1239661 五、發明說明（2) 習知之L· E D模組A於組合時，如圖二所示，係將二 E D 1之電極端1 1以銲錫焊接於電路基板2之導電迴路 2 1上，使用時，提供電源即可驅動l E D 1發光提供光 源而為利用，惟，當L E D模組a中之L E D 1經導通電 源而開使發光時’同時也會產生熱能，凝聚單一 L e d 1 之熱能後的L E D模組A其熱能則顯得更巨大，以往的L ^模=A並不考慮散熱問題，充其量僅係、利用導電迴路 2上裸：=路基板2之表面作有限的散 =二出Γη中之溫度達到-定程度後，將會 及L· U的出光效能及使用壽命。 誠如前述，立，弘0B 1. 發出經鈞Θ h業^ 思到此一問題，進而有業者研 」之「具散熱功％ J^ 口號為5 6 0 7 0 4 D (即發光^極:一極體」，請參閱圖三，該L E 3 1 ，該架體;丨）$具有—*導電金屬—體成形之架體 架腳3 1 1上方炎^形成有一對分開之架腳3 1 1 ，該 開設有一架孔；j、2積較大之架面3 1 2 ，該架面3丄2 撐管321穿说 j該架孔313供一撐件32上方 而下段則為一結合；？上段設有若干鰭片3 2 2， 底3 2 4 一架腳3 接線 結合部 並：ί f時係將晶片3 3容置於管壁底部之撐 1 I而力屬接線3 4分別連接於晶片3 3及另 與接線3 4以封膠；！ 3 3广連同晶片3 3 合部3 2 3诵$ 其運用守，係將撐件3 2下段之 、過一印刷電路板4鎖開具之板孔之1239661 V. Description of the invention (2) When the conventional L · ED module A is assembled, as shown in Fig. 2, the electrode terminals 1 1 of the two ED 1 are soldered to the conductive circuit 21 of the circuit substrate 2 by soldering. When in use, the power supply can drive the ED 1 light source to provide light source for use. However, when LED 1 in the LED module a is turned on by turning on the power to emit light, it will also generate thermal energy, condensing a single L ed 1 The thermal energy of the LED module A after the thermal energy appears to be even greater. In the past, L ^ mode = A did not consider the heat dissipation problem. At best, it is only used and bare on the conductive circuit 2: = the surface of the circuit board 2 is limited. After the temperature in Γη reaches a certain degree, it will be related to the light output efficiency and service life of L · U. As mentioned above, Li, Hong 0B 1. Issue Jing Jun Θ h industry ^ Thinking about this problem, and then have the industry research "" with heat dissipation% J ^ slogan is 5 6 0 7 0 4 D (that is, light emitting ^ pole "One pole body", please refer to Figure 3. The LE 3 1, the frame body; 丨) $ has — * conductive metal — body-shaped frame body frame legs 3 1 1 above the flame ^ is formed with a pair of separate frame legs 3 1 1, there is a shelf hole; j, 2 large shelf surface 3 1 2, the shelf surface 3 丄 2 brace pipe 321 through j frame hole 313 for a support member 32 above and a lower section is a combination ;? The upper section is provided with a plurality of fins 3 2 2, the bottom 3 2 4 and a leg 3 connection joint and: when f is the support 1 I that holds the wafer 3 3 in the bottom of the pipe wall, and the power connection 3 4 is connected to each Chip 3 3 and another with wiring 3 4 for sealing glue; 3 3 Guang together with the chip 3 3 joint 3 2 3 诵 $ The use of the guard, is to support the 3 2 lower part of the board through a printed circuit board 4 lock the plate hole
第7頁 1239661 五、發明說明（3) 其係與一散熱件5之接合孔5 i结入 之周緣開具有溝槽5 2 ，牟f F n Q為—體’該散 產生之高熱，可藉由撐件^ 發光時，晶片 熱，其中，撐件3 2上ρ μ > 此傳導至散熱件， 開具之溝槽5 2皆係為2設之鰭片3 2 2及散熱γ 散熱功“LG為：：：：…設立，Η 散熱件5須以外加方式為埶，製作程序複杂 元件而已。 八放熱效果僅侷限於專 組a藉：模組基板所用之習知u ίί=;ί容易因ledi之局部熱度過度升/ 一習知之L F ^ ^熱而減損發光功率甚至損壞之虞， 須外加-散熱件5:^2有一撐件3 2可供散熱， 雜，而其散i H ^導…、，不但成本高，且製作ίι 之必要性政熱效果僅偈限於單-之元件，故實有加！; 於習知的L 3 t:f電子相關產業開發之專業人員， 經驗積極的進行研、：之二熱方法未臻完善，乃以長今 明。 九’在不斷的試驗及改良後終獲s 【發明内容】Page 7 1239661 V. Description of the invention (3) It is provided with a groove 5 2 at the periphery of the joint hole 5 i of a heat sink 5. Mou F F n Q is the body's high heat generated by the dispersion. When the support member ^ emits light, the chip is heated, wherein the support member 3 2 ρ μ > This conducts to the heat sink, and the grooves 5 2 that are opened are all 2 fins 3 2 2 and heat dissipation γ heat dissipation function. "LG is :::: ... established, Η The heat sink 5 must be added in addition to 埶, and the production process is complicated. The eight heat radiation effect is limited to the special group a. Borrowing: the knowledge of the module substrate u ίί; ί It is easy to reduce the luminous power or even damage due to the local heat rise of the ledi / a familiar LF ^ ^ heat, which must be added-the heat sink 5: ^ 2 has a support member 3 2 for heat dissipation, miscellaneous, and its scattered i H ^ guide ..., not only the high cost, but also the necessity of making ίι only limited to single-element, so there is a real increase !; in the conventional L 3 t: f electronics related industry development professionals, experience Active research: Second, the thermal method has not been perfected, but it is based on long-term and bright future. Nine 'finally won s after continuous testing and improvement. [Invention Yung]
置，目的’在於提供-種led模魬I 貫穿於電路1!^1)模組之電路基板，設置有數1 、路基板之散熱孔，該散熱孔内壁周面敦有: Μ牛5 丨3所 散 5所 一具 ，該 D模 量之 而造 而另 但仍 序複 改進 有鑑 工作 本發 熱裝 眾多 熱構 1239661 時’由 上、下 6 4周 等方式 僅需將 7之電 要電流 一般功 組’其 上層散 散熱孔 熱構件 熱構件 散熱孔 板厚） 於L E 層散熱 壁之散 加工於 LED 極端7 通過， 率或屬 因電流 熱構件 6 4之 6 5, 6 3b 6 4, 專變化 五、發明說明（5) 本發明 的導電迴路 熱孔6 4及 蒸鍍、蝕刻 之L E D模 置上’並將 電迴路6 2 無論L £ d 態呈現的L 可藉由基板 熱，同時， 内周壁因亦 基板6 1之 有散熱構件 高度（基板 積）擴大。 D模組 構件6 熱構件 基板6 7設於 1以焊 即可使 高功率 之通過 6 3a 設置， 而可將其熱能 ’特別值得一 將隨著孔徑大 而令其表面積 路基板6上 6 3 b、散 係事先利用 故，本發明 1之預定位 式焊接在導 7發光，而 是以陣列形 出之高熱， 大面積之散 熱孔6 4之 快速導引至 提的是，設 小、間距及 (即散熱面 又，目前電路其4 了，其貫穿之孔之貫孔技術中，已是相當成熟 可小至〇· lrom，換:至可小至〇· 25mm，二孔洞之最小間距 愈密之散熱孔6之，本發明於應用時，若設置愈多、 利於散熱工作之〜，即相對增加愈多的散熱面積，而更有 發明之散熱面積=f。而由以下的換算公式中，可得知本 *目前可製有〇 · 74倍到3 · 8 5倍之擴大效能。 *目前可製^之最小孔杈為0· 25mm ( d ) 表嶮之最小PAD為每邊^随 1239661 五、發明說明（6) *目前可製造之孔對孔最小間距〇 .丨min * T 土板板厚（目前最小板厚為〇.4mm，選用上以 〇 · 4mm〜1 · 6mm為大宗） * L < ( d +〇· 2 + 0· 1 ) A < L x L =〇· 30 25mm2 A 1 = π d2/4 A 2 = ^ d x T ΣΑ = α~Α 1 + A2 Ζ<ΣΑ/ A (增加面積的百分比） 〇· 25ππη 為 dThe purpose is to provide-a kind of led module 魬 I runs through the circuit 1! ^ 1) The circuit board of the module is provided with a number of cooling holes on the circuit board. The inner wall of the cooling hole has: Μ 牛 5 丨 3 One of the five is scattered, the D modulus is made but the other is still improved. There are many thermal structures in the case of heating. 1239661 'From top to bottom, 6 to 4 weeks, etc., only 7 of the electricity required The general work group 'its upper layer dissipates heat holes, the heat members, the heat members, and the heat sink holes are thick.) The heat dissipation walls of the LE layer are processed at the LED extremes 7 and pass. Specific changes V. Description of the invention (5) The conductive circuit hot holes 64 and the vapor-deposited and etched LED molds of the present invention are placed on the LED circuit 6 and the electrical circuit 6 2 can be represented by L in the L £ d state through the substrate heat, at the same time As a result, the height of the inner peripheral wall (substrate product) of the substrate 61 is enlarged. D module component 6 thermal component substrate 6 7 is set at 1 for soldering to allow high power to pass through 6 3a, and its thermal energy can be particularly worthwhile. It will make its surface area on the substrate 6 6 as the aperture is large. b. The loose system is used in advance. Therefore, the pre-positioned welding of the present invention 1 emits light at the guide 7, but the high heat generated by the array, the large area of the heat dissipation holes 64, and the fast guidance are provided. And (that is, the heat dissipation surface, the current circuit is 4, and the through hole technology of the through hole is quite mature and can be as small as 0 · lrom, change: as small as 0 · 25mm, the minimum distance between the two holes is more Among the dense heat dissipation holes 6, when the present invention is applied, if more is provided to facilitate the heat dissipation work, that is, the more the heat dissipation area is increased, the more the heat dissipation area of the invention is equal to f. From the following conversion formula, It can be known that the present * can be expanded from 0.74 times to 3.85 times. * The smallest hole branch that can be manufactured currently is 0.25mm (d). 1239661 V. Description of the invention (6) * The minimum hole-to-hole spacing that can be manufactured at present 丨 min * T Soil plate thickness (currently the minimum plate thickness is 0.4mm, and the upper part is selected from 0.4mm to 1.6mm) * L < (d + 〇 · 2 + 0 · 1) A < L x L = 〇 30 25mm2 A 1 = π d2 / 4 A 2 = ^ dx T ΣΑ = α ~ Α 1 + A2 ZO < ΣΑ / A (percent increase in area) 〇 25ππη is d
*單位面積（即散熱面積）由〇.74倍到385倍 綜上所述，本發明之L E D模組散熱裴置，乃係 E D模組之電路基板上避開導電迴路處設以散熱構件月 L E D相對應之散熱孔，並於散熱孔周壁周壁 & ，與 構件，藉由眾多個散熱孔之設置，以增加接二空f ，熱 面積，並利用散熱構件良好之散熱性將L F =乱散熱 生之熱能，迅速引導散熱，以避免led因無、去$哉產 生減損發光功率或損壞之情形，因而影塑敕:’τ政…、而發 〜響整片L E D模組* The unit area (ie, heat dissipation area) ranges from 0.74 times to 385 times. As mentioned above, the heat dissipation of the LED module of the present invention is a heat dissipation component on the circuit board of the ED module to avoid conductive circuits. The heat dissipation holes corresponding to the LED, and the surrounding walls of the heat dissipation holes, and the components, through the setting of a number of heat dissipation holes, to increase the connection space f, the thermal area, and use the good heat dissipation of the heat dissipation components to change LF = chaos The heat generated by the heat can quickly guide the heat to avoid the loss of the luminous power or damage caused by the absence and loss of the LED. Therefore, the shadow of the sound: 'τ 政…, and the whole LED module will sound.
第11頁 1239661 五、發明說明（7) 上的其他的L E D，不僅簡單且不需外加散熱器，能有效 節省成本，確實達到散熱之功效，顯已具有新穎性及進步 性之要件，爰依法提出發明之申請，祈請 貴審查委員之 詳鑑，惠賜為准予專利之審定，至感德便。Page 111239665 5. The other LEDs on the description of invention (7) are not only simple and do not need an additional heat sink, which can effectively save costs and indeed achieve the effect of heat dissipation. It is obviously a novel and progressive element. When submitting an application for an invention, I ask your reviewing committee for your detailed examination. The benefit is for the examination of the grant of a patent.
第12頁 1239661 圖式簡單說明 一、 圖式說明Page 12 1239661 Schematic description I. Schematic description
圖一係習知L E D模 圖二係習知L E D模 圖三係另一習知L E 圖四係本發明L E D 圖五係本發明L E D 二、 圖號說明 A L E D模組 1 L E D 1 2電路基板 2 3 L E D 3 3 3 4印刷電路板 5散熱件 5 B L E D模組 6電路基板 6 6 6 7 L E D 7 之立體圖。 之剖視圖。 模組之側視圖。 組之立體圖。 組之剖視圖。 電 極 端 導 電 迴 路 架 體 3 1 1 架 腳 2 架 面 3 1 3 架 孔 撐 件 3 2 1 撐 管 2 鰭 片 3 2 3 結 合 部 晶 片 3 4 金 屬 接 線 接 合 孔 5 2 溝 槽 基 板 6 2 導 電 迴 路 a 上 層 散熱 構件 b 下 層 散熱 構件 散 熱 孔 散 熱 構 件 電 極 端Figure 1 is a conventional LED model. Series 2 is a conventional LED model. Series 3 is another conventional LE. Figure 4 is a LED of the present invention. Figure 5 is a LED of the present invention. 2. Drawing numbers illustrate ALED module 1 LED 1 2 circuit board 2 3 LED 3 3 3 4 printed circuit board 5 heat sink 5 BLED module 6 circuit board 6 6 6 7 LED 7 perspective view. Cutaway view. Side view of the module. Set of perspective views. Sectional view of the group. Electrode end conductive circuit frame body 3 1 1 Frame leg 2 Frame surface 3 1 3 Frame hole support 3 2 1 Support tube 2 Fin 3 2 3 Bonding wafer 3 4 Metal wiring joint hole 5 2 Groove substrate 6 2 Conductive circuit a Upper radiating memberb Lower radiating member