JP2001217576A - Heat radianting structure of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radianting structure which has a superior radiant heat effect and can efficiently radiate heat own a long term. SOLUTION: In a heat radianting structure of an electronic apparatus, as an elastic piece 8c risen from a first cover 8 is brought into elastic contact with a metal piece 10 fitted on a first pattern 3, a first pattern like the prior art is not shaved, but heat radianting effect to the elastic piece 8c is superior, and it is possible to efficiently radiate heat over a long term.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for an electronic device such as a tuner used in a digital television receiver.

[0002]

2. Description of the Related Art A conventional heat radiating structure of an electronic device will be described with reference to FIG. It has second openings 21b and 21c and a partition wall 21d that partitions the inside of the side wall 21a.

A circuit board 22 made of a printed board is provided on the upper and lower surfaces so as to face each other, and first and second metallic patterns 23 and 24 made of copper foil and holes 22a provided in the circuit board 22 are provided. And a connection portion 25 for connecting the first and second patterns 23 and 24 for heat conduction, and provided on the surface of the circuit board 22. Wiring pattern 26.

Various electric components (not shown) are mounted on the circuit board 22 and connected to a wiring pattern 26 by soldering, and a heat generating component 27 such as an IC is formed on the second pattern 24. In the mounted state, it is connected to the wiring pattern 26 by soldering. Such a circuit board 22 is fixed to an intermediate portion in the frame 21 by appropriate means.

The first cover 28 made of a metal plate includes a flat rectangular plate-like portion 28a, an attachment piece 28b bent from four sides of the plate-like portion 28a, and the inside of the frame 21 from the plate-like portion 28a. Elastic piece 28 cut and raised toward
c, and a tongue piece 28d cut and raised from the plate-like portion 28a toward the inside of the frame 21.

The first cover 28 is attached to the frame 21 while the first opening 21b of the frame 21 is covered with the plate-like portion 28a and the outer surface of the side wall 21a is sandwiched by the attachment piece 28b. Have been. When the first cover 28 is attached to the frame 21, the elastic piece 28c
Resiliently contacts the first pattern 23, and the tongue piece 28d for grounding resiliently contacts the end face of the partition wall 21d.

The second cover 29 made of a metal plate has a flat rectangular plate-like portion 29a, mounting pieces 29b bent from four sides of the plate-like portion 29a, and the inside of the frame 21 from the plate-like portion 29a. Elastic piece 29 cut and raised toward
c. The second cover 29 is attached to the frame 21 with the second opening 21c of the frame 21 covered with the plate-like portion 29a and the outer surface of the side wall 21a sandwiched between the attachment pieces 29b. . When the second cover 29 is attached to the frame 21, the elastic piece 29
c is in a state of elastic contact with the upper surface of the heat generating component 27.

[0008] Such a configuration constitutes a conventional electronic device. When this electronic device is incorporated in a television receiver and used, the heat generating component 27 generates heat. Then, the heat of the heat generating component 27 is transmitted to the first pattern 23 via the second pattern 24 and the connecting portion 25, and the first
The heat transmitted to the pattern 23 is transmitted to the plate-like portion 28a via the elastic piece 28c of the first cover 28, and is radiated from the plate-like portion 28a.

Further, on the second cover 29 side, heat is transmitted to the elastic piece 29c elastically contacting the heat generating component 27,
Heat is radiated from the plate portion 29a, and the first and second
The electronic devices are radiated with the covers 28 and 29. In order to enhance the heat radiation effect, particularly, the elastic piece 28c of the first cover 28 is increased in its elasticity so as to make strong contact with the first pattern 23. When the resilience of the piece 28c is increased, during the mounting of the frame 21 of the first cover 28,
Or, the elastic piece 28 may be
c, the first pattern 23 is shaved, heat conduction from the first pattern 3 to the elastic piece 28c is deteriorated, and the heat radiation effect is deteriorated.

[0010]

A conventional heat dissipation structure of an electronic device includes an elastic piece 28 having a large elastic force of a first cover 28.
Since c is elastically in contact with the first pattern 23, the first pattern 23 is shaved by the elastic piece 28 c due to vibration during the mounting of the frame 21 of the first cover 28 or during the transportation of the electronic device, and the like. There is a problem that heat conduction from the first pattern 3 to the elastic piece 28c is deteriorated, a heat radiation effect is deteriorated, and good heat radiation cannot be performed for a long time.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat radiation structure of an electronic device which has a good heat radiation effect and can perform good heat radiation for a long period of time.

[0012]

As a first means for solving the above problems, a frame having a first opening, a circuit board mounted in the frame, and both sides of the circuit board are provided. A metal first and second pattern formed facing each other, a conductive connecting portion provided in a hole of the circuit board and connecting the first and second patterns, And a first cover made of a metal plate attached to the frame so as to cover the first opening, and a heat-generating component mounted and attached on the first pattern. Has a structure in which a metal piece is attached, and an elastic piece cut and raised from the first cover is elastically contacted with the metal piece.

As a second solution, a plurality of the metal pieces are attached to the first pattern, and the elastic piece is elastically contacted with each of the plurality of metal pieces. . As a third solution, the metal piece is formed by a rod-shaped member.

As a fourth solution, the metal piece is provided on the first pattern at a position facing the lower surface of the heat generating component. As a fifth solution, the frame has a second opening on the side where the heat-generating component is mounted, and a second metal opening attached to the frame so as to cover the second opening. And the elastic piece cut and raised from the second cover is elastically contacted with the heat-generating component.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A drawing of a heat dissipation structure of an electronic device according to the present invention will be described. FIG. 1 is an enlarged sectional view of a main part showing a heat dissipation structure of an electronic device according to the present invention, and FIG. FIG. 3 is a perspective view showing one embodiment of a metal piece relating to a heat dissipation structure of a device, and FIG. 3 is a perspective view showing another embodiment of a metal piece relating to a heat dissipation structure of an electronic device of the present invention.

FIGS. 1 to 3 show a heat radiation structure of an electronic device according to the present invention.
The metal frame 1 is provided with side walls 1a on all sides to form a mouth, and partitions the inside of the side walls 1a from first and second openings 1b and 1c provided above and below it. And a partition wall 1d.

The circuit board 2 made of a printed board is provided on the upper and lower surfaces so as to face each other. The first and second metal patterns 3 and 4 made of copper foil and the holes 2a provided in the circuit board 2 are provided. A connecting portion 5 for solidifying by injecting a conductive silver paste or the like into the first portion and connecting the first and second patterns 3 and 4, and a connecting portion 5 provided on the surface of the circuit board 2. Wiring pattern 6.

Various electric components (not shown) are placed on the circuit board 2 and connected to the wiring pattern 6 by soldering, and a heat generating component 7 such as an IC is formed on the second pattern 4. In the mounted state, it is connected to the wiring pattern 6 by soldering. And such a circuit board 2
It is fixed to an intermediate portion in the frame 1 by appropriate means.

A metal piece 1 made of a cylindrical rod-shaped member
0 is a copper wire called a zero ohm jumper wire, as shown in FIG.
Is mounted on the first pattern 3 by half-bonding at a position facing the lower surface of the first pattern 3. In addition, this metal piece 10
As shown in FIG. 3, a plate-like member made of a material having good thermal conductivity such as a copper material may be used, and further, a rectangular bar-like member or the like may be used. If the metal piece 10 is made of a metal material which has good thermal conductivity and can be soldered, the metal piece 10 can be easily attached and has good heat transfer efficiency, which is preferable.

The first cover 8 made of a metal plate has a flat rectangular plate-like portion 8a, mounting pieces 8b bent from four sides of the plate-like portion 8a, and the first cover 8 from the plate-like portion 8a. The elastic piece 8c cut and raised toward the
a and a tongue piece 8d cut and raised toward the inside of the frame 1 from a.

The first cover 8 is attached to the frame 1 while the first opening 1b of the frame 1 is covered with the plate-like portion 8a and the outer surface of the side wall 1a is sandwiched between the attachment pieces 8b. Have been. Also, the first cover 8 is the frame 1
When the elastic piece 8c is attached to the first pattern 3, the elastic piece 8c is in elastic contact with the metal piece 10 attached to the first pattern 3, and the ground tongue 8d is in elastic contact with the end face of the partition wall 1d. In this embodiment, one elastic piece 8c elastically contacts one metal piece 10, but a plurality of metal pieces 10 are attached, and a plurality of elastic pieces 8c are provided.
An elastic piece 8c may be elastically contacted with each of the plurality of metal pieces 10.

The second cover 9 made of a metal plate includes a flat rectangular plate-like portion 9a, mounting pieces 9b bent from four sides of the plate-like portion 9a, and the plate-like portion 9a into the frame 1. And an elastic piece 9c that is cut and raised toward the other side.
The second cover 9 is attached to the frame 1 with the second opening 1c of the frame 1 covered with the plate-like portion 9a and the outer surface of the side wall 1a sandwiched between the attachment pieces 9b. . When the second cover 9 is attached to the frame 1, the elastic piece 9 c is in a state of being in elastic contact with the upper surface of the heat generating component 7.

The electronic device of the present invention is constituted by such a configuration, and when the electronic device is incorporated in a television receiver and used, the heat generating component 7 generates heat. Then, the heat of the heat generating component 7 is transferred to the second pattern 4, the connecting portion 5,
And transmitted to the metal piece 10 via the first pattern 3,
The heat transmitted to the metal piece 10 is transmitted to the plate portion 8a via the elastic piece 8c of the first cover 8, and is radiated from the plate portion 8a.

Further, on the second cover 9 side, heat is transmitted to the elastic piece 9c elastically in contact with the heat-generating component 7, and is radiated from the plate-like portion 9a. The heat is radiated from the electronic device by the covers 8 and 9. In order to enhance this heat radiation effect, the first cover 8
In the elastic piece 8c, the elastic force is increased to achieve strong contact with the metal piece 10.

Even when the elastic force of the elastic piece 8c is increased, the elastic piece 8c does not elastically contact the first pattern 3 because the elastic piece 8c elastically contacts the metal piece 10.
The first pattern 3 is not shaved by the elastic piece 8c due to vibrations during the mounting of the frame 1 of the first cover 8 or during the transportation of the electronic device, and the heat radiation effect to the elastic piece 8c is good, Good heat radiation can be performed over the entire area.

[0026]

According to the heat radiation structure of the electronic device of the present invention, the elastic piece 8c cut and raised from the first cover 8 is elastically contacted with the metal piece 10 mounted on the first pattern 3. Without the first pattern like
The heat radiation effect to the elastic piece 8c is good, and good heat radiation can be performed for a long period of time.

Further, a plurality of metal pieces 10 are attached to the first pattern 3, and the elastic pieces 8c are elastically contacted with the plurality of metal pieces 10, respectively. Can be provided. In addition, since the metal piece 10 is formed of a rod-shaped member, the zero-ohm jumper wire used in the tuner can be used, and the cost is low and the assemblability is good.

Further, since the metal piece 10 is provided on the first pattern 3 at a position facing the lower surface of the heat-generating component 7, heat can be efficiently conducted to the metal piece 10 and the heat radiation effect can be further improved. Good things can be provided. In addition, since the elastic piece 9c cut and raised from the second cover 9 is elastically contacted with the heat generating component 7, heat can be dissipated in addition to the first cover 8, and a heat dissipating element having a better heat dissipating effect can be obtained. Can be provided.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view of a main part showing a heat dissipation structure of an electronic device according to the invention.

FIG. 2 is a perspective view showing one embodiment of a metal piece according to the heat dissipation structure of the electronic device of the present invention.

FIG. 3 is a perspective view showing another embodiment of the metal piece according to the heat dissipation structure of the electronic device of the present invention.

FIG. 4 is an enlarged sectional view of a part of a main part showing a heat dissipation structure of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 1b 1st opening 1c 2nd opening 1d Partition wall 2 Circuit board 2a hole 3 1st pattern 4 2nd pattern 5 Connection part 6 Wiring pattern 7 Heat generation component 8 1st cover 8a board Shaped part 8b Mounting piece 8c Elastic piece 8d Tongue piece 9 Second cover 9a Plate-shaped part 9b Mounting piece 9c Elastic piece 10 Metal piece

Claims (5)

[Claims] 1. A frame having a first opening, a circuit board mounted in the frame, and first and second metallic substrates formed on both sides of the circuit board so as to face each other.
And a first pattern provided in a hole of the circuit board.
A conductive connecting portion connecting the first pattern and the second pattern; a heat-generating component mounted and mounted on the second pattern; and a heating component mounted on the frame so as to cover the first opening. A first cover made of a metal plate, wherein a metal piece is mounted on the first pattern, and an elastic piece cut and raised from the first cover is elastically contacted with the metal piece. Heat dissipation structure of electronic equipment characterized by the following. 2. The method according to claim 1, wherein a plurality of the metal pieces are attached to the first pattern, and the elastic pieces are elastically contacted with the plurality of metal pieces, respectively. Heat dissipation structure of electronic equipment. 3. The heat radiating structure for an electronic device according to claim 1, wherein said metal piece is formed of a rod-shaped member. 4. The heat radiation of an electronic device according to claim 1, wherein the metal piece is provided on the first pattern at a position facing a lower surface of the heat generating component. Construction. 5. The frame has a second opening on the mounting side of the heat-generating component, and a second metal cover attached to the frame is provided to cover the second opening. The heat dissipation structure for an electronic device according to any one of claims 1 to 4, wherein the elastic piece cut and raised from the second cover is elastically contacted with the heat generating component.