CN112639671A

CN112639671A - Electronic device

Info

Publication number: CN112639671A
Application number: CN201880094134.0A
Authority: CN
Inventors: 刘景�; 陈松亚
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-09-14
Filing date: 2018-09-14
Publication date: 2021-04-09
Also published as: WO2020052028A1; WO2020051904A1; CN112640395A; CN112640597A; WO2020052030A1

Abstract

An electronic device (100) includes a first portion (10), a second portion (20), and a flexible thermally conductive layer (30). The first portion (10) comprises a first heat radiator (11) and a main board component (12), the main board component (12) is connected to one side of the first heat radiator (11) in a heat conduction mode, the second portion (20) comprises a second heat radiator (21) and a battery component (22), the battery component (22) is connected to one side of the second heat radiator (21) in the heat conduction mode, and the flexible heat conduction layer (30) is connected with the first heat radiator (11) and the second heat radiator (21) in the heat conduction mode. The flexible heat conduction layer (30) is connected with the first heat radiator (11) and the second heat radiator (21) in a heat conduction mode, so that heat of the main board component (12) can be transmitted to the second heat radiator (21) through the first heat radiator (11) and the flexible heat conduction layer (30) to be radiated, and similarly, heat of the battery component (22) can also be transmitted to the first heat radiator (11) through the second heat radiator (21) and the flexible heat conduction layer (30) to be radiated. When the heat generation amount of the main board component (12) or the battery component (22) is large, the heat can be better dissipated due to the large heat dissipation area, and further the local overheating of the electronic device (100) can be prevented, so that the user experience is improved.

Description

Electronic device

Technical Field

The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

An electronic device in the related art, such as a cellular phone, includes a first part and a second part. Typically, the first part is provided with a main board and the second part is provided with a battery. The heat generated by the heating of the main board is radiated by heat radiation and natural convection through the rear cover of the first part, and the heat generated by the heating of the battery is radiated by heat radiation and natural convection through the rear cover of the second part. However, because the heat productivity of the main board is large, the first part and the second part are two independent areas respectively, and the first part can not transfer heat to the second part to form uniform temperature heat dissipation, so that the surface temperature of the rear cover of the first part is high, and the user experience is affected.

Disclosure of Invention

The invention provides an electronic device.

The electronic device comprises a first part, a second part and a flexible heat conduction layer, wherein the first part comprises a first heat radiator and a main board component, the main board component is connected to one side of the first heat radiator in a heat conduction mode, the second part comprises a second heat radiator and a battery component, the battery component is connected to one side of the second heat radiator in a heat conduction mode, and the flexible heat conduction layer is connected with the first heat radiator and the second heat radiator in a heat conduction mode.

In the electronic device, the flexible heat conduction layer is connected with the first radiator and the second radiator in a heat conduction mode, so that heat of the main board component can be transmitted to the second radiator through the first radiator and the flexible heat conduction layer to be radiated, and similarly, heat of the battery component can also be transmitted to the first radiator through the second radiator and the flexible heat conduction layer to be radiated. When the heat productivity of the main board component or the battery component is larger, the heat dissipation area is larger, so that the heat can be better dissipated, the local overheating of the electronic device can be prevented, and the user experience is improved.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of an electronic device according to an embodiment of the invention;

FIG. 2 is a schematic perspective view of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic perspective view of an electronic device according to an embodiment of the invention when folded;

FIG. 4 is an exploded perspective view of a portion of an electronic device according to an embodiment of the invention when the electronic device is flattened;

FIG. 5 is an exploded perspective view of an electronic device according to an embodiment of the present invention from another perspective, with the electronic device partially flattened;

FIG. 6 is an exploded perspective view of an electronic device according to an embodiment of the invention;

FIG. 7 is another exploded view of the electronic device according to the embodiment of the present invention;

FIG. 8 is an exploded perspective view of a portion of an electronic device according to an embodiment of the invention when it is flattened;

FIG. 9 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention when the electronic device is flat;

fig. 10 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention when folded.

Description of the main element symbols:

an electronic device 100;

the first portion 10, the first heat sink 11, the receiving groove 110, the first recess 111, the main board member 12, the main board 121, the first chip portion 122, the first shield cover 1221, the first chip 1222, the first heat conduction layer 1223, the second chip portion 123, the second shield cover 1231, the second chip 1232, the second heat conduction layer 1233, the first cover 13, the first mounting cavity 130, the third heat conduction layer 14, the second portion 20, the second heat sink 21, the second recess 211, the battery member 22, the second cover 23, the second mounting cavity 230, the fourth heat conduction layer 24, the flexible heat conduction layer 30, the support plate 31, the hinge assembly 40, the hinge body 41, the connector 42, the first notched groove 43, the second notched groove 44, the flexible panel assembly 50, the support frame 51, and the flexible display screen 52.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1-10, the electronic device 100 according to the embodiment of the invention may be a flexible foldable electronic device, such as a flexible foldable mobile phone or a flexible foldable tablet computer. The electronic device 100 comprises a first portion 10, a second portion 20 and a flexible thermally conductive layer 30.

The first portion 10 includes a first heat radiator 11 and a main board member 12. The main board member 12 is thermally connected to one side of the first heat radiator 11. The second portion 20 includes a second heat radiator 21 and a battery section 22. The battery part 22 is thermally connected to one side of the second heat radiator 21. The flexible heat conductive layer 30 thermally connects the first heat sink 11 and the second heat sink 21. In this way, since the flexible heat conduction layer 30 is thermally connected to the first heat sink 11 and the second heat sink 21, the heat of the motherboard component 12 can be transferred to the second heat sink 21 through the first heat sink 11 and the flexible heat conduction layer 30 for heat dissipation, and similarly, the heat of the battery component 22 can also be transferred to the first heat sink 11 through the second heat sink 21 and the flexible heat conduction layer 30 for heat dissipation. When the heat generation amount of the main board component 12 or the battery component 22 is large, the heat dissipation area is large, so that the heat can be better dissipated, and the local overheating of the electronic device 100 can be prevented, thereby improving the user experience. In particular, since the heat generation amount of the main board member 12 is larger than that of the battery member 22, the flexible heat conductive layer 30 can transfer the heat from the area of the main board member 12 to the area of the battery member 22, thereby achieving a good temperature equalization effect.

The shape of the electronic device 100 may be set as appropriate, and may be, for example, a rectangular parallelepiped shape. The electronic device 100 is capable of switching between an unfolded state and a folded state. When the electronic device 100 is bent up to approximately 180 degrees (as shown in fig. 3 and 10), the first portion 10 and the second portion 20 substantially overlap, and the spacing between the main board member 12 and the battery member 22 is small, which may result in heat dissipation between the main board member and the battery member being affected if the flexible heat conductive layer 30 is not provided. In the embodiment of the present invention, the flexible heat conduction layer 30 is disposed on the other side of the first heat sink 11 and the other side of the second heat sink 21, and the flexible heat conduction layer 30 can increase the heat dissipation areas of the main board component 12 and the battery component 22, thereby facilitating heat dissipation.

It can be understood that in order to make the first and

second heat radiators

11 and 21 have a large heat dissipation area, the first heat radiator 11 may be shaped like a plate, and the second heat radiator 21 may be shaped like a plate. In addition, the first heat radiating body 11 and the second heat radiating body 21 can be spaced, which is more favorable for heat radiation.

In some embodiments, the first heat sink 11 and the second heat sink 21 are close to each other when the electronic device 100 is folded, and are far from each other when the electronic device 100 is unfolded. Thus, even if the main board member 12 and the battery member 22 approach each other when the electronic device 100 is bent, the first heat radiator 11 and the second heat radiator 21 in combination with the flexible heat conductive layer 30 can dissipate heat generated by the main board member 12 and heat generated by the battery member 22, and when the electronic device 100 is unfolded, the first heat radiator 11 and the second heat radiator 21 are away from each other, which is beneficial to heat dissipation.

In some embodiments, the flexible heat conduction layer 30 is used for transferring heat of the first heat sink 11 to the second heat sink 21 for emission. Thus, the heat generated by the main board component 12 can be dissipated in time, and then the balanced heat dissipation is achieved.

In some embodiments, the flexible heat conductive layer 30 is located on the opposite side of the first heat sink 11 from the main board member 12 and the battery member 22. Thus, the flexible heat conduction layer 30 and the first heat sink 11 are in full contact, so that heat generated by the main board 12 can be fully dissipated to the flexible heat conduction layer 30 through the first heat sink 11, and the purpose of balanced heat dissipation is achieved.

In some embodiments, the electronic device 100 includes a hinge assembly 40. A hinge assembly 40 connects the first portion 10 and the second portion 20. The hinge assembly 40, the first heat sink 11 and the second heat sink 21 are disposed on the same side of the flexible heat conductive layer 30. In this manner, the hinge assembly 40 may effect relative rotation of the first and

second portions

10, 20.

In the present embodiment, the hinge assembly 40 is bendable as a whole. The first and

second parts

10 and 20 are symmetrically disposed at both sides of the hinge assembly 40. The first and

second sections

10, 20 are switchable about the hinge assembly 40 between an extended state and a folded state.

In some embodiments, the flexible thermally conductive layer 30 covers the hinge assembly 40 and is thermally conductively coupled to the hinge assembly 40. As such, the flexible heat conductive layer 30 has a large heat conductive area and can further dissipate heat from the hinge assembly 40.

In some embodiments, the electronic device 100 includes a support plate 31 affixed to the flexible heat conductive layer 30, the support plate 31 being positioned between the hinge assembly 40 and the flexible heat conductive layer 30. In this way, the support plate 31 has a certain supporting effect on the flexible heat conducting layer 30, and the support plate 31 separates the hinge assembly 40 from the flexible heat conducting layer 30, so that the hinge assembly 40 is prevented from wearing the flexible heat conducting layer 30 when being bent, thereby protecting the flexible heat conducting layer 30.

In the present embodiment, the first and

second radiators

11 and 21 are provided on one side of the support plate 31. A flexible heat conducting layer 30 is arranged on the other side of the support plate 31. So, the higher radiator of temperature in first radiator 11 and the second radiator 21 can be conducted the heat to flexible heat-conducting layer 30 by backup pad 31, and then flexible heat-conducting layer 30 can be with the lower radiator of temperature in heat conduction to first radiator 11 and the second radiator 21, then realize the samming heat dissipation.

Preferably, the orthographic area of the support plate 31 on the flexible heat conductive layer 30 substantially covers the flexible heat conductive layer 30 (the size of the support plate 31 may be consistent with the size of the flexible heat conductive layer 30, or the size of the support plate 31 may be slightly larger than the size of the flexible heat conductive layer 30) so that the support plate 31 can completely separate the flexible heat conductive layer 30 and the hinge assembly 40.

In some embodiments, the flexible heat conducting layer 30 is made of graphene or graphite. The support plate 31 is made of metal. Thus, the heat conduction effect of the flexible heat conduction layer 30 and the support plate 31 is better. In one example, support plate 31 may be fabricated from sheet metal steel.

In some embodiments, the first heat sink 11 is formed with a first groove 111. The second heat radiator 21 is formed with a second recess 211. The first and

second grooves

111 and 211 together form the receiving groove 110. The flexible heat conductive layer 30 is partially or completely received in the receiving slot 110. In this way, the accommodating groove 110 improves the stability of mounting the flexible heat conduction layer 30, and increases the contact area between the first heat sink 11 and the flexible heat conduction layer 30 and the second heat sink 21.

In the present embodiment, the support plate 31 and the flexible heat conductive layer 30 are stacked and attached to the housing groove 110 in this order. The shape of the support plate 31 matches the shape of the flexible heat conducting layer 30. The support plate 31 is located between the flexible heat conductive layer 30 and the bottom wall of the receiving groove 110. The flexible heat conducting layer 30 is completely received in the receiving cavity 110, and the thickness of the flexible heat conducting layer 30 is smaller than the depth of the receiving cavity 110, so that other components can be received in the receiving cavity 110.

Further, the hinge assembly 40 includes a bendable hinge body 41 and two bendable connectors 42 provided on the hinge body 41. The hinge body 41 connects the first part 10 and the second part 20. A first notch 43 is formed on one side of the first groove 111, and a second notch 44 is formed on one side of the second groove 211. The top surface of the hinge body 41 is substantially coplanar with the bottom surface of the first recess 111 and the bottom surface of the second recess 211. The two connectors 42 are oppositely disposed on two sides of the top surface of the hinge body 41 near the edge, and the connectors 42 connect the edge of the first notch 43 and the edge of the second notch 44, that is, the connectors 42 can connect the first heat sink 11 and the second heat sink 21. The support plate 31 and the flexible heat conducting layer 30 are both located above the side of the two connectors 42 remote from the hinge body 41.

In some embodiments, referring to fig. 6 and 9, the main board 12 includes a main board 121 and a first chip portion 122. The first chip part 122 includes a first shield case 1221 and a first chip 1222. The first chip 1222 and the first shield case 1221 are disposed on the main board 121. A first shielding 1221 encloses the first chip 1222 and is thermally conductively connected to the first chip 1222. The first shield 1221 is thermally conductively connected to the first heat sink 11. In this way, the heat generated by the first chip 1222 can be dissipated by the first shielding case 1221 being conducted to the first heat sink 11. The first shield 1221 may be used to protect the first chip 1222.

In certain embodiments, the first core portion 122 includes a first thermally conductive layer 1223. The first thermally conductive layer 1223 thermally conductively connects the first shield 1221 and the first chip 1222. As such, the first thermally conductive layer 1223 improves the efficiency of thermal conduction between the first chip 1222 and the first shield cover 1221. The first thermally conductive layer 1223 may be, for example, thermally conductive silicone gel or thermally conductive silicone grease.

In some embodiments, the main board component 12 includes a second chip section 123. The second chip part 123 includes a second shield 1231 and a second chip 1232. The second chip 1232 and the second shield cover 1231 are disposed on a side of the main board 121 facing away from the first chip portion 122. The second shield 1231 covers the second chip 1232 and is thermally connected to the second chip 1232. The second shield 1231 increases the heat dissipation area of the main board assembly 12 and serves to protect the second chip 1232. The heat dissipation between the first chip part 122 and the second chip part 123 does not affect each other, and the heat dissipation efficiency is improved.

In some embodiments, the second chip portion 123 includes a second thermally conductive layer 1233. The second heat conductive layer 1233 thermally connects the second shield 1231 and the second chip 1232. As such, the second heat conductive layer 1233 improves the efficiency of heat conduction between the second chip 1232 and the second shield cover 1231. The second thermal conductive layer 1233 may be, for example, thermally conductive silicone or thermally conductive silicone grease.

In certain embodiments, the first portion 10 includes a thermally conductive first cover 13. The first cover 13 and the first heat radiator 11 are connected and jointly form a first mounting cavity 130. The main board member 12 is accommodated in the first mounting cavity 130. The second shield 1231 is thermally conductively coupled to the first cover 13. In this way, the first cover 13 increases the heat radiation area of the main board member 12 and protects the main board member 12.

In certain embodiments, the first portion 10 includes a third thermally conductive layer 14. The third thermally conductive layer 14 thermally conductively connects the second shield 1231 and the first cover 13. In this manner, the third heat conductive layer 14 improves the efficiency of heat conduction between the second shield 1231 and the first cover 13. The third heat conducting layer 14 may be, for example, a graphite sheet.

In certain embodiments, the second portion 20 includes a thermally conductive second cover 23. The second cover 23 and the second heat radiator 21 are connected and jointly form a second mounting cavity 230. Battery component 22 is located within second mounting cavity 230. The battery part 22 is thermally conductively connected to the second cover 23. In this way, the second cover 23 can protect the battery member 22 while increasing the heat dissipation area of the battery member 22.

In some embodiments, when the electronic device 100 is bent, the first cover 13 and the second cover 23 are close to each other, and a distance between the first cover 13 and the second cover 23 is smaller than a distance between the first heat sink 11 and the second heat sink 21. Thus, when the electronic device 100 is bent, the heat dissipation is more facilitated.

In certain embodiments, the second portion 20 includes a fourth thermally conductive layer 24. The fourth thermally conductive layer 24 thermally conductively connects the battery component 22 and the second cover 23. As such, the fourth thermally conductive layer 24 improves the efficiency of thermal conduction between the battery part 22 and the second cover 23. The fourth thermally conductive layer 24 may be, for example, a graphite sheet.

In some embodiments, the electronic device 100 includes a flexible screen assembly 50. A flexible screen assembly 50 is mounted to a side of the flexible heat conductive layer 30 facing away from the first and

second portions

10, 20. This, in turn, facilitates heat dissipation from the flexible screen assembly 50.

In this embodiment, the flexible heat conductive layer 30 is located between the flexible screen assembly 50 and the support plate 31.

In some embodiments, the flexible screen assembly 50 includes a support frame 51 and a flexible display screen 52. The support brackets 51 are arranged on the side of the flexible heat conducting layer 30 facing away from the first portion 10 and the second portion 20. The flexible display screen 52 is arranged on the side of the support frame 51 facing away from the flexible heat conducting layer 30. In this way, the support frame 51 can improve the overall stability of the flexible screen assembly 50. In one example, the support 51 is a liquid metal support.

The first cover 13 and the second cover 23 form two heat dissipation paths, respectively, that is, the first cover 13 can dissipate heat of the main board component 12, and the second cover 23 can dissipate heat of the battery component 22. When the flexible electronic device 100 is in the unfolded state, the first cover 13 and the second cover 23 do not affect each other, and each of them emits heat. However, when the flexible electronic device 100 is in the folded state, the first cover 13 and the second cover 23 are close to each other or even contact each other, and the space for dissipating heat outwards is small, and the heat dissipation efficiency is low. In addition, when the first cover 13 and the second cover 23 are made of a non-heat conductive material such as plastic, heat dissipation is further affected. In the folded state, the heat is thus dissipated mainly via the additional heat dissipation path, i.e. via the heat dissipation body which is still located on the outside. The heat of main board component 12 is homogenized to the second radiator 21 of battery component 22 through the heat conduction assembly, the heat of battery component 22 and the heat of main board component 12 that transmits over give off through second radiator 21, and the heat of main board component 12 gives off through first radiator 11 simultaneously to ensure holistic radiating efficiency. When the flexible electronic device 100 is in the unfolded state, the first cover 13, the second cover 23, the first heat sink 11 and the second heat sink 21 all function as a main heat dissipation path to dissipate heat.

It will be appreciated that the heat conducting assembly may also comprise only the flexible heat conducting layer 30, i.e. both heat conducting and support are provided by the flexible heat conducting layer 30, in which case the support plate 31 may be omitted.

Further, when the hinge assembly 40 is made of a metal material, it can also serve as a heat dissipation path for dissipating heat from the battery part 22 and the main plate part 12. Namely, the first cover 13, the second cover 23, the heat conductive assembly, the first heat sink 11 and the second heat sink 21 may further transfer heat to the hinge assembly 40 and then radiate the heat to the outside through the hinge assembly 40, so as to further enhance the heat dissipation effect.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

In the description of the present specification, reference to the description of the terms "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

An electronic device, comprising:

a first portion including a first heat radiator and a main board member thermally connected to one side of the first heat radiator;

the second part comprises a second radiator and a battery component, and the battery component is connected to one side of the second radiator in a heat conduction mode;

the flexible heat conduction layer is connected with the first heat radiator and the second heat radiator in a heat conduction mode.
The electronic device of claim 1, wherein the first heat sink and the second heat sink are closer to each other when the electronic device is folded and further from each other when the electronic device is unfolded.
The electronic device of claim 1, wherein the flexible heat conduction layer is used for transferring heat of the first heat dissipation body to the second heat dissipation body to dissipate.
The electronic device of claim 1, wherein the flexible thermally conductive layer is located on an opposite side of the first heat sink from the motherboard component and the battery component.
The electronic device of claim 1, wherein the electronic device comprises a hinge assembly connecting the first portion and the second portion, the hinge assembly, the first heat sink, and the second heat sink being disposed on a same side of the flexible heat conductive layer.
The electronic device of claim 5, wherein the flexible thermally conductive layer covers and is thermally conductively coupled to the hinge assembly.
The electronic device of claim 1, comprising a support plate affixed to the flexible thermally conductive layer, the support plate being positioned between the hinge assembly and the flexible thermally conductive layer.
The electronic device of claim 7, wherein the flexible thermal conductive layer is made of a graphene material or a graphite material, and the support plate is made of a metal.
The electronic device of claim 1, wherein the first heat sink is formed with a first recess, the second heat sink is formed with a second recess, the first recess and the second recess together form a receiving slot, and the flexible heat conducting layer is partially or completely received in the receiving slot.
The electronic device according to claim 1, wherein the main board member includes a main board and a first chip portion, the first chip portion includes a first shield case and a first chip, the first chip and the first shield case are provided on the main board, the first shield case covers the first chip and is thermally connected to the first chip, and the first shield case is thermally connected to the first heat sink.
The electronic device of claim 10, wherein the motherboard component includes a second chip section including a second shield can and a second chip, the second chip and the second shield can being disposed on a side of the motherboard facing away from the first chip section, the second shield can covering the second chip and being thermally conductively connected to the second chip.
The electronic device of claim 10, wherein the first chip portion includes a first thermally conductive layer that thermally conductively connects the first shield can and the first chip.
The electronic device of claim 11, wherein the second chip portion includes a second thermally conductive layer thermally connecting the second shield can and the second chip.
The electronic device of claim 11, wherein the first portion includes a thermally conductive first cover, the first cover and the first heat sink are coupled and together form a first mounting cavity, the motherboard component is positioned within the first mounting cavity, and the second shield is thermally coupled to the first cover.
The electronic device of claim 11, wherein the first portion comprises a third thermally conductive layer that thermally conductively connects the second shield and the first cover.
The electronic device of claim 1, wherein the second portion includes a thermally conductive second cover, the second cover and the second heat sink being coupled and collectively forming a second mounting cavity, the battery component being located within the second mounting cavity, the battery component being thermally coupled to the second cover.
The electronic device according to claim 14 or 16, wherein when the electronic device is bent, the first cover and the second cover are close to each other, and a distance between the first cover and the second cover is smaller than a distance between the first heat sink and the second heat sink.
The electronic device of claim 16, wherein the second portion comprises a fourth thermally conductive layer that thermally conductively connects the battery component and the second cover.
The electronic device of claim 1, wherein the electronic device comprises a flexible screen assembly mounted on the flexible thermally conductive layer.
The electronic device according to claim 12 or 13, wherein the first heat conducting layer is made of heat conductive silicone, and the second heat conducting layer is made of heat conductive silicone.
An electronic device according to claim 15 or 18, wherein the third thermally conductive layer is made of a graphite material and the fourth thermally conductive layer is made of a graphite material.