従来の電球型LEDランプの側断面図であり、この電球型LEDランプ101は、LEDを駆動するための点灯装置107を口金111の内部に組み込み、絶縁のために点灯装置107は樹脂ケース108によって覆われている。そして、樹脂ケース108は熱伝導性の高い円筒状のヒートシンク106によって覆われている。   FIG. 2 is a side sectional view of a conventional light bulb type LED lamp. In this light bulb type LED lamp 101, a lighting device 107 for driving an LED is incorporated in a base 111, and the lighting device 107 is a resin for insulation. Covered by a case 108. The resin case 108 is covered with a cylindrical heat sink 106 having high thermal conductivity.

又、LEDとこれを実装するLED基板とで構成されるLEDユニット104は、熱伝導性の高い円板状のヒートシンク112上に設置されており、LEDユニット104とヒートシンク112はその周囲が光透過性の高いドーム状のグローブ105によって保護されている。尚、グローブ105にはフロスト処理、レンズカット等の光学処理が施されており、LEDから出射する光の配光がグローブ105によって制御される。   In addition, the LED unit 104 composed of the LED and the LED substrate on which the LED is mounted is installed on a disk-shaped heat sink 112 having high thermal conductivity. It is protected by a highly dome-shaped glove 105. The globe 105 is subjected to optical processing such as frost processing and lens cutting, and the distribution of light emitted from the LED is controlled by the globe 105.

ところで、電球型LEDランプに関して、特許文献1には、LEDユニットと点灯回路ユニット(点灯装置)とをヒートシンクと回路用ケースにそれぞれ取り付けて互いに熱結合し、ヒートシンクと回路用ケースとの間に断熱層としての間隙を形成する構成が提案されている。これによれば、点灯駆動時にLEDユニットから発生する熱をヒートシンクに伝達する際、点灯回路ユニットから発生する熱の影響を受けにくく、又、点灯回路ユニットで発生した熱がヒートシンクへと伝達されにくいため、LEDユニットで発生した熱がヒートシンクへと効率良く伝達される。   By the way, regarding the light bulb type LED lamp, Patent Document 1 discloses that an LED unit and a lighting circuit unit (lighting device) are respectively attached to a heat sink and a circuit case and thermally coupled to each other, and heat insulation is performed between the heat sink and the circuit case. A configuration for forming a gap as a layer has been proposed. According to this, when transferring the heat generated from the LED unit to the heat sink during lighting driving, the heat generated from the lighting circuit unit is hardly affected, and the heat generated in the lighting circuit unit is not easily transferred to the heat sink. Therefore, the heat generated in the LED unit is efficiently transmitted to the heat sink.

特開2010−103241号公報JP 2010-103241 A

ところが、図2に示した従来の電球型LEDランプ101においては、点灯装置107と樹脂ケース108及びヒートシンク106との間に断熱空間が形成されているため、点灯装置107で発生した熱の放熱性が悪いという問題がある。   However, in the conventional light bulb type LED lamp 101 shown in FIG. 2, a heat insulating space is formed between the lighting device 107, the resin case 108, and the heat sink 106. There is a problem that is bad.

又、特許文献1において提案された電球型LEDランプでは、ヒートシンクと回路用ケースとの間に断熱層としての間隙が形成されているために点灯回路ユニットで発生した熱のヒートシンクへの伝達が遮断され、点灯回路ユニットから回路用ケースへと伝導した熱は給電口金からしか放熱されないために放熱性が悪いという問題がある。   Further, in the light bulb type LED lamp proposed in Patent Document 1, since a gap as a heat insulating layer is formed between the heat sink and the circuit case, transmission of heat generated in the lighting circuit unit to the heat sink is cut off. However, the heat conducted from the lighting circuit unit to the circuit case is radiated only from the power supply base, and thus there is a problem that heat radiation is poor.

本発明は上記問題に鑑みてなされたもので、その目的とする処は、放熱性を高めて発光効率の向上、大光量化、発光範囲の拡大等を図ることができる電球型LEDランプを提供することにある。   The present invention has been made in view of the above problems, and the object of the present invention is to provide a light bulb type LED lamp that can improve heat dissipation, improve luminous efficiency, increase the amount of light, expand the luminous range, etc. There is to do.

上記目的を達成するため、本発明は、光源であるLEDとこれを実装するLED基板を有するLEDユニットと、該LEDユニットを覆う光透過性のグローブと、前記LEDユニットの熱を放熱する有底筒状のヒートシンクと、前記LEDを駆動制御する点灯装置と、電球ソケットに接続可能な口金部を有する筒状の放熱ケースを備えた電球型LEDランプにおいて、前記ヒートシンクの一部を外部に露出させてその内部に前記放熱ケースを組み込むとともに、ヒートシンクの底面に前記LEDユニットを配置し、前記放熱ケース内に前記点灯装置を組み込み、前記放熱ケースの内面と前記点灯装置間に熱伝導部材を配置して点灯装置からの熱を前記熱伝導部材を介して放熱ケースに伝え、該放熱ケースからの熱と前記LEDユニットからの熱を前記ヒートシンクによって外部に放熱するよう構成したことを特徴とする。   To achieve the above object, the present invention provides an LED unit having an LED as a light source and an LED substrate on which the LED is mounted, a light-transmitting globe that covers the LED unit, and a bottom that dissipates heat from the LED unit. In a light bulb type LED lamp having a cylindrical heat sink, a lighting device for driving and controlling the LED, and a cylindrical heat dissipation case having a base portion connectable to a light bulb socket, a part of the heat sink is exposed to the outside. The heat dissipating case is incorporated into the heat sink, the LED unit is disposed on the bottom surface of the heat sink, the lighting device is incorporated in the heat dissipating case, and a heat conducting member is disposed between the inner surface of the heat dissipating case and the lighting device. The heat from the lighting device is transmitted to the heat radiating case through the heat conducting member, and the heat from the heat radiating case and the LED unit Characterized by being configured to heat dissipation to the outside by the heat sink.

本発明によれば、LEDユニットにおいて発生した熱はヒートシンクに直接伝導して該ヒートシンクから外部に放熱される。又、点灯装置において発生した熱は、熱伝導部材を介して放熱ケースに伝わり、該放熱ケースからヒートシンクへと伝わって該ヒートシンクから外部に放熱される。従って、LEDユニットからの熱も点灯装置からの熱も共にヒートシンクから外部に放熱されるため、LEDユニットと点灯装置の温度上昇が抑えられ、LEDの寿命と発光効率が高められる。又、当該電球型LEDランプの放熱性が高められる結果、LEDユニットの設置位置を下げて発光範囲を拡大することができるとともに、消費電力を上げて大光量化を実現することができる。   According to the present invention, heat generated in the LED unit is directly conducted to the heat sink and radiated from the heat sink to the outside. Further, the heat generated in the lighting device is transmitted to the heat radiating case through the heat conducting member, is transmitted from the heat radiating case to the heat sink, and is radiated to the outside from the heat sink. Therefore, since both the heat from the LED unit and the heat from the lighting device are radiated from the heat sink to the outside, the temperature rise of the LED unit and the lighting device is suppressed, and the lifetime and the light emission efficiency of the LED are improved. Moreover, as a result of improving the heat dissipation of the light bulb-type LED lamp, it is possible to expand the light emission range by lowering the installation position of the LED unit, and it is possible to increase the power consumption and realize a large amount of light.

本発明に係る電球型LEDランプの側断面図である。It is a sectional side view of the bulb-type LED lamp according to the present invention. 従来の電球型LEDランプの側断面図である。It is a sectional side view of the conventional bulb-type LED lamp.

以下に本発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

図1は本発明に係る電球型LEDランプの側断面図であり、図示の電球型LEDランプ1は、光源であるLED2とこれを実装するLED基板3を有するLEDユニット4と、該LEDユニット4を覆う光透過性の高いドーム状のグローブ5と、前記LEDユニット4の熱を放熱するヒートシンク6と、前記LED2を駆動制御する点灯装置7と、不図示の電球ソケットに接続可能な口金部8aを有する放熱ケース8を含んで構成されている。   FIG. 1 is a side sectional view of a light bulb type LED lamp according to the present invention. A light bulb type LED lamp 1 shown in FIG. 1 includes an LED unit 4 having an LED 2 as a light source and an LED substrate 3 on which the LED 2 is mounted, and the LED unit 4. A light-transmitting dome-shaped globe 5, a heat sink 6 that dissipates heat from the LED unit 4, a lighting device 7 that drives and controls the LED 2, and a base portion 8 a that can be connected to a light bulb socket (not shown). It is comprised including the thermal radiation case 8 which has.

前記ヒートシンク6は、熱伝導性の高いアルミニウムや放熱樹脂、放熱セラミック等によって二重筒状に一体成形されており、そのグローブ5内に組み込まれた有底筒状の本体部6Aの上端部は円錐台状に成形され、この部分には前記LEDユニット4が熱伝達可能に接合した状態で設置されている。そして、ヒートシンク6の本体部6Aの下面開口部の周縁からはグローブ5の下部外周に沿って立ち上がる円筒状の放熱部6Bが露出している。尚、本実施の形態では、LEDユニット4は複数のLED2とこれらをそれぞれ実装する複数のLED基板3によって構成されている。尚、LED2及びLED基板3はそれぞれ複数でも良く、1つでも良い、又、グローブ5は光学処理が施されていない素通しのレンズでも良く、グローブ5にフロスト処理、レンズカット等の光学処理を施して各LED2から出射する光の配光を当該グローブ5によって制御しても良い。例えば、グローブ5は集光レンズであっても良い。   The heat sink 6 is integrally formed in a double cylinder shape by using aluminum, heat radiating resin, heat radiating ceramic or the like having high thermal conductivity, and the upper end portion of the bottomed cylindrical main body portion 6A incorporated in the globe 5 is It is formed in a truncated cone shape, and the LED unit 4 is installed in this portion in a state where it is joined so as to be able to transfer heat. A cylindrical heat radiation portion 6B that rises along the outer periphery of the lower portion of the globe 5 is exposed from the periphery of the lower surface opening of the main body portion 6A of the heat sink 6. In the present embodiment, the LED unit 4 is composed of a plurality of LEDs 2 and a plurality of LED substrates 3 on which these are mounted. Each of the LED 2 and the LED substrate 3 may be plural or one, and the globe 5 may be a plain lens that is not subjected to optical processing, and the globe 5 is subjected to optical processing such as frost processing and lens cutting. The light distribution of the light emitted from each LED 2 may be controlled by the globe 5. For example, the globe 5 may be a condenser lens.

前記放熱ケース8は、放熱性の高い放熱セラミックや放熱樹脂によって円筒状に一体成形されており、その内部の中心には前記点灯装置7が組み込まれている。そして、この点灯装置7から上方に延びるワイヤーハーネスはヒートシンク6を貫通してLEDユニット4の各LED基板3にそれぞれ電気的に接続されている。   The heat dissipating case 8 is integrally formed in a cylindrical shape with heat dissipating ceramic or heat dissipating resin, and the lighting device 7 is incorporated in the center of the inside. The wire harness extending upward from the lighting device 7 passes through the heat sink 6 and is electrically connected to each LED substrate 3 of the LED unit 4.

而して、本実施の形態では、放熱ケース8の内部の点灯装置7との間の空間には、熱伝導部材として放熱性の高い放熱樹脂10が充填されている。尚、放熱樹脂10に代えて熱伝導性の高いアルミニウムや放熱セラミック等で構成されたブロック状の熱伝導部材を放熱ケース8内に組み込んでも良い。又、放熱ケース8は、その外周がヒートシンク6の本体部6Aの内周に密着していても、離間して両者間に隙間が形成されていても良い。   Thus, in the present embodiment, the space between the lighting device 7 inside the heat radiating case 8 is filled with a heat radiating resin 10 having a high heat radiating property as a heat conducting member. Instead of the heat radiating resin 10, a block-shaped heat conductive member made of aluminum having a high thermal conductivity, heat radiating ceramic, or the like may be incorporated in the heat radiating case 8. Moreover, even if the outer periphery is closely_contact | adhered to the inner periphery of the main-body part 6A of the heat sink 6, the thermal radiation case 8 may be spaced apart and the clearance gap may be formed between both.

そして、放熱ケース8のヒートシンク6から下方に突出する下端部外周には金属製の口金部8aが設けられており、この口金部8aを不図示の電球ソケットにねじ込むことによって当該電球型LEDランプ1が電球ソケットに取り付けられて照明用として使用される。   A metal base portion 8a is provided on the outer periphery of the lower end portion protruding downward from the heat sink 6 of the heat radiating case 8, and the light bulb type LED lamp 1 is screwed into the light bulb socket (not shown). Is attached to the light bulb socket and used for lighting.

而して、電球型LEDランプ1が電球ソケットに取り付けられた状態で、該電球型LEDランプ1に放熱ケース8の口金部8aから電流が供給されると、その電流は点灯装置7からワイヤーハーネス9を経てLEDユニット4の各LED2に供給され、各LED2が起動されて点灯し、各LED2から出射する光の配光がグローブ5によって制御されて照明に供される。   Thus, when a current is supplied to the light bulb type LED lamp 1 from the base portion 8a of the heat radiating case 8 in a state where the light bulb type LED lamp 1 is attached to the light bulb socket, the current is supplied from the lighting device 7 to the wire harness. 9 is supplied to each LED 2 of the LED unit 4, each LED 2 is activated and turned on, and the light distribution of the light emitted from each LED 2 is controlled by the globe 5 and used for illumination.

ところで、LED2の発光によってLEDユニット4及び点灯装置7が発熱するが、LEDユニット4において発生した熱はヒートシンク6に熱伝達可能に接合した部分から伝導して該ヒートシンク6から外部に放熱される。又、点灯装置7において発生した熱は、熱伝導部材である放熱樹脂10を介して放熱ケース8に伝わり、該放熱ケース8から輻射と熱伝導によってヒートシンク6へと伝わって最終的に該ヒートシンク6から外部に放熱される。尚、ヒートシンク7の放熱量が十分あるため、点灯装置7で発生した熱はヒートシンク6によって十分放熱される。このため、点灯装置7で発生した熱がLEDユニット4に伝わることは殆どない。   By the way, although the LED unit 4 and the lighting device 7 generate heat due to the light emission of the LED 2, the heat generated in the LED unit 4 is conducted from the portion joined to the heat sink 6 so as to be able to transfer heat and is radiated from the heat sink 6 to the outside. Further, the heat generated in the lighting device 7 is transmitted to the heat radiating case 8 through the heat radiating resin 10 which is a heat conducting member, and is transmitted from the heat radiating case 8 to the heat sink 6 by radiation and heat conduction, and finally the heat sink 6. Radiates heat from the outside. In addition, since the heat dissipation amount of the heat sink 7 is sufficient, the heat generated in the lighting device 7 is sufficiently dissipated by the heat sink 6. For this reason, the heat generated in the lighting device 7 is hardly transmitted to the LED unit 4.

従って、本実施の形態に係る電球型LEDランプ1においては、LEDユニット4からの熱も点灯装置7からの熱も共にヒートシンク6から外部に放熱されるため、LEDユニット4と点灯装置7の温度上昇が抑えられ、LED2の寿命と発光効率が高められる。又、当該電球型LEDランプ1の放熱性が高められる結果、LEDユニット4の設置位置を下げて発光範囲を拡大することができるとともに、消費電力を上げて大光量化を実現することができる。   Therefore, in the light bulb type LED lamp 1 according to the present embodiment, both the heat from the LED unit 4 and the heat from the lighting device 7 are radiated from the heat sink 6 to the outside, so the temperature of the LED unit 4 and the lighting device 7 is increased. The rise is suppressed, and the lifetime and luminous efficiency of the LED 2 are increased. Moreover, as a result of improving the heat dissipation of the light bulb-type LED lamp 1, the installation position of the LED unit 4 can be lowered to expand the light emission range, and the power consumption can be increased to increase the amount of light.

1 電球型LEDランプ
2 LED
3 LED基板
4 LEDユニット
5 グローブ
6 ヒートシンク
6A ヒートシンクの本体部
6B ヒートシンクの放熱部
7 点灯装置
8 放熱ケース
8a 放熱ケースの口金部
9 ワイヤーハーネス
10 放熱樹脂(熱伝導部材)
1 Light bulb type LED lamp 2 LED
DESCRIPTION OF SYMBOLS 3 LED board 4 LED unit 5 Globe 6 Heat sink 6A Heat sink main body 6B Heat sink heat sink 7 Lighting device 8 Heat sink case 8a Heat sink base 9 Wire harness 10 Heat dissipation resin (heat conduction member)

Claims (1)

光源であるLEDとこれを実装するLED基板を有するLEDユニットと、該LEDユニットを覆う光透過性のグローブと、前記LEDユニットの熱を放熱する有底筒状のヒートシンクと、前記LEDを駆動制御する点灯装置と、電球ソケットに接続可能な口金部を有する筒状の放熱ケースを備えた電球型LEDランプにおいて、
前記ヒートシンクの一部を外部に露出させてその内部に前記放熱ケースを組み込むとともに、ヒートシンクの底面に前記LEDユニットを配置し、前記放熱ケース内に前記点灯装置を組み込み、前記放熱ケースの内面と前記点灯装置間に熱伝導部材を配置して点灯装置からの熱を前記熱伝導部材を介して放熱ケースに伝え、該放熱ケースからの熱と前記LEDユニットからの熱を前記ヒートシンクによって外部に放熱するよう構成したことを特徴とする電球型LEDランプ。
An LED unit having an LED as a light source and an LED substrate for mounting the LED, a light-transmitting globe that covers the LED unit, a bottomed cylindrical heat sink that dissipates heat from the LED unit, and drive control of the LED In a light bulb-type LED lamp having a cylindrical heat dissipation case having a base part connectable to a lighting device and a light bulb socket,
A part of the heat sink is exposed to the outside and the heat radiating case is incorporated therein, the LED unit is disposed on the bottom surface of the heat sink, the lighting device is incorporated in the heat radiating case, and the inner surface of the heat radiating case and the A heat conducting member is disposed between the lighting devices to transmit heat from the lighting device to the heat radiating case via the heat conducting member, and heat from the heat radiating case and heat from the LED unit are radiated to the outside by the heat sink. A bulb-type LED lamp characterized by being configured as described above.
JP2010247048A 2010-11-04 2010-11-04 Bulb type led lamp Pending JP2012099375A (en)

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CN103982883A (en) * 2014-05-28 2014-08-13 昆山生态屋建筑技术有限公司 Reflector lamp adjustable in light emitting angle
US9127827B2 (en) 2012-01-31 2015-09-08 Lg Innotek Co., Ltd. Lighting device
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US9353914B2 (en) 2011-09-02 2016-05-31 Lg Innotek Co., Ltd. Lighting device
US10260724B2 (en) 2011-09-02 2019-04-16 Lg Innotek Co., Ltd. Lighting device
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