【０００１】
【発明の属する技術分野】
本発明は、ＣＡＴＶ用受信機等に使用して好適な電子機器に関し、特に、発熱部品の放熱構造に関する。
【０００２】
【従来の技術】
従来の電子機器を図５、図６に基づいて説明すると、プリント基板等からなる回路基板２１は、矩形状の孔２１ａと、導電パターン２１ｂを有しており、この回路基板２１上には、種々の電気部品（図示せず）が導電パターン２１ｂに接続されて、所望の回路が構成されている。
また、トランジスタ等の発熱部品２２は端子部２２ａを有し、また、金属からなる取付部材２３は、間隔おいて形成された一対の孔２３ａを有し、前記発熱部品２２の下部が一対の孔２３ａ間において取付部材２３に固定されて、発熱部品２２と取付部材２３とが一体化されている。
【０００３】
そして、発熱部品２２は、回路基板２１の孔２１ａに挿入され、端子部２２ａが導電パターン２１ｂに半田付されて取り付けられている。
また、比較的厚く剛体の金属板からなるコ字状の熱伝導部材２４は、上板部２４ａと、上板部２４ａの両端から下方に延びる脚部２４ｂと、上板部２４ａに設けられた一対のネジ孔２４ｃを有する。
そして、この熱伝導部材２４は、上板部２４ａを取付部材２３の下部に当接させた状態で、２個のネジ２５を、取付部材２３の孔２３ａを貫通させて熱伝導部材２４のネジ孔２４ｃにネジ込みして、取付部材２３に熱伝導部材２４を取り付ける。
【０００４】
また、電子機器のケース（図示せず）内には、金属板からなるシャーシ２６が設けられており、そして、発熱部品２２、熱伝導部材２４を取り付けた回路基板２１は、電子機器のケース（図示せず）内に収容されて、回路基板２１がシャーシ２６に適宜手段により取り付けられている。
そして、回路基板２１が取り付けれた際、熱伝導部材２４の脚部２４ｂの下端面がシャーシ２６に当接した状態となっている。
このため、発熱部品２２の熱は、取付部材２３と熱伝導部材２４を介してシャーシ２６に伝達され、それぞれから放熱するようになっている。
【０００５】
【発明が解決しようとする課題】
従来の電子機器は、取付部材２３と熱伝導部材２４とをネジ２５で結合するため、その結合作業が面倒で、生産性が悪く、コスト高になるという問題がある。また、熱伝導部材２４は、剛体で構成されているため、シャーシ２６と当接した際、寸法のバラツキにより回路基板２１を大きく撓ませ、回路基板２１の破損を招く等の問題がある。
また、熱伝導部材２４は、脚部２４ｂの下端面がシャーシ２６に当接するため、その面積が少なく、熱伝導部材２４からシャーシ２６への熱伝達性が悪いという問題がある。
また、取付部材２３と熱伝導部材２４の上板部２４ａとの間、及び熱伝導部材２４の脚部２４ｂの下端面とシャーシ２６との間における密着性が悪く、熱伝達性が悪いという問題がある。
【０００６】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、回路基板の導電パターンに接続された発熱部品と、該発熱部品の下部に取り付けられ、孔等からなる少なくとも一対の係合部を有する金属からなる取付部材と、バネ性のある金属板からなる熱伝導部材とを備え、該熱伝導部材には、上板部と、該上板部の両端から下方に延びる脚部と、前記上板部から上方に突出して形成された少なくとも一対の係止部とを設け、前記取付部材の下部に前記上板部を弾接させると共に、前記係止部を前記係合部に掛け止めして、前記取付部材と前記熱伝導部材を結合した構成とした。
また、第２の解決手段として、シャーシ等からなる板状部材を有し、また、前記熱伝導部材には、前記脚部の一端から直角方向に折り曲げられて横方向に延びる延設部を設け、該延設部の下部を前記板状部材に弾接させて、前記発熱部品の熱を前記熱伝導部材を介して前記板状部材に伝達するようにした構成とした。
【０００７】
また、第３の解決手段として、回路基板の導電パターンに接続された発熱部品と、該発熱部品の下部に取り付けられ、孔等からなる少なくとも一対の係合部を有する金属からなる取付部材と、該取付部材の下部に取り付けられ、熱伝導性と弾性のあるゴム等からなる第１熱伝導シートと、バネ性のある金属板からなる熱伝導部材とを備え、該熱伝導部材には、上板部と、該上板部の両端から下方に延びる脚部と、前記上板部から上方に突出して形成された少なくとも一対の係止部とを設け、前記第１熱伝導シートの下部に前記上板部を弾接させると共に、前記係止部を前記係合部に掛け止めして、前記取付部材と前記熱伝導部材を結合した構成とした。
また、第４の解決手段として、シャーシ等からなる板状部材を有し、また、前記熱伝導部材には、前記脚部の一端から直角方向に折り曲げられて横方向に延びる延設部を設け、該延設部の下部を前記板状部材に弾接させて、前記発熱部品の熱を前記第１熱伝導シートと前記熱伝導部材を介して前記板状部材に伝達するようにした構成とした。
また、第５の解決手段として、シャーシ等からなる板状部材と、熱伝導性と弾性のあるゴム等からなる第２熱伝導シートとを有し、また、前記熱伝導部材には、前記脚部の一端から直角方向に折り曲げられて横方向に延びる延設部を設け、前記板状部材の上面に設けた前記第２熱伝導シートに、前記延設部の下部を弾接させて、前記発熱部品の熱を前記第１熱伝導シート、前記熱伝導部材、及び前記第２熱伝導シートを介して前記板状部材に伝達するようにした構成とした。
【０００８】
【発明の実施の形態】
本発明の電子機器の一実施例を図１〜図３に基づいて説明すると、図１は本発明の電子機器の一実施例の要部の平面図、図２は図１の２ー２線における断面図、図３は本発明の電子機器に係る熱伝導部材の斜視図である。
【０００９】
次に、図１〜図３に基づいて本発明の電子機器を説明すると、プリント基板等からなる回路基板１は、矩形状の孔１ａと、導電パターン１ｂを有しており、この回路基板１上には、種々の電気部品（図示せず）が導電パターン１ｂに接続されて、所望の回路が構成されている。
また、トランジスタ等の発熱部品２は端子部２ａを有し、また、金属からなる取付部材３は、間隔おいて形成された一対の孔等からなる係合部３ａを有し、前記発熱部品２の下部が一対の係合部３ａ間において取付部材３に固定されて、発熱部品２と取付部材３とが一体化されている。
【００１０】
そして、発熱部品２は、回路基板１の孔１ａに挿入され、端子部２ａが導電パターン１ｂに半田付されて取り付けられている。
また、バネ性のある金属板からなる略コ字状の熱伝導部材４は、上板部４ａと、上板部４ａの両端から下方に延びる脚部４ｂと、脚部４ｂの一端から直角方向に折り曲げられて横方向に延びる延設部４ｃと、上板部４ａの一部が切り起こしされ、上板部４ａから上方に突出して形成されたく字状の突出部からなる一対の係止部４ｄとを有する。
そして、この熱伝導部材４は、上板部４ａを取付部材３の下部に弾接させた状態で、熱伝導部材４の係止部４ｄを取付部材３の係合部３ａに掛け止めして、取付部材３に熱伝導部材４を結合する。
【００１１】
また、電子機器のケース（図示せず）内には、金属板のシャーシからなる板状部材５が設けられており、そして、発熱部品２、熱伝導部材４を取り付けた回路基板１は、電子機器のケース（図示せず）内に収容されて、回路基板１が板状部材５に適宜手段により取り付けられている。
そして、回路基板１が取り付けれた際、熱伝導部材４の脚部４ｂの下部に設けられた延設部４ｃの下面が板状部材５に面接触の状態で弾接した状態となっている。
即ち、熱伝導部材４は、バネ性のある金属板で形成されているため、脚部４ｂにより、取付部材３と板状部材５との間の寸法のバラツキを吸収すると共に、上板部４ａを取付部材３に、また、延設部４ｃを板状部材５に弾接させるようになっている。
このため、発熱部品２の熱は、取付部材３と熱伝導部材４を介して板状部材５に伝達され、それぞれから放熱するようになっている。
【００１２】
また、図４は本発明の電子機器の他の実施例を示し、この実施例は、熱伝導性と弾性のあるゴム等からなる第１熱伝導シート６を取付部材３の下部に取付、この第１熱伝導シート６の下部に熱伝導部材４の上板部４ａを弾接すると共に、熱伝導部材４の係止部４ｄを取付部材３の係合部３ａに掛け止めして、取付部材３に熱伝導部材４を結合し、また、熱伝導性と弾性のあるゴム等からなる第２熱伝導シート７を板状部材５の上面に取付、この第２熱伝導シート７上に熱伝導部材４の延設部４ｃを弾接させたものである。
このような第１、第２熱伝導シート６、７を使用することにより、熱伝導部材４との密着性を良くして、接触面積を大きくし、熱伝達性の向上を図ったものである。
そして、その他の構成は前記実施例と同様であるので、同一部品には同一番号を付し、ここでは説明を省略する。
【００１３】
なお、前記実施例では、板状部材５を金属製のシャーシで説明したが、このシャーシに代えて、導電パターンを有するプリント基板からなる板状部材５とし、この導電パターンに延設部４ｃを弾接させたり、このプリント基板上に第２熱伝導シート７を取り付けて、この第２熱伝導シート７上に弾接した延設部４ｃからの熱を導電パターンに伝達するようにしても良い。
また、前記実施例における取付部材３の係合部３ａは、切り欠き部によって形成しても良く、更に、係止部４ｄは、く字状の突出部の他に、種々の形状が適用できること勿論である。
【００１４】
【発明の効果】
本発明の電子機器は、取付部材３の下部に、バネ性のある金属板からなる熱伝導部材４の上板部４ａを弾接させると共に、取付部材３の係合部３ａに熱伝導部材４の係止部４ｄを掛け止めして、取付部材３と熱伝導部材４とを結合したため、従来に比して結合作業が簡単で、生産性が良く、安価な電子機器を提供できる。
また、回路基板１に取り付けられた取付部材３に弾接した熱伝導部材４には、脚部４ｂの一端に延設部４ｃを設け、この延設部４ｃを板状部材５に弾接するようにしたため、回路基板１と板状部材５との間の寸法バラツキをバネ性のある脚部４ｂで吸収でき、回路基板１の破損等のない電子機器を提供できる。
また、延設部４ｃが板状部材５に面接触するため、従来に比して接触面積が大きく、熱伝達性の良好な電子機器を提供できる。
【００１５】
また、取付部材３と熱伝導部材４の上板部４ａとの間に、熱伝導性と弾性のある第１熱伝導シート６を介在させたため、取付部材３と上板部４ａとの間における密着性が良好であると共に、接触面積が大きく、熱伝達性の良好な電子機器を提供できる。
また、板状部材５と熱伝導部材４の延設部４ｃとの間に、熱伝導性と弾性のある第２熱伝導シート７を介在させたため、板状部材５と延設部４ｃとの間における密着性が良好であると共に、接触面積が大きく、熱伝達性の良好な電子機器を提供できる。
【図面の簡単な説明】
【図１】本発明の電子機器の一実施例の要部の平面図。
【図２】図１の２ー２線における断面図。
【図３】本発明の電子機器に係る熱伝導部材の斜視図。
【図４】本発明の電子機器の他の実施例の要部の断面図。
【図５】従来の電子機器の要部の平面図。
【図６】図５の６ー６線における断面図。
【符号の説明】
１ 回路基板
１ａ 孔
１ｂ 導電パターン
２ 発熱部品
２ａ 端子部
３ 取付部材
３ａ 係合部
４ 熱伝導部材
４ａ 上板部
４ｂ 脚部
４ｃ 延設部
４ｄ 係止部
５ 板状部材
６ 第１熱伝導シート
７ 第２熱伝導シート[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device suitable for use in a CATV receiver or the like, and more particularly to a heat dissipation structure for a heat generating component.
[0002]
[Prior art]
A conventional electronic device will be described with reference to FIGS. 5 and 6. A circuit board 21 made of a printed circuit board or the like has a rectangular hole 21 a and a conductive pattern 21 b, and on the circuit board 21, Various electrical components (not shown) are connected to the conductive pattern 21b to form a desired circuit.
Further, the heat generating component 22 such as a transistor has a terminal portion 22a, and the metal mounting member 23 has a pair of holes 23a formed at intervals, and the lower portion of the heat generating component 22 is a pair of holes. It fixes to the attachment member 23 between 23a, and the heat-emitting component 22 and the attachment member 23 are integrated.
[0003]
The heat generating component 22 is inserted into the hole 21a of the circuit board 21, and the terminal portion 22a is soldered to the conductive pattern 21b.
The U-shaped heat conducting member 24 made of a relatively thick and rigid metal plate is provided on the upper plate portion 24a, the leg portions 24b extending downward from both ends of the upper plate portion 24a, and the upper plate portion 24a. A pair of screw holes 24c is provided.
The heat conducting member 24 has two screws 25 passing through the holes 23a of the mounting member 23 and the screws of the heat conducting member 24 in a state where the upper plate portion 24a is in contact with the lower portion of the mounting member 23. The heat conducting member 24 is attached to the attachment member 23 by screwing into the hole 24c.
[0004]
In addition, a chassis 26 made of a metal plate is provided in a case (not shown) of the electronic device, and the circuit board 21 to which the heat generating component 22 and the heat conducting member 24 are attached is the case of the electronic device ( The circuit board 21 is attached to the chassis 26 by appropriate means.
When the circuit board 21 is attached, the lower end surface of the leg portion 24 b of the heat conducting member 24 is in contact with the chassis 26.
For this reason, the heat of the heat generating component 22 is transmitted to the chassis 26 via the mounting member 23 and the heat conducting member 24 and is radiated from each.
[0005]
[Problems to be solved by the invention]
Since the conventional electronic device couples the mounting member 23 and the heat conducting member 24 with the screw 25, there is a problem that the coupling operation is troublesome, the productivity is poor, and the cost is high. Further, since the heat conducting member 24 is composed of a rigid body, there is a problem in that when contacting the chassis 26, the circuit board 21 is greatly bent due to dimensional variations, and the circuit board 21 is damaged.
Moreover, since the lower end surface of the leg part 24b contacts the chassis 26, the heat conductive member 24 has a problem that its area is small and heat transfer from the heat conductive member 24 to the chassis 26 is poor.
In addition, the adhesion between the mounting member 23 and the upper plate portion 24a of the heat conducting member 24 and between the lower end surface of the leg portion 24b of the heat conducting member 24 and the chassis 26 is poor, and the heat transfer performance is poor. There is.
[0006]
[Means for Solving the Problems]
As a first means for solving the above problems, a heat generating component connected to the conductive pattern of the circuit board, and a metal attached to a lower portion of the heat generating component and having at least a pair of engaging portions including holes or the like are used. And a heat conduction member made of a metal plate having a spring property. The heat conduction member includes an upper plate portion, leg portions extending downward from both ends of the upper plate portion, and the upper plate portion. And at least a pair of locking portions that protrude upward from the mounting member, the upper plate portion is elastically contacted to the lower portion of the mounting member, and the locking portion is hooked to the engaging portion, The mounting member and the heat conducting member are combined.
Further, as a second solution, a plate-like member made of a chassis or the like is provided, and the heat conducting member is provided with an extending portion that is bent at a right angle from one end of the leg portion and extends in the lateral direction. The lower part of the extended portion is elastically contacted with the plate-like member so that the heat of the heat generating component is transmitted to the plate-like member via the heat conducting member.
[0007]
Further, as a third solving means, a heat generating component connected to the conductive pattern of the circuit board, a mounting member made of metal having at least a pair of engaging portions made of holes and the like attached to the lower portion of the heat generating component, A first heat conductive sheet attached to a lower portion of the attachment member and made of rubber having thermal conductivity and elasticity, and a heat conductive member made of a metal plate having a spring property. A plate portion, leg portions extending downward from both ends of the upper plate portion, and at least a pair of locking portions formed to protrude upward from the upper plate portion are provided, and the lower portion of the first heat conductive sheet The upper plate portion is elastically contacted, and the engaging portion is latched to the engaging portion, and the attachment member and the heat conducting member are coupled.
Further, as a fourth solution, a plate-like member made of a chassis or the like is provided, and the heat conducting member is provided with an extending portion that is bent in a right angle direction from one end of the leg portion and extends in the lateral direction. A configuration in which a lower portion of the extending portion is elastically contacted with the plate-like member, and heat of the heat generating component is transmitted to the plate-like member via the first heat conductive sheet and the heat conductive member. did.
Further, as a fifth solution means, there is provided a plate-like member made of a chassis or the like, and a second heat conductive sheet made of rubber having thermal conductivity and elasticity, etc. An extending portion that is bent in a right angle direction from one end of the portion and extends in the lateral direction, and the lower portion of the extending portion is elastically contacted with the second heat conductive sheet provided on the upper surface of the plate-like member, It was set as the structure which transmitted the heat | fever of the heat-emitting component to the said plate-shaped member via the said 1st heat conductive sheet, the said heat conductive member, and the said 2nd heat conductive sheet.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the electronic apparatus according to the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view of the main part of an embodiment of the electronic apparatus according to the present invention, and FIG. FIG. 3 is a perspective view of a heat conducting member according to the electronic apparatus of the present invention.
[0009]
Next, the electronic apparatus according to the present invention will be described with reference to FIGS. 1 to 3. A circuit board 1 made of a printed circuit board or the like has a rectangular hole 1a and a conductive pattern 1b. Above, various electric components (not shown) are connected to the conductive pattern 1b to form a desired circuit.
Further, the heat generating component 2 such as a transistor has a terminal portion 2a, and the attachment member 3 made of metal has an engaging portion 3a made of a pair of holes formed at intervals, and the heat generating component 2 Is fixed to the attachment member 3 between the pair of engaging portions 3a, and the heat generating component 2 and the attachment member 3 are integrated.
[0010]
The heat generating component 2 is inserted into the hole 1a of the circuit board 1, and the terminal portion 2a is soldered to the conductive pattern 1b.
Further, the substantially U-shaped heat conducting member 4 made of a spring metal plate includes an upper plate portion 4a, a leg portion 4b extending downward from both ends of the upper plate portion 4a, and a perpendicular direction from one end of the leg portion 4b. A pair of locking portions formed of an extended portion 4c that is bent in a lateral direction and a rectangular protrusion portion formed by cutting and raising a part of the upper plate portion 4a and protruding upward from the upper plate portion 4a. 4d.
The heat conducting member 4 is configured such that the engaging portion 3 a of the mounting member 3 is latched with the engaging portion 4 d of the heat conducting member 4 with the upper plate portion 4 a elastically contacting the lower portion of the mounting member 3. The heat conducting member 4 is coupled to the mounting member 3.
[0011]
Further, a plate-like member 5 made of a metal plate chassis is provided in a case (not shown) of the electronic device, and the circuit board 1 to which the heat generating component 2 and the heat conducting member 4 are attached is an electronic device. The circuit board 1 is housed in a case (not shown) of the device and attached to the plate member 5 by appropriate means.
When the circuit board 1 is attached, the lower surface of the extended portion 4 c provided at the lower portion of the leg portion 4 b of the heat conducting member 4 is in elastic contact with the plate-like member 5 in surface contact.
That is, since the heat conducting member 4 is formed of a metal plate having a spring property, the leg portion 4b absorbs variation in dimensions between the mounting member 3 and the plate-like member 5, and the upper plate portion 4a. Are attached to the mounting member 3 and the extended portion 4c is elastically contacted to the plate-like member 5.
For this reason, the heat of the heat generating component 2 is transmitted to the plate-like member 5 via the mounting member 3 and the heat conducting member 4 and is radiated from each.
[0012]
FIG. 4 shows another embodiment of the electronic apparatus according to the present invention. In this embodiment, a first heat conductive sheet 6 made of rubber having thermal conductivity and elasticity is attached to the lower portion of the attachment member 3. The upper plate portion 4a of the heat conducting member 4 is elastically contacted with the lower portion of the first heat conducting sheet 6, and the engaging portion 4d of the heat conducting member 4 is hooked on the engaging portion 3a of the attaching member 3 to attach the attaching member 3 to the engaging member 3a. Further, the second heat conductive sheet 7 made of rubber having heat conductivity and elasticity is attached to the upper surface of the plate-like member 5, and the heat conductive member 7 is mounted on the second heat conductive sheet 7. 4 extending portions 4c are elastically contacted.
By using such first and second heat conductive sheets 6 and 7, the adhesiveness with the heat conductive member 4 is improved, the contact area is increased, and the heat transfer property is improved. .
Since other configurations are the same as those in the above embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.
[0013]
In the above-described embodiment, the plate-like member 5 has been described as a metal chassis. However, instead of this chassis, the plate-like member 5 made of a printed circuit board having a conductive pattern is used, and the extending portion 4c is formed on the conductive pattern. The second heat conductive sheet 7 may be elastically contacted, or the second heat conductive sheet 7 may be attached to the printed circuit board, and heat from the extended portion 4c elastically contacted on the second heat conductive sheet 7 may be transmitted to the conductive pattern. .
Further, the engaging portion 3a of the mounting member 3 in the above embodiment may be formed by a notch, and the engaging portion 4d can be applied in various shapes in addition to the square-shaped protruding portion. Of course.
[0014]
【The invention's effect】
In the electronic device according to the present invention, the upper plate portion 4a of the heat conductive member 4 made of a spring metal plate is elastically contacted with the lower portion of the attachment member 3, and the heat conductive member 4 is engaged with the engaging portion 3a of the attachment member 3. Since the mounting member 3 and the heat conducting member 4 are coupled by latching the latching portion 4d, it is possible to provide an electronic device that is simpler and more productive and cheaper than conventional ones.
Further, the heat conductive member 4 elastically contacting the attachment member 3 attached to the circuit board 1 is provided with an extending portion 4c at one end of the leg portion 4b, and the extending portion 4c is elastically contacted with the plate-like member 5. Therefore, the dimensional variation between the circuit board 1 and the plate-like member 5 can be absorbed by the spring leg 4b, and an electronic device without damage to the circuit board 1 can be provided.
In addition, since the extended portion 4c is in surface contact with the plate-like member 5, it is possible to provide an electronic device having a large contact area as compared with the prior art and having good heat transfer properties.
[0015]
Moreover, since the 1st heat conductive sheet 6 with heat conductivity and elasticity was interposed between the attachment member 3 and the upper board part 4a of the heat conductive member 4, between the attachment member 3 and the upper board part 4a. An electronic device with good adhesion, a large contact area, and good heat transfer can be provided.
Moreover, since the 2nd heat conductive sheet 7 with heat conductivity and elasticity was interposed between the plate-shaped member 5 and the extended part 4c of the heat conductive member 4, between the plate-shaped member 5 and the extended part 4c. It is possible to provide an electronic device that has good adhesion between them, a large contact area, and good heat transfer properties.
[Brief description of the drawings]
FIG. 1 is a plan view of a main part of an embodiment of an electronic apparatus according to the invention.
FIG. 2 is a cross-sectional view taken along line 2-2 in FIG.
FIG. 3 is a perspective view of a heat conducting member according to the electronic apparatus of the present invention.
FIG. 4 is a cross-sectional view of a main part of another embodiment of the electronic apparatus according to the invention.
FIG. 5 is a plan view of a main part of a conventional electronic device.
6 is a cross-sectional view taken along line 6-6 in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 1a Hole 1b Conductive pattern 2 Heat generating component 2a Terminal part 3 Mounting member 3a Engagement part 4 Thermal conduction member 4a Upper plate part 4b Leg part 4c Extension part 4d Locking part 5 Plate-like member 6 1st heat conductive sheet 7 Second heat conduction sheet
