KR20120063453A

KR20120063453A - Metal pcb, led module and led device

Info

Publication number: KR20120063453A
Application number: KR1020110130574A
Authority: KR
Inventors: 이형곤
Original assignee: 이형곤
Priority date: 2010-12-07
Filing date: 2011-12-07
Publication date: 2012-06-15

Abstract

PURPOSE: A metal circuit board, a light emitting module and a light emitting device are provided to maximize heat dissipation by efficiently discharging heat from a light emitting chip through the metal circuit board. CONSTITUTION: A COB(Chip On Board) includes a PCB(1,3) and metal thermal interface materials(5). An electrode pad is located on one side of the PCB to mount a conductive circuit for power wiring and a conductive terminal for supplying power. The electrode pad includes a first electrode pad(7) and a second electrode pad(9). A heat radiation surface of an LED is mounted on a part of the thermal interface materials. A PCB includes a slit in a longitudinal direction.

Description

Metal Circuit Board, Light Emitting Module and Light Emitting Device {METAL PCB, LED MODULE AND LED DEVICE}

The present invention relates to a metal circuit board with improved heat dissipation characteristics among components used for a semiconductor light emitting package such as an LED, a light emitting module and a light emitting device comprising the same, and parts used for a mobile device, a screen display device and an lighting device. And technology associated with the product.

In the light emitting device, fluorescent lamps, mercury lamps, halogen lamps and a wide variety of types have been developed and used, including incandescent lamps having the longest origin. Regardless of its kind, it has advantages and disadvantages. In recent years, the demand for energy saving and eco-friendly products is increasing, and LIGHT EMITTING DEVICE (LED) is attracting attention as an alternative to meet the demand. LED is a kind of semiconductor diode that converts the current flowing inside the device into light and emits it to the outside. In order to use such a light emitting semiconductor diode in daily life, it is necessary to complete a module or device that is mounted on a designated circuit board in some form and supplies electricity. Circuit boards commonly used to complete such modules and devices include FR4 substrates, which are common circuit boards, and MCPCBs including metal cores that improve thermal conductivity.

The FR4 substrate used as a general electrical and electronic circuit board is very poor in thermal conductivity efficiency, and MCPCB has a complicated manufacturing method and a high material cost, which inevitably reduces the competitiveness in terms of product cost. The presence of an insulating layer that is essentially used to form makes the thermal conductivity poor.

In order to improve this problem, a number of configurations such as those proposed in Korean Patent Applications 10-2006-0067250 and 10-2006-7002025 have been filed. These configurations seem to be the key to solving some of the issues at issue in the MCPCB. In any case, however, the above-mentioned patents must penetrate at least the heat dissipation area of the LED or the PCB area above the light emitting area to the perforated state. Such a drilling operation is a waste of materials, as well as a serious waste generation, deterioration of the work environment due to dust generation and equipment purchase cost for this operation is increased and productivity is greatly reduced. In addition, in order to accurately mount the LED on the perforated portion, mounting electrode pads must be provided to fit therein. Naturally, circuit design must be constrained for this. In particular, in order to manufacture a high power light emitting device in which a large number of LEDs are mounted on a single PCB, the above problems become more serious. In addition, when the size of the hole is strictly controlled and manufactured to have accurate dimensions, the position control process for the LED mounting process also inevitably lowers work efficiency and yield, and the specialized work environment and equipment for the drilling and mounting work are required. And devices are needed. More than anything. The most important problem is the cost increase of the product caused by the above problems. As described above, attempts have been made to efficiently dissipate heat generated from light emitting chips, improve components and processes, and reduce costs, but there is still a need for improvement and demand.

In order to solve the above problems, the present invention eliminates waste of pcb materials and minimizes waste generation, and widens the choice in mounting the LED as well as the circuit design and the selection of heat dissipation, improving productivity and improving the working environment. By reducing the equipment cost, the heat dissipation efficiency is maximized and provides a competitive MPCB and a light emitting module and a light emitting device including the same.

According to the present invention, in manufacturing a metal circuit board (MPCB), a light emitting module, and a light emitting device used in a light emitting device including an LED, it eliminates the waste of pcb material, minimizes the waste generation, In addition to the selection, the choice of LED mounting location is expanded, and the heat dissipation efficiency is maximized and the competitiveness is improved through productivity improvement, work environment improvement and facility cost reduction.

1 is a metal PCB (MPCB) formed by forming a pair of electrode couple separately on the PCB divided into two and combined on the heat insulating material
2 is a MPCB formed by combining a heat sink and a slit-type PCB that is divided into a first PCB and a second PCB and left only at an end by forming a slit long in the center without completely cutting the PCB in FIG.
Figure 3 is an MPCB including a connector connecting the first PCB and the second PCB in Figure 1
Figure 4 is a longitudinal cutaway view of Figure 2
FIG. 5 is an MPCB configured by combining a plurality of combinations of FIG. 3 to mount a plurality of LEDs in a width direction (a plurality of stripe-shaped protrusions may be formed on one heat dissipation material).
FIG. 6 is a cutaway view of the LED (LED chip or LED package) mounted on the MPCB of FIG. 1 and then cut in the width direction (in the drawing, the LED package is mounted by the surface mounting method, but the LED chip is placed on the heat dissipating material). Bonding with the electrode pad by wire bonding method after mounting is possible-not shown)
7 is configured by changing the size and shape of the PCB and the heat dissipation in Figure 6
8 is a projection depression formed laterally
FIG. 9 is a light emitting device which combines the second heat dissipating material with that of FIG.
FIG. 10 is a light emitting device in which a LED chip is mounted instead of an LED package in FIG. 9 and connected to an electrode pad provided on a PCB by a bonding wire;
Figure 11 is a light emitting module configured to press the LED from above by further introducing a pressurized substrate on the one of Figure 7
FIG. 12 illustrates a metal circuit board and an LED chip provided with wire bonding pads (or soldering pads) electrically connected to the N and P electrodes of the LED chip.
Figure 13 is an exemplary cross-sectional view of Figure 12
14 is a cross-sectional view of a light emitting module formed by installing one PCB in the center and electrically connecting the LED chips mounted on both sides.
15 is a cross-sectional view of a metal circuit board and an LED chip including one unit PCB and one heat dissipation material.

In one aspect of the present invention, a metal circuit board for a chip on board (COB) or package on board (POB) for a light emitting device comprising at least one unit PCB and at least one metallic heat dissipating material, at least one of the at least one PCB One side is provided with a conductive circuit for power wiring, a conductive terminal (or soldering point) for power supply, and electrode pads for mounting a plurality of LED (chip or package) electrodes (or electrode wires), and at least one of the PCBs. One side is provided with a state in which the heat dissipation is coupled, wherein the heat dissipation is at least a portion of the heat dissipation surface of the LED (chip or package) is mounted, at least one of the heat dissipation surface of the heat dissipation surface of the heat dissipation member to be mounted The place is not covered by the PCB and is exposed to the outside, and the unit PCB is electrically connected to an electrode pad provided on its surface. The connected LED is opened in at least one direction without completely enclosing the heat dissipation mounting surface of the heat dissipation material to be mounted, and the heat dissipation mounting surface on which the heat dissipation surface of the LED is mounted is viewed from an upward direction perpendicular to the heat dissipation chamber mounting surface. At least some of the heat dissipation mounting surfaces are not completely surrounded by one of the unit PCBs and are open in at least one direction of the unit PCBs, and at least one (or all) heat dissipation mounting surfaces are the outermost sides of the unit PCBs. Provided is a metal circuit board, characterized in that it is not located within the unit PCB self area with its margins and is configured to exist in a place other than the unit PCB self area.

COBs or POBs for light emitting devices are manufactured by mounting an LED chip or a package on a circuit board. The circuit board is provided with a conductive circuit for power wiring for supplying power to each LED to be mounted, and a conductive terminal or soldering point for connecting the power wire supplied from the power supply device to the conductive circuit itself. In addition, electrode pads connected to the wiring circuit are provided to mount a plurality of LED electrodes or wires. The metal heat dissipation member is provided with a heat dissipation chamber surface exposed to the outside in order to allow the heat dissipation surface of the LED to be mounted on a portion thereof. The unit PCB has a shape in which the LED electrically connected to the electrode pad provided on its surface is opened in at least one direction without completely enclosing the heat dissipation mounting surface of the heat dissipation material to be mounted, and the heat dissipation surface of the LED is mounted. When the heat dissipation chamber mounting surface is viewed in an upward direction perpendicular to the heat dissipation chamber mounting surface, at least some of the heat dissipation chamber mounting surfaces are not completely surrounded by one of the unit PCBs, and are open in at least one direction of the unit PCBs. At least one (or all) heat dissipation mounting surface is not located within the unit PCB self area, which is limited to the outermost edge of the unit PCB, and the configuration is such that the configuration exists in a place other than the unit PCB self area. Note of the present invention selected to mount the LED on the metallic heat dissipation while omitting the step Features. This configuration is a configuration that can completely solve all of the above problems because it can be provided by cutting a PCB larger than the unit PCB size, a non-limiting example PCB original board and the like to a specified specification of the desired shape.

According to another aspect of the present invention, the unit PCB is provided with two electrodes including a first electrode pad and a second electrode pad which are at least one couple of the electrode pads on one surface, and at least one LED is a pair. Both electrodes forming a metal circuit board is provided that is electrically connected to the electrode pad couple on the one unit PCB. As such, when the first electrode pad and the second electrode pad, which are at least one couple of the electrode pads, are included on one surface of the unit PCB, the metal circuit board can be completed with only one unit PCB. This is because the steps are simplified and the unit cost can be reduced. For a light emitting device including a COB in which an LED chip is mounted on the heat dissipating material, a bonding wire connected to the LED chip may be simply bonded onto the electrode pads. However, in order to complete the light emitting device using a metal circuit board for POB in which the LED package is mounted on the heat dissipating material and the PCB, a package in which two electrodes are drawn out on one side is specially fitted to the electrode pad of the PCB. It is to use that can effectively combine the heat dissipation surface of the LED with the heat dissipation material and improve the heat dissipation efficiency. Of course, even in the case of POB of this embodiment, most of the above benefits can be obtained.

According to another aspect of the present invention, the metal circuit board includes two or more PCBs including a first PCB and a second PCB, and the first electrode pad and the second electrode pad forming at least one couple of the electrode pad couples include: Among the plurality of PCBs, a metal circuit board is provided, which is provided in a divided state on different PCBs. The metal circuit board of this aspect may be useful when the LED package manufactured in the special form cannot be provided as described above, but may also be used for a COB type light emitting device.

According to another aspect of the invention, the PCB is provided with a metal circuit board, characterized in that provided with a heat dissipation chamber mounting surface of the heat dissipating material on at least both sides. The configuration of this embodiment is not limited to both sides of the PCB, it may take a configuration having a heat dissipation mounting surface of the heat dissipation around the edge of the PCB. This configuration is one configuration that can mount many LEDs with a minimum PCB area.

According to another aspect of the present invention, the heat dissipation member is provided with a stripe (STRIPE) shape irregularities provided along a longitudinal direction on at least the side on which the PCBs are installed, and a part of the protrusions or depressions of the irregularities is a heat dissipation surface of the LED. This is a part to be mounted, and a part of the surface other than the part on which the heat dissipation surface of the LED is mounted is provided with the MPCB, characterized in that the PCB is coupled. One of the reasons for providing the stripe-shaped concave-convex portion is to correct a height with a PCB installed on at least both sides of the concave-convex portion to be a specified condition. The reason for providing along the longitudinal direction as described above is a shape having a long length. This is because it is advantageous for continuous molding. It means the shape suitable for continuous work such as extrusion, rolling or roll press. The uneven portion of the heat dissipating material formed in this aspect should be a portion on which the heat dissipation surface of the LED is mounted, and the PCB should be coupled to any part of a low height other than the uneven portion to correspond to the uneven portion of the heat dissipating part and the height of the PCB. Both the electrode part and the heat dissipation part of the LED are in close contact with the designated surface, and at the same time, the overall thickness of the product becomes thin.

According to another aspect of the invention the electrode pads are provided on the bottom of the PCB, the electrode of the LED is located between the electrode pad and the heat dissipating material, the light exit direction of the LED is to be upward of the PCB A metal circuit board is provided, which is mounted. This configuration is somewhat cumbersome in the bonding process after mounting, etc., but is advantageous for the operation of bonding to the heat dissipating material surface at a higher pressure.

According to another aspect of the present invention, the PCB and / or the heat dissipating material is provided through a step of cutting at least one time in at least one of the longitudinal direction and the width direction is provided. The reason for undergoing the step of cutting the PCB and the heat dissipation material at least once in the longitudinal direction or the width direction is to omit the step of drilling the hole, which is proposed in the prior art, and to simply cut from the disc to replace the hole in the prior art. In order to improve productivity and reduce product cost by making and dividing the disc into large area PCB to produce several PCBs in the longitudinal direction and the width direction at the same time, it is formed long in the longitudinal direction to have the specified cross-sectional area. This is because it increases productivity, lowers product cost and frees product design without special customized equipment and equipment by using extrusion, rolling, press, roll press and bending as a manufacturing method.

According to still another aspect of the present invention, the heat dissipation member is provided with an uneven portion at least on a surface other than the surface facing the PCB, and the uneven portion is provided with an MPCB characterized in that it is custom-bonded with the second heat dissipating member. Since the MCPCB has a function of releasing thermal energy from its surface, some heat dissipation functions may be performed without additionally combining the second heat dissipation material, but may be used in combination with the second heat dissipation material for faster heat dissipation. It is preferable that the contact surface with the heat dissipation member is larger in bonding with the second heat dissipation member. As a method for increasing the contact surface in a limited-size product, a method of custom fabricating and joining mutually uneven surfaces is proposed. In this way, more heat energy can be transferred to the combined second heat dissipation material.

According to still another aspect of the present invention, there is provided a light emitting device (MPCB) comprising at least one PCB and at least one heat dissipating material, wherein the PCB is provided with a slit (SLIT) formed along a longitudinal direction, and the heat dissipating material is connected to the PCB. A stripe-shaped protrusion provided along a longitudinal direction is provided on a facing surface, and a portion of the protrusion is a portion on which a heat dissipation surface of the LED exposed toward the surface on which the electrode pads are provided through the slit is mounted. A portion of the surface other than the portion where the heat dissipation surface of the LED is mounted is a portion to which the PCB is coupled, and the inner length of the slit is longer than or equal to the length of the stripe, and the stripe protrusion may be completely inserted inside the slit. The PCB is provided with electrode pad couplers for mounting two or more LEDs. At least one of the first electrode pad and the second electrode pad of the electrode pad couple is provided with a plurality of couples in a divided state on the other side with the stripe-shaped protrusion between, one or more of the heat dissipating material is in the longitudinal direction MPCB is provided characterized in that it is provided through a step of cutting at least once. As such, the method of forming and using long slits on the PCB may be less than the above method of forming the MPCB by cutting the PCB into two or more sides, but the productivity may be somewhat lower than that of each LED to be mounted when manufacturing the heat dissipating material. It is a very advantageous and convenient method in that it can cut and use universal heat dissipating material only by length compared to the method of forming and manufacturing protrusions respectively. Therefore, it improves to have strong competitiveness in terms of product cost.

According to still another aspect of the present invention, there is provided a light emitting device (MPCB) including at least one PCB and at least one heat dissipating material, wherein the PCB has a slit (SLIT) formed along a length direction and is formed on both sides of the slit of the PCB. The electrode pad couplers for mounting at least two LEDs are provided, and the first electrode pads and the second electrode pads of the electrode pad couples are provided in a state in which they are divided on the other side with an inner portion of the slit interposed therebetween. The slit portion is provided so that the partial area of the heat dissipating material is exposed, and at least one of the heat dissipating materials is provided through the step of cutting at least one time in the longitudinal direction is provided. The configuration of this aspect can be achieved by combining the PCB with the slit and electrode couples in one plane of the heat dissipation, which is combined with the heat dissipation having the stripe-shaped protrusions since the PCBs are combined to protrude above the plane. Rather, the external light extraction efficiency is inevitably deteriorated, but it is advantageous in that it is possible to use commonly available heat dissipating materials as components. The reason for arranging the first electrode pad and the second electrode pad on the different PCBs between the first PCB and the second PCB is that the two electrode pads are disposed on the surface of the heat dissipation member exposed between the two PCBs, that is, the heat dissipation chamber surface. This is for mounting the heat dissipation surface of the LED to be mounted face to face.

According to another aspect of the present invention, the PCB is provided with electrode pad couples for at least three or more LEDs, and the PCB may be referred to as A on which the first electrode pad is provided, and B on which the second electrode pad is provided. In this case, two or more of the three or more electrode pads provided on the A side are electrically connected to each other, and two or more of the electrode pads provided on the B side are provided with the MPCB. MPCB, which consists of a PCB of such a configuration, provides a light emitting module capable of supplying a higher voltage power than a unit LED supply power by combining LEDs installed in series.

According to another aspect of the present invention, there is provided an MPCB, wherein the PCB is flexible or three-dimensionally molded. This configuration will be a configuration that can respond to the electronic products aimed at light and small.

According to another aspect of the present invention there is provided a light emitting module comprising one or more LEDs and one or more of the MPCB provided above. The heat dissipation material included in the light emitting module may be manufactured separately as described above, but may be replaced with a part having excellent thermal conductivity among parts of the light emitting device including the light emitting module.

According to still another aspect of the present invention, there is provided a light emitting device comprising a housing (or chassis) of a light emitting device as a heat radiating material (or a second heat radiating material) in a light emitting device including the MPCB. When manufacturing the MPCB of the present invention by completely cutting the PCB from the above, as shown in FIG. 1, the first PCB 1 and the second PCB 3 are disposed on the electrode pad couplers 7 and 9 on the heat dissipating material 5. It is possible to align and combine by a method of aligning, as shown in Figures 3 and 5, the first combination by the connector 10, and then combined with the heat dissipating material (5) is also possible. This combination order and method itself are not limiting.

As shown in FIG. 2, when the PCB is manufactured in a slit form without completely cutting the PCB, the process of aligning the first PCB and the second PCB may be omitted, but a separate device and space for slit processing may be required as well as dust or particles. As a result, the work space becomes poor, and furthermore, waste and consumption of PCB materials and tools are accompanied. When manufacturing the MPCB using the heat sink including the slit-shaped PCB and the protrusion formed along the longitudinal direction, as shown in Figs. 2 and 4, the length of the protrusion in the heat dissipating material should be shorter or equal to the inner length of the slit. Inserted upward through the slit, the height of the upper surface of the protruding portion 501 and the PCB is the same, thereby facilitating mounting of a universal LED.

As shown in FIG. 5, when manufacturing a light emitting module including a plurality of LED units connected in series and / or parallel, first electrode pads 7 and second electrode pads 9 on a completely cut PCB. May be arranged together, but is not a limiting example.

In the light emitting module comprising a metal circuit board and one or more LEDs provided above, the LED is applied to the electrode of the PCB when pressure is applied to couple the light emitting module in a state in which the light emitting module is in close contact with the heat dissipating material or the second heat dissipating material. Problems such as falling contact or poor contact may occur from the pads. As a method for preventing such a problem, the light emitting module may be manufactured by additionally using a pressurizing substrate 35 capable of pushing the LED and / or the electrode of the LED from above, but is not limited thereto.

In the above, the LED is mainly described as an LED package, but as shown in FIG. 10, a light emitting module having an LED chip mounted on the heat dissipating member and wired on a PCB by a bonding wire 33 is also possible.

In the above description, the first and second electrode pads are described with reference to the LED having two electrodes when describing the electrode pad couple, but the present invention is not limited thereto. That is, the MPCB may be configured by providing electrode pad couple terminals to mount an LED having three or more terminals. In addition, the heat dissipating material may be manufactured separately and provided, but a part of the light emitting device including the LED may be used to replace the heat dissipating material by using a good thermal conductivity among the housing, case, or component of the light emitting device.

The mounting method may use one or more methods selected from the group including soldering, bonding, heat dissipation sheet insertion, grease insertion, and heat dissipation adhesive bonding, but is not limited thereto.

The first electrode pad and the second electrode pad formed on the PCB in the above should be formed to be spaced apart at a corresponding interval to correspond to the position of the LED electrode terminal to be mounted thereon, but in the case of manufacturing and combining the PCB by cutting method MPCB In the case of, in consideration of the cutting loss, it is prepared in the state of being almost stuck, and after cutting, what is necessary is to open and combine by space | interval corresponding to the said LED electrode. Therefore, the PCB material can be reduced as much as well as provide a variety of economic, environmental, and health benefits described above.

According to another aspect of the present invention, the LED is an LED chip, and the metal circuit board is a component of a chip on board. A metal circuit board is provided. This is because a COB type light emitting unit is much smaller in size than a POB type product which is completed by mounting an LED package on a circuit board.

Attempts have been made to improve the heat dissipation efficiency and use a ceramic substrate as a heat dissipation substrate or a circuit board of the LED light emitting unit as a material similar to the thermal expansion coefficient of the LED chip. To this end, according to another aspect of the present invention, the metal substrate is provided with a metal circuit board comprising at least one ceramic layer and at least one metal layer. The realization of this aspect can be configured by laminating a metal sheet and a ceramic sheet, which are well known as a green tape, but are not limited and can be used as long as the material can be combined with the metal sheet.

Since the air-cooled cooling method that is commonly used is limited, in order to more effective cooling, the field of introducing a water-cooled or heat pipe cooling method is increasing. For this purpose, the metal substrate may be provided with a metal circuit board, characterized in that it has an internal channel (CHANNEL) through which one or more cooling fluid and / or vapor can move. In general, in the case of water cooling, the inner channel is connected to a fitting connected to at least one cooling water supply line, and is connected to a fitting connected to at least one cooling water discharge line to form a cooling circuit. On the other hand, when the inner channel is used as a vacuum channel constituting the heat pipe, unlike the cold water method, the inner channel is a vacuum space of a closed structure completely isolated from the outside and is manufactured in a form including a working fluid therein. . Such a heat pipe is a configuration of a general cooling method used for a long time, so detailed description thereof will be omitted.

According to another aspect of the present invention for the above configuration is provided a metal circuit board, characterized in that the inner channel is a cooling water channel or a vacuum pipe for the heat pipe.

1; first PCB 3; second PCB 5; heat dissipation material 7; first electrode pad 9; second electrode pad 10; connector (or connecting circuit board-mechanically and / or electrically connects the first and second PCBs) 11; A first PCB power supply electrode 13; a second PCB power supply electrode 15; a slit PCB 17 formed of a slit without completely cutting the PCB, divided into a first PCB and a second PCB, and leaving only an end portion thereof; an LED (LED chip or LED package) 19; A solder layer 21 formed on the first electrode pad; a solder layer 23 formed on the second electrode pad; a solder layer 25 connecting the heat dissipation portion of the LED to the heat dissipation material; a hole formed in an extra area outside the heat dissipation element in the PCB (upper and lower sides of the hole May be formed in an insulated or conductive state; 27; a second heat dissipation material (or may be replaced with a housing or a case of a light emitting product, and a heat dissipation fin may be omitted) 29; a heat dissipation fin 31; a first LED chip ( CHIP) 32; Second LED chip 33; Bonding wire 35; Pressing substrate 51; Before first PCB power supply Pole A 52; first PCB power supply electrode B
53; second PCB power supply electrode C 54; second PCB power supply electrode D 56; first wire bonding pad (N pole of second LED chip) 57; First wire bonding pad (N pole of the first LED chip) 58; second wire bonding pad (P pole of the second LED chip) 59; second wire bonding pad (P pole of the first LED chip)
501; The upper surface of the stripe (STRIPE) shape of the continuously formed in the heat dissipating material (STRIPE) may be a surface on which the heat dissipation surface of the LED is mounted, the LED heat dissipation mounting surface may be selected from the surface of the heat dissipating material and the upper surface of the protrusion It is not limited to) 503; low-height portion 505, 507, 509 other than the protrusion of the upper surface of the heat insulating material; irregularities formed other than the surface to which the PCB is bonded 511; LED chip mounting portion

Claims

A metal circuit board for a chip on board (COB) or package on board (POB) for a light emitting device comprising at least one unit PCB and at least one metallic heat dissipating material, wherein at least one side of the at least one PCB is electrically conductive for power wiring Electrode pads for mounting a circuit, a power supply conductive terminal (or soldering point), and a plurality of LED (chip or package) electrodes (or electrode wires) are all provided. And a heat dissipation surface of an LED (chip or package) is mounted on at least a portion of the heat dissipation material, and at least one of the heat dissipation surface of the heat dissipation material on which the heat dissipation surface of the LED is to be mounted by the PCB. The unit PCB is not covered and is exposed to the outside, and the LED is electrically connected to the electrode pad provided on the surface of the unit PCB. The heat dissipation surface of the heat dissipation member is not completely enclosed in at least one direction, and the heat dissipation surface on which the heat dissipation surface of the LED is mounted is viewed in an upward direction perpendicular to the heat dissipation surface. At least a part of the unit PCB is not completely surrounded by one of the unit PCBs and is open in at least one direction of the unit PCB, and at least one (or all) heat dissipation surface of the unit PCB is limited to the outermost edge of the unit PCB. Metal circuit board, characterized in that it is not located within the area of the unit PCB itself is configured to exist in a place other than the unit PCB area

According to claim 1, wherein the unit PCB is provided with two electrodes including a first electrode pad and a second electrode pad to be at least one couple of the electrode pad on one surface, at least one LED is a pair of two electrodes All of the metal circuit board, characterized in that electrically connected to the electrode pad couple on the unit PCB

The metal circuit board of claim 1, wherein the metal circuit board includes two or more PCBs including a first PCB and a second PCB, and the first electrode pad and the second electrode pad forming at least one couple of the electrode pad couples include the plurality of PCBs. The metal circuit board is characterized in that it is provided divided into different PCB

The metal circuit board of claim 1, wherein the PCB includes at least two sides of a heat dissipation mounting surface of the heat dissipation material.

The heat dissipating member of claim 1 is provided with a stripe-shaped concave-convex portion provided along a longitudinal direction at least on a side on which the PCBs are installed, and a part of a protrusion or recess of the concave-convex portion is a heat dissipating surface of an LED. A metal circuit board, characterized in that the mounting surface is a heat dissipation chamber, and a part of the surface other than the heat dissipation chamber is a part to which the PCB is coupled.

In a metal circuit board for a light emitting device comprising at least one PCB and at least one heat dissipating material, the PCB has a slit (SLIT) formed along the longitudinal direction, the heat dissipating material in the longitudinal direction on the surface facing the PCB A stripe (STRIPE) shape protrusion provided along the side is provided, and a portion of the protrusion is exposed to the surface provided with the electrode pads through the slit to mount the heat dissipation surface of the LED, and a portion of the surface other than the protrusion. Is a portion to which the PCB is coupled, and an inner length of the slit is longer than or equal to the length of the stripe, and the stripe protrusion may be completely inserted into the slit, and at least two or more LEDs may be mounted on the PCB. Electrode pad couplers are provided for the at least first electrode pad coupler. The electrode pad and the second electrode pad are provided with a plurality of couples separated from each other with the stripe-shaped protrusion interposed therebetween, and at least one of the heat dissipating materials is provided through a step of cutting at least once in the longitudinal direction. Metal circuit board, characterized in that

In a metal circuit board for a light emitting device comprising at least one PCB and at least one heat dissipating material, the PCB has a slit (SLIT) formed long along the longitudinal direction, at least two LED mounting on both sides of the slit of the PCB Electrode pad couplers are provided for the first electrode pads and the second electrode pads of the electrode pad couplers are provided in a state in which they are divided on the other side with an inner portion of the slit interposed therebetween, The metal circuit board is combined to expose a partial area, and at least one of the heat dissipating members is provided through a step of cutting at least one time in the longitudinal direction.

8. The electrode pads of claim 1, wherein the electrode pads are provided on a bottom surface of the PCB, and the electrodes of the LEDs are positioned between the electrode pads and the heat dissipating material. Metal circuit board, characterized in that mounted to be upward

The metal circuit board according to any one of claims 1 to 7, wherein the PCB and / or the heat dissipating material is provided through a step of cutting at least one time in at least one of a longitudinal direction and a width direction.

The heat dissipating material according to any one of claims 1 to 7, wherein the heat dissipating member is provided with at least one surface other than the surface facing the PCB, the uneven portion is characterized in that the uneven portion is combined with the uneven portion of the second heat radiation material. Metal circuit board

The PCB according to any one of claims 1 to 7, wherein the PCB is provided with electrode pad couples for at least three or more LEDs, wherein the PCB is provided with the first electrode pad A and the second electrode pad A When B is a metal circuit board, characterized in that two or more of the three or more electrode pads provided on the A side is electrically connected to each other, and two or more of the electrode pads provided on the B side are also electrically connected to each other.

The metal circuit board of any one of claims 1 to 7, wherein the PCB is flexible or three-dimensionally molded.

A light emitting module comprising a metal circuit board provided in any one of claims 1 to 7 and one or more LEDs.

A light emitting device comprising the metal circuit board provided in any one of claims 1 to 7, wherein the housing (or chassis) of the light emitting device is included as the heat dissipating material (or the second heat dissipating material). Light emitting device

The method according to any one of claims 1 to 7, LED is As LED chip The metal circuit board is COB ( CHIP ON BOARD Is a component of Metal ash Board

The metal circuit board of any one of claims 1 to 7, wherein the metal substrate comprises at least one ceramic layer and at least one metal layer.

The metal circuit board of any one of claims 1 to 7, wherein the metal substrate has an internal channel through which one or more cooling fluids and / or vapors can move.

The metal circuit board of claim 1, wherein the inner channel is a coolant channel or a vacuum channel for a heat pipe.