JP2000022371A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent performance deterioration of an electronic component due to a temperature rise in a case, by mounting a heat transfer member made of a metal plate brought into contact with a heating component, and bringing the member into contact with a conductive pattern of a mother board. SOLUTION: A case 1 in which a printed board 4 and a heat transfer member 2 adhered with a sheet 14 are mounted is fixed to a surface formed with a conductive pattern 12a of a mother board 12. Heat generated from a heating component 6 is transferred to a tongue piece 2d, diffused to the overall member 2 and dissipated to the pattern 12a of the board 12 brought into close contact with the sheet 14. Thus, the heat from the component 6 is rapidly dissipated out of the case 1 from the member 2 via the sheet 14 and the pattern 12a, thereby suppressing a temperature rise in the case 1. Accordingly, performance deterioration of an electronic component due to the temperature rise can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a transmission / reception unit used for a portable telephone, and more particularly to an electronic device with improved heat radiation efficiency.

[0002]

2. Description of the Related Art Conventional electronic equipment will be described with reference to FIGS. 3 to 5. FIG. 3 is a perspective view of the conventional electronic equipment, FIG. 4 is an exploded perspective view showing a part of the conventional electronic equipment, and FIG. Is a sectional view of a main part of a conventional electronic device. In these figures,
The case 31 formed of a plastic material has a bottom wall portion 31.
a, four side walls 31b, an opening 31c facing the bottom wall 31a and opening upward, a through hole 31d provided in the bottom wall 31a for drawing out a cable, and a bottom wall 31a. On the same surface, an ear portion 31e provided at a corner located outside the side wall portion 31b, a through hole 31f provided at the center of the ear portion 31e, and an inwardly projecting protrusion provided on the side wall portion 31b. It has a portion 31g, a screw hole 31h provided at the center of the convex portion 31g, and a metal film 31k applied over the entire surface of the case 31 by means such as plating.

A tongue piece 32 made of a metal plate has a rectangular shape, and a part of the tongue piece 32 is buried and attached to the bottom wall 31a of the case 31 by insert molding. The portion protrudes upward from the bottom wall 31a and is located in an inclined state, and the tongue piece 32 is in contact with the metal film 31k attached to the case surface.

The printed circuit board 33 has a through hole 37 and a conductive pattern (not shown), and a lower surface 33a of the printed circuit board 33 has a connector 3 for connecting a cable.
4 and a heat-generating component 35 having a large calorific value are provided, and an electronic component 36 having a relatively small calorific value is provided on the upper surface 33b.
Are installed. A box-shaped metal cover 38 made of a metal plate has an open lower surface and a plurality of through holes 39 on the upper surface.
The electronic component 36 attached to the printed circuit board 33 so as to cover the
Are electrically shielded.

[0005] The printed circuit board 33 includes a heat-generating component 35.
The lower surface 33a on which is installed is placed on the case 31 so as to cover the opening 31c with the bottom surface 31a of the case 31 facing the bottom wall 31a, and the screw 40 passed through the through hole 37 of the printed circuit board 33 is inserted into the case 31. Screw hole 31h of 31 convex portion 31g
The printed circuit board 33 is screwed into
Attached to.

Then, the printed circuit board 33 is
The tongue piece 32 comes into contact with the surface of the heat-generating component 35 in a state where the heat-generating component 35 is attached.

[0007] The case 31 to which the printed circuit board 33 is attached is a conductive pattern 41 a of the mother board 41.
Is placed on the surface on which is formed the ear 31 e of the case 31.
The screw 42 passed through the through hole 31f is screwed into a screw hole 41b provided in the mother board 41, and the case 31 is fixed to the mother board 41.

In the electronic device having the above-described configuration, in use, heat generated from the heat-generating component 35 is transmitted from the tongue piece 32 to the metal film 31k of the case 31, and mainly the Metal film 31k deposited on inner wall
Then, the heat is dissipated into the case 31.

[0009]

SUMMARY OF THE INVENTION In a conventional electronic device,
Since the heat from the heat generating component 35 is mainly radiated from the metal film 31 k on the inner wall of the case 31, the heat stays inside the case 31, and the temperature inside the case 31 rises, and
3 has a problem of hindering the performance of the electronic components installed in the electronic device.

[0010]

[Means for Solving the Problems]

An electronic apparatus according to the present invention includes a printed circuit board, a heat-generating component mounted on the printed circuit board, a case for mounting the heat-generating component on the printed circuit board, and a mother having a conductive pattern formed on a surface thereof. And a heat conductive member made of a metal plate in contact with the heat generating component is attached to the case, and the heat conductive member is brought into contact with the conductive pattern of the mother substrate.

Further, the electronic apparatus of the present invention has a printed circuit board, a heat-generating component installed on the printed circuit board, a case for mounting the printed circuit board and housing the heat-generating component, and a conductive pattern formed on the surface. A heat conductive member made of a metal plate in contact with the heat-generating component is attached to the case, between the heat conductive member and the conductive pattern of the mother substrate, good heat conductivity,
In addition, an elastic sheet is interposed, and the heat of the heat conductive member is conducted to the conductive pattern via the sheet.

Further, the electronic device of the present invention has a configuration in which a plurality of through holes are provided in the heat conducting member.

[0014]

1 and 2, an electronic component of the present invention will be described. FIG. 1 is an exploded perspective view showing a part of an electronic device of the present invention, and FIG. 2 is an electronic component of the present invention. It is sectional drawing of the principal part of an apparatus. In these figures, a case 1 molded of a plastic material includes a bottom wall 1a, four side walls 1b, an opening 1c facing the bottom wall 1a and opening upward, and a bottom wall 1a. Large through hole 1 provided
d, a through hole 1e for drawing out a cable, a projection 1f formed at several locations on the outer periphery of the large through hole 1d, and protruding toward the opening 1c. Ears 1g provided at the corners located on the outside,
A through hole 1h provided at the center of the ear 1g, and a side wall 1b
The convex portion 1k provided in the inner portion, the screw hole 1m provided in the center of the convex portion 1k, and the entire surface of the case 1
And a metal film 1n applied by means such as plating.

The heat conducting member 2 made of a metal plate has a flat plate portion 2
a, a plurality of protrusions 2b provided to protrude outward at several places on the outer periphery of the flat plate portion 2a, a through hole 2c provided at the center of the protrusion 2b, and a partial cutout at several places of the flat plate portion 2a. It has a tongue piece 2d cut and raised upward and a plurality of through holes 3 provided in the flat plate portion 2a. Further, the flat plate portion 2a of the heat conductive member 2 has a bulging portion protruding downward in a shape conforming to the large through hole 1d of the case 1, and the through hole 3 reduces the weight of the heat conductive member 2. ing.

The heat conducting member 2 is housed inside the case 1 with the tongue piece 2d cut and raised upward, and is passed through the projection 1f of the case 1 through the through hole 2c of the projection 2b. Is mounted so as to cover the large through hole 1d, and the protrusion 1f is deformed by heating, and the protrusion 1f is fixed to the case 1 by filling and covering the through hole 2c. When the heat conducting member 2 is attached, the bulging portion of the flat plate portion 2a of the heat conducting member 2 formed so as to conform to the shape of the large through hole 1d of the case 1 extends downward from the large through hole 1d. Exposed, bottom wall 1a of case 1
And it is configured to protrude from the bottom wall 1a.

The elastic sheet 14 having good thermal conductivity and elasticity is, for example, a polyimide film coated on both sides with an acrylic adhesive material, and is exposed from the large through hole 1d of the case 1 of the heat conductive member 2. It is attached and adhered to the surface.

The printed board 4 has a through hole 8 and a conductive pattern (not shown).
On a, a connector 5 for connecting a cable and a heat-generating component 6 having a large heat value are provided, and on the upper surface 4b, an electronic component 7 having a relatively small heat value are provided. A box-shaped metal cover 9 made of a metal plate has an open lower surface and a plurality of through holes 10 on the upper surface. The metal cover 9 is attached to the printed circuit board 4 so as to cover the electronic components 7 on the upper surface 4b. The electronic component 7 installed on the upper surface 4 b is electrically shielded by the metal cover 9.

The printed circuit board 4 is placed on the case 1 so that the lower surface 4a on which the heat-generating components 6 are installed faces the bottom wall 1a of the case 1 and closes the opening 1c. 4 is screwed into the screw hole 1m of the projection 1k of the case 1 by screwing the screw 11 passed through the through hole 8 of the case 1.
It is attached to case 1. When the printed circuit board 4 is attached to the case 1, the heat conducting member 2 is provided on the lower surface 4 a of the printed circuit board 4 while facing the area including the heat generating component 6 on the lower surface 4 a of the printed circuit board 4. The tongue 2d of the heat conducting member 2 is provided on the surface of the heat generating component 6.
Are in contact with each other.

The printed circuit board 4 and the sheet 14
Case 1 with heat conductive member 2 attached with
Is mounted on the surface of the mother board 12 on which the conductive patterns 12a are formed. The case 1 is provided with screws 13 passing through the through holes 1h of the ears 1g of the case 1 on the mother board 12. Screwed into the screw hole 12b.

In the electronic device having the above-described configuration, in use, the heat generated from the heat-generating component 6 is transmitted through the tongue piece 2d, diffuses to the entire heat-conducting member 2, and The sheet 1 through the sheet 14 which is in close contact with
The heat is radiated to the conductive pattern 12a of the mother substrate 12 which is in close contact with the substrate 4. That is, heat from the heat generating component 6 is quickly released from the heat conductive member 2 to the outside of the case 1 via the sheet 14 and the conductive pattern 12a, so that a rise in the temperature inside the case 1 is suppressed. .

The contact surface between the heat generating component 6 and the tongue piece 2d may be coated with silicon grease, and the sheet 14 may be bonded to the conductive pattern 12a of the mother board 12. Further, the mother substrate 12 and the heat conductive member 2 may be directly in contact with the conductive pattern 12a without using a sheet.

[0023]

According to the electronic apparatus of the present invention, case 1
The conductive pattern 12 of the mother board 12 is
a, the heat from the heat generating component 6 is transmitted through the heat conductive member 2 and is quickly released to the conductive pattern 12a, so that the temperature rise in the case 1 is suppressed, It is possible to provide a highly reliable electronic device in which the performance of electronic components including the heat-generating component 6 does not deteriorate due to a rise in temperature.

In the electronic device according to the present invention, between the heat conductive member 2 and the conductive pattern 12a of the mother substrate 12,
By interposing the elastic sheet 14 having good heat conductivity, the sheet 14 and the heat conductive member 2 and between the sheet 14 and the conductive pattern 12a can be brought into close contact with each other without any gap. Thermal conductive pattern 12a
It is possible to improve the efficiency of heat radiation to the device.

Further, in the electronic device of the present invention, by providing a plurality of through holes 3 in the heat conducting member 2, a lightweight electronic device can be provided.

[Brief description of the drawings]

FIG. 1 is an exemplary exploded perspective view showing an electronic device according to the present invention;

FIG. 2 is a cross-sectional view of a main part of the electronic device of the invention.

FIG. 3 is a perspective view of a conventional electronic device.

FIG. 4 is an exploded perspective view showing a part of a conventional electronic device.

FIG. 5 is a cross-sectional view of a main part of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case 1a Bottom wall 1b Side wall 1c Opening 1d Large through-hole 1e Through-hole for pulling out cable 1f Projection 1g Ear 1h Through-hole 1k Convex 1m Screw hole 1n Metal film 2 Heat conductive member 2a Flat plate 2b Projecting portion 2c Through hole 2d Tongue piece 3 Through hole 4 Printed circuit board 4a Lower surface 4b Upper surface 5 Connector 6 Heating component 7 Electronic component 8 Through hole 9 Metal cover 10 Through hole 11 Screw 12 Mother substrate 12a Conductive pattern 12b Screw hole 13 Screw 14 Sheet

Claims (3)

[Claims] 1. A printed circuit board comprising: a printed circuit board; a heat-generating component mounted on the printed circuit board; a case for mounting the heat-generating component on the printed circuit board; and a mother board having a conductive pattern formed on a surface thereof. An electronic device, wherein a heat conductive member made of a metal plate in contact with the heat generating component is attached to the case, and the heat conductive member is brought into contact with the conductive pattern on the mother board. 2. A printed circuit board, comprising: a heat-generating component mounted on the printed circuit board; a case for mounting the heat-generating component by attaching the printed circuit board; and a mother board having a conductive pattern formed on a surface thereof. A heat conductive member made of a metal plate that is in contact with the heat generating component is attached to the case, and a sheet having good heat conductivity and elasticity is interposed between the heat conductive member and the conductive pattern of the mother board. An electronic device wherein the heat of the heat conductive member is conducted to the conductive pattern via the sheet. 3. The electronic device according to claim 1, wherein a plurality of through holes are provided in the heat conducting member.